JPH10183188A - Releasing agent composition for adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition excellent in releasing property and capable of shortening releasing time by compounding an organic solvent having an aromatic structure in a molecular structure and containing an oxygen atom with a specific alkylene oxide compound. SOLUTION: This composition is composed of (A) an organic solvent having an aromatic structure in a molecular structure and containing an oxygen atom, preferably an aromatic compound of formula I (R<5> is H or a 1-4C hydrocarbon; W is Co, O or CH2 ; X is H, OH, OCH3 , etc.) and (B) an alkylene oxide compound of one or more selected from a group of compounds of formulae II to IV [R<1> is H, a 1-8C alkyl or allyl; R<2> and R<3> are each a 2-4C alkylene; R<4> is H, a 1-4C alkyl or a 1-4C acyl; (m), (n), (p) and (q) are each an integer of 1-7, 0-7, 0-5 and 0-5, respectively]. The compounding ration of the component A/the component B is preferably 50/50 to 99/1 in weight. Thus obtained composition is useful as a releasing agent for a reaction-type adhesive such as a cyanoacrylate-based adhesive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a release agent composition for various adhesives, and more particularly, to the removal of a reactive adhesive such as a cyanoacrylate adhesive, a polyurethane adhesive or an acrylic resin adhesive. The present invention relates to a release agent composition having excellent properties.

[0002]

2. Description of the Related Art Cyanoacrylate-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, and the like are adhesives of the type in which a monomer or oligomer is cured by a chemical reaction to form an adhesive film. Classified as an agent. Reactive adhesives are widely used in general consumer applications, aircraft, automobiles, various transports, the electronics and electrical industries, and civil engineering and construction fields.

[0003] In the field of electronics and electrical industry, semiconductor and crystal materials such as silicon, gallium and arsenic, gallium and phosphorus, materials related to electronic parts such as quartz, quartz and glass; magnetic materials such as ferrite and samarium and cobalt; In recent years, in the process of processing metals, ceramic materials, such as magnetic materials such as barium titanate and PZT, piezoelectric materials such as PZT, the size of the workpiece has been increased in order to improve the yield, and the processing accuracy has rapidly increased due to the downsizing of parts. Came up. As a result, the amount of reactive adhesive used increases,
The required adhesive strength has also become severe.

In particular, in the processing of small components such as chip capacitors, chip resistors, and magnetic heads, the use of cyanoacrylate-based adhesives, which are generally well known as instant adhesives, has been increasing. The cyanoacrylate adhesive is α-methyl methyl cyanoacrylate, α
-Ethyl cyanoacrylate, isobutyl α-cyanoacrylate or the like as a main component, which is widely used in general consumer applications as a material capable of obtaining high adhesive strength in a short time.

Conventionally, as a method for peeling and removing an unnecessary reactive adhesive, an organic solvent such as toluene, ethyl acetate, methyl ethyl ketone, acetone, and dimethylformamide is contained in paper or cloth to wipe off necessary portions. ,
The method of swelling the adhesive by dropping, pouring, dipping, brushing, or the like, and then scraping it off with a spatula or the like was common. However, in these methods, a large amount of organic solvent is used, so that the risk of fire is large, the cost is increased due to evaporation and scattering, and further, there is a large problem in hygiene.

On the other hand, chip capacitors, chip resistors,
In industrial applications such as processing of small parts such as a magnetic head, there has been a difficulty that a large amount of adhesive having high adhesive strength formed in a narrow gap must be peeled off in a short time.

Conventionally, acetone and methylene chloride have been used for this purpose. Acetone has a low flash point,
Due to hygiene issues, there are many restrictions on handling. Since methylene chloride alone has insufficient detergency, it may be used in combination with an alkaline detergent.
Due to its potential for carcinogens, strict regulations are being imposed on wastewater and air leakage, and reductions and bans on its use are being called for.

[0008] Regarding the peeling of the adhesive, for example, Japanese Patent Application Laid-Open No. Sho 60-20982 discloses a rimbar composition for an adhesive such as α-cyanoacrylate in a solvent having a boiling point of 100 ° C. or higher in a solvent having a carboxyl group-containing polymer. And a high-boiling compound such as N-methylpyrrolidone, γ-butyrolactone, sulfolane, and propylene carbonate. However, in the rimbar composition, since the carboxyl group-containing polymer compound is contained, the viscosity of the composition becomes high, and it is difficult to remove the adhesive in a narrow gap.

Japanese Patent Application Laid-Open No. Hei 6-80940 discloses that N, N-dimethylformamide, N, N-
In a non-halogen organic solvent containing a nitrogen element such as dimethylacetamide and N-methylpyrrolidone, HLB is 4 to
An adhesive stripping composition containing 16 nonionic surfactants is shown. However, in this release agent composition,
Adhesives with high adhesive strength have low releasability as well as fire hazards and hygiene problems.

