JPH10190062A - Surface-mount light emitting diode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform automatic transfer, assembly, measurement, etc., on a surface mount light emitting diode constituted in a micro CSP(chip size package) in the same way as those performed on an ordinary individual parts by constituting the diode having a structure such that the polarity can be recognized. SOLUTION: A light emitting diode having an anode plate 2 and a cathode plate 5 on the surface of a light emitting diode element chip 1 parallel to the P-N junction section 1a of the ship 1 is constituted in such a structure that can make the polarities of electrodes physically recognizable by molding the side face section of the chip 1 with a light transmitting resin 6 and forming the surface of one electrode plate of the diode in a recessed shape 2a, both electrode plates to have different thickness, or a polarity recognizing mark on at least one electrode plate or combining the recessed shape, different thicknesses, and mark.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a surface mount type light emitting diode.

[0002]

2. Description of the Related Art The structure of a surface-mount type light-emitting diode of the type having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light-emitting diode and having side surfaces coated with an insulator. And the manufacturing method is disclosed in JP-A-6-275684, JP-A-6-32
No. 6365 and JP-A-7-283439, all of which are processed and manufactured in the form of a semiconductor wafer, each of which constitutes an electrode portion, is subjected to insulating coating on a side surface portion, and is divided by dicing. Surface mount type components (SM
D). Japanese Patent Application Laid-Open No. Hei 6-326365 discloses a method of forming a coating layer on a cut surface of a wafer element with a thin insulating material. Japanese Laid-Open Publication No. 7-283439 has a structure in which the wafer portion on the side surface other than the PN junction is exposed. Also, Japanese Patent Application Laid-Open No. 6-275684
In this method, an insulating material layer is molded in a groove of a mesa structure, but a special structure called a mesa structure is required. Further, in any of the above-mentioned inventions, no special consideration is given to a structure which can automatically identify an electrode plate and at the same time can process the same as a chip component such as a normal resistor or capacitor.

The inventor's own patent application, Japanese Patent Application No. 8-308674, which has been already filed, relates to a method of manufacturing a surface-mounted semiconductor device including a light-emitting diode and a surface-mounted light-emitting diode formed thereby. FIG. 5 is a perspective view showing the structure of a surface-mounted light emitting diode manufactured by this manufacturing method. This manufacturing method uses a dicing
The light emitting diode device wafer stuck on the
Each light emitting diode element chip is formed by performing full dicing to a desired chip size, and the dicing sheet on which the fully diced semiconductor element chips are adhered is expanded to a desired size, and the expanded dicing is performed. The cathode side of each light emitting diode chip on the sheet is adhesively hardened to the cathode electrode plate, the dicing sheet is peeled off, and the anode of each peeled light emitting diode chip is peeled off. After the anode side is similarly bonded and cured to the anode electrode plate, a translucent resin is filled and cured between the light emitting diode element chips, and the anode and cathode electrode plates and the filled translucent resin are filled. The light emitting diode is formed by slicing a portion of the conductive resin vertically and horizontally to separate the light emitting diodes, and the structure of the light emitting diode formed by this manufacturing method is as shown in FIG. By de element void portion is translucent resin 6 sandwiched between the electrode plates 2 and 5 of the chip 1, filled to the desired thickness, mode - were those having a rugged construction field. As shown in FIG. 5, in the above-mentioned Japanese Patent Application No. 8-308674, the weakness of the above-mentioned prior art of mechanical strength is eliminated by making the thickness of the light-transmitting resin 6 adjustable to a desired size. Although it was a chip-size package component, it had a robust structure and pursued the possibility of handling the same level as chip components such as resistors and capacitors, but it still had some problems in polarity discrimination, etc. Was.

[0004]

SUMMARY OF THE INVENTION The present invention relates to the above-mentioned Japanese Patent Application Laid-Open
275684, JP-A-6-326365 and JP-A-7
By further pushing forward the prior art disclosed in US Pat. No. 2,834,439 and the invention of Japanese Patent Application No. 8-308674, the polarity of a surface mount type light emitting diode of a very small chip size package (CSP) can be determined. By adopting a simple structure, it can be handled as easily as chip parts such as ordinary resistors and capacitors, enabling reverse mounting and prevention of incorrect wiring, and transported by automatic feeding means such as part feeders. The purpose is to be able to supply and to enable automatic assembly, measurement, etc.

