US20230032633A1 - Physical quantity sensor, physical quantity sensor device, and method for manufacturing physical quantity sensor device - Google Patents
Physical quantity sensor, physical quantity sensor device, and method for manufacturing physical quantity sensor device Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/10—Measuring force or stress, in general by measuring variations of frequency of stressed vibrating elements, e.g. of stressed strings
- G01L1/106—Constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/135—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by making use of contacts which are actuated by a movable inertial mass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
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- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass
Definitions
- the present disclosure relates to a physical quantity sensor, a physical quantity sensor device, and a method for manufacturing a physical quantity sensor device.
- JP-A-2019-158475 discloses a physical quantity sensor including a base portion, three arm portions, a movable portion, a constricted portion, and a physical quantity detection element.
- fixed regions provided in the three arm portions are formed in a first region and a second region that are defined by a first straight line passing through a center of the physical quantity detection element along a direction crossing the constricted portion in a plan view, and are not formed in, among four regions defined by the first straight line and a second straight line passing through the constricted portion and orthogonal to the first straight line in the plan view, at least one of a third region located in the first region closer to a base portion than is the second straight line and a fourth region located in the second region closer to the base portion than is the second straight line.
- a physical quantity sensor includes: a base portion; a first arm portion, a second arm portion, and a third arm portion that are coupled to the base portion and that are provided with fixing portions; a movable portion disposed between the first arm portion and the second arm portion and between the first arm portion and the third arm portion in a plan view; a constricted portion that is disposed between the base portion and the movable portion, and that couples the base portion and the movable portion; and a physical quantity detection element that is disposed across the constricted portion in the plan view and that is attached to the base portion and the movable portion. Thin portions are formed at least at two positions in at least one of the second arm portion and the third arm portion.
- a physical quantity sensor device includes: the physical quantity sensor including the fixing portion described above; and a base at which the physical quantity sensor is mounted.
- the fixing portion is attached to the base.
- a method for manufacturing a physical quantity sensor device includes: preparing a physical quantity detection element; preparing a cantilever including a base portion, a first fixing portion, a second fixing portion, and a third fixing portion; bonding the physical quantity detection element to the cantilever; attaching the first fixing portion, the second fixing portion, and the third fixing portion to a base; and separating the second fixing portion and the base portion from each other or separating the third fixing portion and the base portion from each other.
- FIG. 1 is a perspective view showing a schematic structure of a physical quantity sensor according to a first embodiment.
- FIG. 2 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to the first embodiment.
- FIG. 3 is a diagram showing a difference in stress applied to an element depending on the presence or absence of a thin portion.
- FIG. 4 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to a second embodiment.
- FIG. 5 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to a third embodiment.
- FIG. 6 is a cross-sectional view showing a schematic structure of a physical quantity sensor device according to a fourth embodiment.
- FIG. 7 is a flowchart showing a method for manufacturing a physical quantity sensor device.
- FIG. 8 is a plan view showing a schematic structure of a cantilever provided in a physical quantity sensor device according to a fifth embodiment.
- FIG. 9 is a flowchart showing a method for manufacturing a physical quantity sensor device.
- FIG. 10 is a plan view showing a schematic structure of a cantilever provided in a physical quantity sensor device according to a sixth embodiment.
- FIG. 11 is an exploded perspective view of a physical quantity sensor device according to a seventh embodiment.
- a physical quantity sensor 10 according to a first embodiment is described with reference to FIGS. 1 , 2 and 3 by taking an acceleration sensor that detects an acceleration in a vertical direction as an example.
- an X axis, a Y axis, and a Z axis are shown as three axes orthogonal to one another in the following perspective views, plan views and a cross-sectional view.
- a direction along the X axis is referred to as an “X direction”
- a direction along the Y axis is referred to as a “Y direction”
- a direction along the Z axis is referred to as a “Z direction”.
- An arrow side in each axis is also referred to as a “plus side”
- an opposite side from the arrow is also referred to as a “minus side”.
- a plus side in the Z direction is also referred to as “upper”, and a minus side in the Z direction is also referred to as “lower”.
- the Z direction is along the vertical direction, and an XY plane is along a horizontal plane.
- a plus Z direction and a minus Z direction are collectively referred to as the Z direction.
- the physical quantity sensor 10 can detect an acceleration of a physical quantity detection element 60 in the Z direction, which is the vertical direction, as a physical quantity. As shown in FIG. 1 , such a physical quantity sensor 10 includes the physical quantity detection element 60 , a cantilever 15 that fixes the physical quantity detection element 60 , and a mass portion 70 serving as a weight.
- the cantilever 15 is formed of a crystal substrate, and includes, as shown in FIG. 2 , a base portion 20 , an arm portion 30 , a movable portion 40 , and a constricted portion 50 .
- a first arm portion 31 , a second arm portion 32 , and a third arm portion 33 which are arm portions 30 , are coupled to both ends of the base portion 20 in the X direction.
- the first arm portion 31 extending to a positive side in the Y direction is coupled to one end portion of the base portion 20
- the second arm portion 32 extending to the positive side in the Y direction and the third arm portion 33 extending to the negative side in the Y direction are coupled to the other end portion of the base portion 20 .
- the first arm portion 31 , the second arm portion 32 , and the third arm portion 33 include base end portions coupled to the base portion 20 , and a first fixing portion 81 , a second fixing portion 82 , and a third fixing portion 83 , which are fixing portions 80 , are respectively provided on a free end portion sides of the first arm portion 31 , the second arm portion 32 , and the third arm portion 33 .
- thin portions 85 and 86 are formed at two positions between the base portion 20 and the second fixing portion 82 .