JP-A-6-150229 discloses that when washing a cyanoacrylate-based instant adhesive used for bonding a ceramic to a processing jig, the adhesive is dissolved in N-methylpyrrolidone at an elevated temperature. Then, after removing the block from the processing jig by ultrasonic cleaning, the remaining N-methylpyrrolidone is subjected to ultrasonic cleaning with isopropyl alcohol, and further subjected to vapor cleaning with fluorocarbon. However, in the case of this cleaning method, there are inconveniences such as low releasability of an adhesive having high adhesive strength, flammability of a solvent used, and an effect on the environment.

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to solve a problem which has not been solved thus far. That is, it is an object of the present invention to provide a highly safe release agent composition which improves the drawbacks of the conventional release agent and release method, has excellent release properties, can shorten the release time, and can further improve the working environment. .

[0012]

Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above-mentioned problems, and as a result, an organic solvent having an aromatic ring structure in the molecular structure and having an oxygen atom, and a specific alkylene The present inventors have found that a release agent composition combining an oxide compound has excellent releasability and high safety, and has completed the present invention.

That is, the gist of the present invention is as follows: (1) (a) an organic solvent having an aromatic ring structure in a molecular structure and having an oxygen atom, and (b) general formulas (1), (2) and (3)

[0014]

Embedded image

(Wherein R ¹ is a hydrogen atom and has 1 to 1 carbon atoms)
8 represents an alkyl group or an allyl group, and R ² and R ³ each represent an alkylene group having 2 to 4 carbon atoms. R ⁴ represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. m is 1 to 7, n is 0
7, p represents an integer of 0 to 5, and q represents an integer of 0 to 5. A release agent composition for an adhesive, characterized by comprising one or more alkylene oxide compounds selected from the group consisting of the compounds represented by the following formula:

[0016]

Embedded image

(Wherein, R ⁵ is a hydrogen atom or a carbon atom having 1 carbon atom)
And W represents C の O, O, or CH _2.
X represents O, X represents H, OH, OCH ₃ , CH ₃ , or (R
Indicates ⁶ O) k H, R ⁶ is an alkylene group having 2 to 3 carbon atoms, k is an integer of 1-3. The release agent composition according to the above [1], which is an aromatic compound represented by the formula [3]: [3] The component (a) / the component (b) is 50/5 by weight.
The release agent composition according to the above [1] or [2], which is 0 to 99/1; [4] the release agent composition according to any one of the above [1] to [3], wherein the adhesive is a cyanoacrylate-based adhesive Things, things.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The release agent composition for an adhesive of the present invention comprises (a) an organic solvent having an aromatic ring structure in the molecular structure and having an oxygen atom, and (b) a general formula (1) ,
(2) and (3)

[0019]

Embedded image

(Wherein R ¹ is a hydrogen atom and has 1 to 1 carbon atoms)
8 represents an alkyl group or an allyl group, and R ² and R ³ each represent an alkylene group having 2 to 4 carbon atoms. R ⁴ represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. m is 1 to 7, n is 0
7, p represents an integer of 0 to 5, and q represents an integer of 0 to 5. ), One or more alkylene oxide compounds selected from the group consisting of the compounds represented by the formula (1). In the release agent composition of the present invention, such an organic solvent may be used alone or in combination of two or more.

Among the components used in the release agent composition of the present invention, the component (a) is an organic solvent having an aromatic ring structure in the molecular structure and having an oxygen atom. Here, the oxygen atom may constitute a polar group.

Examples of such a polar group include a hydroxyl group, an alkoxy group, an aryloxy group, a carbonyl group, a carboxyl group, an acyl group, an aroyl group, an acetyl group, an alkanoyl group, an acetoxy group and a glycol ether group.

Specific examples of the organic solvent satisfying the above conditions include the following compounds. (1) As alcohols, benzyl alcohol, 4-
Ethylbenzyl alcohol, 4-isopropylbenzyl alcohol, 4-butylbenzyl alcohol, 4-t-
Butylbenzyl alcohol, 3,5-dimethylbenzyl alcohol, 2-methoxybenzyl alcohol, 3-methoxybenzyl alcohol, 4-methoxybenzyl alcohol, 2,4-dimethoxybenzyl alcohol, 3,
4-dimethoxybenzyl alcohol, 2,5-dimethoxybenzyl alcohol, 3,5-dimethoxybenzyl alcohol, 2-ethoxybenzyl alcohol, 4-ethoxybenzyl alcohol, 4-butoxybenzyl alcohol, 3-ethoxy-4-methoxybenzyl alcohol, 4-ethoxy-3-methoxybenzyl alcohol,
2-methoxy-α-methylbenzyl alcohol, 1,2
-Benzene dimethanol, 1,3-benzene dimethanol, 1,4-benzene dimethanol, s-phenethyl alcohol, 2-phenyl-2-propanol, 1,2-
Diphenyl-2-propanol, 1-phenyl-1-propanol, 2-methyl-1-phenyl-1-propanol, 2,2-dimethyl-1-phenyl-1-propanol, 1-phenyl-1-butanol, phenethyl alcohol , 1-phenyl-2-propanol, 2-phenyl-1-propanol, 2-methyl-1-phenyl-2
-Propanol, α-ethylphenethyl alcohol, β
-Ethylphenethyl alcohol, 2-methoxy-2-phenylethanol, 1-phenyl-2-pentanol,
3-phenyl-1-propanol, 2,2-dimethyl-
3-phenyl-1-propanol, 4-phenyl-1-
Butanol, 3-phenyl-1-butanol, 2-phenyl-2-butanol, 5-phenyl-1-pentanol, 6-phenyl-1-hexanol, 1-phenyl-
1,2-ethanediol, 3-phenoxy-1,2-propanediol, 2-benzyloxy-1,3-propanediol, 2-methylphenethyl alcohol, 2-methoxyphenethyl alcohol, 1- (2-methoxyphenyl) -2-propanol, 3-methoxyphenethyl alcohol, 4-methylphenethyl alcohol, 4-methoxyphenethyl alcohol and the like.

