JPH10180626A - 化学的機械的研磨システムのための適合材料層を有するキャリアヘッド - Google Patents

化学的機械的研磨システムのための適合材料層を有するキャリアヘッド

Info

Publication number
JPH10180626A
JPH10180626A JP31575297A JP31575297A JPH10180626A JP H10180626 A JPH10180626 A JP H10180626A JP 31575297 A JP31575297 A JP 31575297A JP 31575297 A JP31575297 A JP 31575297A JP H10180626 A JPH10180626 A JP H10180626A
Authority
JP
Japan
Prior art keywords
substrate
carrier
carrier head
polishing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP31575297A
Other languages
English (en)
Japanese (ja)
Inventor
Robert D Tolles
ディー． トールズ ロバート
Tsungan Cheng
チャン ツンガン
John Prince
プリンス ジョン
Shamouil Shamouilian
シャモウイリアン シャモウイル
Norm Shendon
シェンドン ノーム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/729,298 external-priority patent/US5820448A/en
Priority claimed from US08/728,688 external-priority patent/US6036587A/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JPH10180626A publication Critical patent/JPH10180626A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP31575297A 1996-10-10 1997-10-13 化学的機械的研磨システムのための適合材料層を有するキャリアヘッド Withdrawn JPH10180626A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/729,298 US5820448A (en) 1993-12-27 1996-10-10 Carrier head with a layer of conformable material for a chemical mechanical polishing system
US08/728,688 US6036587A (en) 1996-10-10 1996-10-10 Carrier head with layer of conformable material for a chemical mechanical polishing system
US08/728688 1996-10-10
US08/729298 1996-10-10

Publications (1)

Publication Number Publication Date
JPH10180626A true JPH10180626A (ja) 1998-07-07

Family

ID=27111727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31575297A Withdrawn JPH10180626A (ja) 1996-10-10 1997-10-13 化学的機械的研磨システムのための適合材料層を有するキャリアヘッド

Country Status (4)

Country Link
EP (1) EP0835723A1 (ko)
JP (1) JPH10180626A (ko)
KR (1) KR19980032714A (ko)
TW (1) TW371635B (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003006206A1 (en) 2001-07-10 2003-01-23 Ebara Corporation Substrate polishing machine
JP2006123092A (ja) * 2004-10-29 2006-05-18 Okamoto Machine Tool Works Ltd ウエハ保持用バッキング材およびそれを備える研磨ヘッド構造
WO2008050475A1 (fr) * 2006-10-27 2008-05-02 Shin-Etsu Handotai Co., Ltd. Tête de polissage et appareil de polissage
US8100743B2 (en) 2007-10-29 2012-01-24 Ebara Corporation Polishing apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
KR102098741B1 (ko) * 2013-05-27 2020-04-09 삼성디스플레이 주식회사 증착용 기판 이동부, 이를 포함하는 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN104985522B (zh) * 2015-07-03 2017-03-08 中国科学院微电子研究所 一种表面形貌仿真的方法及系统
US10211072B2 (en) * 2017-06-23 2019-02-19 Applied Materials, Inc. Method of reconstituted substrate formation for advanced packaging applications
KR20210061273A (ko) * 2019-11-19 2021-05-27 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치
KR102100376B1 (ko) * 2019-12-26 2020-04-14 삼성디스플레이 주식회사 증착용 기판 이동부
CN112405330B (zh) * 2020-12-08 2021-09-07 杭州众硅电子科技有限公司 一种抛光装置
CN115060125B (zh) * 2022-07-08 2023-11-03 江西洪都航空工业集团有限责任公司 一种可变直径变支撑间距导弹支撑固定机构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558095B1 (fr) * 1984-03-14 1988-04-08 Ribard Pierre Perfectionnements apportes aux tetes de travail des machines de polissage et analogues
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003006206A1 (en) 2001-07-10 2003-01-23 Ebara Corporation Substrate polishing machine
US7156725B2 (en) 2001-07-10 2007-01-02 Ebara Corporation Substrate polishing machine
JP2006123092A (ja) * 2004-10-29 2006-05-18 Okamoto Machine Tool Works Ltd ウエハ保持用バッキング材およびそれを備える研磨ヘッド構造
WO2008050475A1 (fr) * 2006-10-27 2008-05-02 Shin-Etsu Handotai Co., Ltd. Tête de polissage et appareil de polissage
US8092281B2 (en) 2006-10-27 2012-01-10 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
KR101402720B1 (ko) * 2006-10-27 2014-06-02 후지코시 기카이 고교 가부시키가이샤 연마헤드 및 연마장치
US8100743B2 (en) 2007-10-29 2012-01-24 Ebara Corporation Polishing apparatus

Also Published As

Publication number Publication date
KR19980032714A (ko) 1998-07-25
TW371635B (en) 1999-10-11
EP0835723A1 (en) 1998-04-15

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20050104