JPH09251030A - Capacitance-type pressure sensor, packaging structure thereof and manufacture of capacitance-type pressure sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively perform the mass production of a highly accurate capacitance-type pressure sensor having the uniform characteristics by forming an outer-wiring bonding part on the side of a movable electrode flush with an outer-wiring bonding part on the side of a fixed electrode, and eliminating the dispersion of the widths of a capacitor and a gap caused by the disturbance of the bonding attitude of an insulating substrate and a conductive pressure sensitive part. SOLUTION: Since the height dimensions of a pressure sensitive part 2 and a terminal small piece 6 are equal, the heat pressure sensitive part 2 bonded on an insulating substrate 1 and the upper surface of the terminal small piece 6 are included in the same plane, and made flush with each other. The upper surface at the pressure sensitive part 2 is the outer-wiring bonding part on the side of a movable electrode, and the upper surface of the terminal small piece 6 is the outer-wiring bonding part on the side of a fixed electrode. At the bonding interface of the insulating substrate 1 and the conductive pressure seisitive part 2, there is no local holding of a conductor film as in the conventional device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitance type pressure sensor used in various devices including a pressure detection system such as a sphygmomanometer, a gas meter or a safety valve device, and particularly to not only the structure of the sensor itself but also the sensor. And a method of manufacturing the sensor.

[0002]

7 and 8 show an example of a conventional capacitance type pressure sensor. This sensor is composed of a large-sized insulating substrate 1 made of glass and a conductive pressure-sensitive component 2 having a slightly smaller size. The conductive pressure-sensitive component 2 is made of a conductive substrate such as a silicon substrate and is molded by a semiconductor device manufacturing technique or a micromachining technique. The thin diaphragm 2a is integrally formed with a thick supporting frame portion 2b. It has a simplified shape. The lower surface of the support frame portion 2b is in close contact with and bonded to a predetermined position on the upper surface of the insulating substrate 1, and the diaphragm 2a faces the upper surface of the insulating substrate 1 with a small gap.

On the upper surface of the insulating substrate 1, there is formed a circular fixed electrode conductor film 3 which fits within the frame of the support frame portion 2b of the pressure-sensitive component 2. The fixed electrode conductor film 3 serves as a movable electrode diaphragm. It faces 2a. As a result, the diaphragm 2a and the fixed electrode conductor film 3 face each other with a small gap therebetween to form a sensor capacitor.

That is, when the diaphragm 2a bends under pressure, the distance between the two changes and the capacitance between the diaphragm 2a and the fixed electrode conductor film 3 changes. Therefore,
By detecting the change in the electrostatic capacitance, the deflection amount (displacement amount) of the diaphragm 2a is obtained, and the pressure can be detected accordingly. In the illustrated example, the pressure applied to the diaphragm 2a is given through the pressure introducing hole 7 provided in the insulating substrate 1, and the diaphragm 2a is separated from the insulating substrate 1 (fixed electrode conductor film 3) by applying pressure. It has a simple structure.

The structure for taking out the change in the capacitance to the outside is as follows. First, on the upper surface of the insulating substrate 1, a lead conductor film 3a continuous with the fixed electrode conductor film 3 is formed. The lead conductor film 3a extends outside the frame of the support frame portion 2b and has a pattern bent at a right angle on the upper surface of the insulating substrate 1. Further, a cutout groove 4 is formed on the lower surface of the support frame portion 2b at a position where the lead conductor film 3a passes, and the cutout groove 4 makes the lead conductor film 3a and the support frame portion 2b electrically non-contact with each other. It is kept.

Further, on the upper surface of the insulating substrate 1, a rectangular lead conductor film 5 is formed at a position adjacent to the lead conductor film 3a. One end portion of the lead conductor film 5 enters the joint interface between the insulating substrate 1 and the support frame portion 2b. That is, the support frame portion 2b is joined to one end portion of the lead conductor film 5. As a result, the conductive pressure-sensitive component 2 and the lead conductor film 5 are electrically connected.

As described above, the diaphragm 2a, which is the movable electrode of the sensor capacitor, is connected to the lead conductor film 5, and the fixed electrode conductor film 3 facing the diaphragm 2a is connected to the lead electrode film 3a. A signal corresponding to the capacitance generated between the movable electrode and the fixed electrode conductor film 3 is output between the lead conductor films 5 and 3a. Then, the lead conductor film 3 a and the lead conductor film 5 exposed on the upper surface of the insulating substrate 1
Serves as a bonding pad for external connection of this pressure sensor.