(2) As ethers, anisole, 2
-Methylanisole, 3-methylanisole, 4-methylanisole, 2-ethoxyanisole, phenetole, 4-methylphenetol, isopropylphenylether, butylphenylether, cyclohexylphenylether, benzylmethylether, benzylethylether, benzylisopropylether Benzyl butyl ether, benzyl cyclohexyl ether, benzyl phenyl ether, cresyl methyl ether, diphenyl ether, dibenzyl ether, di (α-methylbenzyl) ether, veratrol, 1,3-dimethoxybenzene, 1,4-dimethoxybenzene and the like.

(3) As aldehydes, benzaldehyde, 2-ethoxybenzaldehyde, 2,4-dimethoxybenzaldehyde, 2,5-dimethoxybenzaldehyde, 3,4-dimethoxybenzaldehyde, 3,5
-Dimethoxybenzaldehyde, 2,4,6-trimethoxybenzaldehyde, 3,4,5-trimethoxybenzaldehyde, 2,4,5-trimethoxybenzaldehyde, 3-ethoxy-4-methoxybenzaldehyde,
Salicylaldehyde, phenylacetaldehyde, 2-
Phenylpropionaldehyde, 3-phenylbutyraldehyde and the like.

(4) As ketones, p-methylacetophenone, acetophenone, propiophenone, butyrophenone, isobutyrophenone, valerophenone, 2,2
2-dimethylpropiophenone, hexanophenone, heptanophenone, cyclohexyl phenyl ketone, 2-
Methoxyphenylacetone, 3-methoxyphenylacetone, 4-methoxyphenylacetone, 3,4-dimethoxyphenylacetone, benzyl methyl ketone, benzyl ethyl ketone, benzyl isopropyl ketone, benzyl butyl ketone, benzyl cyclohexyl ketone, benzyl phenyl ketone, diphenyl ketone , Dibenzyl ketone, di (α-methylbenzyl) ketone, 4- (4-methoxyphenyl) -2-butanone, benzylacetone and the like.

(5) As organic acids, benzoic acid, 1,1,
2,3,6-tetrahydrobenzoic acid and the like. (6) Nonylphenol and the like as phenols. (7) As esters, ethyl phenylacetate, benzyl acetate, benzyl propionate, methyl benzoate, ethyl benzoate, propyl benzoate, isopropyl benzoate, butyl benzoate, methyl salicylate, isoamyl salicylate, benzyl salicylate, dimethyl phthalate And diethyl phthalate, dipropyl phthalate, dibutyl phthalate, diamyl phthalate, di-n-hexyl phthalate, benzyl formate, benzyl propionate, ethyl cinnamate and the like.

[0028] (8) as a glycol ether compounds, (POE) ₁ ~ ₃ monophenyl ether, (PO
E) ₁ ~ ₃ monobenzyl ether, (POP) ₁ ~ ₃ monophenyl ether, (POP) ₁ ~ ₃ monobenzyl ether, (POE) ₁ ~ ₃ monophenyl ether acetate.

As the organic solvent, general formula (4)

[0030]

Embedded image

(Wherein R ⁵ is a hydrogen atom or a carbon atom having 1 carbon atom)
And W represents C の O, O, or CH _2.
X represents O, X represents H, OH, OCH ₃ , CH ₃ , or (R
Indicates ⁶ O) k H, R ⁶ is an alkylene group having 2 to 3 carbon atoms, k is an integer of 1-3. ) Are more preferable from the viewpoint of peelability.

Specific examples of the aromatic compound represented by the general formula (4) include benzyl alcohol, 4-ethylbenzyl alcohol, anisole, benzyl methyl ether,
Benzaldehyde, acetophenone, benzoic acid, methylbenzoic acid, (POE) ₁ ~ ₃ monophenyl ether,
(POE) ₁ ~ ₃ monobenzyl ether, (POP) ₁
To ₃ monophenyl ethers and (POP) ₁ to ₃ monobenzyl ethers.