- the thin portions 85 and 86 are thinner than the other portions in the Z direction, which is a thickness direction of the second arm portion 32 .
- the thin portions 85 and 86 are provided at the two positions between the base portion 20 of the second arm portion 32 and the second fixing portion 82 , the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions.
- the movable portion 40 is disposed between the first arm portion 31 and the second arm portion 32 and between the first arm portion 31 and the third arm portion 33 in a plan view from the Z direction.
- the constricted portion 50 is disposed between the base portion 20 and the movable portion 40 , and couples the base portion 20 and the movable portion 40 .
- the physical quantity detection element 60 is implemented by, for example, a double-tuning fork type crystal resonator, and detects, for example, an acceleration or pressure as a physical quantity.
- the physical quantity detection element 60 is disposed across the constricted portion 50 in a plan view from the Z direction, and is attached to the base portion 20 and the movable portion 40 via a bonding member 61 (see FIG. 6 ) such as an adhesive.
- the mass portion 70 is made of metal such as SUS or copper, for example, and is bonded to an upper surface of the movable portion 40 on a free end portion side via a bonding member 74 , as shown in FIG. 1 .
- the mass portion 70 is not limited to being bonded to an upper surface side of the movable portion 40 , and may also be bonded to a lower surface side of the movable portion 40 (see FIG. 6 ).
- the mass portion 70 moves up and down together with the movable portion 40 , and both end portions 71 and 72 of the mass portion 70 function as stoppers that prevent excessive amplitude by coming into contact with the first arm portion 31 and the second arm portion 32 .
- a stress is generated in the physical quantity detection element 60 attached to the base portion 20 and the movable portion 40 .
- a resonance frequency serving as a vibration frequency of the physical quantity detection element 60 changes according to the stress applied to the physical quantity detection element 60 .
- the physical quantity can be detected based on the change in the resonance frequency.
- the fixing portion 80 of the physical quantity sensor 10 When the fixing portion 80 of the physical quantity sensor 10 is fixed to a package or the like via an adhesive or the like, a stress at the time of fixing, an external force applied to the package, a stress due to a difference in thermal expansion between the cantilever 15 and the package accompanying a change in external temperature, and the like may be transmitted to the physical quantity detection element 60 via the fixing portion 80 , and the temperature characteristics and the aging characteristics of the physical quantity sensor 10 may deteriorate.
- FIG. 3 is a diagram showing a stress applied to the physical quantity detection element 60 when the thin portions 85 and 86 are formed in the second arm portion 32 and when the thin portions 85 and 86 are not formed in the second arm portion 32 .
- a case in which the thin portions 85 and 86 are not provided is 100% of a reference
- a case in which the thin portions 85 and 86 are provided is 9.6%
- the stress applied to the physical quantity detection element 60 can be reduced by about 90% as compared with the case in which the thin portions 85 and 86 are not provided. Therefore, by forming the thin portions 85 and 86 in the second arm portion 32 , it is possible to reduce deterioration of the temperature characteristics and the aging characteristics when the physical quantity sensor 10 is fixed to a package or the like.
- the thin portions 85 and 86 which are thinner than the other portions, are formed at the two positions between the base portion 20 of the second arm portion 32 and the second fixing portion 82 , a stress from a package or the like when the fixing portion 80 is fixed can be relaxed, and deterioration of the temperature characteristics and the aging characteristics can be reduced. Therefore, it is possible to obtain the physical quantity sensor 10 excellent in temperature characteristics and aging characteristics.
- FIG. 4 is a plan view showing a schematic structure of a cantilever 15 a in the physical quantity sensor 10 a according to the second embodiment.
- the physical quantity sensor 10 a according to the present embodiment is similar as the physical quantity sensor 10 according to the first embodiment except that the structure of the cantilever 15 a is different from that of the physical quantity sensor 10 according to the first embodiment. Differences from the first embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted.
- thin portions 85 a and 86 a are formed at two positions between the base portion 20 of the second arm portion 32 and the second fixing portion 82 .
- the thin portions 85 a and 86 a are thinner than the other portions in the X direction, which is a thickness direction of the second arm portion 32 .
- the thin portions 85 a and 86 a are provided at the two positions between the base portion 20 of the second arm portion 32 and the second fixing portion 82 , the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions.
- the width dimension of the thin portions 85 a and 86 a can be processed with high accuracy according to the photolithography technique and the etching technique, variations in temperature characteristics and aging characteristics can be reduced.
- FIG. 5 is a plan view showing a schematic structure of a cantilever 15 b in the physical quantity sensor 10 b according to the third embodiment.
- the physical quantity sensor 10 b according to the present embodiment is similar as the physical quantity sensor 10 according to the first embodiment except that the structure of the cantilever 15 b is different from that of the physical quantity sensor 10 according to the first embodiment. Differences from the first embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted.
- thin portions 85 b and 86 b are formed at two positions between the base portion 20 of the third arm portion 33 and the third fixing portion 83 .
- the thin portions 85 b and 86 b are thinner than the other portions in the Z direction, which is a thickness direction of the third arm portion 33 .
- the thin portions 85 b and 86 b are provided at the two positions between the base portion 20 of the third arm portion 33 and the third fixing portion 83 , the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions.
- a physical quantity sensor device 100 including the physical quantity sensors 10 , 10 a, and 10 b according to a fourth embodiment will be described with reference to FIG. 6 .
- a configuration to which the physical quantity sensor 10 is applied will be described as an example.