[0008]

However, the above-mentioned conventional capacitance type acceleration sensor has the following problems. That is, the conductive pressure-sensitive component 2 is usually bonded onto the insulating substrate 1 by means of anodic bonding or the like. At that time, as described above, a small part of the lower surface of the supporting frame portion 2b is bonded onto the lead conductor film 5 formed on the insulating substrate 1 to form a lead conductor between the supporting frame portion 2b and the insulating substrate 1. The membrane 5 is sandwiched. This pinching is local,
Moreover, since the lead conductor film 5 has a certain thickness, it is difficult to make the upper plane of the insulating substrate 1 and the lower plane of the support frame portion 2b closely and parallelly adhere to each other as shown in an enlarged view in FIG. 8B. A gap S is created.

When the gap S becomes large, the support frame portion 2b is inclined and joined to the upper plane of the insulating substrate 1. Moreover, this inclination adjustment varies depending on the product, and the interval between the diaphragm 2a and the fixed electrode conductor film 3 (width of the capacitor gap) is not constant between products, and as a result, the variation in characteristics between products increases. That is, there is a problem that it is difficult to mass-produce a highly accurate sensor having uniform characteristics at low cost.

Further, in the case of the type in which pressure is introduced from the side of the insulating substrate 1 shown in the figure, the pressure chamber formed by the upper surface of the insulating substrate 1 and the diaphragm 2a is hermetically sealed for performing highly sensitive measurement. It is preferable that the notch groove 4 is filled with an insulating resin such as polyimide to achieve airtightness. However, when the gap S becomes large and opens up to the pressure chamber, the pressure chamber is opened to the atmosphere through the gap S, and high-precision measurement cannot be performed.

Since the pressure-sensitive component 2 is entirely made of a conductive material, it is possible to bond the external wiring of the diaphragm 2a (movable electrode) to, for example, the upper surface of the support frame portion 2b. The conductor film 5 is unnecessary, and the above-mentioned problems can be solved without the lead conductor film 5. However, if the bonding portion on the movable electrode side is the upper surface of the conductive pressure-sensitive component 2 and the bonding portion on the fixed electrode side is the lead conductor film 3a on the insulating substrate 1, the conductive pressure-sensitive component 2 is connected to the two bonding portions. There is a step difference in height.

Then, a normal bonding tool cannot be used for bonding the external wiring involved in mounting the sensor or packaging, and the bonding work becomes extremely troublesome. In order to avoid the trouble in the bonding work, the movable electrode side lead conductor film 5 is formed on the upper surface of the insulating substrate 1 and arranged flush with the fixed electrode side lead conductor film 3a ( Therefore, the problems mentioned above occur).

The present invention has been made in view of the above background, and an object of the present invention is to solve the above problems and to provide an external wiring bonding portion on the movable electrode side and an external wiring bonding portion on the fixed electrode side. It is possible to mass-produce a highly accurate capacitive pressure sensor with uniform characteristics at low cost by eliminating the variation of the capacitor gap width due to the disturbance of the bonding posture between the insulating substrate and the conductive pressure-sensitive component. An object of the present invention is to provide a capacitive pressure sensor, a packaging structure thereof, and a method of manufacturing the capacitive pressure sensor.

[0014]

In order to achieve the above-mentioned object, a capacitance type pressure sensor according to the present invention is configured to have the following requirements (1) to (5) (claims). 1). (1) The conductive pressure-sensitive component and the conductive terminal blob are bonded to the upper surface of the insulating substrate in a predetermined arrangement with an appropriate interval,
The upper surfaces of the conductive pressure-sensitive component and the conductive terminal blob are substantially flush with each other. (2) The conductive pressure-sensitive component is made of a conductive material such as polysilicon, and has a shape in which the periphery of a thin diaphragm is integrated with a thick support frame portion, and the lower surface of the support frame portion is the insulation. The diaphragm is closely adhered to and bonded to the upper surface of the substrate, and the diaphragm faces the upper surface of the insulating substrate with a small gap therebetween. (3) On the upper surface of the insulating substrate, there are formed a fixed electrode conductor film which is accommodated in the frame of the support frame portion and faces the diaphragm as the movable electrode, and a lead conductor film which is continuous with the fixed electrode conductor film. The lead conductor film extends outside the frame of the support frame portion. (4) A cutout groove is formed on the lower surface of the support frame portion at a position where the lead conductor film passes, and the cutout groove keeps the lead conductor film and the support frame portion electrically non-contact with each other. Is dripping (5) The small pieces of conductive terminals are joined on the tip end portion of the lead conductor film, and both are electrically connected.