The flash point of the organic solvent is not particularly limited, but is preferably higher than a normal use temperature from the viewpoint of ensuring safety. Specifically, the temperature is preferably 80 ° C. or higher, more preferably 90 ° C. or higher, and particularly preferably 100 ° C. or higher.

Among the components used in the release agent composition of the present invention, the component (b) includes the above-mentioned general formulas (1) and (2).
And 1 selected from the group consisting of compounds represented by (3)
More than one kind of alkylene oxide compound.

[0035]

Embedded image

(Wherein R ¹ is a hydrogen atom and has 1 to 1 carbon atoms)
8 represents an alkyl group or an allyl group, and R ² and R ³ each represent an alkylene group having 2 to 4 carbon atoms. R ⁴ represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. m is 1 to 7, n is 0
7, p represents an integer of 0 to 5, and q represents an integer of 0 to 5. )

In the general formulas (1), (2) and (3), R ¹
Is a hydrogen atom or an alkyl group or an allyl group having 1 to 8 carbon atoms, and is preferably an alkyl group or an allyl group having 2 to 6 carbon atoms from the viewpoint of solubility in water during rinsing. When R ¹ is not a hydrogen atom or a hydrocarbon group,
The compatibility when other components such as water are blended may be reduced. R ² and R ³ are each preferably an alkylene group having 2 to 4 carbon atoms from the viewpoint of ease of production. Those having less than 2 carbon atoms are very difficult to produce. Those having more than 4 carbon atoms not only reduce the rinsing properties after peeling off, but are also very expensive and difficult to obtain. R ⁴ is a hydrogen atom, having 1 to 1 carbon atoms
It represents 4 alkyl groups or an acyl group having 1 to 4 carbon atoms, but those having more than 4 carbon atoms may deteriorate the rinsing properties after peeling.

M is 1 to 7, n is 0 to 7, p is 0 to
5, q is an integer of 0-5. Here, m + n is 1 to 1.
4, and p + q is in the range of 0 to 10. However, from the viewpoint of solubility in water and compatibility with other components, m +
n is preferably in the range of 2 to 4, and p + q is preferably in the range of 0 to 4. One of these alkylene oxide compounds may be used alone, or two or more thereof may be used in combination.

Specific examples of such alkylene oxide compounds include methanol, ethanol, propanol,
Alcohols having a linear or branched alkyl group such as butanol, isobutanol, hexanol and octanol; phenols such as phenol and cresol; alicyclic alcohols such as cyclohexanol; acetic acid, propionic acid, butyric acid and hexane Fatty acids having a linear or branched alkyl group such as acid and isooctylic acid; organic carboxylic acids such as methacrylic acid and benzoic acid; and direct acids such as ethylamine, diethylamine, hexylamine, dibutylamine, octylamine, benzylamine and cyclohexylamine. Amine compounds having a chain, a branched chain, an aromatic or alicyclic hydrocarbon group, and the like, to which an alkylene (ethylene, propylene, butylene) oxide is added alone or in combination, are exemplified. Terminal hydroxyl group of adduct Methylation with an alkyl chloride and the like, or ethylated or butylated compounds esterified with such as acetic acid and propionic acid.

Specific examples of the alkylene oxide compound represented by the general formula (1) include the following compounds. Ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, tetraethylene glycol monomethyl ether, pentaethylene glycol monomethyl ether, hexaethylene glycol monomethyl ether, heptaethylene glycol monomethyl ether (each of the above compounds (POE) ₁ monomethyl ether , (POE) ₂ monomethyl ether, (POE)
₃ monomethyl ether, (POE) ₄ monomethyl ether, (POE) ₅ monomethyl ether, (POE) ₆ monomethyl ether, (POE) ₇ monomethyl ether,
May be abbreviated. Also, sometimes referred to as collectively these compounds and (POE) ₁ ~ ₇ monomethyl ether. In addition, similar compounds and the like may be abbreviated as described above with expressions corresponding thereto. ).

[0041] (POE) ₁ ~ ₇ mono ethyl ether,
(POE) ₁ ~ ₇ monopropyl ether, (POE) _1
1-7 monobutyl ether, (POE) _{1 1-7} monoisobutyl ether, (POE) _{1 1-7} monoallyl ether,
(POE) ₁ to ₇ monohexyl ether, (POE) ₁
~ ₇ mono 2-ethylhexyl ether, (POE) ₁ ~
₇ monooctyl ether, (POE) _4-7 monophenyl ether, (POE) ethylene glycol monomethyl ethers such as _4-7 monobenzyl ether.