- the physical quantity sensor device 100 includes the physical quantity sensor 10 , a base 110 at which the physical quantity sensor 10 is mounted, and a lid 120 serving as a cover.
- the base 110 is configured as a package base including a bottom wall 110 A and a side wall 110 B.
- the base 110 forms a package that houses the physical quantity sensor 10 together with the lid 120 .
- the lid 120 is bonded to an opening end of the base 110 via a bonding member 121 such as a glass frit or a seam ring.
- a physical quantity in the physical quantity sensor device 100 according to the present embodiment is an acceleration.
- the bottom wall 110 A of the base 110 is provided with a step portion 112 that is one step higher than an inner surface 110 A 1 of the bottom wall 110 A along, for example, the three side walls 110 B of the four side walls 110 B.
- the step portion 112 may protrude from the inner surface of the side wall 110 B, may be integrated with or separate from the base 110 , and is a part of the base 110 .
- the physical quantity sensor 10 is fixed to the step portion 112 with an adhesive 113 .
- the fixing portion 80 of the physical quantity sensor 10 is attached to the step portion 112 of the base 110 .
- the adhesive 113 for example, a resin adhesive having a high elastic modulus such as an epoxy resin is preferably used. This is because an adhesive such as low-melting glass is hard and thus cannot absorb stress strain generated at the time of bonding, which adversely affects the physical quantity detection element 60 .
- the physical quantity detection element 60 can be coupled to an electrode such as a gold electrode formed on the step portion 112 by a bonding wire 62 .
- an electrode such as a gold electrode formed on the step portion 112 by a bonding wire 62 .
- the electrode pattern provided at the base portion 20 may be coupled to the electrode formed at the step portion 112 of the base 110 via a conductive adhesive without using the bonding wire 62 .
- the bottom wall 110 A of the base 110 is provided with external terminals 114 , which are used when the base 110 is mounted at a circuit board or the like (not shown), at an outer surface 110 A 2 that is an opposite-side surface from the inner surface 110 A 1 .
- the external terminal 114 is electrically coupled to the physical quantity detection element 60 via a wiring, an electrode, or the like (not shown).
- the bottom wall 110 A is provided with a sealing portion 115 that hermetically seals an internal space 130 of the package formed by the base 110 and the lid 120 .
- the sealing portion 115 is provided in a through hole 116 formed in the base 110 .
- the sealing portion 115 is provided by disposing a sealing material in the through hole 116 , heating and melting the sealing material, and then solidifying the sealing material.
- the physical quantity sensor device 100 includes the physical quantity sensor 10 excellent in temperature characteristics and aging characteristics, an acceleration can be detected with high accuracy.
- the manufacturing method for the physical quantity sensor device 100 includes a physical quantity detection element preparation step, a cantilever preparation step, an element bonding step, a mass portion bonding step, a cantilever bonding step, a bonding step, a lid bonding step, and a sealing step.
- step S 1 a crystal substrate is processed according to a photolithography technique and an etching technique to prepare a double-tuning fork type crystal resonator as the physical quantity detection element 60 .
- step S 2 the crystal substrate is processed according to the photolithography technique and the etching technique, and the cantilever 15 including the base portion 20 , the arm portion 30 , the movable portion 40 , the constricted portion 50 , the thin portions 85 and 86 , the first fixing portion 81 , the second fixing portion 82 , and the third fixing portion 83 is prepared.
- step S 3 one end portion of the physical quantity detection element 60 is bonded to the upper surface of the base portion 20 of the cantilever 15 via the bonding member 61 such as an adhesive, and the other end portion of the physical quantity detection element 60 is bonded to the upper surface of the movable portion 40 of the cantilever 15 via the bonding member 61 .
- step S 4 the mass portion 70 is bonded to the upper surface and the lower surface on the free end portion side of the movable portion 40 of the cantilever 15 via the bonding member 74 .
- step S 5 the cantilever 15 in which the physical quantity detection element 60 and the mass portion 70 are bonded is bonded to the base 110 .
- the first fixing portion 81 , the second fixing portion 82 , and the third fixing portion 83 of the physical quantity sensor 10 are fixed onto the step portion 112 of the base 110 via the adhesive 113 .
- step S 6 the electrode provided at the physical quantity detection element 60 and the electrode formed at the step portion 112 of the base 110 are electrically coupled by the bonding wire 62 .
- step S 7 the lid 120 is bonded to the upper surface of the base 110 via the bonding member 121 .
- step S 8 a sealing material is disposed in the through hole 116 formed in the bottom wall 110 A of the base 110 , the sealing material is heated and melted and then solidified, and the internal space 130 in which the physical quantity sensor 10 is housed is hermetically sealed.
- the physical quantity sensor device 100 that includes the physical quantity sensor 10 excellent in temperature characteristics and aging characteristics and that is capable of detecting an acceleration with high accuracy is completed.
- FIG. 8 is a plan view showing a schematic structure of a cantilever 15 c of a physical quantity sensor 10 c provided in a physical quantity sensor device 100 a according to the fifth embodiment.
- the physical quantity sensor device 100 a according to the present embodiment is similar as the physical quantity sensor device 100 according to the fourth embodiment except that the structure of the cantilever 15 c of the physical quantity sensor 10 c is different from that of the physical quantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted.
- This state is a state in which, in the cantilever 15 of the physical quantity sensor 10 according to the first embodiment shown in FIG. 2 , a portion between the thin portion 85 and the thin portion 86 formed in the second arm portion 32 is broken and removed. Therefore, the stress from the package or the like generated by fixing the fixing portion 80 can be further relaxed, and the deterioration of the temperature characteristics and the aging characteristics can be further reduced.