The upper surface of the insulating substrate in the present invention means
It means the joint surface side with the conductive pressure-sensitive component. Then, the vertical direction is defined based on that, and each part is defined / explained (except in the case where a particular reference is made to a drawing or the like in the description of the specification). Therefore, in the actual manufacturing process, if there is a process of placing a glass substrate (insulating substrate) on a silicon substrate (conductive pressure-sensitive component, conductive terminal small block), etc., The upper and lower surfaces referred to in this specification are in the opposite state.

There is no conductor film for electrically connecting the movable electrode to the outside on the joint surface between the conductive pressure-sensitive component and the insulating substrate, and a lead conductor film for electrically connecting the fixed electrode conductor film to the outside is provided. Since the notch groove exists in the wiring portion, the joint surface between the conductive pressure-sensitive component and the insulating substrate is uniformly surface-contacted and is not partially lifted. Therefore,
In a normal state, the distance between the movable electrode and the fixed electrode conductor film is constant, and there is no variation between sensors.

Here, the conductive terminal small pieces are made of the same material as the conductive pressure sensitive parts, and a bonding conductor film is formed on the upper surfaces of the conductive pressure sensitive parts and the conductive terminal small pieces. It is preferable that (1) is adopted because the conductive pressure-sensitive component and the conductive terminal blob can be formed from the same substrate (claim 2).

Further, the capacitance type pressure sensor is housed in a predetermined package, and the wiring conductor pattern of the package is connected to the upper surfaces of the conductive pressure sensitive component and the conductive terminal small block by wire bonding. You may make it take a structure (Claim 3). Also,
A packaging structure may be adopted in which the sensor is housed in a predetermined package, and the wiring conductor pattern of the package is connected to the upper surface of the conductive pressure-sensitive component and the upper surface of the conductive terminal blob by face-down bonding. It may be (claim 4).

Further, as a method of manufacturing the electrostatic capacitance type pressure sensor, the conductive pressure-sensitive component and the conductive terminal blob are integrally molded by a conductive substrate such as a silicon substrate, and this integrated body is formed. An object is bonded to the insulating substrate and then separated into the conductive pressure-sensitive component and the conductive terminal blob (claim 5). In that case, when molding the conductive pressure-sensitive component and the conductive terminal small piece integrally, a separation groove extending appropriately to the upper surface side is previously formed on the lower surface side (formed by half dicing or the like). It is possible to separate the conductive pressure-sensitive component and the conductive terminal blob at the position of the groove after bonding this to the insulating substrate (claim 6).

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of an embodiment of a capacitance type pressure sensor according to the present invention. As shown in the figure, the point that the conductive pressure-sensitive component 2 is bonded to the upper surface of the insulating substrate 1 made of a rectangular glass plate is similar to the conventional one. However, in the present invention, the conductive terminal blobs 6 are bonded to the upper surface of the insulating substrate 1 in a state of being separated from the conductive inter-voltage component 2. The conductive pressure-sensitive component 2 and the conductive terminal blob 6 are made of silicon and are molded by a semiconductor device manufacturing technique or a micromachining technique as described later.

In the conductive pressure-sensitive component 2, the periphery of the thin diaphragm 2a is integrated with the thick support frame portion 2b, the planar shape is square, and the overall three-dimensional envelope shape is a rectangular parallelepiped. The lower surface of the support frame portion 2b is closely adhered to and bonded to a predetermined position on the upper surface of the insulating substrate 1, and the diaphragm 2a faces the upper surface of the insulating substrate 1 with a small gap. Further, the pressure is applied from above the conductive inter-pressure component, and the diaphragm 2a comes closer to the insulating substrate 1 side as the applied pressure increases.

