CN216593886U - Micro-electromechanical resonance type pressure sensitive structure - Google Patents
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Abstract
The utility model provides a micro-electromechanical resonant pressure sensitive structure capable of eliminating nonlinear frequency variation in resonant frequency variation, which comprises: the device comprises a substrate with a sealed cavity, a pressure-sensitive film arranged at the top of the substrate, an elastic cantilever beam arranged in the sealed cavity and suspended in the middle, at least one pair of functional electrodes oppositely arranged at two sides of the elastic cantilever beam, at least one pair of compensation electrodes oppositely arranged at two sides of the elastic cantilever beam, and a plurality of anchor points which are arranged on the pressure-sensitive film and extend from the pressure-sensitive film to the bottom direction of the substrate to form; the anchor points of the fixed compensation electrodes displace along with the anchor points of the fixed elastic cantilever beams when the pressure-sensitive film deforms under pressure. The micro-electromechanical resonant pressure sensitive structure provided by the utility model can transfer deformation to the elastic cantilever beam through the anchor point and eliminate the part with nonlinear frequency change in the resonance frequency change when the pressure sensitive film is deformed under pressure, thereby improving the measurement accuracy.
Description
Technical Field
The utility model relates to the technical field of micro electro mechanical systems, in particular to a micro electro mechanical resonant pressure sensitive structure.
Background
Micro-electromechanical systems (MEMS) are developed on the basis of microelectronics, and incorporate micro-sensors, micro-actuators, micro-mechanical structures, micro-power micro-energy sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communication, etc. into a single micro-device or system. MEMS is a revolutionary new technology, is widely applied to high and new technology industries, and is a key technology related to national science and technology development, economic prosperity and national defense safety.
The MEMS pressure sensor is produced in various MEMS devices earlier. At present, most MEMS pressure sensor chips on the market are piezoresistive type and capacitive type, namely, the change of external pressure is converted into the change of resistance or capacitance, and then the change is detected through a corresponding circuit. However, the detection accuracy of the piezoresistive sensor is affected by thermal noise, and the capacitive sensor is difficult to avoid the influence of parasitic capacitance, and the pressure sensor based on the two principles is difficult to meet the requirements of particularly high-detection-accuracy applications.
In order to solve the above problems, manufacturers have recently introduced resonant pressure sensor products which convert pressure changes into frequency signals for detection, and the principle is as follows: the method comprises the steps of firstly, manufacturing a specific resonator structure on a chip through a micromachining technology, converting external pressure change into rigidity change of an elastic cantilever beam of the structure, further causing inherent resonant frequency change of the structure, and detecting the current resonant frequency of the structure by matching with a phase-locked loop (PLL) circuit through a functional electrode configured on the structure. The detection precision is mainly determined by the frequency resolution of the sensor system, and the quality factor of the resonance structure is improved by processing the sensitive structure in the sealed cavity close to vacuum in the chip, so that the extremely high frequency resolution can be realized. The pressure sensor adopting the principle can realize higher detection precision compared with products adopting the piezoresistive and capacitance detection principle theoretically. In addition, the frequency signal also has the advantages of interference resistance, suitability for long-distance transmission and direct digital reading.
However, although the resonant pressure sensor has high detection precision, the measurement accuracy is affected by introducing large nonlinearity which is difficult to avoid in the process of converting the pressure into the change of the stiffness of the elastic cantilever beam, so that an additional mechanism is required to improve the linearity index of the sensor output.