[0042] (POE) ₁ ~ ₇ dimethyl ether, (P
OE) ₁ ~ ₇ diethyl ether, (POE) ₁ ~ ₇ dipropyl ether, (POE) ₁ ~ ₇ dibutyl ether,
(POE) ₁ ~ ₇ diisobutyl ether, (POE) ₁
To ₇ diallyl ether, (POE) ₁ to ₇ dihexyl ether, (POE) ₁ to ₇ di-2-ethylhexyl ether, (POE) ₁ to ₇ dioctyl ether, (POE)
_1-7 ether, (POE) _1-7 dibenzyl ether, (POE) _1-7 ethyl methyl ether,
(POE) ₁ ~ _7-butyl methyl ether, (POE) ₁
~ ₇ 2-ethylhexyl methyl ether, (POE) ₁
Ethylene glycol diethers such as ₁ to ₇ isopropyl methyl ether and (POE) ₁ to ₇ isopropyl ethyl ether.

[0043] (POP) ₁ ~ ₇ monomethyl ether,
(POP) ₁ to ₇ monoethyl ether, (POP) ₁ to
₇ monopropyl ether, (POP) ₁ ~ ₇ monobutyl ether, (POP) ₁ ~ ₇ monoisobutyl ether,
(POP) ₁ to ₇ monoallyl ether, (POP) ₁ to
₇ monohexyl ether, (POP) ₁ ~ ₇ mono-2-ethylhexyl ether, (POP) ₁ ~ ₇ monooctyl ether, (POP) ₄ ~ ₇ monophenyl ether,
(POP) Propylene glycol monomethyl ethers such as _4-7 monobenzyl ether. Note that (POP) is the same abbreviation as (POE) except that ethylene is propylene.

[0044] (POP) ₁ ~ ₇ dimethyl ether, (P
OP) ₁ ~ ₇ diethyl ether, (POP) ₁ ~ ₇ dipropyl ether, (POP) ₁ ~ ₇ dibutyl ether,
(POP) ₁ ~ ₇ diisobutyl ether, (POP) ₁
To ₇ diallyl ether, (POP) ₁ to ₇ dihexyl ether, (POP) ₁ to ₇ di-2-ethylhexyl ether, (POP) ₁ to ₇ dioctyl ether, (POP)
₁ to ₇ diphenyl ether, (POP) ₁ to ₇ dibenzyl ether, (POP) ₁ to ₇ ethyl methyl ether,
(POP) ₁ ~ _7-butyl methyl ether, (POP) ₁
~ ₇ 2-ethylhexyl methyl ether, (POP) ₁
Propylene glycol diethers such as -7 to ₇ isopropyl methyl ether and (POP) ₁ to ₇ isopropyl ethyl ether.

[0045] (POE) ₁ ~ ₇ monomethyl ether acetate, (POE) ₁ ~ ₇ monoethyl ether acetate, (POE) ₁ ~ ₇ monopropyl ether acetate, (POE) ₁ ~ ₇ monobutyl ether acetate,
(POE) ₁ ~ ₇ monoisobutyl ether acetate,
(POE) ₁ ~ ₇ monoallyl ether acetate, (P
OE) ₁ to ₇ monohexyl ether acetate, (PO
E) _1-7 mono-2-ethylhexyl ether acetates, (POE) _1-7 monooctyl ether acetates, (POE) _1-7 monophenyl ether acetate, (POE) ethylene glycol monobutyl ether, such as _1-7 monobenzyl ether acetate Acetates.

[0046] (POP) ₁ ~ ₇ monomethyl ether acetate, (POP) ₁ ~ ₇ monoethyl ether acetate, (POP) ₁ ~ ₇ monopropyl ether acetate, (POP) ₁ ~ ₇ monobutyl ether acetate,
(POP) ₁ ~ ₇ monoisobutyl ether acetate,
(POP) ₁ to ₇ monoallyl ether acetate, (P
OP) ₁ to ₇ monohexyl ether acetate, (PO
P) _1-7 mono-2-ethylhexyl ether acetates, (POP) _1-7 monooctyl ether acetates, (POP) _1-7 monophenyl ether acetate, (POP) Propylene glycol monomethyl ethers such as _1-7 monobenzyl ether acetate Acetates.

Monopropylene glycol diacetates such as propylene glycol diacetate. A compound in which ethylene oxide and propylene oxide are block- and randomly added to alcohols having a straight-chain or branched-chain alkyl group or alicyclic alcohols, which are raw materials for the hydrocarbon group, that is, (POE) ₁ ~
₇ (POP) ₁ ~ ₇ monoethers; (POE) ₁ ~ ₇
(POP) ₁ ~ ₇ diethers.

Specific examples of the alkylene oxide compound represented by the general formula (2) include alcohols having a straight-chain or branched-chain alkyl group and alicyclic alcohols, which are raw materials for the above-mentioned hydrocarbon groups. Instead, a compound using a fatty acid having a linear or branched alkyl group such as acetic acid, propionic acid, butyric acid, hexanoic acid, and isooctylic acid, and an organic carboxylic acid such as methacrylic acid and benzoic acid may be used.