The electrically conductive terminal blob 6 has the same height and length as the electrically conductive pressure-sensitive component 2 and is in the form of an elongated rectangular parallelepiped having a small width. Since the pressure-sensitive component 2 and the terminal blob 6 have the same height, the upper surfaces of the pressure-sensitive component 2 and the terminal blob 6 bonded on the insulating substrate 1 are included in the same plane as shown in the figure. It's flush. In this embodiment, a conductor film serving as a bonding pad for external wiring is formed on the upper surfaces of the pressure-sensitive component 2 made of polysilicon and the terminal blob 6 by metallization (not shown).

On the upper surface of the insulating substrate 1, there is formed a circular fixed electrode conductor film 3 which fits within the frame of the support frame portion 2b of the pressure-sensitive component 2. This fixed electrode conductor film 3 serves as a movable electrode diaphragm. It faces 2a. The diaphragm 2a and the fixed electrode conductor film 3 face each other with a small gap therebetween to form a sensor capacitor. When the diaphragm 2a receives pressure and bends, the distance between the two changes, and the electrostatic capacitance between the diaphragm 2a and the fixed electrode conductor film 3 changes.

The fixed electrode conductor film 3 is formed on the upper surface of the insulating substrate 1.
A continuous lead conductor film 3a is formed. The lead conductor film 3a extends outside the frame of the support frame portion 2b, and a cutout groove 4 is formed on the lower surface of the support frame portion 2b at a position where the lead conductor film 3a passes. The notch groove 4 electrically keeps the lead conductor film 3a and the support frame portion 2b out of contact with each other.

The tip portion of the lead conductor film 3a enters the bonding interface between the insulating substrate 1 and the conductive terminal blob 6, and the tip portion of the lead conductor film 3a is placed between the insulating substrate 1 and the conductive terminal blob 6. Is sandwiched between. That is, the lead conductor film 3 a is formed on the insulating substrate 1, and the lead conductor film 3 a is formed.
The conductive terminal blobs 6 are bonded to the upper surface of the insulating substrate 1 while being placed on the surface a.

Next, the function and effect of the above configuration will be described. The fixed electrode conductor film 3 is electrically connected to the conductive terminal blob 6 via the lead conductor film 3a, and the upper surface of the terminal blob 6 serves as a bonding pad for external wiring (in the present embodiment, This part is metallized).
On the other hand, the diaphragm 2a as a movable electrode facing the fixed electrode to form the sensor capacitor is formed of polysilicon, which is a conductive material, as a whole of the pressure-sensitive component 2 including the diaphragm 2a. Serves as a bonding pad for external wiring (in this embodiment, this portion is metallized).

As described above, since the height dimensions of the pressure-sensitive component 2 and the terminal blob 6 are the same, as shown in the figure, the upper surface of the pressure-sensitive component 2 and the terminal blob 6 bonded on the insulating substrate 1 is shown. Are included in the same plane and are flush with each other. Then, the upper surface of the pressure-sensitive component 2 is the external electrode bonding portion on the movable electrode side,
The upper surface of the terminal blob 6 is the external wiring bonding portion on the fixed electrode side. Therefore, the external wiring work can be done easily using a general bonding tool.

Further, since there is no local sandwiching of the conductor film at the joint interface between the insulating substrate 1 and the conductive pressure-sensitive component 2 unlike the conventional case, the factor that disturbs the joint posture is removed, and the variation in the capacitor gap width is eliminated. Very few. Of course, since the lead conductor film 3a passes through the position of the cutout groove 4 of the support frame portion 2b and is not in contact, it does not disturb the joining posture of the conductive pressure-sensitive component 2.

The capacitance type pressure sensor shown in FIG. 1 is of the type in which the measured pressure is applied from the conductive pressure sensitive component 2 side, but the present invention is not limited to this, and for example, FIG. As shown in FIG. 4, it is of course possible to apply the measurement pressure from the insulating substrate 1 side. That is,
In the illustrated example, the pressure introducing hole 7 that vertically penetrates the insulating substrate 1
Is provided so that external pressure can be introduced to the lower surface of the diaphragm 2a through the pressure introducing hole 7. Since the other configurations and effects are the same as those of the structure shown in FIG. 1, the same reference numerals are given and detailed description thereof will be omitted.

