JPH10185946A - Capacitance type sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitance type sensor device that is unsusceptible to an outer environment. SOLUTION: The capacitance type acceleration sensor device comprises capacitance type acceleration sensor element 10 and a stem 1 to which the sensor element 10 is mounted. Only one of the side faces (a to-be-mounted surface) of the sensor element 10 is bonded to an inner side wall (a mounting surface) of the stem 1 with an adhesive resin 3. The area of the side face of the sensor element 10 is smaller than that of the bottom face, and the width (or length) of the sensor element 10 is generally longer than the thickness thereof. The side face on which the sensor element 10 is mounted is perpendicular to a vibration direction of a movable electrode 15. As a result, even when variation of an outer environment (e.g. temperature) causes the stem 1 to be deformed, the sensor element 10 is not affected by it, thereby an accurate detecting of an acceleration can be effected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitance type sensor including an acceleration sensor, a pressure sensor and the like.

[0002]

2. Description of the Related Art FIG. 12 shows a conventional example of a capacitance type acceleration sensor device in which a capacitance type acceleration sensor element is mounted on a resin stem. (A) is a sectional view taken along line XII-XII of (B), and (B) is a plan view of the capacitive acceleration sensor device.

The bottom surface of the capacitive acceleration sensor element 50 is bonded to the inner bottom surface of a resin stem 61 on which a lead frame 62 is insert-molded by an adhesive resin 64. Stem
The inner bottom surface of 61 is the mounting surface of the sensor element 50.

The capacitive acceleration sensor element 50 is composed of an upper fixed substrate 51 and a lower fixed substrate 52 made of an insulating material such as glass, and a conductive silicon semiconductor substrate 53 sandwiched therebetween. .

The silicon semiconductor substrate 53 has a frame portion 54,
A weight portion 55 and a beam portion 56 connecting these are formed. Since the beam portion 56 is formed thin, the weight portion 55 vibrates up and down according to the applied acceleration. The weight 55 serves as a movable electrode.

The surfaces of the upper fixed substrate 51 and the lower fixed substrate 52 facing the weight 55 are fixed electrodes 57 and 58, respectively.
Are formed respectively. When acceleration is applied from the upper surface (or lower surface) of the sensor element 50, the capacitance between the weight 55 and the two fixed electrodes 57, 58 changes. Acceleration is detected based on these changes in capacitance.

On the upper surface of the upper fixed substrate 51, two pairs of bonding pads 68a are provided on the left and right sides, respectively, for a fixed electrode and a movable electrode. One pair of bonding pads 68a is a movable electrode 55 and a fixed electrode.
57 is electrically connected through a wiring pattern and a connection hole (not shown), and the other pair of bonding pads 68a is connected to the movable electrode 55 and the fixed electrode 58.

As described above, two lead frames 62 are provided on the left and right sides of the stem 61, respectively. Stem 61
Bonding pad 68b provided on the step 61a of
And the corresponding ones of the lead frames 62 are electrically connected to each other.

The bonding pads 68a and the corresponding bonding pads 68b are electrically connected by wires 63, respectively. Thus, the movable electrode 55 and the fixed electrodes 57 and 58 of the capacitance type acceleration sensor element 50 are connected to an external acceleration detection circuit (not shown) through the lead frame 62.

[0010] The capacitance type pressure sensor is also formed by joining a fixed substrate and a semiconductor substrate, and a thin diaphragm portion is formed on the semiconductor substrate. A movable electrode is provided on the diaphragm, and a fixed electrode is provided on the fixed substrate. The diaphragm is displaced according to the difference between the measured pressure introduced from outside and the reference pressure (atmospheric pressure or vacuum pressure), and the capacitance between the movable electrode and the fixed electrode changes accordingly. The measured pressure is detected based on the capacitance between the movable electrode and the fixed electrode.