- the method for manufacturing the physical quantity sensor device 100 a according to the present embodiment is similar as the method for manufacturing the physical quantity sensor device 100 according to the fourth embodiment except that a separating step of step S 16 is added after the cantilever bonding step of step S 15 as compared to the method for manufacturing the physical quantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted.
- the method for manufacturing the physical quantity sensor device 100 a includes a physical quantity detection element preparation step, a cantilever preparation step, an element bonding step, a mass portion bonding step, a cantilever bonding step, the separating step, a bonding step, a lid bonding step, and a sealing step.
- the separating step of step S 16 in a state in which the physical quantity sensor 10 is mounted on the base 110 , specifically, in a state in which the first fixing portion 81 , the second fixing portion 82 , and the third fixing portion 83 of the physical quantity sensor 10 are fixed onto the step portion 112 of the base 110 , the thin portion 85 and the thin portion 86 that are formed in the second arm portion 32 are broken and removed.
- the physical quantity sensor 10 c in which the base portion 20 and the second fixing portion 82 coupled by the second arm portion 32 are separated from each other is obtained. Since the base portion 20 and the second fixing portion 82 are separated from each other, the stress from the package or the like generated by fixing the fixing portion 80 can be further relaxed.
- the separating step may be performed after the bonding step of step S 17 .
- the method for manufacturing the physical quantity sensor device 100 a in the present embodiment it is possible to obtain the physical quantity sensor device 100 a capable of further reducing the deterioration of the temperature characteristics and the aging characteristics.
- FIG. 10 is a plan view showing a schematic structure of a cantilever 15 d of a physical quantity sensor 10 d provided in the physical quantity sensor device 100 b according to the sixth embodiment.
- the physical quantity sensor device 100 b according to the present embodiment is similar as the physical quantity sensor device 100 according to the fourth embodiment except that the structure of the cantilever 15 d of the physical quantity sensor 10 d is different from that of the physical quantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted.
- This state is a state in which, in the cantilever 15 b of the physical quantity sensor 10 b according to the third embodiment shown in FIG. 5 , a portion between the thin portion 85 b and the thin portion 86 b formed in the third arm portion 33 is broken and removed. Therefore, the stress from the package or the like generated by fixing the fixing portion 80 can be further relaxed, and the deterioration of the temperature characteristics and the aging characteristics can be further reduced.
- the method for manufacturing the physical quantity sensor device 100 b is the same as the method for manufacturing the physical quantity sensor device 100 a according to the fifth embodiment.
- the separating step of step S 16 the portion between the thin portion 85 b and the thin portion 86 b that are formed in the third arm portion 33 is broken and removed in a state in which the physical quantity sensor 10 b is mounted at the base 110 .
- the physical quantity sensor 10 d in which the base portion 20 and the third fixing portion 83 coupled by the third arm portion 33 are separated from each other is obtained, and the physical quantity sensor device 100 b can be manufactured.
- a physical quantity sensor device 200 including physical quantity sensor devices 100 , 100 a, and 100 b according to a seventh embodiment will be described with reference to FIG. 11 .
- a configuration to which the physical quantity sensor device 100 including the physical quantity sensor 10 is applied will be described as an example.
- the physical quantity sensor device 200 includes the three physical quantity sensor devices 100 , and can detect physical quantities of three axes orthogonal to one another.
- the physical quantity in the physical quantity sensor device 200 according to the present embodiment is an acceleration.
- the three physical quantity sensor devices 100 are mounted at a circuit board 210 .
- the three physical quantity sensor devices 100 are mounted at the circuit board 210 such that detection axes of the three physical quantity sensor devices 100 are respectively aligned with the three orthogonal axes.
- the circuit board 210 is electrically coupled to a connector board 220 .
- the circuit board 210 and the connector board 220 are housed and held in a package formed by a package base 230 and a lid 240 .
- the three physical quantity sensor devices 100 each including the physical quantity sensor 10 excellent in temperature characteristics and aging characteristics are mounted along the three orthogonal axes serving as the detection axes. Therefore, accelerations in three axes can be detected with high accuracy.
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Abstract
Description
- The present application is based on, and claims priority from JP Application Serial Number 2021-123141, filed Jul. 28, 2021, the disclosure of which is hereby incorporated by reference herein in its entirety.
- The present disclosure relates to a physical quantity sensor, a physical quantity sensor device, and a method for manufacturing a physical quantity sensor device.
- For example, JP-A-2019-158475 discloses a physical quantity sensor including a base portion, three arm portions, a movable portion, a constricted portion, and a physical quantity detection element. In the physical quantity sensor, fixed regions provided in the three arm portions are formed in a first region and a second region that are defined by a first straight line passing through a center of the physical quantity detection element along a direction crossing the constricted portion in a plan view, and are not formed in, among four regions defined by the first straight line and a second straight line passing through the constricted portion and orthogonal to the first straight line in the plan view, at least one of a third region located in the first region closer to a base portion than is the second straight line and a fourth region located in the second region closer to the base portion than is the second straight line.
- However, in the physical quantity sensor described in JP-A-2019-158475, when the fixed region is fixed to a package or the like by an adhesive or the like, a stress at the time of fixing, an external force applied to the package, a stress caused by a difference in thermal expansion, and the like may be transmitted to the physical quantity detection element via the fixed region, and temperature characteristics and aging characteristics of the physical quantity sensor may deteriorate.
