JPH1019979A - Measuring method and measuring jig of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the electric test of a BGA (semiconductor device) which lost solder balls, and improve reliability and performance of a BGA. SOLUTION: A measuring jig 20 is used when, after a semiconductor device wherein solder balls for mounting onto a device board are installed is mounted on the device board, the semiconductor device is again peeled from the device board, and a BGA 4 which lost the solder balls in installed on an IC socket 7 for electric test. A plurality of balls 2 enabling electric conduction between each electrode of a plurality of socket electrodes 11 installed in an IC socket 7 and the parts where the solder balls of the semiconductor device have been installed are installed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a jig for measuring a semiconductor device. More specifically, the present invention relates to a method for measuring a semiconductor chip on which a large number of contact pads are formed, by applying a conductive adhesive to a wired epoxy substrate. A semiconductor device comprising: bonding, contact pads of a semiconductor chip and wiring of a glass epoxy substrate bonded by a gold wire or the like, coating the surface of the semiconductor chip with a resin, and further providing a solder ball on the back surface of the glass epoxy substrate [ Hereinafter, also referred to as “BGA” (abbreviation for Ball-Grid Array)] and a measuring jig used in this measuring method.

[0002]

2. Description of the Related Art A semiconductor device (BG
A) is easy to handle because there is no worry about lead bending, and there are very few mounting problems when compared with QFP, which is the current mainstream package. Furthermore, the mounting area is small with the same number of pins. This is a package whose demand is remarkably increasing because of its advantages such as high density mounting.

Here, the structure of this semiconductor device (BGA) will be described first with reference to FIG. 5 (a cross-sectional view thereof), and then the conventional measurement method of this semiconductor device (BGA) will be described with reference to FIG. A description will be given based on FIG. 7 (schematic view of a test board used in a conventional measuring method) and FIG. 7 (enlarged sectional view of the IC socket portion in FIG. 6).

(Structure of BGA) As shown in FIG. 5, a BGA 13 is formed by bonding a semiconductor chip 53 to the surface of a substrate 51 provided with a wiring 52 with a conductive adhesive, and disposing the semiconductor chip 53 on the surface. The pad and the wiring 52 are electrically connected by ultrasonic thermocompression bonding of a metal wire 54 of Au or the like. The surface of the substrate 51 is sealed with an epoxy resin 55 to protect the semiconductor chip 53 and the metal wires 54. On the other hand, a solder ball 6 is provided on the rear surface of the substrate 51.
Is provided. In addition, such BG
A is soldered by melting the solder ball 6 when mounted on the device base. Therefore, once implemented BG
A indicates that the solder ball 6 loses its shape when it is peeled off from the device substrate.

(Conventional Measurement Method of BGA) A conventional measurement method of the BGA having the above configuration will be described. The assembled (formed) BGA 13 performs an electrical test to confirm that the mounted semiconductor chip 53 operates normally. In this test, a power supply and a test signal are sent from the tester to the semiconductor chip 53 inside the BGA through the terminal of the BGA 13 to operate the semiconductor chip 53, and it is confirmed from the output result that the semiconductor chip 53 is operating normally. At the time of this operation check, a jig (hereinafter referred to as a "test board") has conventionally been used to electrically connect the BGA 13 and the tester.
Is used.

The conventional test board comprises an IC socket 7 and a test board substrate 8, as shown in FIG.
The test board 8 has a tester on its back surface.
Pads 9 are provided so that they can be connected to the terminals 10 coming out of 15. The BGA 13 is set in the test board IC socket 7 during the measurement.
(See FIG. 6).

At this time, the IC socket 7 has
As shown in (enlarged sectional view of the IC socket 7), the BGA 1
3 is set, an IC socket electrode 11 is provided at a position below each solder ball 6 and at a position for receiving the solder ball 6, and a cover 1 of the IC socket 7 is provided.
By pressing the BGA 13 from above by means of 2, the solder ball 6 is pressed against the IC socket electrode 11 and the IC socket 7 and the BGA 13 are conducted.

[0008]

However, BGA13
Is, once it is mounted on the device substrate and then peeled off from the mounting board, the shape of the solder ball 6 is lost as described above, so that contact with the IC socket cannot be made. The electrical analysis of the sample that caused the above trouble could not be performed, and this was a major obstacle in investigating the cause of the trouble, improving performance, improving reliability, and improving customer satisfaction.

The present invention has been made in view of the above problems, and an object of the present invention is to peel a BGA having a trouble on a device from a device base, evaluate the BGA,
It is possible to analyze, in other words, it is possible to conduct electrical test and measurement of "BGA with lost shape (function) as solder ball", which was not possible until now, and to find the cause of trouble It is an object of the present invention to provide a method of measuring a semiconductor device and a measuring jig used for the method, which can collect data indispensable for improving the performance, reliability, and customer satisfaction.