In a capacitance type sensor, an external force to be measured is detected based on an electrode distance (capacitance) between a movable electrode and a fixed electrode. It is desirable that it does not change. However, the stem and the sensor element (a glass substrate and a silicon semiconductor substrate) expand or contract due to changes in the external environment (temperature, pressure, humidity, etc.) and changes over time in the material used.

In the structure of a conventional capacitance type sensor, the inner bottom surface of the stem is a mounting surface, and the bottom surface of the sensor element is mounted on this mounting surface. Therefore, the following problem occurs. (1) Since the area of the bottom surface of the mounted sensor element is large, the influence of the stress generated on the stem is easily transmitted.
(2) The bottom surface of the stem is easily deformed in the direction of vibration of the movable electrode of the sensor element, so that the stress generated in the stem easily changes the electrode interval, which easily affects the output characteristics of the sensor element.

[0013]

DISCLOSURE OF THE INVENTION The present invention provides a capacitive sensor which is hardly affected by changes in the external environment and the like.

According to the present invention, there is provided a capacitance type sensor element for converting a change in external force into a corresponding change in capacitance, and a supporting member having a recess for accommodating the sensor element therein, and at least one surface in the recess is provided. A mounting surface on which the mounting surface of the sensor element is fixed to the mounting surface, wherein the mounting surface of the support member faces in a direction different from the direction in which external force is applied; Is characterized in that the surface to be mounted faces a direction different from the direction in which external force is applied.

In general, a capacitive sensor element has a large surface to which external force is applied (and a surface facing the external force), and a different surface (external force is applied to the front and back surfaces (upper and lower surfaces) of the sensor element). When it is done, the side corresponding to the side) is small. According to the present invention, since a surface having a small area different from the surface of the sensor element in the direction in which the external force is applied is used as the mounting surface, the stress transmitted from the support member to the sensor element can be reduced. Further, since the mounting surface of the support member is also different from the direction in which external force is applied, the direction in which stress is transmitted from the mounting surface of the support member to the surface on which the sensor element is mounted is different from the vibration direction of the movable electrode. Therefore, the stress from the support member is unlikely to cause a change in the capacitance of the sensor element.

As described above, according to the present invention, a capacitance type sensor which is hardly affected by the deformation of the support member due to the change of the external environment or the stress generated therein is realized.

Preferably, the mounting surface of the sensor element is fixed to the mounting surface with an adhesive resin. Since the surface of the sensor element facing the direction in which the external force is applied merely contacts the support member, it is less affected by the deformation and stress of the support member.

In one embodiment, a first protruding member is provided on a part of the mounting surface, and an adhesive is filled around the first protruding member. In another embodiment, a step is provided on the mounting surface and a part thereof is dented, and an adhesive resin is filled between the dented part and the mounting surface of the sensor element. The filled adhesive resin has a buffering effect on stress.

The present invention also provides a capacitance type sensor in which a sensor element is fixed to a support member without using an adhesive resin. According to the present invention, an elastic member is provided on at least a part of the mounting surface, and the sensor element is fixed in the support member by the elastic member. Since the sensor element is not joined to the support member and the elastic member buffers the stress, the stress generated in the support member is not easily transmitted to the sensor element.

In another embodiment, a second protruding member is provided on a part of the mounting surface, and a concave portion is formed on a portion of the mounting surface of the sensor element facing the second protruding member. The second projection member is engaged with the recess. Since the sensor element is restrained by the support member by the snap,
There is no need to fix the sensor element to the support member with an adhesive resin or the like. Since the sensor element is not joined to the support member, stress generated in the support member is not easily transmitted to the sensor element. Further, the snap can prevent the sensor element from falling off the support member.

Preferably, the support member is provided with a locking member for locking the sensor element to the support member. A cover may be provided at an opening of the support member, and a member for holding the sensor element may be provided between a lower surface of the cover and an upper surface of the sensor element. The sensor element can be prevented from falling off the support member.

[0022]

【Example】

First Embodiment FIG. 1 shows a capacitance type acceleration sensor device according to a first embodiment. (A) is a sectional view taken along the line II of (B), and (B) is a plan view of the capacitive acceleration sensor device. In FIG. 1 (A), for the convenience of drawing and for clarity,
The thickness of the members forming the sensor element is emphasized to be thicker. This is the same in other embodiments described later.