[0005]

In order to achieve the above object, a surface mount type light emitting diode of the present invention comprises an anode and a cathode on a surface parallel to a PN junction of a light emitting diode element chip. In a surface-mounted light emitting diode having a cathode electrode plate, one of an anode electrode plate and a cathode electrode plate is formed of a metal plate formed into a concave shape. Further, the surface-mounted light-emitting diode of the present invention is a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light-emitting diode chip. The anode electrode plate and the cathode electrode plate are formed of metal plates having different thicknesses. Further, the surface mount type light emitting diode of the present invention has an anode and a cathode on a surface parallel to the PN junction of the light emitting diode element chip.
In a surface mount type light emitting diode having a gate electrode plate,
A mark indicating the polarity of the electrode plate is provided on at least one of the two electrode plates.
Surface-emitting light emitting diode characterized by forming a laser diode
De. Further, the surface-mounted light-emitting diode of the present invention is a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light-emitting diode chip. The side surface of the light emitting diode element chip was coated with a desired thickness with a translucent resin, and one of an anode electrode plate and a cathode electrode plate was formed of a concavely shaped metal plate. It is characterized by: Further, the surface mount type light emitting diode of the present invention is a light emitting diode element chip having a P
In a surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to the N junction, a light emitting diode is provided.
It is characterized in that the side surface of the element chip is coated with a desired thickness with a translucent resin, and the anode electrode plate and the cathode electrode plate are formed of metal plates having different thicknesses. Further, the surface mount type light emitting diode of the present invention has an anode and a cathode on a surface parallel to the PN junction of the light emitting diode element chip.
In a surface mount type light emitting diode having a gate electrode plate,
The light emitting diode element chip has a side surface coated with a desired thickness with a translucent resin, and a mark representing the polarity of the electrode plate is formed on at least one of the two electrode plates. . Furthermore, the surface-mounted light emitting diode of the present invention
In a surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to the PN junction of the light emitting diode element chip, the side surface of the light emitting diode element chip has a light transmitting property. It is characterized in that it is molded to a desired thickness with a resin, and one of an anode electrode plate and a cathode electrode plate is formed of a concavely shaped metal plate. Further, the surface-mounted light-emitting diode of the present invention is a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light-emitting diode chip. The side surface of the light emitting diode element chip is molded to a desired thickness with translucent resin.
The anode electrode plate and the cathode electrode plate are formed of metal plates having different thicknesses. Further, the surface-mounted light-emitting diode of the present invention is a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light-emitting diode chip. The light emitting diode element chip has a side surface molded with a light-transmitting resin to a desired thickness, and a mark representing the polarity of the electrode plate is formed on at least one of the two electrode plates. . Further, the surface-mounted light-emitting diode of the present invention has a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to the PN junction of the light-emitting diode element chip.
The light emitting diode element chip side surface is coated to a desired thickness with a translucent resin, and the light emitting diode element chip side surface is further coated to a desired thickness with a translucent resin. In the molded product, the center of the dowel on the back surface of the concave portion formed on one electrode plate substantially overlaps the center line of the light emitting diode sandwiched between the two electrode plates. I have. Further, the surface-mounted light-emitting diode of the present invention comprises a surface-mounted light-emitting diode having an anode and a cathode electrode plate on a surface parallel to the PN junction of the light-emitting diode element chip, and furthermore a light-emitting diode. -The side of the element chip coated with a desired thickness with a translucent resin; and
Further, a concave portion formed on one of an anode electrode plate and a cathode electrode plate, for example, when the side surface of a light emitting diode element chip is molded to a desired thickness with a translucent resin. Is characterized in that it also serves as the type of the electrode plate and its polarity display mark. Further, the surface-mount type light emitting diode of the present invention has an anode and a cathode electrode plate on a surface parallel to the PN junction of the light emitting diode element chip. Either one is formed of a metal plate formed into a concave shape and the side surface of the light emitting diode element chip is coated with a desired thickness by a translucent resin, A light-emitting diode coated to a desired thickness with a light-transmitting resin excluding a cathode and a cathode electrode plate, and the side surface of the molded light-emitting diode is symmetric with respect to the center line of the light-emitting diode; It is characterized by having the same rectangular shape.

[0006]