[0010]

SUMMARY OF THE INVENTION The present invention relates to a "BGA which has lost its function as a solder ball" after being mounted on a device board and peeled from the device board. A jig provided with a conductive ball for compensating the above problem is inserted (interposed) between the BGA and the IC socket, thereby achieving the above object.

That is, the object of the present invention is to provide a semiconductor device provided with a solder ball for mounting on a device base, after mounting the semiconductor device on the device base, peeling the semiconductor device from the device base again, A method for electrically testing a semiconductor device in which the solder ball has been lost and measuring the semiconductor device, wherein the semiconductor device and an IC socket for measurement are placed at a position where the solder ball is provided. A method for measuring a semiconductor device, characterized in that the measurement is performed with a jig instead of the solder ball interposed therebetween. "

Further, the object of the present invention is to provide a semiconductor device provided with a solder ball for mounting on a device base, after mounting the semiconductor device on the device base, peeling the semiconductor device from the device base again, What is claimed is: 1. A measuring jig for mounting a semiconductor device having a lost solder ball to an IC socket for measurement, comprising: a plurality of socket electrodes provided in the IC socket; A measuring jig characterized by having a configuration in which a plurality of conductive members are provided so as to be able to conduct to a portion where the solder ball is provided. "

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the measuring jig is the same as the measuring jig (the same applies to the jig used in the measuring method). A fixed configuration (claim 3); and a configuration in which a conductive elastic member is provided at one end of the contact surface of the conductive member (claim 4). This is a preferred embodiment.

The conductive member is not particularly limited in the present invention, but may be an Au ball or an Au ball.
It is preferable to use plated Cu balls
(Claim 5) The conductive elastic member is preferably, but not limited to, a conductive rubber (Claim 6).

[0015]

Next, the present invention will be described in detail with reference to examples of a method for measuring a semiconductor device according to the present invention and a measuring jig used in the method. It is not limited by.

(Embodiment 1) FIG. 1 shows an embodiment of the present invention.
FIG. 2 is a plan view of a measuring jig (Embodiment 1), and FIG. 2 is a sectional view taken along line AA in FIG. FIG. 3 is a schematic cross-sectional view of a use form of the jig for illustrating a measuring method using the measurement jig shown in FIG.

First, FIGS. 1 and 2 in the first embodiment.
The measurement jig 20 shown below is used for measurement after mounting a semiconductor device as described below, that is, the “BGA 13” as shown in FIG. That is, as shown in FIG. 5, as a semiconductor device to which the measuring jig 20 used in the first embodiment is applied, a semiconductor chip (53) in which a large number of contact pads are formed is attached to a glass epoxy with wiring (52). A semiconductor chip (53) is adhered to a substrate (substrate 51) with a conductive adhesive.
And the wiring (52) of the glass epoxy substrate (substrate 51) are bonded with gold wires or the like (metal wires 54 such as Au), and the surface of the semiconductor chip (53) is coated with a resin (55). Furthermore, it has a structure in which a solder ball (6) is provided on the back surface of the glass epoxy substrate, and is intended for mounting on a device base. [The symbols in parentheses are the symbols in FIG. 5 described above. same as below. ]

The semiconductor device (BG) provided with the solder ball (6) for mounting on the device substrate as described above.
A13) "is once mounted on the device board, and the semiconductor device (BGA 13) is peeled off from the device board due to a failure or the like, and the solder ball (6) is lost in the BGA4.
[In order to distinguish from the BGA 13 provided with a solder ball shown in FIG.
GA4 ″ (refer to FIG. 3)].

Since the measuring jig 20 is peeled off after the device to be measured has been mounted, the measuring jig 20 has already been soldered.
Le 6 has not retained its original shape, but this solder
By placing it between the BGA 4 and the IC socket 7 for electrical testing at the position where the ball 6 was provided, it is used as a means for conduction instead of the solder ball 6.
(See FIG. 3). In the first embodiment, the measuring jig 20
A metal ball 2 which is a conductive member is an insulating plate 1
Is fixed so as to be exposed on the front and back surfaces.

When manufacturing the measuring jig 20 of the first embodiment, first, as shown in FIG. 1, the insulating jig having the same size as the base of the BGA 4 to be measured and having a thickness of about 0.3 to 0.5 mm, for example, is used. Plate 1 (Galaeppo base is good), BGA solder ball
A hole of about 0.5 mm is made in the same arrangement as in (6).

Next, a groove enough to fit the base into a metal ball 2 (for example, Au or Cu is preferably plated with Au) having the same diameter (about 0.75 mm ± 0.1 mm) as the solder ball of the BGA. 2a is provided. Then, the metal ball 2 is
Push (press-fit) into the hole of the insulating plate 1
Thereby, the groove 2a of the metal ball 2 and the edge of the hole are fitted, and the metal ball 2 is fixed to the insulating plate 1.

