JPH10178131A - Electric connector of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure the electric connection between a plurality of bump electrodes arrayed in matrix shape of electronic parts such as CSP chips and the tester side of the electronic parts by lengthening the arrayal intervals of the matrix shape contacts by a conversion patterns having wiring patterns. SOLUTION: A bump BP of CSP chip 8 is connected to a sheet 5. At this time, if a pressure unit PH is depressed against the upper surface of the chip 8 by F force, the bump BP can be connected to the connecting member 5a of a sheet 5 without fail, Through these procedures, the arrayal patterns of the bump BP of the CSP chip 8 are electrically connected by the connecting parts 5a of the sheet 5 so that the arrayal patterns of the connecting part 5a may be expanded to a connecting terminal 4T by a conversion substrate 4. In such a constitution, the expanded connecting terminal 4T is connected to a discriminator 130 passing a duty board 7 through the intermediary of a cord 11 so that inspection signals may be transmitted to the bump BP side for inspecting the CSP chip 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection device for electrically connecting a plurality of projecting electrodes arranged in a matrix of electronic components to a tester side of the electronic components. .

[0002]

2. Description of the Related Art QFs are used for electronic parts such as semiconductor parts.
P (Quat Flat Package), CSP (Chip Scale Package or Chip Size Package)
Package) is used. The electronic component of the QFP has a large number of contact feet protruding around the package. In order to confirm the operation of such an electronic component of the QFP, it is electrically connected to a tester via a socket.

[0003] Unlike the electronic component of the QFP, the electronic component of the CSP has a large number of protruding electrodes formed on the back side of the package. These bump electrodes are formed in a full matrix on the back surface of the package and are called bumps. These bumps have, for example, an arrangement pitch of 0.5
mm, which is very small compared to the arrangement pitch of each pin of the electronic components of the QFP, and the shape of the bumps of the electronic components of the CSP is completely different from the shape of many electrodes spread outside the package. It is.

[0004]

Therefore, the electronic components of the CSP cannot be electrically connected to the tester using the sockets of the electronic components of the conventional QFP, and the electronic components of the CSP cannot be electrically connected. There is a desire for an electrical connection device for use. Therefore, the present invention solves the above-mentioned problems, and an electronic device capable of reliably performing electrical connection between a plurality of projecting electrodes arranged in a matrix of an electronic component such as a CSP chip and a tester side of the electronic component. It is intended to provide an electrical connection device for components.

[0005]

According to the present invention, there is provided an electronic apparatus comprising: a plurality of protruding electrodes arranged in a matrix of an electronic component; In an electrical connection device used when testing the electronic component, a base, and disposed on the base,
A sheet for electrical connection having conductive connection members arranged in a matrix corresponding to a plurality of protruding electrodes of the electronic component; a positioning means arranged on the base to position the electronic component and the sheet; Having a matrix-shaped contact corresponding to the arrangement of the conductive connection members, and a conversion board having a wiring pattern for expanding the arrangement interval of the matrix-shaped contact, and an electrical connection device for electronic components including: Achieved.

In the present invention, a plurality of protruding electrodes arranged in a matrix of electronic components are used for making an electrical connection to a tester side of the electronic components and testing the electronic components. . The sheet for electrical connection is arranged on the base. The sheet has conductive connecting members arranged in a matrix corresponding to a plurality of projecting electrodes of the electronic component. The positioning means positions these electronic components and the sheet. The conversion board has a matrix-shaped contact corresponding to the arrangement of each conductive connection member of the sheet, and the conversion board has a wiring pattern for expanding the arrangement interval of the matrix-shaped contact. ing. Thereby, the conversion board can enlarge the arrangement pattern of the plurality of protruding electrodes arranged in a matrix of the electronic component to an arrangement pattern suitable for the tester side.

In the present invention, the supporting means for supporting the conversion board supports the pressing force when the protruding electrode of the electronic component is pressed against the connecting member of the sheet, so that the base and its surroundings by the pressing force are supported. The deformation of the part can be prevented. Further, in the present invention, the displacement of the base and the component on the tester side is absorbed by using the displacement displacement absorbing means for absorbing the displacement between the base and the component on the tester side, and the electronic component test is performed. Electrical connection with the container side can be reliably performed. The sheet used in the present invention can be easily made by injecting an insulating material into a plurality of connecting members.

