JPH10189841A - Heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance certainty of contact of a heat sink with a heat-generating component by a method, wherein a plurality of fixing legs which reach the rear side of a board by sandwiching the heat-generating component are provided from a heat sink body which promotes the dissipation of heat from the heat-generating component mounted on the board. SOLUTION: A heat sink body 2 is formed to be a planar shape which is a regular square or the like, so as to match a heat-generating component 5, a plurality of radiating fins 2a are arranged on the surface side, the rear side is formed as a heat-absorbing face which absorbs heat from the heat-generating component 5, and legs 3 used to fix the heat-absorbing face 2b are arranged at four corners. When a heat sink 1 is attached to a board 4, the legs 3 for fixation are inserted into fixation holes 4a, and the heat sink 1 is placed on the heat-generating component 5 in such a way that the heat-absorbing face 2b at the heat sink 1 comes into contact with the heat- generating component 5. Then, the heat sink 1 is set to a state that it presses the heat-generating component 5, the legs 3 for fixation are soldered from the rear of the board 4, and the heat sink 1 is fixed to the board 4 by means of a solder 7. Thereby, the certainty of contact of heat sink with the heat-generating component can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a heat sink fixing structure for preventing a heat sink from coming off from a heat-generating component.

[0002]

2. Description of the Related Art Conventionally, when an electronic component such as an LSI mounted on a substrate has a large amount of heat dissipation during operation, heat dissipation is actively promoted by attaching a heat sink.

For the heat sink and the heat-generating component, for example, a technique of radiating heat from the heat-generating component by interposing a double-sided adhesive tape having high thermal conductivity between the heat sink and the heat-generating component has been selected.

[0004]

However, with the technique of interposing a double-sided adhesive tape as described above, the following inconvenience may occur. Due to aging, the adhesive material of the double-sided adhesive tape deteriorates. As a result, a gap is generated between the heat generating component and the heat sink. Heat transfer is reduced and the heat dissipation effect is reduced. The heat sink comes off the heat-generating component and contacts other components.

The present invention has been made in view of the above circumstances, and aims to achieve the following objects. Improve the heat dissipation effect. Improve the reliability of contact between the heat sink and the heat-generating component. Improve the reliability of the heat radiation effect against aging. Prevent the heat sink from coming off. To improve workability and economy when fixing the heat sink.

[0006]

Means for Solving the Problems A structure having a heat sink body for promoting heat radiation of a heat generating component mounted on a substrate, and a plurality of fixing legs extending from the heat sink body to the back side of the substrate with the heat generating component interposed therebetween. Is done. The plurality of fixing legs are plated with solder and are arranged in a plurality at the periphery of the heat sink body. The fixing leg is inserted into the fixing hole of the board and the technique of fixing the heat sink body to the board by soldering, or the hook part is arranged on the fixing leg, and the fixing leg is twisted at the back side of the board By doing so, a technique for fixing the heat sink body to the substrate in a hooked state is selected. A heat conductive layer for promoting heat transfer is disposed between the heat sink body and the heat generating component.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a heat sink according to the present invention will be described below with reference to the drawings. 1 or 2, reference numeral 1 denotes a heat sink, 2 denotes a heat sink body, 3 denotes a fixing leg, 4 denotes a substrate, 5 denotes a heat-generating component, 6
Is a heat conductive layer.

The heat sink 1 has a heat sink main body 2 for promoting heat radiation of the heat generating component 5 mounted on the substrate 4, and fixing legs 3 extending from the heat sink main body 2 to the back side of the substrate 4 with the heat generating component 5 interposed therebetween. And has a solder plating finish.

The heat sink body 2 has, for example, a square or rectangular planar shape in accordance with the shape of the heat-generating component 5, and has a plurality of radiating fins 2a on its front side as shown in FIG. 1 or FIG. The back side is a heat absorbing surface 2b that absorbs heat from the heat generating component 5, and fixing legs 3 of the heat absorbing surface 2b are arranged at four corners.

The fixing leg 3 is set to a length that can be soldered at the back surface position of the substrate 4 in a mounted state.

[0011] As shown in FIG.
(Quad Flat Package), DIP (Dual Inline Packag)
e) The heat-generating component 5 that generates a large amount of heat during operation is mounted,
The fixing hole 4a is arranged around the heat-generating component 5 as a position where the fixing leg 3 can be inserted.

When the heat sink 1 is mounted on the substrate 4, the fixing leg 3 is inserted into the fixing hole 4a, and the heat sink 1 is mounted on the heat generating component 5 so that the heat absorbing surface 2b of the heat sink 1 contacts the heat generating component 5. Place. Then, with the heat sink 1 pressed against the heat-generating component 5, the fixing leg 3 is soldered from the back surface of the substrate 4 as shown in FIG. You.