The method of using the measuring jig configured as described above will be described with reference to FIG. 3. First, the measuring jig 20 is used with the lid 12 of the IC socket 7 opened. The measuring jig 20 is placed on the IC socket 7, and the BGA 4 from which the solder ball has been lost is placed thereon. Then, the lid 12 of the IC socket 7 is closed (the state shown in FIG. 3), and the BGA 4 is pressed down by the lid 12, so that the measuring jig 20 is connected to the conductive portion on the lower surface side of the BGA 4 instead of the solder ball. The IC socket electrode 11 can be electrically connected.

(Embodiment 2) FIG. 4 shows another embodiment of the present invention.
FIG. 7 is a cross-sectional view of a measuring jig (Example 2). In the second embodiment, the portion (see FIGS. 1 and 2) of the metal ball 2 described in the first embodiment above the groove 2a (see FIGS. 1 and 2) is cylindrical as shown in FIG. Metal 17 is provided, and a conductive rubber 16 as an elastic member is provided on the upper end surface of the cylindrical shape. This metal 17
The entire height of the conductive rubber 16 and the conductive rubber 16 is set to be the same as the height of the solder ball provided on the BGA 13 (about 0.75 mm ± 0.1 mm). The conductive rubber 16 is fixed to the plate 1 with its surface facing up.

The method of use in the second embodiment is the same as that of the first embodiment.
Is the same as However, in the second embodiment, since the conductive rubber 16 having elasticity is used, stable contact can be achieved even when the solder ball of the BGA slightly remains and the height of the contact surface varies. This has the advantage that conduction performance is more reliable.

[0025]

As described above, according to the present invention, a measuring jig for supplementing a solder ball of a BGA having a lost solder ball is interposed between the IC socket and the BGA. The electrical test and measurement of the lost BGA of the solder ball which could not be measured can be performed. Further, by using an elastic member such as a conductive rubber on at least one contact surface of the solder ball, even if a small amount of BGA solder ball remains and the height of the contact surface varies, it may occur. , Stable contact is possible.

As described above, according to the present invention, it is possible to peel off the BGA in which some trouble has occurred on the device from the device base and evaluate and analyze the BGA, to investigate the cause of the trouble, improve the performance, improve the reliability, It becomes possible to collect data that is indispensable for improving the degree of satisfaction.

[Brief description of the drawings]

FIG. 1 is a plan view of a measuring jig showing one embodiment (Example 1) of the present invention.

FIG. 2 is a sectional view of a portion taken along line AA in FIG.

FIG. 3 is a schematic cross-sectional view of a jig usage mode for illustrating a measurement method using the measurement jig shown in FIG.

FIG. 4 is a sectional view of a main part of a measuring jig showing another embodiment (Example 2) of the present invention.

FIG. 5 is a sectional view of a BGA.

FIG. 6 shows a test board used in the conventional measurement method of BGA.
FIG.

FIG. 7 is an enlarged sectional view of an IC socket part of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2 Metal ball 2a groove 4 BGA with missing solder ball 6 Solder ball 7 IC socket 8 Test board substrate 11 IC socket electrode 12 Lid 13 BGA having solder ball 16 Conductivity Rubber 17 Metal 20 and 21 Measurement jig 51 Substrate 52 Wiring 53 Semiconductor chip 54 Metal wire 55 Resin

Claims (6)

[Claims] After mounting a semiconductor device provided with a solder ball for mounting on a device base on the device base, the semiconductor device is peeled off from the device base again, and the solder ball is lost. Electrically testing semiconductor devices,
A method for measuring the semiconductor device, comprising:
The semiconductor device and the IC for measurement at the position where the
A method for measuring a semiconductor device, comprising: interposing a jig instead of a solder ball between a socket and a socket. 2. A semiconductor device provided with a solder ball for mounting on a device base is mounted on the device base, and then the semiconductor device is peeled off from the device base again, and the solder ball is lost. A measurement jig used when a semiconductor device is mounted on an IC socket for measurement, wherein each of a plurality of socket electrodes provided on the IC socket and a solder ball of the semiconductor device are provided. A measurement jig provided with a plurality of conductive members that enable conduction with a portion. 3. The measurement jig according to claim 2, wherein the measurement jig is fixed such that the conductive member is exposed on the front and back surfaces of an insulating plate. 4. The measuring jig according to claim 2, wherein the measuring jig is provided with a conductive elastic member on one end side of a contact surface of the conductive member. 5. The method according to claim 1, wherein the conductive member is made of Au ball or A ball.
5. The measuring jig according to claim 2, comprising a u-plated Cu ball. 6. The measuring jig according to claim 4, wherein the conductive elastic member is a conductive rubber.