[0008]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIGS. 1 and 2 (A) to 2 (F) show a preferred embodiment of the electrical connection device for electronic components of the present invention. The electronic component electrical connection device is for performing an electrical test of an electronic component, for example, the CSP chip 8 on the tester side. The electrical connection device 100 is roughly composed of a handler 101 and a test head 102 of a tester.
It is provided in connection with. The electrical connection device 100 includes:
It has a base (also called a handler base) 1, a sheet (also called a socket) 5, a guide 6 as positioning means, a conversion board 4, and the like.

The base 1, the sheet 5, the guide 6 as a positioning means, and the conversion board 4 on the handler 101 side will be sequentially described. When the CSP chip 8 is mounted on the base 1 of the handler 101, the test head 102 electrically connects to the CSP chip 8 and
The discrimination unit 100 tests a product check such as the electrical characteristics of the CSP chip 8. The CSP chip 8, the sheet 5, the guide 6, and the conversion board 4 are shown in the sectional view of FIG. 1 and the exploded perspective view of FIG. 1 and 2 (B)
The CSP chip 8 shown in FIG.
It is a scale package chip and a semiconductor chip. On the back side of the CSP chip 8, bumps BP, which are protruding electrodes, are formed in a full matrix at a predetermined pitch.

The sheet 5 shown in FIG. 1 and FIG.
At a position corresponding to the bump BP of the CSP chip 8, a connection member (pin-shaped member) is formed in a full matrix as shown in FIGS. Connection member 5a of sheet 5
Are vertically fixed to an insulating sheet base 5b made of rubber, for example, and the pitch of the adjacent connecting members 5a is, for example, 0.5 corresponding to the arrangement pattern of the bumps BP.
mm pitch.

A guide 6 shown in FIGS. 1 and 2 (D) is a member for guiding the sheet 5 and the CSP chip 8.
The guide 6 has a hole 6a for receiving and positioning the sheet 5 and the CSP chip 8. The guide 6 is fixed to a hole of the base 1 by a screw. The guide 6 has a hole 6b. The conversion board 4 is provided in the hole 6b.
Bolt 4a is inserted. The guide 6 is a part of the socket base 3 and is fixed to the base 1.

The conversion board 4 has a conversion circuit 4b as shown in FIG. 2 (E) and FIGS. 3 and 4. The conversion circuit 4b enlarges the arrangement pattern of the connection members 5a of the sheet (also referred to as a child socket) 5, that is, the arrangement pattern of the bumps BP of the CSP chip 8, and converts the arrangement pattern to the pitch P2 of the connection terminals 4T. That is, the arrangement pitch P1 of the connection members 5a of the sheet 5 can be expanded to the arrangement pitch P2 of the connection terminals 4T. When the pitch P1 is, for example, 0.5 mm,
The pitch P2 can be enlarged to, for example, 1.27 mm. The conversion board 4 is attached to the socket base 3 by using nuts 13 using bolts 4a. The socket base 3 is attached to the base 1. Guide 6
This is the above-described hole located at the center of the socket base 3. The sheet 5 can be positioned and fixed by the guide 6 in contact with the conversion board 4. Thus, the conversion board 4, the guide 6, and the sheet 5 can be attached to the base 1.

Next, the structure of the test head 102 will be described. A parent socket 15 is mounted on the support plate 12 on the test head 102 side in FIG. The parent socket 15 has a large number of holes 15a into which the connection terminals 4T of the conversion board 4 are inserted, as shown in FIG. The number of holes 15a of the parent socket 15 is set larger than the number of connection terminals 4T of the conversion board 4. Thereby, when the conversion board 4 is changed and another conversion board 4 is set, even if the number of the connection terminals 4T increases, the parent socket 15 is fitted with the connection terminals 4T and electrically connected. it can. The parent socket 15 electrically connects the connection terminal 4T to the connection terminal 15T of the parent socket 15. The connection terminal 15 </ b> T is led through the duty board 7 via the cord 11 to the determination unit 100.

The support plate 12 shown in FIG. 1 has a plurality of (for example, four at four corners) universal joints 1.
4 is set on the duty board 7. The universal joint 14 supports the support plate 12
Can be held even when moved with respect to the duty board 7 along the X direction and the Y direction. That is, the universal joint 14 is a misalignment absorbing means that allows the support plate 12 to be displaced in a substantially horizontal direction with respect to the duty board 7. The guide pins 2, 2 are attached upward from the support plate 12, and the guide pins 2, 2 are inserted into the holes 3a of the socket base to align the center of the seat 5 with the center of the parent socket 15. it can. Above the handler 101, a pusher unit PH is arranged. The pusher unit PH can press the CSP chip 8 placed on the sheet 5 downward by the operation of the robot RT with the force of F. The robot RT is set on the base 1.