- A physical quantity sensor includes: a base portion; a first arm portion, a second arm portion, and a third arm portion that are coupled to the base portion and that are provided with fixing portions; a movable portion disposed between the first arm portion and the second arm portion and between the first arm portion and the third arm portion in a plan view; a constricted portion that is disposed between the base portion and the movable portion, and that couples the base portion and the movable portion; and a physical quantity detection element that is disposed across the constricted portion in the plan view and that is attached to the base portion and the movable portion. Thin portions are formed at least at two positions in at least one of the second arm portion and the third arm portion.
- A physical quantity sensor device includes: the physical quantity sensor including the fixing portion described above; and a base at which the physical quantity sensor is mounted. The fixing portion is attached to the base.
- A method for manufacturing a physical quantity sensor device includes: preparing a physical quantity detection element; preparing a cantilever including a base portion, a first fixing portion, a second fixing portion, and a third fixing portion; bonding the physical quantity detection element to the cantilever; attaching the first fixing portion, the second fixing portion, and the third fixing portion to a base; and separating the second fixing portion and the base portion from each other or separating the third fixing portion and the base portion from each other.
-
FIG. 1 is a perspective view showing a schematic structure of a physical quantity sensor according to a first embodiment. -
FIG. 2 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to the first embodiment. -
FIG. 3 is a diagram showing a difference in stress applied to an element depending on the presence or absence of a thin portion. -
FIG. 4 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to a second embodiment. -
FIG. 5 is a plan view showing a schematic structure of a cantilever provided in the physical quantity sensor according to a third embodiment. -
FIG. 6 is a cross-sectional view showing a schematic structure of a physical quantity sensor device according to a fourth embodiment. -
FIG. 7 is a flowchart showing a method for manufacturing a physical quantity sensor device. -
FIG. 8 is a plan view showing a schematic structure of a cantilever provided in a physical quantity sensor device according to a fifth embodiment. -
FIG. 9 is a flowchart showing a method for manufacturing a physical quantity sensor device. -
FIG. 10 is a plan view showing a schematic structure of a cantilever provided in a physical quantity sensor device according to a sixth embodiment. -
FIG. 11 is an exploded perspective view of a physical quantity sensor device according to a seventh embodiment. - First, a
physical quantity sensor 10 according to a first embodiment is described with reference toFIGS. 1, 2 and 3 by taking an acceleration sensor that detects an acceleration in a vertical direction as an example. - For convenience of description, an X axis, a Y axis, and a Z axis are shown as three axes orthogonal to one another in the following perspective views, plan views and a cross-sectional view. A direction along the X axis is referred to as an “X direction”, a direction along the Y axis is referred to as a “Y direction”, and a direction along the Z axis is referred to as a “Z direction”. An arrow side in each axis is also referred to as a “plus side”, and an opposite side from the arrow is also referred to as a “minus side”. A plus side in the Z direction is also referred to as “upper”, and a minus side in the Z direction is also referred to as “lower”. The Z direction is along the vertical direction, and an XY plane is along a horizontal plane. In the present specification, a plus Z direction and a minus Z direction are collectively referred to as the Z direction.
- The
physical quantity sensor 10 according to the present embodiment can detect an acceleration of a physicalquantity detection element 60 in the Z direction, which is the vertical direction, as a physical quantity. As shown inFIG. 1 , such aphysical quantity sensor 10 includes the physicalquantity detection element 60, acantilever 15 that fixes the physicalquantity detection element 60, and amass portion 70 serving as a weight. - The
cantilever 15 is formed of a crystal substrate, and includes, as shown inFIG. 2 , abase portion 20, anarm portion 30, amovable portion 40, and aconstricted portion 50. - A
first arm portion 31, asecond arm portion 32, and athird arm portion 33, which arearm portions 30, are coupled to both ends of thebase portion 20 in the X direction. Thefirst arm portion 31 extending to a positive side in the Y direction is coupled to one end portion of thebase portion 20, and thesecond arm portion 32 extending to the positive side in the Y direction and thethird arm portion 33 extending to the negative side in the Y direction are coupled to the other end portion of thebase portion 20. - The
first arm portion 31, thesecond arm portion 32, and thethird arm portion 33 include base end portions coupled to thebase portion 20, and afirst fixing portion 81, asecond fixing portion 82, and athird fixing portion 83, which are fixingportions 80, are respectively provided on a free end portion sides of thefirst arm portion 31, thesecond arm portion 32, and thethird arm portion 33. In thesecond arm portion 32,thin portions base portion 20 and thesecond fixing portion 82. Thethin portions second arm portion 32. In the present embodiment, although thethin portions base portion 20 of thesecond arm portion 32 and thesecond fixing portion 82, the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions. - The
movable portion 40 is disposed between thefirst arm portion 31 and thesecond arm portion 32 and between thefirst arm portion 31 and thethird arm portion 33 in a plan view from the Z direction. - The
constricted portion 50 is disposed between thebase portion 20 and themovable portion 40, and couples thebase portion 20 and themovable portion 40. - The physical
quantity detection element 60 is implemented by, for example, a double-tuning fork type crystal resonator, and detects, for example, an acceleration or pressure as a physical quantity. The physicalquantity detection element 60 is disposed across theconstricted portion 50 in a plan view from the Z direction, and is attached to thebase portion 20 and themovable portion 40 via a bonding member 61 (seeFIG. 6 ) such as an adhesive. - The