The capacitance type acceleration sensor device comprises a capacitance type acceleration sensor element 10 and a stem (package) 1 in which the sensor element 10 is mounted. The stem 1 is formed by four side walls and a bottom wall, and the upper surface is open. The inner surface of one side wall of the stem 1 is a mounting surface of the sensor element 10, and the side surface of the acceleration sensor element 10 is adhered to the mounting surface by the adhesive resin 3.

The capacitive acceleration sensor element 10 is of a differential type, and includes an upper fixed substrate 11, a lower fixed substrate 12,
Further, it is constituted by a conductive silicon semiconductor substrate 13 sandwiched between the fixed substrates 11 and 12. The upper fixed substrate 11 and the lower fixed substrate 12 are formed of an insulating material such as glass. Substrates 11 and 12 formed of glass are anodically bonded to semiconductor substrate 13. Substrates 11 and 12 can also be formed using a semiconductor material. In this case, the substrates 11 and 12 are joined to the semiconductor substrate 13 via an insulator.

The silicon semiconductor substrate 13 includes a frame portion (or support portion) 14 having a frame shape, a beam portion 16, and a truncated inverted pyramid-shaped weight portion 15 supported in a cantilever manner by the beam portion 16. ing. These are preferably formed by performing vertical etching on the silicon semiconductor substrate 13 with high accuracy using an alkaline etching solution. The frame part 14 is anodically bonded to the upper fixed substrate 11 and the lower fixed substrate 12.

The beam 16 is formed to be quite thin. The number of beams may be two or more instead of one. The weight portion 15 is also formed to be slightly thinner than the frame portion 14, and a minute gap is formed between the weight portion 15 and the upper fixed substrate 11 and the lower fixed substrate 12. Since the weight portion 15 is formed by the silicon semiconductor substrate 13, it has conductivity and is used as a movable electrode.

The beam 16 has elasticity. The weight part 15 supported by the beam part 16 vibrates up and down according to the applied acceleration.

Each of the upper fixed substrate 11 and the lower fixed substrate 12 has one fixed electrode 21 and one fixed electrode 22 formed on a surface facing the weight portion 15. The fixed electrodes 21 and 22 are formed on the upper fixed substrate 11 and the lower fixed substrate 12 by evaporating aluminum or the like. The fixed electrode 21 and the movable electrode 15 make a pair. The fixed electrode 22 and the movable electrode 15 form another pair.

On the upper surface of the upper fixed substrate 11, two pairs of bonding pads 18a for the movable electrode and the fixed electrode are provided on the left and right, respectively. One pair of bonding pads 18a is a movable electrode 15 and a fixed electrode.
21 is electrically connected through a wiring pattern and a connection hole (not shown), and the other pair of bonding pads 18 a is connected to the movable electrode 15 and the fixed electrode 22.

Two lead frames 2 are provided on the left and right sides of the stem 1 by insert molding, respectively, and project outward from the stem 1. A step portion 1a is formed all around the side wall of the stem 1, and bonding pads 18b are provided on the upper surface of the step portion 1a on the left and right sides, respectively.
Are provided one by one. These bonding pads
18b is electrically connected to the corresponding lead frame 2.

The four bonding pads 18b provided on the upper surface of the step portion 1a of the stem 1 and the four bonding pads 18a formed on the upper surface of the sensor element 10 (the upper surface of the upper fixed substrate 11), respectively. Are electrically connected to each other by bonding wires (gold wire, aluminum wire, etc.) 17.

In this manner, the movable electrode 15 and the fixed electrodes 21 and 22 of the acceleration sensor element 10 are connected to an external acceleration measuring circuit (not shown) through the lead frame 2.