At this time, the heat absorbing surface 2b of the heat sink 1
A heat conductive layer 6 made of silicon rubber or the like is inserted between the heat generating components 5 so as to improve adhesion and improve heat conduction.

In such a heat sink 1, since the heat sink 1 is directly fixed to the substrate 4 via the fixing leg 3, it is possible to prevent the heat sink 1 from floating due to aging and the heat sink 1 from coming off due to external force such as vibration or impact. it can. Further, since it is fixed to the substrate 4 by soldering, it is possible to solder simultaneously with other electronic components.

Hereinafter, a second embodiment of the heat sink according to the present invention will be described with reference to the drawings. 3 to 5, reference numeral 3a denotes a hook portion.

The second embodiment differs from the first embodiment in that, as shown in FIGS. 3 and 4, a hook 3a is provided on the fixing leg 3, and the hook 3a is connected to the fixing leg on the same side. 3 and is in a protruding state. Fixing hole 4a of substrate 4
Is arranged in a position where the fixing leg 3 including the hook portion 3a can be inserted, and the hook portion 3a can be hooked on the substrate 4 by twisting the fixing leg 3 at a position on the back side of the substrate 4. It is said.

When the heat sink 1 is mounted on the substrate 4, the fixing legs 3 are inserted into the fixing holes 4a, and the heat sink 1 is mounted on the heat generating component 5 so that the heat absorbing surface 2b of the heat sink 1 contacts the heat generating component 5. Place. Then, while the heat sink 1 is pressed against the heat-generating component 5, the hook 3 a of the fixing leg 3 is twisted at a position on the back side of the substrate 4 as shown by an arrow A in FIG. As shown, the hook portion 3a is hooked around the fixing hole 4a of the substrate 4 and the heat sink 1 is fixed to the substrate 4.

At this time, the heat absorbing surface 2b of the heat sink 1
A heat conductive layer 6 made of silicon rubber or the like is inserted between the heat generating components 5 so as to improve adhesion and improve heat conduction.

In such a heat sink 1, since the hook portion 3a is fixed to the substrate 4 by being hooked on the substrate 4, the heat sink 1 floats due to aging and the heat sink 1 due to external force such as vibration or impact. Can be prevented from coming off. Further, since the fixing leg 3 is fixed to the substrate 4 by twisting, it can be attached even in a situation where soldering cannot be performed. Since the cross-sectional area of the base of the fixing leg 3 is smaller than that of the hook 3a, it is easy to twist the base.

[0020]

According to the heat sink of the present invention, the following effects can be obtained. (1) Since the fixing legs are arranged on the heat sink body and are directly fixed to the substrate, it is possible to improve the reliability of the contact between the heat sink and the heat generating component. (2) Since the fixing legs are fixed by soldering or hooking by hooks, the reliability of the heat radiation effect against aging can be improved. (3) Since the fixing legs are fixed by soldering or hooking by hooks, the heat sink can be prevented from coming off due to external force such as vibration or impact. (4) Since the fixing leg is fixed by soldering or twisting of the hook portion, workability and economic efficiency in fixing the heat sink can be improved. (5) Since the heat sink is fixed to the heat-generating component in a pressed state, the heat radiation effect can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an attached state of a first embodiment of a heat sink according to the present invention.

FIG. 2 is a side view showing a fixed state of the heat sink of FIG. 1;

FIG. 3 is a perspective view showing an attached state of a heat sink according to a second embodiment of the present invention.

FIG. 4 is an enlarged view showing a hook portion of the fixing leg of FIG. 3;

FIG. 5 is a perspective view showing a state in which a hook portion of the fixing leg of FIG. 3 is latched;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heat sink 2 ... Heat sink main body 2a ... Heat radiating fin 2b ... Heat absorption surface 3 ... Fixing leg 3a ... Hook part 4 ... Board 4a ... Fixing hole 5 ... Heat generating component 6 ... Thermal conductive layer 7 ... Solder

Claims (5)

[Claims] A heating component (5) mounted on a substrate (4)
A heat sink comprising: a heat sink body (2) for promoting heat radiation; and a plurality of fixing legs (3) extending from the heat sink body to the back side of the substrate with a heat-generating component interposed therebetween. 2. The heat sink according to claim 1, wherein a plurality of fixing legs are arranged around the heat sink body. 3. The fixing leg (3) is inserted into a fixing hole (4a) of the substrate (4) and fixes the heat sink body (2) to the substrate by soldering. The described heat sink. 4. The fixing leg (3) is provided with a hook portion (3a), and the fixing leg is twisted at a position on the back side of the substrate (4) so that the heat sink body (2) is locked. 3. The fixing device according to claim 1, wherein
The described heat sink. 5. A heat conductive layer (6) for promoting heat transfer is provided between the heat sink body (2) and the heat generating component (5). , 3
Or the heat sink according to 4.