1 to 4 are explanatory views for explaining the structure of a surface mount type light emitting diode according to the present invention. FIG. 1 is a front view, and FIG. 2 is a view from the anode side. Perspective view,
FIG. 3 is a perspective view seen from the cathode side, and FIG.
FIG. 4 is a sectional view taken along the arrow IV. As can be seen from the figure, a light emitting diode element chip 1 exists in the center and its PN junction 1a
At both ends 1b (on the anode electrode side) and 1c (on the cathode electrode side) parallel to, the anode electrode 2 and the cathode electrode 5 are provided with a conductive sheet or silver paste 3, 4, respectively. The anode electrode plate 2, the cathode electrode plate 5, and the light emitting diode element chip 1 are bonded and fixed so as to sandwich this.
The gap formed by the molding is filled with a desired thickness by the translucent epoxy resin 6, and the side surface of the light emitting diode chip 1 is formed by the two electrode plates 2 and 5 and the translucent epoxy resin 6. It has a solid block structure that is mechanically protected from the outside and has a rectangular parallelepiped shape as a whole. The anode electrode plate 2 is made of a copper or copper alloy plate, and the outside thereof is formed in a concave portion 2a and the inside thereof is formed in a convex portion 2b (a dowel portion) by half blanking press working. The cathode electrode plate 5 is also made of copper or copper alloy,
The outside is a minus mark (-) 5 by pressing.
a is formed. And a dowel portion 2 of the anode electrode plate.
a is bonded to the anode electrode side 1b of the light emitting diode element chip 1 by a silver paste or a conductive sheet 3 so as to substantially coincide with the center line CL of the light emitting diode element chip 1. The side 5b of the cathode electrode plate 5 where no minus mark is present is bonded to the cathode electrode side 1c of the light emitting diode element chip 1 by silver paste or a conductive sheet 4. As described above, the gap formed by the light emitting diode chip 1 and the two electrode plates 2 and 5 is filled with the translucent epoxy resin 6,
The light-emitting diode element chip 1 is protected from the outside by the two electrode plates 2, 5 and the translucent epoxy resin 6, and as a whole, is substantially symmetric with respect to a center line CL perpendicular to the PN junction 1a and has four side surfaces. Have the same rectangular shape. The surface of each electrode plate is coated with solder or gold plating 7, 8 so that it can be surface-mounted. still,
In the case of this embodiment, the anode electrode 2 is 500 microns ×
A 500 micron square with a thickness of 200 micron, the cathode electrode 5 is a 500 micron x 500 micron square with a thickness of 300 micron, and the translucent epoxy resin 6 mold has a cross section of both electrode plates 2,5. Same 500 microns x 5
The square is 00 micron, and the sides are 500 micron x 400 micron rectangular on all sides, and the light emitting diode is 500 micron x 900 micron overall.
It goes without saying that these numerical values are merely examples of this embodiment and the present invention is not limited to these.
In this embodiment, the anode electrode plate is formed in a concave shape, which indicates that the electrode plate formed in the concave shape is an anode (type) and has a positive pole. In short, the concave shape is for distinguishing one from the other, and conversely, the cathode electrode plate may be formed in a concave shape.
In this case, the portion formed in a concave shape is a cathode (kind) and represents a negative pole. By forming a concave shape in this way, even if there is no + -mark display, the polarity can also be displayed. In this embodiment, a negative mark (-) is positively applied to the cathode electrode plate to display the polarity. The cathode electrode plate may be formed in a concave shape, and a positive mark (+) may be positively provided only on the anode electrode plate. Except for the identification of these electrode plates, the molding method using the translucent epoxy resin 6 is basically the same as that described in Japanese Patent Application No. 8-308674. The operation of the above structure will be described below.

Since the surface of the anode electrode plate 2 is formed of a metal plate formed in a concave shape 2a, it can be distinguished from the cathode electrode plate 5 in shape, and at the same time, the polarity of the electrode can be determined. Incorrect wiring can be prevented. In this embodiment, the anode electrode plate 2 has a thickness of 200 microns and a cathode.
Since the thickness of the electrode plate 5 is different from 300 microns, it can be distinguished from the cathode electrode in shape, and the polarity of the electrode can be determined at the same time. Similarly, reverse mounting and erroneous wiring can be prevented. Since a minus mark (-) is formed on the cathode electrode, the discriminating function can be further visually enhanced. As a result, shape identification and electrode discrimination became extremely easy, and assembling work and wiring work were significantly improved. Further, it is determined whether or not the portion 2b (convex portion) of the half-cut dowel having a size equal to or smaller than the chip size of the anode electrode plate 2 substantially matches the center line CL of the light emitting diode element chip. Since it can be seen through the surface of the translucent epoxy resin 6, it is possible to easily determine whether or not the light emitting diode element chip 1 is misaligned, thereby making the centering work extremely easy, and The stability of the judgment and the quality of assembly can be obtained. In addition to these discernible structures of the electrodes, the sides 5
Since it has a size of 00 μm × 900 μm, the characteristics and reliability of the light emitting diode are not affected even if any of the four surfaces is mounted and fixed. In addition, even if the light emission characteristics are measured, the same operation is performed from any of the four surfaces, so that it is not necessary to select the surface, and the setting operation for the measurement is facilitated. Similarly, since the above-mentioned structure and side surfaces of the electrode plate that can be distinguished have the same rectangular shape, they can be easily aligned and transported by a part feeder or the like in the same manner as ordinary parts. Assembly work has become easier. For the same reason, the direction of the application of the measurement voltage and the direction of the measurement of the light emission characteristics are also determined, so that the measurement and sorting work can be automatically and continuously performed independently of chip components such as ordinary resistors and capacitors.
In the above, the most preferred embodiment of the present invention has been described as a development of Japanese Patent Application No. 8-308674. The technique of forming a polar mark on an electrode plate can of course be effectively applied to any side-coating or molding light-emitting diode as long as it has a type having both electrode plates. It is.