Next, an example of the manufacturing method according to the present invention for manufacturing the capacitance type pressure sensor having the above structure will be described. A manufacturing method in which the conductive pressure-sensitive component 2 and the conductive terminal blob 6 are integrally molded from silicon or the like, the integrated body is bonded to the insulating substrate 1, and then the pressure-sensitive component 2 and the terminal blob 6 are separated. Is rational. Then, in order to form and separate such an integrated body without making much changes to the conventional manufacturing process, it is preferable to adopt the following method.

In accordance with a normal pressure sensor manufacturing process, the surface of a conductive substrate such as a silicon substrate is etched to form a recess at a predetermined position on the bonding surface side. The place where the recess is formed finally becomes the diaphragm. Further, half dicing is performed at predetermined positions on the bonding surface side to form grooves having a predetermined depth in parallel at regular intervals.

The specific formation position of this groove is a boundary portion between the conductive inter-voltage component and the conductive terminal blob in the final product. After performing such a treatment, the insulating substrate is anodically bonded and integrated, and the upper surface of the silicon substrate is further etched to form a concave portion in the diaphragm formation portion. As a result, an intermediate product as shown in FIG. 3 is formed.

That is, the pressure-sensitive component 2 and the terminal blob 6 are integrally formed, and the lower surface side thereof is appropriately provided with a separating groove 8 formed by the above-mentioned half dicing and extending to the upper surface side. . At the time of joining, the connecting portion 8a
Since the pressure-sensitive component 2 and the terminal small piece 6 are connected and integrated via the lead conductor film 3a, the lead conductor film 3a locally lifts the terminal small piece 6 upward, and the strain caused thereby is transmitted to the pressure-sensitive part 2 side. However, since the contact portion between the lead conductor film 3a and the terminal blob 6 is far from the joint portion between the supporting frame portion 2a and the insulating substrate 1 and the groove 8 is present, the strain is generated in the connecting portion 8a. Since it is transmitted through the device, it is absorbed in the middle of the process and does not pose a practical problem.

After that, the connecting portion 8a is cut by die-signing the position corresponding to the groove 8 from above the silicon substrate to separate the pressure-sensitive component 2 and the terminal blob 6 from each other. Although half dicing is shown as the method of forming the groove 8, it goes without saying that other methods such as etching may be used.

Next, an embodiment of the packaging structure according to the present invention will be described. The pressure sensor of the embodiment shown in FIG. 1 is turned upside down and housed in a box-shaped package 9 having an upper opening shown in FIGS. Lead frames 10 a and 10 b are arranged on the inner bottom surface of the package 9. The movable electrode side bonding portion of the upper surface (the lower surface in FIGS. 4 and 5) of the support frame portion 2b in the pressure sensor contacts the lead frame 10a, and the upper surface of the conductive terminal blob 6 (lower surface in FIGS. 4 and 5). The fixed electrode side bonding portion of) contacts the lead frame 10b. These are electrically connected via the conductive paste 11. There is a pressure guiding tube 15 at the center of the bottom surface of the package 9, and the pressure from this acts on the diaphragm 2a.

FIG. 6 shows another embodiment of the package structure. The pressure sensor is housed in a box-shaped package 12 having an upper opening shown in FIG. Lead frames 13a and 13b are provided on the upper step portion 12a of the package 12 and are substantially flush with the upper surface of the pressure sensor housed therein.

Then, the support frame portion 2b of the conductive pressure-sensitive component 2
Movable electrode side bonding part on the upper surface of the and lead frame 1
3a is wire-bonded to the fixed electrode side bonding portion on the upper surface of the conductive terminal blob 6 and the lead frame 13.
Wire bond with b. Incidentally, reference numeral 14a,
Each of 14b indicates a bonding wire.
Further, there is a pressure guiding tube 15 at the center of the bottom surface of the package 12, and this communicates with the pressure introducing hole 7 of the sensor, and the pressure from this acts on the diaphragm 2a.

[0038]

As described above, in the capacitance type pressure sensor, the packaging structure thereof and the method of manufacturing the capacitance type pressure sensor according to the present invention, the external wiring bonding portion on the movable electrode side and the fixed electrode side are formed. Makes the external wiring bonding part flush with each other, eliminates the variation in the capacitor gap width due to the disorder of the bonding posture between the insulating substrate and the conductive pressure-sensitive component, and makes it possible to inexpensively provide a highly accurate capacitive pressure sensor with uniform characteristics. Mass production is possible.