[0049] For example, (POE) ₁ ~ ₇ monomethyl ester, (POE) ₁ ~ ₇ monoethyl ester, (POP) ₁ ~ ₇ adduct of butyric acid ((POP) ₁ ~ ₇ acid), methacrylic acid (POE) ₁ to ₇ adducts of benzoic acid (P
OE) glycol monoesters such as ₁ to ₇ adducts;
(POE) ₁ ~ _7-dimethyl ester, (POE) ₁ ~ ₇
Examples include glycol diesters such as diethyl ester.

Specific examples of the alkylene oxide compound represented by the general formula (3) include alcohols having a straight-chain or branched-chain alkyl group, alicyclic alcohols, In place of ethylamine,
Examples thereof include compounds using amines having a linear, branched, aromatic or alicyclic hydrocarbon group, such as diethylamine, hexylamine, butylamine, octylamine, benzylamine, and cyclohexylamine.

[0051] For example, (POE) ₁ ~ ₇ ethylamine,
(POE) ₁ ~ ₇ diethylamine, (POE) ₁ ~ ₇ hexylamine, (POE) ₁ ~ ₇ butylamine, (PO
E) Glycol monoamines such as ₁ to ₇ octylamine, (POE) ₁ to ₇ benzylamine, and (POE) ₁ to ₇ cyclohexylamine.

Among the above compounds, the alkylene oxide compound represented by the general formula (1) is preferable from the viewpoint of availability. Further, those listed below are preferably used from the viewpoint of the releasability, the rinsing property after the release, and the compatibility when other components such as water are blended. (POE) ₁ ~ ₅
Monomethyl ether, (POE) ₁ ~ ₅ monoethyl ether, (POE) ₁ ~ ₅ monopropyl ether, (PO
E) ₁ ~ ₅ monobutyl ether, (POE) ₁ ~ ₂ monoisobutyl ether, (POE) ₁ ~ ₂ monoallyl ether, (POE) ₁ ~ ₂ monohexyl ether, (PO
E) ₁ ~ ₂ mono-2-ethylhexyl ether, (PO
E) ₄ ~ ₅ monophenyl ether, (POE) ₄ ~ ₅ monobenzyl ether;

[0053] (POE) ₁ ~ ₄ dimethyl ether, (P
OE) ₁ ~ ₂ diethyl ether, (POE) ₁ ~ ₂ dipropyl ether, (POE) ₁ ~ ₂ dibutyl ether,
(POE) _2-ethyl methyl ether, (POE) _2-butyl methyl ether, (POE) ₂ 2-ethylhexyl ether; (POP) ₁ ~ ₃ monomethyl ether,
(POP) ₁ ~ ₃ monoethyl ether, (POP) ₁ ~
₃ monopropyl ether, (POP) ₁ ~ ₃ monobutyl ether, (POP) ₄ ~ ₅ monophenyl ether,
(POP) ₄ ~ ₅ monobenzyl ether;

[0054] (POP) ₁ ~ ₃ dimethyl ether, (P
OP) ₁ ~ ₂ diethyl ether, (POP) ₁ ~ ₂ dipropyl ether, (POP) ₁ ~ ₂ dibutyl ether,
(POP) ₂ isopropyl methyl ether, (POP)
₂ isopropyl ethyl ether; (POE) ₁ ~ ₂ monomethyl ether acetate, (POE) ₁ ~ ₂ monoethyl ether acetate, (POE) ₁ ~ ₂ monopropyl ether acetate, (POE) ₁ ~ ₂ monobutyl ether acetate; (POP) ₁ monomethyl ether acetate, (POP) ₁ monoethyl ether acetate,
(POP) ₁ diacetate.

These alkylene oxide compounds are
For example, an alcohol, a phenol, a fatty acid, an organic carboxylic acid, or an amine compound having a hydrocarbon group having 1 to 8 carbon atoms, an alkylene oxide having 2 to 4 carbon atoms (ethylene oxide) while heating in the presence of a catalyst such as caustic soda. , Propylene oxide, butylene oxide, etc.)
In a liquid or gaseous state and reacted. Further, those obtained by alkylating the terminal hydroxyl groups of these alkylene oxide adducts with an alkyl chloride or the like or esterifying them with an organic acid or the like can be used. When an alkylene oxide is added, random addition polymerization in which two or more alkylene oxides are mixed and reacted or block addition polymerization in which an alkylene oxide is sequentially added may be performed.

The release agent composition of the present invention has an anionic surfactant and a cationic surfactant for the purpose of improving the releasability, the rinsing property after the release, and the compatibility when other components such as water are blended. A surfactant such as a surfactant, a nonionic surfactant, or an amphoteric surfactant can be used in combination.