mass portion 70 is made of metal such as SUS or copper, for example, and is bonded to an upper surface of themovable portion 40 on a free end portion side via abonding member 74, as shown inFIG. 1 . Themass portion 70 is not limited to being bonded to an upper surface side of themovable portion 40, and may also be bonded to a lower surface side of the movable portion 40 (seeFIG. 6 ). Themass portion 70 moves up and down together with themovable portion 40, and bothend portions mass portion 70 function as stoppers that prevent excessive amplitude by coming into contact with thefirst arm portion 31 and thesecond arm portion 32. - Here, when the
movable portion 40 is displaced according to a physical quantity such as an acceleration or pressure with theconstricted portion 50 as a fulcrum, a stress is generated in the physicalquantity detection element 60 attached to thebase portion 20 and themovable portion 40. A resonance frequency serving as a vibration frequency of the physicalquantity detection element 60 changes according to the stress applied to the physicalquantity detection element 60. The physical quantity can be detected based on the change in the resonance frequency. - Next, effects of the
thin portions second arm portion 32 will be described. - When the
fixing portion 80 of thephysical quantity sensor 10 is fixed to a package or the like via an adhesive or the like, a stress at the time of fixing, an external force applied to the package, a stress due to a difference in thermal expansion between thecantilever 15 and the package accompanying a change in external temperature, and the like may be transmitted to the physicalquantity detection element 60 via thefixing portion 80, and the temperature characteristics and the aging characteristics of thephysical quantity sensor 10 may deteriorate. - Therefore, in the
physical quantity sensor 10 according to the present embodiment, thethin portions second arm portion 32 in order to reduce the influence of the stress from the package or the like.FIG. 3 is a diagram showing a stress applied to the physicalquantity detection element 60 when thethin portions second arm portion 32 and when thethin portions second arm portion 32. Assuming that a case in which thethin portions thin portions quantity detection element 60 can be reduced by about 90% as compared with the case in which thethin portions thin portions second arm portion 32, it is possible to reduce deterioration of the temperature characteristics and the aging characteristics when thephysical quantity sensor 10 is fixed to a package or the like. - As described above, in the
physical quantity sensor 10 according to the present embodiment, thethin portions base portion 20 of thesecond arm portion 32 and thesecond fixing portion 82, a stress from a package or the like when thefixing portion 80 is fixed can be relaxed, and deterioration of the temperature characteristics and the aging characteristics can be reduced. Therefore, it is possible to obtain thephysical quantity sensor 10 excellent in temperature characteristics and aging characteristics. - Next, a
physical quantity sensor 10 a according to a second embodiment will be described with reference toFIG. 4 . -
FIG. 4 is a plan view showing a schematic structure of acantilever 15 a in thephysical quantity sensor 10 a according to the second embodiment. - The
physical quantity sensor 10 a according to the present embodiment is similar as thephysical quantity sensor 10 according to the first embodiment except that the structure of thecantilever 15 a is different from that of thephysical quantity sensor 10 according to the first embodiment. Differences from the first embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted. - As shown in
FIG. 4 , in thecantilever 15 a of thephysical quantity sensor 10 a,thin portions base portion 20 of thesecond arm portion 32 and the second fixingportion 82. Thethin portions second arm portion 32. In the present embodiment, although thethin portions base portion 20 of thesecond arm portion 32 and the second fixingportion 82, the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions. - With such a configuration, it is possible to attain similar effects as those of the
physical quantity sensor 10 according to the first embodiment. - Since the width dimension of the
thin portions - Next, a
physical quantity sensor 10 b according to a third embodiment will be described with reference toFIG. 5 . -
FIG. 5 is a plan view showing a schematic structure of acantilever 15 b in thephysical quantity sensor 10 b according to the third embodiment. - The
physical quantity sensor 10 b according to the present embodiment is similar as thephysical quantity sensor 10 according to the first embodiment except that the structure of thecantilever 15 b is different from that of thephysical quantity sensor 10 according to the first embodiment. Differences from the first embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted. - As shown in
FIG. 5 , in thephysical quantity sensor 10 b,thin portions base portion 20 of thethird arm portion 33 and the third fixingportion 83. Thethin portions third arm portion 33. In the present embodiment, although thethin portions base portion 20 of thethird arm portion 33 and the third fixingportion 83, the present disclosure is not limited thereto. Alternatively, the thin portions may be provided at three or more positions. - With such a configuration, it is possible to attain similar effects as those of the
physical quantity sensor 10 according to the first embodiment. - Next, a physical
quantity sensor device 100 including thephysical quantity sensors FIG. 6 . In the following description, a configuration to which thephysical quantity sensor 10 is applied will be described as an example. - The physical
quantity sensor device 100 includes thephysical quantity sensor 10, a base 110 at which thephysical quantity sensor 10 is mounted, and alid 120 serving as a cover. In the present embodiment, thebase 110 is configured as a package base including abottom wall 110A and aside wall 110B. The base 110 forms a package that houses thephysical quantity sensor 10 together with thelid 120. Thelid 120 is bonded to an opening end of thebase 110 via abonding member 121 such as a glass frit or a seam ring. A physical quantity in the physicalquantity sensor device 100 according to the present embodiment is an acceleration. - The
bottom wall 110A of thebase 110 is provided with astep portion 112 that is one step higher than an inner surface 110A1 of thebottom wall 110A along, for example, the threeside walls 110B of the fourside walls 110B. Thestep portion 112 may protrude from the inner surface of theside wall 110B, may be integrated with or separate from thebase 110, and is a part of thebase 110. As shown inFIG. 6 , thephysical quantity sensor 10 is fixed to thestep portion 112 with an adhesive 113. Specifically, the fixingportion 80 of thephysical quantity sensor 10 is attached to thestep portion 112 of thebase 110. Here, as the adhesive 113, for example, a resin adhesive having a high elastic modulus such as an epoxy resin is preferably used. This is because an adhesive such as low-melting glass is hard and thus cannot absorb stress strain generated at the time of bonding, which adversely affects the physicalquantity detection element 60. - In the present embodiment, as shown in