FIG. 2F shows a state in which the pusher unit PH presses the CSP chip 8 placed on the sheet 5 with the force of F, and the connection terminals 4 T of the conversion board 4 are connected to the parent socket 15. The connection terminal 15T of the parent socket 15 is connected to the determination unit 13 through the duty board 7.
0 can be electrically connected.

Next, an example of use of the electrical connection device will be described with reference to FIGS. Conversion board 4 is bolt 4a
And the nut 13 are already fixed to the socket base 3. Conversion board 4 is in a state of being electrically connected to parent socket 15. At this time, even if the position of the connection terminal 4T of the conversion board 4 fixed to the socket base 3 side and the position of the hole 15a of the parent socket 15 are slightly shifted, the guide pins 2 and 2 are fixed to the hole 3a of the socket base 3. By fitting in, the positional relationship between the conversion board 4 and the parent socket 15 can be exactly matched by the action of the universal joint 14. That is, the parent socket 15 and the support plate 12 move in the X or Y direction with respect to the duty board 7 via the universal joint 14. By doing so, the alignment for electrical connection between the conversion board 4 and the parent socket 15 can be reliably performed.

Next, the CSP chip 8 having the bumps BP shown in FIG. As shown in FIGS. 4 and 3, each bump BP is connected to the connecting member 5 a of the sheet 5.
Connected to. Then, when the pusher unit PH presses the upper surface side of the CSP chip 8 with the force of F, the bump B
P can be reliably connected to the connection members 5a of the sheet 5. Thereby, the bump B of the CSP chip 8
The arrangement pattern of P is electrically connected by the connection member 5a of the sheet 5, and the arrangement pattern of the connection member 5a is expanded to the connection terminal 4T by the conversion board 4. The enlarged connection terminal 4T is connected to the determination unit 130 through the duty board 7 via the cord 11. A signal for inspection is sent from the determination unit 130 to the bump BP side, an electrical inspection of the CSP chip 8 is performed, and the determination unit 130 performs the inspection. By the way, the parent socket 15 can prevent the conversion board 4 and the sheet 5 from warping due to the pressing force when the pusher unit PH presses downward with F. It can prevent direct application of force. Thereby, the connection between the bump BP and the connection terminal of the sheet 5 can be reliably performed.

FIGS. 2A to 2F show an electrical connection device for a CSP chip according to the present invention.
(K) shows an example of a commonly used electrical connection device for a QFP chip. 2 (A) to 2 (F) and FIG.
As shown by comparing (G) to (K), the electrical connection device for the QFP chip uses a QF
P chip 1002 presses QFP chip 1002 and Q
FP chips are child socket 1003 and parent socket 1004
And assemble as shown in FIG. Such a Q
FIG. 2 shows the correspondence between the electrical connection device of the FP chip and the electrical connection device for the CSP chip of the present invention.

The test head set ring 10 shown in FIG.
The duty board 7 is detachably attached to the test head 102 side.
By loosening 0, the duty board 7, the support plate 12, and the like can be removed.

Next, another embodiment of the electronic component electrical connection device of the present invention will be described with reference to FIGS.
The main difference between the electrical connection device 200 of FIGS. 5 and 6 and the electrical connection device 100 of FIG.
5 is omitted. Instead of omitting the parent socket 15, a support body 319 is set between the conversion board 4 and the support plate 312. The support body 319 can prevent deformation of the conversion board 4 and the sheet 5 even when receiving the force F of the pusher unit PH.

In FIGS. 5 and 6, the CSP chip 8 and the sheet 5 are the same as the corresponding CSP chip 8 and sheet 5 in FIGS. Pusher unit P
H has a similar structure. In FIG. 5, the electrical connection device 200 includes a handler 201 and a test head 20.
Two. The handler 201 includes a base 301,
It has a socket base 303 and a socket base 3
Numeral 03 is fixed to the base 301 with screws, and guide pins 302 align the socket base 303 and the base 301.

The socket base 303 is a CSP chip 8
And a positioning means for positioning the sheet 5 in the center, and a CSP is provided in the guide hole 303a.
The chip 8 and the sheet 5 can be positioned. This hole 303a
The conversion board 4 (also referred to as an adapter socket) is fixed by a screw 315a and a nut 315 in a manner corresponding to FIG. The conversion board 4 is held by the support body 319 with respect to the support plate 312. The support plate 312 is movably supported by the support block 316 of the duty board 309. That is, since the support plate 312 is supported on the planner 318 of the support block 316 via the ball 318a, the support plate 312 is, for example, Y
It can move in any direction. The duty board 309 is detachably attached to the test head 202 by a set ring 312.