An acceleration is applied to the sensor element 10 from above or below in FIG. When acceleration is applied to the sensor element 10, the weight 15 of the silicon semiconductor substrate 13
Vibrates up and down, whereby the capacitance between the weight (movable electrode) 15 and the fixed electrode 21 (referred to as first capacitance)
Changes. The weight (movable electrode) 15 and the fixed electrode 22
(The second capacitance) also changes. The measured acceleration is detected based on these changes in capacitance.

The inner surface of the side wall of the stem 1 is a sensor element.
10 mounting surfaces. The side surface of the sensor element 10 is bonded to the inner surface of the side wall. Since the side surface of the sensor element 10 has a smaller area than the bottom surface, the stress transmitted from the stem 1 is small. Further, since the width (or length) of the sensor element is generally longer than its thickness, deformation due to stress transmitted to the side surface of the sensor element 10 is small. Since the side surface on which the sensor element is mounted is perpendicular to the direction of vibration of the movable electrode 15, the gap between the movable electrode and the fixed electrode hardly changes or is small due to the influence of the stress transmitted to this side surface. Further, since the adhesive resin 3 joining the sensor element 10 and the stem 1 has elasticity, the adhesive resin 3 has a function of buffering the stress generated in the stem 1.

As a result, the influence on the sensor element 10 due to a change in the external environment or the like can be reduced, and a more accurate acceleration can be detected.

The bottom surface of the sensor element 10 and the stem 1 are in contact but not joined. Therefore, the stress from the stem 1 is hardly transmitted on the bottom surface of the sensor element 10,
The output of the sensor element 10 is hardly affected.

The sensor element 10 shown in the first embodiment is a differential capacitive sensor element in which fixed electrodes 21 and 22 are provided on the upper and lower surfaces of a movable electrode (weight portion) 15, respectively. is there. In the differential type, the effect of removing the influence of the external environment and the like becomes more remarkable. In the differential type, a difference between a first capacitance between the movable electrode 15 and the fixed electrode 21 and a second capacitance between the movable electrode 15 and the fixed electrode 22 (or a difference between them). The acceleration is calculated based on ()). Even if the fixed substrates 11 and 12 are slightly deformed due to thermal deformation, etc., the change in the capacitance between the electrodes due to this deformation is
This is because the difference between the two capacitances is almost canceled. Therefore, the influence of not only the deformation of the stem 1 but also the deformation of the fixed substrates 11 and 12 on the output of the capacitance type sensor element 10 can be reduced.

As shown in FIG. 2, a resin reservoir groove 30a is preferably formed in the lower part of the mounting surface over the entire width thereof. When the side surface of the sensor element 10 is adhered to the mounting surface using the adhesive resin 3, excess adhesive resin enters the groove 30 a, so that the adhesive resin does not protrude to the bottom surface of the sensor element 10.
This prevents the bottom surface of the sensor element 10 from being adhered to the bottom surface of the stem 1B.

As shown in FIG. 3, the resin reservoir groove 30b may be formed on the bottom surface of the stem 1C and in a portion in contact with the mounting surface.

Second Embodiment FIG. 4 shows a capacitance type acceleration sensor device according to a second embodiment. (A) is a sectional view taken along the line IV-IV of (B), and (B) is a plan view of the capacitive acceleration sensor device. The same components as those shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted. This is the same in the capacitance type acceleration sensor devices of the third to sixth embodiments described later.

The point different from the structure of the acceleration sensor device shown in FIG. 1 is that the projection member 4 is provided on the mounting surface of the stem 1, and the side surface (mounting surface) of the sensor element 10 and the side wall of the stem 1 The point is that the distance from the inner surface (mounting surface) is large.

The sensor element 10 is disposed such that its mounting surface is in contact with the tip of the protruding member 4 and its bottom surface is in contact with the inner bottom surface of the stem 1. The adhesive resin 3 is filled between the side surface of the sensor element 10 and the inner surface of the side wall of the stem 1.