[Brief description of drawings]

FIG. 1A is a plan view showing an example of an embodiment of a capacitance type pressure sensor according to the present invention. (B) is FIG.
It is a BB sectional view taken on the line of (A).

FIG. 2 is a configuration diagram showing another embodiment of the capacitance type pressure sensor according to the present invention.

FIG. 3 is a diagram showing the main points of an embodiment of a method for manufacturing a capacitance type pressure sensor according to the present invention.

FIG. 4 is a configuration diagram showing a first embodiment of a packaging structure according to the present invention.

FIG. 5 is a configuration diagram showing a first embodiment of a packaging structure according to the present invention.

FIG. 6 is a configuration diagram showing a second embodiment of a packaging structure according to the present invention.

FIG. 7A is a plan view of a conventional electrostatic capacitance type pressure sensor. FIG. 7B is a sectional view taken along line BB of FIG.

FIG. 8A is a front view of a conventional capacitance type pressure sensor. (B) is the figure which expanded and showed a part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Conductive pressure-sensitive component 2a Diaphragm 2b Support frame part 3 Fixed electrode conductor film 3a Lead conductor film 4 Notch groove 6 Conductive terminal blob 8 Separation groove 9,12 Package 10a, 10b, 13a, 13b Lead frame 11 Conductive paste 14a, 14b Bonding wire

Claims (6)

[Claims] 1. A capacitance type pressure sensor having the following requirements (1) to (5). (1) The conductive pressure-sensitive component and the conductive terminal blob are bonded to the upper surface of the insulating substrate in a predetermined arrangement with an appropriate interval,
The upper surfaces of the conductive pressure-sensitive component and the conductive terminal blob are substantially flush with each other. (2) The conductive pressure-sensitive component is made of a conductive material such as a silicon substrate, and has a shape in which the periphery of a thin diaphragm is integrated with a thick support frame portion, and the lower surface of the support frame portion is the insulation. The diaphragm is closely adhered to and bonded to the upper surface of the substrate, and the diaphragm faces the upper surface of the insulating substrate with a small gap therebetween. (3) On the upper surface of the insulating substrate, there are formed a fixed electrode conductor film which is accommodated in the frame of the support frame portion and faces the diaphragm as the movable electrode, and a lead conductor film which is continuous with the fixed electrode conductor film. The lead conductor film extends outside the frame of the support frame portion. (4) A cutout groove is formed on the lower surface of the support frame portion at a position where the lead conductor film passes, and the cutout groove keeps the lead conductor film and the support frame portion electrically non-contact with each other. Is dripping (5) The small pieces of conductive terminals are joined on the tip end portion of the lead conductor film, and both are electrically connected. 2. The conductive terminal small piece according to claim 1, made of the same material as the conductive pressure sensitive component, and a conductive film for bonding is formed on the upper surfaces of the conductive pressure sensitive component and the conductive terminal small chunk. Capacitive pressure sensor characterized in that 3. The capacitive pressure sensor according to claim 1 or 2 is housed in a predetermined package, and the wiring conductor pattern of the package, the conductive pressure-sensitive component, and the upper surface of the conductive terminal blob. A packaging structure characterized by connecting wires by wire bonding. 4. The capacitive pressure sensor according to claim 1 or 2 is housed in a predetermined package, and the wiring conductor pattern of the package, the conductive pressure-sensitive component, and the upper surface of the conductive terminal blob. A packaging structure characterized by being connected by face-down bonding which directly contacts with. 5. A method of manufacturing the capacitance type pressure sensor according to claim 1, wherein the conductive pressure-sensitive component and the conductive terminal blob are a conductive substrate such as a silicon substrate. A method of manufacturing a capacitance-type pressure sensor, characterized in that it is integrally molded by means of, and the integrated body is bonded to the insulating substrate and then separated into the conductive pressure-sensitive component and the conductive terminal small block. 6. The separation groove according to claim 5, wherein a groove for separation extending to the upper surface side is appropriately formed on the lower surface side at the time of molding the integrated body of the conductive pressure sensitive component and the small conductive terminal block. A method for manufacturing a capacitance type pressure sensor, comprising: joining the insulating substrate to the insulating substrate and then separating the conductive pressure-sensitive component and the small conductive terminal block at the position of the groove.