The conversion board 4 also called an adapter socket is similar to the conversion board 4 used in the embodiment of FIG. The conversion substrate 4 is shown in FIGS. 5 and 6 (D).
As shown by, a connection terminal 4T is provided. This conversion board 4 is similar to the conversion board 4 of FIG. 1 in that the arrangement pattern of the bumps BP of the CSP chip 8,
The arrangement pattern of “a” is enlarged and converted into an arrangement pattern of the connection terminals 4T. The misalignment between the handler 201 and the test head 202 is caused by the fact that the support plate 312 is
It can be absorbed by moving in the Y direction by 18a. Pusher unit PH is C by robot RT
The SP chip 8 can be pressed by the force of F. The robot RT is mounted on a base 301 (handler base).

As shown in FIG. 6F, when the pusher unit PH presses the CSP chip 8, the bumps BP of the CSP chip 8 are electrically connected to the connection members of the sheet 5, respectively. The bump BP is electrically connected to the connection terminal 4T of the conversion board 4 via the connection member of the sheet 5, and the connection terminal 4T is electrically connected to the circuit board of the duty board 309 by the cord 313. The duty board 309 is electrically connected to the determination unit 330. The electrical connection device of the present invention for a CSP chip shown in FIGS. 6A to 6F corresponds to the commonly used electrical connection device for a QFP chip shown in FIGS. 6G to 6K. Are shown.

Next, another embodiment of the electrical connection device of the present invention will be described with reference to FIG. In FIG. 7, an electrical connection device 400 is provided in association with a handler 401 and a test head 402. CSP in FIG.
The chip 8 and the sheet 5 are the same as the CSP chip and the sheet in the embodiment shown in FIGS. A socket base 503 is attached to the base 501 by screws. The socket base 503 is movably supported by the universal joint 514 with respect to the duty board 509 of the test head 402.
The seat 5 is fixed to the socket base 503 by screws 5p, and the positioning means 530 is mounted on the seat 5. Positioning means 530 is a CS
The P chip 8 and the sheet 5 are positioned.

The conversion board 504 is detachably attached by bolts 504a. The connection terminal 504T of the conversion board 504 is electrically connected to the cord 540. The code 540 is electrically connected to the determination unit 550 via the duty board 509. Conversion board 5
Reference numeral 04 extends the arrangement pattern of the bumps BP of the CSP chip 8 and the connection terminals 5a of the sheet 5 to the wiring pattern of the connection terminals 504T, as in the embodiment described above.

Next, referring to FIG.
Will be described. As illustrated in FIGS. 3, 4 and 8F, the sheet 5 has an insulating sheet base 5b.
The connection members 5a are fixed vertically and parallel to each other in a full matrix. In order to adopt such a structure, a manufacturing process as shown in FIGS. 8A to 8E is performed.
FIG. 8A shows a metal jig 601 for forming the sheet base 5b. This jig 601 is
It has holes 602 corresponding to the required number of connection members 5a. A large number of connecting members 5a are put into the jig 601 and the connecting members 5a are sucked from the lower portion of the jig 601 through the holes 602 by a vacuum suction force, as shown in FIG. Then, each connection member (electrode) 5a enters into each hole 602 successfully. The middle portion of these connecting members 5a stops at the inner peripheral surface of the hole 2, the upper end portion 5f of the connecting member 5a protrudes into the jig 601, and the lower end portion 5g of the connecting member 5a is located below the jig 601. Protrude. In this state,
As shown in FIG. 8C, an insulating material, for example, a resin is injected into the jig 601 by an injection nozzle 610. Resin 6
05 is formed into a plate with a required thickness in the jig 601 and is heated and hardened as shown in FIG. The solidified sheet base 5b is taken out of the jig 601 so that
The sheet 5 in which many connecting members 5a are fixed can be obtained from the resin-made sheet base 5b. The resulting sheet 5 has a shape as shown in FIGS.

FIG. 9 shows a typical shape of the connecting member 5a. One end 5f of the connection member 5a is formed in a substantially Y-shape, and the other end 5g has a closed shape. The seat 5 firmly fixes the intermediate portion 5h of the connecting member 5a. Bump BP of CSP chip 8
Can penetrate into the substantially Y-shaped one end portion 5f of the connection member 5a to be surely electrically connected.