The release agent composition of the present invention may be used in a non-aqueous system, or may be used after being diluted to an appropriate concentration with water.
When used after dilution with water, the amount of water added is not particularly limited, but from the viewpoint of safety and peelability,
Preferably 3 to 19 based on 100 parts by weight of the release agent composition.
00 parts by weight, more preferably 10 to 900 parts by weight. Water used for dilution is not particularly limited as long as it does not impair the effect of the release agent composition of the present invention, such as ultrapure water, pure water, ion-exchanged water, distilled water, and ordinary tap water. Is used.

In the release agent composition of the present invention, hydroxyethylaminoacetic acid, which is usually used in a release agent or a cleaning agent, may be used, if necessary, as long as the effects of the present invention are not impaired.
Aminocarboxylic acids such as hydroxyethyliminodiacetic acid and ethylenediaminetetraacetic acid, and compounds having chelating power such as salts thereof, preservatives, rust preventives, defoaming agents such as silicones, antioxidants, and having 1 to 5 nitrogen atoms. Amine compounds having a molecular weight of 50 to 300; amine compounds such as alkanolamines, morpholines, cyclic amines, polyamines, linear and branched alkylamines, coconut fatty acid methyl and benzyl acetate Esters, such as
Hydrocarbon solvents or alcohols can be used in combination as appropriate.

The release agent composition of the present invention can be produced by mixing the above-mentioned components and optional components in a conventional manner.

The mixing ratio of the two components in the release agent composition of the present invention is not particularly limited, but the component (a) /
Component (b) is preferably in a weight ratio in the range of 50/50 to 99/1, more preferably in a range of 65/35 to 95/5,
A range of 80/20 to 90/10 is particularly preferred. From the viewpoint of the peelability of the adhesive, the mixing ratio is preferably 50/50 or more. From the viewpoint of compatibility when other components such as water are blended, and from the viewpoint of rinsing with water after peeling the adhesive, 99/50 is preferred. / 1 or less is preferred.

The total content of the components (a) and (b) in the release agent composition of the present invention is preferably 5 to 100% by weight, more preferably 10 to 95% by weight, and more preferably 20 to 95% by weight.
~ 90% by weight is particularly preferred.

The method of peeling the adhesive using the release agent composition of the present invention is not particularly limited except that the above-mentioned release agent composition is used, and a commonly used known method can be used.

It is preferable to heat the release agent composition of the present invention or an aqueous solution thereof and use the effect of softening the adhesive by heat, since the release can be performed in a shorter time. When an aqueous solution of the release agent composition is used, the amount of the release agent composition to be taken out can be further reduced, which is more economical. The temperature at this time is preferably at least 80 ° C, particularly preferably at least 85 ° C.

It should be noted that a physical force is not particularly required in the peeling step, but various physical forces such as bubbling, ultrasonic waves, oscillating, and submerged jet may be used alone or in combination.

The method of peeling and removing the unnecessary adhesive for general consumer use is not particularly limited. Specifically, similar to conventional toluene, ethyl acetate, methyl ethyl ketone, acetone, dimethylformamide, etc., necessary parts are wiped off by dropping them in paper or cloth,
After injecting, dipping, swelling the adhesive by brushing, etc., according to a commonly known method such as scraping with a spatula, that is, the release agent composition of the present invention is used instead of a conventional organic solvent. Can be used for peeling and removal.

On the other hand, a chip capacitor, a chip resistor,
The method of removing the fixing jig and the temporary fixing adhesive after processing small components such as a magnetic head is not particularly limited.
Specifically, it can be carried out according to a conventionally known method such as immersion in conventional acetone or methylene chloride, that is, using the release agent composition of the present invention instead of the conventional organic solvent. . For example, as a method of using the release agent composition of the present invention as it is, a chip capacitor cut to a predetermined size, a chip resistor or the like, or a track-processed magnetic head or the like is placed in a cleaning jig, Dipped in the release agent composition, preferably at 60 ° C
As described above, more preferably, by heating to 70 ° C. or more, the film can be peeled in a short time.

The release agent composition of the present invention is suitably applied to the removal of a reactive adhesive. Examples of such reactive adhesives include semiconductors and crystal materials such as silicon, gallium / arsenic, and gallium / phosphorus;
Electronic component-related materials such as quartz and glass; magnetic materials such as ferrite and samarium / cobalt; magnetic materials such as magnetic heads; piezoelectric materials such as barium titanate and PZT;
Reactive adhesives used in the processing of more than one type of material are exemplified. Further, examples of the processing step include processing steps such as cutting, grinding, and polishing of such a material. Above all, it is particularly preferably applied to a jig after processing small components such as a chip capacitor, a chip resistor, and a magnetic head, and a reactive adhesive used for a temporary fixing adhesive.

The release agent composition of the present invention is applied to release reactive adhesives such as cyanoacrylate adhesives, polyurethane adhesives, and acrylic resin adhesives. In particular, it is particularly preferably applied to the peeling of a cyanoacrylate-based adhesive mainly containing α-methyl methyl cyanoacrylate, ethyl α-cyanoacrylate, isobutyl α-cyanoacrylate, or the like.