FIG. 1 , the physicalquantity detection element 60 can be coupled to an electrode such as a gold electrode formed on thestep portion 112 by abonding wire 62. In this case, it is not necessary to form an electrode pattern on thebase portion 20. However, the electrode pattern provided at thebase portion 20 may be coupled to the electrode formed at thestep portion 112 of thebase 110 via a conductive adhesive without using thebonding wire 62. - The
bottom wall 110A of thebase 110 is provided withexternal terminals 114, which are used when thebase 110 is mounted at a circuit board or the like (not shown), at an outer surface 110A2 that is an opposite-side surface from the inner surface 110A1. Theexternal terminal 114 is electrically coupled to the physicalquantity detection element 60 via a wiring, an electrode, or the like (not shown). - For example, the
bottom wall 110A is provided with a sealingportion 115 that hermetically seals aninternal space 130 of the package formed by thebase 110 and thelid 120. The sealingportion 115 is provided in a throughhole 116 formed in thebase 110. The sealingportion 115 is provided by disposing a sealing material in the throughhole 116, heating and melting the sealing material, and then solidifying the sealing material. - As described above, since the physical
quantity sensor device 100 according to the present embodiment includes thephysical quantity sensor 10 excellent in temperature characteristics and aging characteristics, an acceleration can be detected with high accuracy. - Next, a method for manufacturing the physical
quantity sensor device 100 according to the present embodiment will be described with reference toFIG. 7 . In the following description, a manufacturing method to which thephysical quantity sensor 10 is applied will be described as an example. - As shown in
FIG. 7 , the manufacturing method for the physicalquantity sensor device 100 according to the present embodiment includes a physical quantity detection element preparation step, a cantilever preparation step, an element bonding step, a mass portion bonding step, a cantilever bonding step, a bonding step, a lid bonding step, and a sealing step. - First, in step S1, a crystal substrate is processed according to a photolithography technique and an etching technique to prepare a double-tuning fork type crystal resonator as the physical
quantity detection element 60. - In step S2, the crystal substrate is processed according to the photolithography technique and the etching technique, and the
cantilever 15 including thebase portion 20, thearm portion 30, themovable portion 40, theconstricted portion 50, thethin portions portion 81, the second fixingportion 82, and the third fixingportion 83 is prepared. - In step S3, one end portion of the physical
quantity detection element 60 is bonded to the upper surface of thebase portion 20 of thecantilever 15 via thebonding member 61 such as an adhesive, and the other end portion of the physicalquantity detection element 60 is bonded to the upper surface of themovable portion 40 of thecantilever 15 via thebonding member 61. - In step S4, the
mass portion 70 is bonded to the upper surface and the lower surface on the free end portion side of themovable portion 40 of thecantilever 15 via thebonding member 74. - In step S5, the
cantilever 15 in which the physicalquantity detection element 60 and themass portion 70 are bonded is bonded to thebase 110. Specifically, the first fixingportion 81, the second fixingportion 82, and the third fixingportion 83 of thephysical quantity sensor 10 are fixed onto thestep portion 112 of thebase 110 via the adhesive 113. - In step S6, the electrode provided at the physical
quantity detection element 60 and the electrode formed at thestep portion 112 of the base 110 are electrically coupled by thebonding wire 62. - In step S7, the
lid 120 is bonded to the upper surface of thebase 110 via thebonding member 121. - In step S8, a sealing material is disposed in the through
hole 116 formed in thebottom wall 110A of thebase 110, the sealing material is heated and melted and then solidified, and theinternal space 130 in which thephysical quantity sensor 10 is housed is hermetically sealed. - Through the above steps, the physical
quantity sensor device 100 that includes thephysical quantity sensor 10 excellent in temperature characteristics and aging characteristics and that is capable of detecting an acceleration with high accuracy is completed. - Next, a physical
quantity sensor device 100 a according to the fifth embodiment will be described with reference toFIG. 8 . -
FIG. 8 is a plan view showing a schematic structure of a cantilever 15 c of aphysical quantity sensor 10 c provided in a physicalquantity sensor device 100 a according to the fifth embodiment. - The physical
quantity sensor device 100 a according to the present embodiment is similar as the physicalquantity sensor device 100 according to the fourth embodiment except that the structure of the cantilever 15 c of thephysical quantity sensor 10 c is different from that of the physicalquantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted. - As shown in
FIG. 8 , in the cantilever 15 c of thephysical quantity sensor 10 c provided in the physicalquantity sensor device 100 a, thebase portion 20 of thesecond arm portion 32 and the second fixingportion 82 are separated from each other. This state is a state in which, in thecantilever 15 of thephysical quantity sensor 10 according to the first embodiment shown inFIG. 2 , a portion between thethin portion 85 and thethin portion 86 formed in thesecond arm portion 32 is broken and removed. Therefore, the stress from the package or the like generated by fixing the fixingportion 80 can be further relaxed, and the deterioration of the temperature characteristics and the aging characteristics can be further reduced. - With such a configuration, it is possible to attain similar effects as those of the physical
quantity sensor device 100 according to the fourth embodiment. - Since the
base portion 20 of thesecond arm portion 32 and the second fixingportion 82 are separated from each other, it is possible to further reduce the deterioration of the temperature characteristics and the aging characteristics. - Next, a method for manufacturing the physical
quantity sensor device 100 a according to the present embodiment will be described with reference toFIG. 9 . - The method for manufacturing the physical