[0008]

As is apparent from the above description, the surface mount type light emitting diode of the present invention enables the polarity to be distinguished in itself even though it is a very small chip size package component. Since it has a shape, it is easy to handle. For both the manufacturer and the set maker, the same parts as those for resistors and capacitors and parts feeders are used. The automatic conveyance supply and the automatic assembly measurement and sorting are easy, so that the conventional assembly line can be used without any change, and the effect on the yield and productivity is enormous.

[Brief description of the drawings]

FIG. 1 is a front view of a surface mount type light emitting diode according to the present invention.

FIG. 2 is a perspective view of the surface mount type light emitting diode according to the present invention as seen from the anode side.

FIG. 3 is a perspective view of the surface mount type light emitting diode according to the present invention as viewed from the cathode side.

FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2;

FIG. 5 is a perspective view showing the structure of a surface-mounted light emitting diode manufactured by the manufacturing method of Japanese Patent Application No. 8-308674.

[Explanation of symbols]

 Reference Signs List 1 light emitting diode element chip 1a PN junction 1b anode electrode side of light emitting diode element chip 1c cathode electrode side of light emitting diode element chip 2 anode electrode plate 2a concave part 2b dowel part (convex) 3) Silver paste or conductive sheet 4 Silver paste or conductive sheet 5 Cathode electrode plate 5a Minus mark 5b Minus mark-free side 6 Translucent epoxy resin 7 Solder or gold plating 8 Solder or gold plating

Claims (12)

[Claims] 1. A surface-mounted light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light emitting diode element chip. -A surface-mounted light emitting diode characterized in that one of the electrode plates is formed of a metal plate formed into a concave shape-
De. 2. A surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light emitting diode element chip, wherein said anode electrode plate and a cathode are connected to each other. A surface-mounted light-emitting diode in which a metal plate having a thickness different from that of a gate electrode plate is formed. 3. A surface-mounted light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of a light emitting diode element chip, wherein at least one of the two electrode plates is provided. A surface-mounted light emitting diode, wherein a mark indicating the polarity of the electrode plate is formed. 4. A surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip. A surface characterized in that a side portion is coated with a desired thickness with a translucent resin, and one of the anode electrode plate and the cathode electrode plate is formed of a concavely shaped metal plate. Mounting type light emitting diode. 5. A surface-mounted light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip. A surface-mounted light emitting device characterized in that a side portion is coated with a desired thickness with a translucent resin, and the anode electrode plate and the cathode electrode plate are formed of metal plates having different thicknesses. Diode. 6. A surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip. A surface mount type light emitting diode characterized in that a side portion is coated with a desired thickness with a translucent resin, and a mark representing the polarity of the electrode plate is formed on at least one of the two electrode plates. De. 7. A surface-mounted light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip. A surface characterized in that a side surface portion is molded to a desired thickness with a translucent resin, and one of the anode electrode plate and the cathode electrode plate is formed of a concavely shaped metal plate. Mounting type light emitting diode. 8. A surface mount type light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip, wherein a side surface of the light emitting diode element chip is provided. A surface-mounted light emitting diode, wherein the part is molded to a desired thickness with a translucent resin, and the anode electrode plate and the cathode electrode plate are formed of metal plates having different thicknesses. -Do. 9. A surface-mounted light emitting diode having an anode and a cathode electrode plate on a surface parallel to a PN junction of the light emitting diode element chip. A surface mount type light emitting diode characterized in that a side portion is molded to a desired thickness with a translucent resin, and a mark representing the polarity of the electrode plate is formed on at least one of the two electrode plates. De. 10. A center of a dowel on a back surface of a concave portion provided on one of the electrode plates substantially overlaps a center line of a light emitting diode sandwiched between the two electrode plates. A surface-mounted light-emitting diode according to any one of Claims 4, 4 and 7. 11. The method according to claim 1, wherein the concave portion formed on one of the anode electrode plate and the cathode electrode plate also serves as a type of the electrode and a polarity display mark thereof. A surface-mounted light emitting diode according to any one of claims 4 and 7. 12. A light emitting diode coated or molded to a desired thickness with a translucent resin excluding the anode electrode plate and the cathode electrode plate has a light emitting diode side surface. 8. The surface-mounted light emitting diode according to claim 4, wherein the light emitting diode is symmetric with respect to a center line of the diode and has the same rectangular shape.