SUMMERY OF THE UTILITY MODEL
In a first aspect of the present invention, there is provided a microelectromechanical resonant pressure sensitive structure capable of canceling non-linear frequency variations in resonant frequency variations, comprising:
the device comprises a substrate with a sealed cavity, a pressure-sensitive film arranged at the top of the substrate, an elastic cantilever beam arranged in the sealed cavity and suspended in the middle of the substrate, at least one pair of functional electrodes which are positioned at two sides of the elastic cantilever beam and are oppositely arranged, at least one pair of compensation electrodes which are positioned at two sides of the elastic cantilever beam and are oppositely arranged, and a plurality of anchor points which are arranged on the pressure-sensitive film and extend from the pressure-sensitive film to the bottom direction of the substrate;
the plurality of anchor points comprise a pair of first anchor points used for fixing two ends of the elastic cantilever beam, at least one pair of second anchor points used for fixing the functional electrode and positioned at two sides of the elastic cantilever beam, and at least one pair of third anchor points used for fixing the compensation electrode;
the functional electrode is a comb tooth electrode, and the elastic cantilever beam is provided with a comb tooth part which is mutually inserted with the functional electrode;
the third anchor point can displace along with the first anchor point when the pressure-sensitive film deforms under pressure, so that the self-adaptive compensation of the compensation electrode on the elastic cantilever beam is realized.
In one possible implementation manner of the first aspect, the elastic cantilever, the functional electrode and the compensation electrode are made of a heavily doped silicon material with good electrical conductivity.
In one possible implementation manner of the first aspect, the elastic cantilever beam, the functional electrode and the compensation electrode are electrically isolated from each other, and the lead structures respectively processed by independent metal or polysilicon thin films are connected to the metal pad outside the substrate.
In a possible implementation manner of the first aspect, the elastic cantilever beam coincides with a projection of a central axis of the sealed cavity.
In a possible implementation manner of the first aspect, two pairs of the compensation electrodes are disposed in the sealed cavity, and each compensation electrode is fixed on a single third anchor point.
In a possible implementation manner of the first aspect, two pairs of the compensation electrodes are respectively disposed on two sides of the functional electrode along the direction of the elastic cantilever beam.
In a possible implementation manner of the first aspect, the substrate is formed by laminating a bottom wafer, a structural layer wafer, and a top wafer, and the structural layer wafer, the bottom wafer, and the top wafer enclose the sealed cavity; the pressure sensitive film is disposed on the top wafer, and the anchor points are formed on the pressure sensitive film by an etching or growth process.
In a possible implementation manner of the first aspect, a vacuum environment is provided in the sealed cavity.
The micro-electromechanical resonant pressure sensitive structure provided by the utility model has the following beneficial effects: the compensation electrode can offset the part of the nonlinear frequency change in the resonance frequency change of the elastic cantilever beam, so that the measurement accuracy is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a top view of a MEMS resonant pressure sensitive structure provided in the present invention;
FIG. 2 is a cross-sectional view of a MEMS resonant pressure sensitive structure provided by the present invention;
fig. 3 is a pressure measurement method of the micro-electromechanical resonant pressure sensitive structure provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In a first embodiment of the present invention, a mems resonant pressure sensitive structure 100 is provided, as shown in fig. 1, including:
the device comprises a substrate 10 with a sealed cavity 11, a pressure-sensitive film arranged on the top of the substrate 10, an elastic cantilever beam 20 arranged in the sealed cavity 11 and suspended in the middle, a plurality of pairs of functional electrodes 30 which are positioned on two sides of the elastic cantilever beam 20 and are oppositely arranged, at least one pair of compensation electrodes 31 which are positioned on two sides of the elastic cantilever beam 20 and are oppositely arranged, and a plurality of anchor points which are arranged on the pressure-sensitive film and are formed by extending from the pressure-sensitive film to the bottom direction of the substrate 10.
Specifically, the substrate 10 constitutes a housing of the mems resonant pressure sensitive structure 100, and the substrate 10 is a hollow structure for accommodating various components. A pressure-sensitive film 12 for sensing pressure is disposed on top of the substrate 10, and when the mems resonant pressure-sensitive structure 100 is subjected to an external pressure, the pressure-sensitive film 12 transmits the pressure to other respective components and starts measurement. Preferably, the pressure-sensitive film 12 is disposed in a direction toward the direction in which the pressure is applied. The elastic cantilever beam 20 for measuring pressure is suspended in the sealed cavity 11 of the substrate 10, two ends of the cantilever beam are fixed on the pressure-sensitive film 12 through anchor points, and the middle suspended part is suspended in the sealed cavity 11 of the substrate 10 and can move.