The distance between the side surface of the sensor element 10 and the inner surface of the side wall of the stem 1 can be ensured more than the width corresponding to the height of the projection member 4. The adhesive resin 3 is poured into the gap, and the adhesive resin 3 has a thickness corresponding to the gap. Since the adhesive resin 3 having such a thickness more effectively buffers the stress transmitted from the stem 1, the influence of the deformation of the stem due to a change in the external environment or the like on the sensor element can be reduced.

Third Embodiment FIG. 5 shows a capacitance type acceleration sensor device according to a third embodiment. (A) is a sectional view taken along line V-V of (B), and (B) is a plan view of the capacitive acceleration sensor device.

A step 1b is formed on the mounting surface of the stem 1A.

The mounting surface of the sensor element 10 is the stem 1
The mounting surface of A is arranged below the stepped portion 1b so that the bottom surface thereof is in contact with the inner bottom surface of the stem 1A. The gap between the surface of the mounting surface above the step portion 1b and the mounting surface of the sensor element 10 is filled with the adhesive resin 3.
Also in this structure, since the adhesive resin 3 has a thickness corresponding to the step of the mounting surface, the effect of buffering the transmission of stress can be enhanced. Since the lower part of the mounting surface of the sensor element 10 and the mounting surface of the stem 1A are in contact with each other but are not bonded, the influence of the stress transmitted from this part on the output of the sensor element 10 is small.

Fourth Embodiment FIG. 6 shows a capacitance type acceleration sensor according to a fourth embodiment. (A) is a sectional view taken along the line VI-VI of (B), and (B) is a plan view of the capacitive acceleration sensor device.

An elastic member 5 is tightly provided between one side surface (mounting surface) of the sensor element 10 and an inner surface (mounting surface) of one side surface of the stem 1. The elastic member 5 is, for example, silicon rubber. The other side of the sensor element 10 is pressed against the inner surface of the other side wall of the stem 1 by the restoring force of the elastic member 5, and the sensor element 10 is fixed inside the stem 1.

The left and right side surfaces of the sensor element 10 are in contact with the side wall of the stem 1 and the elastic member 5, but are not joined. Only the bottom surface of the sensor element 10 and the inner bottom surface of the stem 1 are in contact. Therefore, even if the stem 1 is deformed due to a change in the external environment, the sensor element 10 is hardly affected by the deformation. Further, the elastic member 5 buffers the stress transmitted from the stem 1. This also makes the output characteristics of the sensor element 10 less affected by changes in the external environment.

In FIG. 6, the elastic member 5 is provided over the entire width of the sensor element 10. As shown in FIG. 7, the sensor element 10 can be fixed by a small elastic member 5a. Thus, two or more elastic members 5a having a small width may be provided.

Fifth Embodiment FIG. 8 shows a capacitance type acceleration sensor device according to a fifth embodiment. (A) is a sectional view taken along line VIII-VIII of (B), (B)
FIG. 2 is a plan view of a capacitance type acceleration sensor device.

The sensor element 10a has a different structure from the sensor element 10 shown in FIGS. 1 to 7 and the sensor element 10 shown in FIGS. 9 to 11 described later. That is, the left and right lengths of the silicon substrate 13a constituting the sensor element 10a are formed slightly shorter than the left and right lengths of the upper fixed substrate 11 and the lower fixed substrate 12 sandwiching the upper and lower sides. As a result, a concave portion is formed on one side surface of the sensor element 10a.

An elastic projecting member 6 is provided on one side wall of the stem 1 so as to project substantially perpendicularly from the one side wall. A slope is formed at the tip of the projection member 6, and the lower surface is longer than the upper surface. Further, the projection member 6 is fixed at a position where the lower surface thereof is substantially at the same height as the upper surface of the lower fixed substrate 12 of the sensor element 10.

When the sensor element 10a is pushed into the stem 1 from above the stem 1, the lower surface of the projecting member 6 is moved to the lower fixed substrate.
The sensor element 10a is restrained in the upward and downward directions on the upper surface of the sensor element 12. Further, since the projection member 6 presses the sensor element 10 against the other side wall of the stem 1, the sensor element 10a is also restrained in the left and right directions. The projection member 6 functions as a snap.