[0069]

The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

Examples 1 to 13 and Comparative Examples 1 to 10 Various release agent compositions having the compositions shown in Tables 1 to 4 (composition ratio units are% by weight) were prepared, and using these release agent compositions,
The peelability of the following three types of adhesives was evaluated.

[Removability of Cyanoacrylate Adhesive]
1.1 mm x 76 mm x 26 mm slide glass (MI
CRO SLIDE GLASS S-1112, manufactured by Matsunami Glass Industry Co., Ltd.)
0.1mm × 18mm × 18mm cover glass (MICR
O COVERGLASS TROPHY, manufactured by Matsunami Glass Industry Co., Ltd.) with α-cyanoacrylate adhesive: Aron Alpha 2
01 (manufactured by Toa Gosei) at a coating amount of 4 to 5 mg / cm ² and left at room temperature for 24 hours. This was used as a test piece for a peel test.

[Removability of Polyurethane Adhesive] 1.1
mm × 76mm × 26mm slide glass (MICRO SL
IDE GLASS S-1112, manufactured by Matsunami Glass Industry Co., Ltd.)
mm × 18mm × 18mm cover glass (MICRO COVE
RGLASS TROPHY, manufactured by Matsunami Glass Industry Co., Ltd.) 3 polyurethane adhesives: Super Clear (Henkel Hakusui)
Is bonded at a coating amount of 10 to 11 mg / cm ² by using
It was left at room temperature for 24 hours. This was used as a test piece for a peel test.

[Removability of Acrylic Resin Adhesive] 1.1
mm × 76mm × 26mm slide glass (MICRO SL
IDE GLASS S-1112, manufactured by Matsunami Glass Industry Co., Ltd.)
mm × 18mm × 18mm cover glass (MICRO COVE
RGLASS TROPHY, manufactured by Matsunami Glass Industry Co., Ltd.) was prepared by using an acrylic resin-based adhesive: Bond Kone One (manufactured by Konishi) (solution A: solution B = 2: 1.5 (weight ratio)), 6 to 7
The adhesive was applied at a coating amount of mg / cm ² and left at room temperature for 24 hours. This was used as a test piece for a peel test. Liquid A = acrylic resin (100% by weight) Liquid B = amine compound: acrylic resin: acetone (8
5: 10: 5 (% by weight))

The test pieces were immersed in various release agent compositions in an upright position, and the release conditions (temperature,
Under the immersion condition), the time until each of the three cover glasses peeled off was measured, and the average value was taken as the peeling time (min). In this case, the smaller the numerical value of the peeling time, the more the reactive adhesive was peeled in a shorter time,
That is, it indicates that the peeling performance is good. Tables 1 to 4
Shows the composition of the release agent composition, the release conditions, and the release time.

[0075]

[Table 1]

[0076]

[Table 2]

[0077]

[Table 3]

[0078]

[Table 4]

From Tables 1 to 4, it was found that the release agent composition of the present invention in which an organic solvent having a specific structure and an alkylene oxide compound were blended exhibited good release properties (Examples 1 to 4). Example 13). Furthermore, since the release agent composition of the present invention does not need to contain acetone or methylene chloride, the safety is high and the working environment can be improved. On the other hand, the comparative examples showed that any one of the organic solvent and the alkylene oxide compound, or a composition having a structure outside the scope of the present invention, was inferior in peelability.

[0080]

The stripping composition of the present invention is excellent in stripping properties, can shorten stripping time, and can improve productivity. Further, since acetone and methylene chloride are not used, the working environment can be improved, and high safety can be achieved.

Claims (4)

[Claims] (A) an organic solvent having an aromatic ring structure in the molecular structure and having an oxygen atom; and (b) general formulas (1), (2) and (3). (Wherein, R ¹ represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or an allyl group, R ² and R ³ each represent an alkylene group having 2 to 4 carbon atoms. R ⁴ represents a hydrogen atom or Represents an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms, m is 1 to 7, n is 0 to 7, and p is 0 to
5, q represents an integer of 0 to 5; A) a release agent composition for an adhesive, comprising one or more alkylene oxide compounds selected from the group consisting of the compounds represented by 2. The method according to claim 1, wherein the organic solvent is represented by the general formula (4). (Wherein, R ⁵ represents a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms, W represents C ＝ O, O, or CH ₂ O;
Is _{H, OH, OCH 3, CH} 3, or indicate the ^{(R 6 O) k H,} R 6 is an alkylene group having 2 to 3 carbon atoms,
k represents an integer of 1 to 3. The release agent composition according to claim 1, which is an aromatic compound represented by the formula: 3. The ratio of component (a) / component (b) is 50 by weight.
The release agent composition according to claim 1 or 2, wherein the ratio is from 50/99 to 99/1. 4. The release agent composition according to claim 1, wherein the adhesive is a cyanoacrylate-based adhesive.