FIG. 10 shows a method of fixing a connecting member which is usually used for comparison with FIG. In the conventional method shown in FIG. 10, a sheet base 5b is formed in advance by injection molding, and a hole 5j is formed in the sheet base 5b in advance. The other end 5g of the connecting member 5a is inserted into the hole 5j and fixed to the seat base 5b.
However, with such a fixing method, it is difficult to form the hole 5j when the sheet base 5b is injection-molded in advance,
Moreover, even if the connecting member 5a is inserted into the hole 5j, the adhesive force between the two may be weak and the connecting member 5a may come off in the arrow Z1 direction. For this reason, the sheet manufacturing method of the present invention shown in FIGS. 8 and 9 is useful.

In the embodiment of the electrical connection device of the present invention described above, the CSP having a fine arrangement pitch is used.
When an electrical test of the CSP chip is performed by using the bump BP of the chip, the arrangement pitch of the bump BP can be expanded by the conversion substrate 4, so that even a very small CSP chip can be tested with a tester. , Electrical characteristics and the like. By using a connection member easily elastically deformable as shown in FIG.
Even if it is electrically connected to the connection member, it can withstand the repeated connection work sufficiently. Even when the size of the CSP chip 8 changes or a different type of CSP chip is tested, the sheet 5 and the conversion board 4 are in a full matrix, so that the type of the CSP chip can be changed. For example, in FIG. 1, even when the test head 102 is replaced, the conversion board 4 and the parent socket 1 are replaced.
The test head 102 can be easily changed by separating the interval between the test heads 5. In this case, by loosening the test head ring 10, the conversion board 4 and the parent socket 15 can be easily separated.

Pusher unit PH is CSP chip 8
1, the parent socket 15 receives the load in the example of FIG. 1, so that there is no fear that the conversion board 4 is warped or the sheet 5 is warped. Connection can be reliably established.

[0033]

As described above, according to the present invention,
Electrical connection between a plurality of projecting electrodes arranged in a matrix of an electronic component such as a CSP chip and the tester side of the electronic component can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a preferred embodiment 1 of an electrical connection device for electronic components of the present invention.

FIG. 2 is a diagram showing a comparison between the electrical connection device according to the first embodiment of the present invention shown in FIG. 1 and a commonly used electrical connection device for a QFP chip;

FIG. 3 is a CSP chip in the electrical connection device of FIG. 1;
The figure which shows the connection relationship of a sheet and a conversion board.

FIG. 4 is a perspective view showing an electrical connection relationship in FIG. 3;

FIG. 5 is a sectional view showing another embodiment 2 of the electrical connection device of the present invention.

FIG. 6 is a diagram showing an electrical connection device according to a second embodiment of the present invention in comparison with a commonly used electrical connection device of a QFP chip.

FIG. 7 is a sectional view showing Embodiment 3 of the electrical connection device of the present invention.

FIG. 8 is a diagram showing an example of a sheet manufacturing process according to the embodiment of the present invention.

FIG. 9 is a diagram showing a connection member of the seat of the present invention and a fixing state thereof.

FIG. 10 is a diagram showing a relationship between a conventionally used connection member and a seat base.

[Explanation of symbols]

1 ... Base (handler base), 3 ... Socket base (positioning means), 4 ... Conversion board, 5 ...
・ Seat (socket), 8 ... CSP chip (electronic component), 14 ... Universal joint (position displacement absorbing means), 15 ... Parent socket (supporting means), 100
... Electrical connection device, BP ... Bump (protruding electrode of electronic component)

Claims (6)

[Claims] An electrical connection device used for testing an electronic component by electrically connecting a plurality of protruding electrodes arranged in a matrix of the electronic component to a tester side of the electronic component. , A base, an electrical connection sheet having conductive connection members arranged on the base and arranged in a matrix corresponding to a plurality of projecting electrodes of the electronic component, and an electronic component arranged on the base And a positioning means for positioning the sheet, a conversion board having a matrix-shaped contact corresponding to the arrangement of each conductive connection member of the sheet, and a wiring pattern for expanding an arrangement interval of the matrix-shaped contact; An electrical connection device for electronic components, comprising: 2. The electrical connection device according to claim 1, wherein the electronic component is a chip scale package. 3. The electronic component electrical connection device according to claim 1, wherein the support means for supporting the conversion board supports a pressing force when the protruding electrode of the electronic component is pressed against the connection member of the sheet. . 4. The electrical connection device for an electronic component according to claim 1, further comprising a position shift absorbing means for absorbing a position shift between the base and the component on the tester side. 5. The electrical connection device for electronic components according to claim 1, wherein the sheet is formed by injecting an insulating material into a jig in which a plurality of connection members are arranged in parallel in a matrix. 6. The electrical connection device for an electronic component according to claim 1, wherein the connection member is electrically connected with the protruding electrode interposed therebetween.