The sensor element 10a has its side surface in contact with the other side wall of the protruding member 6 and the stem 1, and its bottom surface in contact with the inner bottom surface of the stem 1, but is not joined. For this reason, even if the stem 1 is deformed due to a change in the external environment, the output characteristics of the sensor element 10a are hardly affected. Further, since the projection member 6 restrains the sensor element 10a from above, the sensor element 10a can be securely fixed inside the stem 1 and can be prevented from falling off from the stem 1.

Sixth Embodiment FIG. 9 shows a capacitance type acceleration sensor according to a sixth embodiment. (A) is a sectional view taken along the line IX-IX of (B), and (B) is a plan view of the capacitive acceleration sensor device. It differs from the sensor shown in FIG. 1 only in that a presser member is newly provided.

The holding member 7 is formed by bending a single metal or synthetic resin linear body having a spring property, and is composed of two mounting portions and a holding portion connecting these. The mounting portion of the holding member 7 is buried in the side wall of the stem 1 in an obliquely upward direction (insert molding).

The sensor element 10 is mounted on the stem 1 with the holding member 7 lifted up and bent. Since the pressing member 7 has an elastic force, the central portion of the upper surface of the sensor element 10 is pressed downward (toward the bottom surface of the stem 1). The sensor element 10 is securely fixed inside the stem 1 and is prevented from falling off the stem 1.

FIG. 10 shows a modification of the sixth embodiment.
(A) is a sectional view taken along line XX of (B), and (B) is a plan view of the capacitive acceleration sensor device.

The holding member 8 is made of synthetic resin, and the lower end surface thereof is fixed to the upper surface of the step portion 1a on the side facing the mounting surface of the stem 1. The pressing member 8 extends upward from the upper surface of the step portion 1a, and is bent at a substantially right angle on the way so as to contact the upper surface of the sensor element 10. The holding member 8 is a sensor element 10
Is mounted on the stem 1 and then the lower end surface is adhered to the step portion 1a. The sensor element 10 is securely fixed to the inside of the stem 1 by the pressing member 8, and is prevented from falling off the stem 1.

FIGS. 11A and 11B show another modification of the sixth embodiment. FIG. 11A is a sectional view taken along line XI-XI of FIG. 11B, and FIG. It is a partial cutout plan view.

The opening at the upper end of the stem 1 is closed by a cover 25. The cover 25 is adhered to the entire upper surface of the side wall of the stem 1 using, for example, an adhesive.

A holding member 9 is provided between the lower surface of the cover 25 and the upper surface of the sensor element 10 so as to be located substantially at the center of these surfaces. The pressing member 9 is formed with a thickness substantially equal to the width between the lower surface of the cover 25 and the upper surface of the sensor element 10. The cover 25 provided with the holding member 9 in advance may be fixed to the upper surface of the side wall of the stem 1, or after the holding member 9 is fixed to the upper surface of the sensor element 10,
Can be fixed to the side wall of the stem 1. Holding member 9
May be an elastic body. Since the pressing member 9 fills the gap between the lower surface of the cover 25 and the upper surface of the sensor element 10, the sensor element 10 is securely fixed inside the stem 1.

Although all of the above embodiments relate to a capacitance type acceleration sensor, the present invention relates to a pressure sensor or the like.
It goes without saying that the present invention can be applied to a capacitance type sensor for measuring other physical quantities.

[Brief description of the drawings]

FIG. 1 shows a first embodiment, in which (A) is the II of (B).
A sectional view taken along a line, and (B) is a plan view of the capacitance type acceleration sensor.

FIG. 2 shows a modification of the first embodiment, and is a cross-sectional view of a capacitance type acceleration sensor corresponding to FIG. 1 (A).

FIG. 3 shows another modification of the first embodiment.
FIG. 3A is a cross-sectional view of the capacitive acceleration sensor corresponding to FIG.