Specifically, the sealed cavity 11 in the base body 10 is further provided with at least one pair of functional electrodes 30 oppositely arranged on two sides of the elastic cantilever beam 20 and at least one pair of compensation electrodes 31 oppositely arranged on two sides of the elastic cantilever beam 20, and preferably, the functional electrodes 30 and the compensation electrodes 31 are both arranged on two sides of the suspended part of the elastic cantilever beam 20. Further, the functional electrode 30 is used for driving the elastic cantilever beam 20 into a resonance state and detecting the resonance frequency thereof, and the functional electrode 30 includes a fixed end and a movable end, wherein the fixed end is located on the anchor point, and the movable end faces the elastic cantilever beam 20. In addition, when the pressure-sensitive film 12 is subjected to external pressure, the part of the resonant frequency change of the elastic cantilever beam 20 is divided into linear frequency change and nonlinear frequency change, when the device works, different voltages are applied to two ends of the compensation electrode 31, an electrostatic force is generated between the electrodes, due to the softening or hardening effect of the electrostatic spring, the resonant frequency of the resonant structure can change along with the change of the voltage on the compensation electrode 31, the rate of change of the frequency along with the voltage is related to the electrostatic force applied on the comb-teeth part 221 by the compensation electrode 31, the electrostatic force is related to the capacitance of the compensation electrode 31, and finally the nonlinear frequency change is counteracted, and only the part of the linear frequency change used for measurement is reserved. Similar to the functional electrode 30, the compensation electrode 31 includes a fixed end located on the anchor point and a movable end facing the elastic cantilever beam 20.
Specifically, the plurality of anchor points includes a pair of first anchor points 41 for fixing both ends of the elastic cantilever beam 20, a pair of second anchor points 42 for fixing the functional electrode 30 and located at both sides of the elastic cantilever beam 20, and at least a pair of third anchor points 43 for fixing the compensation electrode.
The functional electrode 30 is a comb-tooth electrode, and the elastic cantilever 20 has a comb-tooth portion 221 inserted into the functional electrode 30.
Specifically, the mems resonant pressure sensitive structure 100 has a plurality of pairs of functional electrodes 30, the functional electrodes 30 are located on the second anchor points 42, and the functional electrodes 30 located on the same side of the elastic cantilever beam 20 are spaced apart from each other to form a plurality of gaps. On the other hand, a plurality of comb-tooth portions 221 are formed in the suspended portion of the elastic cantilever beam 20 extending toward both sides in the direction of the second anchor point 242, and the plurality of comb-tooth portions 221 extend into the corresponding gaps. Specifically, a plurality of comb-shaped portions 221 are introduced into the suspended portion of the elastic cantilever beam 20, and the comb-shaped portions 221 extend into the gap formed between the functional electrodes 30, so that the acting area between the elastic cantilever beam 20 and the functional electrodes 30 is enlarged, and the sensitivity of the mems resonant pressure sensitive structure 100 is further improved.
And the third anchor point moves along with the first anchor point when the pressure-sensitive film is deformed under pressure so as to realize the self-adaptive compensation of the compensation electrode on the elastic cantilever beam. Specifically, the third anchor point 43 displaces along with the first anchor point 41 when the pressure-sensitive film 12 deforms under pressure, and after the first anchor point 41 connected to the elastic cantilever beam 20 displaces, stress is applied to the elastic cantilever beam 20 to cause the rigidity of the elastic cantilever beam 20 to change, so that the resonance frequency of the movable structure (i.e., the suspended portion) changes, including the part of the nonlinear frequency change which negatively affects the measurement; meanwhile, the fixed end of the compensation electrode 31 moves along with the third anchor point 43, and the movable end moves along with the elastic cantilever beam 20, the amplitude and direction of the relative movement displacement between the compensation electrodes 31 are influenced by the actual structural design, that is, the change rate of the capacitance of the compensation electrode 31 along with the applied pressure is influenced by the structural design, that is, when the device works, the electrostatic spring softening or hardening effect generated by the electrostatic force between the compensation electrodes 31 can be adjusted through the structural design, so that the structural resonance frequency of the elastic cantilever beam 20 is changed. Under reasonable structural design, the change of the stiffness of the elastic cantilever beam 20 caused by the conduction of the external pressure change through the pressure-sensitive film 12 and the anchor point can be caused, so that the part of the nonlinear frequency change in the change of the resonant frequency of the movable suspended part of the elastic cantilever beam 20 caused by the change of the external pressure is offset by the change of the softening or hardening effect of the electrostatic spring caused by the change of the external pressure along with the compensation electrode 31, and the nonlinear frequency change of the frequency signal output by the micro-electromechanical resonant pressure-sensitive structure 100 is finally reduced. In a specific embodiment, the elastic cantilever beam 20 coincides with a projection of the central axis of the sealed cavity 11.