quantity sensor device 100 a according to the present embodiment is similar as the method for manufacturing the physicalquantity sensor device 100 according to the fourth embodiment except that a separating step of step S16 is added after the cantilever bonding step of step S15 as compared to the method for manufacturing the physicalquantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted. - As shown in
FIG. 9 , the method for manufacturing the physicalquantity sensor device 100 a according to the present embodiment includes a physical quantity detection element preparation step, a cantilever preparation step, an element bonding step, a mass portion bonding step, a cantilever bonding step, the separating step, a bonding step, a lid bonding step, and a sealing step. - In the separating step of step S16, in a state in which the
physical quantity sensor 10 is mounted on thebase 110, specifically, in a state in which the first fixingportion 81, the second fixingportion 82, and the third fixingportion 83 of thephysical quantity sensor 10 are fixed onto thestep portion 112 of thebase 110, thethin portion 85 and thethin portion 86 that are formed in thesecond arm portion 32 are broken and removed. Through this process, thephysical quantity sensor 10 c in which thebase portion 20 and the second fixingportion 82 coupled by thesecond arm portion 32 are separated from each other is obtained. Since thebase portion 20 and the second fixingportion 82 are separated from each other, the stress from the package or the like generated by fixing the fixingportion 80 can be further relaxed. The separating step may be performed after the bonding step of step S17. - According to the method for manufacturing the physical
quantity sensor device 100 a in the present embodiment, it is possible to obtain the physicalquantity sensor device 100 a capable of further reducing the deterioration of the temperature characteristics and the aging characteristics. - Next, a physical
quantity sensor device 100 b according to a sixth embodiment will be described with reference toFIG. 10 . -
FIG. 10 is a plan view showing a schematic structure of acantilever 15 d of aphysical quantity sensor 10 d provided in the physicalquantity sensor device 100 b according to the sixth embodiment. - The physical
quantity sensor device 100 b according to the present embodiment is similar as the physicalquantity sensor device 100 according to the fourth embodiment except that the structure of thecantilever 15 d of thephysical quantity sensor 10 d is different from that of the physicalquantity sensor device 100 according to the fourth embodiment. Differences from the fourth embodiment described above will be mainly described, the same elements will be denoted by the same reference numerals, and the description thereof will be omitted. - As shown in
FIG. 10 , in thecantilever 15 d of thephysical quantity sensor 10 d provided in the physicalquantity sensor device 100 b, thebase portion 20 of thethird arm portion 33 and the third fixingportion 83 are separated from each other. This state is a state in which, in thecantilever 15 b of thephysical quantity sensor 10 b according to the third embodiment shown inFIG. 5 , a portion between thethin portion 85 b and thethin portion 86 b formed in thethird arm portion 33 is broken and removed. Therefore, the stress from the package or the like generated by fixing the fixingportion 80 can be further relaxed, and the deterioration of the temperature characteristics and the aging characteristics can be further reduced. - The method for manufacturing the physical
quantity sensor device 100 b is the same as the method for manufacturing the physicalquantity sensor device 100 a according to the fifth embodiment. In the separating step of step S16, the portion between thethin portion 85 b and thethin portion 86 b that are formed in thethird arm portion 33 is broken and removed in a state in which thephysical quantity sensor 10 b is mounted at thebase 110. Through this process, thephysical quantity sensor 10 d in which thebase portion 20 and the third fixingportion 83 coupled by thethird arm portion 33 are separated from each other is obtained, and the physicalquantity sensor device 100 b can be manufactured. - With such a configuration, it is possible to obtain similar effects as those of the physical
quantity sensor device 100 according to the fourth embodiment. - Since the
base portion 20 of thethird arm portion 33 and the third fixingportion 83 are separated from each other, it is possible to further reduce the deterioration of the temperature characteristics and the aging characteristics. - Next, a physical
quantity sensor device 200 including physicalquantity sensor devices FIG. 11 . In the following description, a configuration to which the physicalquantity sensor device 100 including thephysical quantity sensor 10 is applied will be described as an example. - The physical
quantity sensor device 200 includes the three physicalquantity sensor devices 100, and can detect physical quantities of three axes orthogonal to one another. The physical quantity in the physicalquantity sensor device 200 according to the present embodiment is an acceleration. - As shown in
FIG. 11 , in the physicalquantity sensor device 200, the three physicalquantity sensor devices 100 are mounted at acircuit board 210. The three physicalquantity sensor devices 100 are mounted at thecircuit board 210 such that detection axes of the three physicalquantity sensor devices 100 are respectively aligned with the three orthogonal axes. Thecircuit board 210 is electrically coupled to aconnector board 220. Thecircuit board 210 and theconnector board 220 are housed and held in a package formed by apackage base 230 and alid 240. - As described above, in the physical
quantity sensor device 200 according to the present embodiment, the three physicalquantity sensor devices 100 each including thephysical quantity sensor 10 excellent in temperature characteristics and aging characteristics are mounted along the three orthogonal axes serving as the detection axes. Therefore, accelerations in three axes can be detected with high accuracy.
Claims (8)
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JP2021-123141 | 2021-07-28 | ||
JP2021123141A JP2023018834A (en) | 2021-07-28 | 2021-07-28 | Physical quantity sensor, physical quantity sensor device, and method for manufacturing physical quantity sensor device |
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US20230032633A1 true US20230032633A1 (en) | 2023-02-02 |
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US17/873,799 Pending US20230032633A1 (en) | 2021-07-28 | 2022-07-26 | Physical quantity sensor, physical quantity sensor device, and method for manufacturing physical quantity sensor device |
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