FIG. 4 shows a second embodiment, wherein (A) is the IV-IV of (B).
A sectional view taken along a line, and (B) is a plan view of the capacitance type acceleration sensor.

5A and 5B show a third embodiment, in which FIG.
A sectional view taken along a line, and (B) is a plan view of the capacitance type acceleration sensor.

FIG. 6 shows a fourth embodiment, wherein (A) is the VI-VI of (B).
A sectional view taken along a line, and (B) is a plan view of the capacitance type acceleration sensor.

FIG. 7 shows a modification of the fourth embodiment, wherein (A) is (B)
7B is a sectional view taken along line VII-VII, and FIG. 7B is a plan view of the capacitive acceleration sensor.

FIG. 8 shows a fifth embodiment, wherein (A) shows VIII-V of (B).
Sectional view along line III, (B) is a plan view of the capacitive acceleration sensor.

FIG. 9 shows a sixth embodiment, wherein (A) is the IX-IX of (B).
A sectional view taken along a line, and (B) is a plan view of the capacitance type acceleration sensor.

FIG. 10 shows a modification of the sixth embodiment.
(B) is a sectional view taken along line XX, and (B) is a plan view of the capacitive acceleration sensor.

FIG. 11 shows another modification of the sixth embodiment, wherein (A)
1B is a cross-sectional view taken along line XI-XI of FIG. 1B, and FIG. 1B is a plan view of the capacitive acceleration sensor.

12A and 12B show a conventional capacitance type acceleration sensor device, in which FIG. 12A is a sectional view taken along line XII-XII of FIG. 12B, and FIG. 12B is a plan view.

[Explanation of symbols]

 1, 1A, 1B, 1C Stem (package) 2 Lead frame 3 Adhesive resin 4 Projection member 5, 5a Elastic deformation member 6 Snap projection member 7, 8, 9 Stopper 10, 10a Capacitive acceleration sensor 11 Upper fixed substrate 12 Lower fixed substrate 13, 13a Silicon substrate 14 Frame 15 Weight 16 Cantilever 17 Bonding wires 18a, 18b Bonding pads 21, 22 Fixed electrode 25 Cover

Claims (9)

[Claims] An electrostatic capacitance type sensor element for converting a change in external force into a corresponding change in capacitance, and a supporting member having a recess for accommodating the sensor element therein, at least one surface in the recess is a mounting surface. In a capacitive sensor in which the mounting surface of the sensor element is fixed to the mounting surface, the mounting surface of the support member faces in a direction different from the direction in which external force is applied. An electrostatic capacitance sensor whose mounting surface faces in a direction different from the direction in which external force is applied. 2. The capacitance type sensor according to claim 1, wherein the mounting surface of the sensor element is fixed to the mounting surface with an adhesive resin. 3. The capacitance type sensor according to claim 2, wherein a first protruding member is provided on a part of the mounting surface, and an adhesive resin is filled around the first protruding member. 4. A step is provided on the mounting surface and a part thereof is dented, and an adhesive resin is filled between the dented part and the surface on which the sensor element is mounted.
The capacitance type sensor according to 1. 5. The capacitance type sensor according to claim 2, wherein a groove for storing the adhesive resin is formed in a part of or near the mounting surface. 6. The capacitive sensor according to claim 1, wherein an elastic member is provided on at least a part of the mounting surface, and the sensor element is fixed in the support member by the elastic member. 7. A second projection member is provided on a part of the mounting surface, and a concave portion is formed on a portion of the mounting surface of the sensor element facing the second projection member, and the second projection member is formed on the mounting surface of the sensor element. The capacitance type sensor according to claim 1, wherein a projection member is engaged with the concave portion. 8. The capacitance type sensor according to claim 1, wherein said support member is provided with a locking member for locking said sensor element to said support member. . 9. The apparatus according to claim 1, wherein a cover is provided at an opening of said support member, and a member for pressing said sensor element is provided between a lower surface of said cover and an upper surface of said sensor element. 9. The capacitance-type sensor according to any one of 8.