Specifically, in order to maximally improve the sensitivity of the mems resonant pressure sensitive structure 100 to pressure, the elastic cantilever beam 20 is disposed at a portion coinciding with the projection of the central axis of the sealed cavity 11, and the elastic cantilever beam 20 is located at the middle of the sealed cavity 11 when viewed from the top, so as to uniformly receive the deformation generated by the pressure-sensitive film 12 when being pressed, and improve the measurement accuracy.
In a specific embodiment, the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31 are made of a heavily doped silicon material with good conductivity.
Specifically, the elastic cantilever beam 20, the functional electrode 30 and the compensation electrode 31 need to have good conductivity, and thus current can be conducted to generate an electric field, and the elastic cantilever beam 20 is driven to enter a resonance state to finally realize pressure measurement, so that the elastic cantilever beam 20, the functional electrode 30 and the compensation electrode 31 are made of a heavily doped silicon material with good conductivity, and further, the conductivity of the heavily doped silicon material can be adjusted according to doped components, so that the structure improves sensitivity in different application scenarios.
In a specific embodiment, the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31 are electrically isolated from each other, and are connected to a metal pad outside the substrate 10 by a wire structure made of independent metal or polysilicon thin film.
In order to avoid electrical conduction among the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31, which may cause electrical leakage, short circuit and the like, it is necessary to apply electrical isolation among the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31, and specifically, an insulating material layer such as a silicon dioxide layer may be applied on one or more of the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31 to ensure mutual insulation among the above structures. Further, in order to make the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31 conductive with external electrical devices, lead structures respectively made of independent metal or polysilicon thin films, which can be made by growth or etching process, are connected to the metal pads outside the base body 10.
In a specific embodiment, two pairs of the compensation electrodes 31 are disposed in the sealed cavity 11, and each of the compensation electrodes 31 is fixed to a single third anchor point 43.
Specifically, in order to improve the adjustment effect of the compensation electrode 31 on the elastic cantilever beam 20, the compensation electrode 31 may be disposed at a designated position as required, and therefore, the single compensation electrode 31 may be fixed on the single third anchor point 43, that is, may have a plurality of third anchor points 43 and the compensation electrode 31 disposed thereon, for example, as shown in fig. 1, the mems resonant pressure sensitive structure 100 has 4 third anchor points 43 and correspondingly 4 compensation electrodes 31, and the number of the third anchor points 43 and the number of the compensation electrodes 31 may be freely set according to requirements.
In a specific embodiment, two pairs of the compensation electrodes 31 are respectively disposed on both sides of the functional electrode 30 along the direction of the elastic cantilever beam 20.
In particular, in order to make the compensation electrodes 31 adjust the elastic cantilever 20 more uniformly, in a preferred embodiment, two pairs of compensation electrodes 31 are provided and are respectively disposed on both sides of the functional electrode 30 along the direction of the elastic cantilever 20, i.e. one compensation electrode 31 is provided on each of the left and right sides of the functional electrode 30 in the axial direction in which the elastic cantilever 20 is disposed, so as to achieve complete compensation of the suspended portion of the elastic cantilever 20, and finally further reduce the nonlinear resonance frequency variation of the elastic cantilever 20.
In a specific embodiment, the substrate 10 is formed by laminating a bottom wafer 103, a structural layer wafer 102 and a top wafer 101, wherein the structural layer wafer 102, the bottom wafer 103 and the top wafer 101 enclose the sealed cavity 11; the pressure sensitive film 12 is disposed on the top wafer 101 and the anchor points are formed on the pressure sensitive film 12 by an etching or growth process.
Specifically, the MEMS device is mostly manufactured by using a semiconductor manufacturing process, and for the present embodiment, the substrate 10 constituting the MEMS resonant pressure sensitive structure 100 is formed by stacking three wafers, i.e., a bottom wafer 103, a structural layer wafer 102, and a top wafer 101, and encloses the sealed cavity 11. Further, the above-mentioned pressure sensitive film 12 is disposed on the top layer wafer 101, and the anchor points are formed on the pressure sensitive film 12 through etching or growth process, and on the other hand, the elastic cantilever 20, the functional electrode 30 and the compensation electrode 31 are formed on the structural layer wafer 102. The wafers are bonded through a bonding adhesion layer, and the elastic cantilever beam 20 formed on the structural layer wafer 102, the functional electrode 30, the compensation electrode 31 and the anchor point formed on the top wafer 101 are also bonded through the bonding adhesion layer.
In a specific embodiment, the sealed cavity 11 is a vacuum environment.
Specifically, when the sealed cavity 11 is formed, the interior of the sealed cavity 11 is evacuated to minimize the resistance of the suspended portion of the elastic cantilever beam 20 when vibrating in the sealed cavity 11, so as to improve the sensitivity of the resonant frequency of the elastic cantilever beam 20, and finally improve the sensitivity of the mems resonance type pressure sensitive structure 100 to pressure.
In a third embodiment of the present invention, a pressure measurement method for the micro-electromechanical resonant pressure sensitive structure 100 provided in the above embodiments is provided, which includes the following steps:
s1: an excitation electrical signal is applied between the elastic cantilever beam 20 and the functional electrode 30 via an external circuit, causing the elastic cantilever beam 20 to oscillate back and forth at a natural resonant frequency, which is monitored in real time by the external circuit.
Specifically, a voltage of a preset intensity and phase is applied to the elastic cantilever beam 20 and the functional electrode 30 through an external circuit, so that the elastic cantilever beam 20 enters a resonance state and vibrates back and forth at a natural resonance frequency, and the natural resonance frequency is monitored by the functional electrode 30 through the external circuit in real time.
S2: applying a compensating electrical signal between the elastic cantilever beam 20 and the compensating electrode 31 to generate an electrostatic force between the elastic cantilever beam 20 and the compensating electrode 31, and influencing the frequency of the reciprocating vibration of the elastic beam 20 through corresponding electrostatic spring hardening and softening effects;
s3: when the pressure-sensitive film 12 is deformed by external pressure, the rigidity and the natural resonant frequency of the elastic cantilever beam 20 are changed, and the distance between the elastic cantilever beam 20 and the compensation electrode 31 is simultaneously changed;
specifically, when the pressure-sensitive film 12 is deformed under pressure, the first anchor point 41 connected to the elastic cantilever beam 20 is displaced, and then stress is applied to the elastic cantilever beam 20 to cause the stiffness of the elastic cantilever beam 20 to change, so that the natural resonant frequency of the movable structure (i.e., the suspended portion) changes, wherein a linear change portion for measuring the magnitude of the pressure and a non-linear change portion for negatively affecting the measurement are included, and at this time, the non-linear change portion is calculated according to the change of the natural resonant frequency measured by an external circuit, and the ratio of the change of the natural resonant frequency to the non-linear change portion in the change of the natural resonant frequency can be obtained by testing the natural property of the elastic cantilever beam.
S4: according to the preset design of the compensation electrode, the electrostatic force between the elastic cantilever beam and the compensation electrode caused by the distance is changed, so that the degree of the hardening and softening effect of the electrostatic spring is changed, and finally the frequency of the reciprocating vibration of the elastic cantilever beam is changed, and the change of the natural resonant frequency of the elastic cantilever beam caused by the external pressure is counteracted by the nonlinear part; specifically, according to the relationship curve of the pre-calibrated nonlinear frequency variation and the electrostatic force applied by the compensation electrode 31, the electrostatic force is applied on the elastic cantilever beam 20 by the compensation electrode 31, and the natural resonant frequency of the elastic cantilever beam is compensated by the hardening and softening effect of the electrostatic spring, so as to counteract the nonlinear variation.
S5: measuring the change of the natural resonant frequency of the elastic cantilever beam 20 after compensation, and calculating the pressure applied to the pressure-sensitive membrane 12 according to the change of the natural resonant frequency.
Finally, since the nonlinear change in the natural resonant frequency is partially cancelled out, the remaining linear frequency change is measured, and the pressure applied to the pressure-sensitive membrane 12 is calculated according to the pre-calibrated natural vibration frequency change-pressure curve.
The technical features of the above embodiments may be arbitrarily combined, and for the sake of brief description, all possible combinations of the technical features in the above embodiments are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. A microelectromechanical resonant pressure sensitive structure, comprising:
the device comprises a substrate with a sealed cavity, a pressure-sensitive film arranged at the top of the substrate, an elastic cantilever beam arranged in the sealed cavity and suspended in the middle of the substrate, at least one pair of functional electrodes which are positioned at two sides of the elastic cantilever beam and are oppositely arranged, at least one pair of compensation electrodes which are positioned at two sides of the elastic cantilever beam and are oppositely arranged, and a plurality of anchor points which are arranged on the pressure-sensitive film and extend from the pressure-sensitive film to the bottom direction of the substrate;
the plurality of anchor points comprise a pair of first anchor points used for fixing two ends of the elastic cantilever beam, at least one pair of second anchor points used for fixing the functional electrode and positioned at two sides of the elastic cantilever beam, and at least one pair of third anchor points used for fixing the compensation electrode;
the functional electrode is a comb tooth electrode, and the elastic cantilever beam is provided with a comb tooth part which is mutually inserted with the functional electrode;
the third anchor point can displace along with the first anchor point when the pressure-sensitive film deforms under pressure, so that the self-adaptive compensation of the compensation electrode on the elastic cantilever beam is realized.
2. A microelectromechanical resonant pressure sensitive structure of claim 1, characterized in that the elastic cantilever beam, the functional electrode and the compensation electrode are electrically isolated from each other and the wire structures, each being fabricated from a separate metal or polysilicon film, are connected to a metal pad outside the substrate.
3. The microelectromechanical resonant pressure sensitive structure of claim 1, characterized in that:
the elastic cantilever beam is superposed with the projection of the central axis of the sealed cavity.
4. The microelectromechanical resonant pressure sensitive structure of claim 1, characterized in that:
two pairs of compensation electrodes are arranged in the sealed cavity, and each compensation electrode is fixed on a single third anchor point.
5. The microelectromechanical resonant pressure sensitive structure of claim 4, characterized in that:
and the two pairs of compensation electrodes are respectively arranged on two sides of the functional electrode along the direction of the elastic cantilever beam.
6. The microelectromechanical resonant pressure sensitive structure of claim 1, characterized in that:
the substrate is formed by laminating a bottom layer wafer, a structural layer wafer and a top layer wafer, and the structural layer wafer, the bottom layer wafer and the top layer wafer are enclosed to form the sealed cavity; the pressure sensitive film is disposed on the top wafer, and the anchor points are formed on the pressure sensitive film by an etching or growth process.
7. The microelectromechanical resonant pressure sensitive structure of claim 6, characterized in that: and a vacuum environment is arranged in the sealed cavity.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113218540A (en) * | 2021-05-07 | 2021-08-06 | 慧石（上海）测控科技有限公司 | Micro-electromechanical resonance type pressure sensitive structure and pressure measuring method |
| CN113218540B (en) * | 2021-05-07 | 2024-10-22 | 慧石（上海）测控科技有限公司 | Micro-electromechanical resonance type pressure sensitive structure and pressure measuring method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113218540A (en) * | 2021-05-07 | 2021-08-06 | 慧石（上海）测控科技有限公司 | Micro-electromechanical resonance type pressure sensitive structure and pressure measuring method |
| CN113218540B (en) * | 2021-05-07 | 2024-10-22 | 慧石（上海）测控科技有限公司 | Micro-electromechanical resonance type pressure sensitive structure and pressure measuring method |
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