JPH10175388A - Non-contact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card of a low cost with high reliability and no uneven part generated on its surface and a method for manufacturing it. SOLUTION: This IC card comprises a core sheet 3 or an underlay sheet 1 punched in a shape of an IC module 4 of at least one being transparent, the module 4 inserted into an air gap part 13 formed by laminating the sheets 3, 1 with adhesive 2 containing ultraviolet curable resin as main component, curing it by emitting an ultraviolet ray thereto and laminating them, and filler 5 containing the curable resin as a main component and sufficiently coating the entire surface of the sheet 3 including the gap 13. Thereafter, a transparent overlay sheet 6 is laminated on a certain surface of the sheet 3 by a pressure roll 12, and cured by emitting the ultraviolet ray thereto and adhered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card which is used for an ID card, an entry / exit management card, a prepaid card, etc., and is capable of non-contact data communication with the outside, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A non-contact IC card which is more convenient and has higher security than other cards has various circuits for transmitting / receiving data to / from external devices, storing data and controlling the entire system, and the like. It is generally manufactured by laminating or molding a resin such as vinyl chloride, acrylonitrile, butadiene, styrene or polyethylene terephthalate into a substrate having a thickness of about 0.8 mm.

For example, an IC card made of a rigid polyvinyl chloride sheet by a heat and pressure laminating method is a method in which a core sheet and an underlay sheet punched according to the shape of an IC module are primarily laminated, and an IC is formed in a gap between the punching marks.
The module and spacer are inserted, covered with an overlay sheet from above, and laminated by heating and pressing with a press machine.

In an IC card by the adhesive laminating method, a polyethylene terephthalate sheet is punched out in the same manner as described above, an adhesive is applied to the entire surface, adhesively laminated with an underlay sheet, and an IC module is inserted into the void of the punching mark. Thereafter, in order to bury the gap of the void, it is manufactured by applying and curing an epoxy-based filler, applying an adhesive to the entire surface, and laminating an overlay sheet.

However, in the case of the heat and pressure laminating method, there is a problem that irregularities are generated on the surface of the card due to a gap between the spacer, the IC module, and the core sheet and a slight difference in thickness.

In addition, in the case of the adhesive laminating method, it takes several hours to cure the filler, and large and small undulations on the surface of the cured film cause undulation on the surface of the base material. Like the card by the pressure lamination method,
Due to the unevenness of the flat surface, there is a problem that printing cannot be performed by, for example, a thermal transfer printer for performing thermal transfer printing of a face photograph or the like.

There is also a method of enclosing an IC module in a base material by injection molding. However, since the IC module is exposed to a high temperature of 200 ° C. or more, the parts used in the IC module and the manufacturing method are restricted. There was a problem with reliability. Further, due to the nature of injection molding, productivity was difficult and there was a limit in cost.

[0008]

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a non-contact IC card which solves the above-mentioned problems, is inexpensive, has high reliability, and has no irregularities on its surface, and a method for manufacturing the same. It is in.

[0009]

In order to achieve the above-mentioned object, as a result of intensive studies, in a non-contact IC card formed by laminating sheets made of various resins, a gap portion in which an adhesive between the sheets and an IC module are inserted. It has been found that the above problem can be solved by using an ultraviolet-curable resin as a filler.

That is, the present invention provides a non-contact IC card in which an IC module is included in a gap formed by a core sheet and an underlay sheet and an overlay sheet laminated on both sides of the core sheet. ,
The non-contact IC card is characterized in that the adhesive between the underlay sheet or the overlay sheet and the filler of the IC module are ultraviolet curable resins.

Further, the present invention is the non-contact IC card described above, wherein at least any two of the core sheet, the underlay sheet and the overlay sheet are made of a transparent sheet.

Further, the present invention is the method for producing a non-contact IC card as described above or above, wherein the curing of the adhesive and the filler is performed by irradiation with ultraviolet rays.

After the IC module is inserted into a concave portion (gap) formed by the underlay sheet and the core sheet, the entire surface of the core sheet including the gap is sufficiently coated with an ultraviolet curable resin to encapsulate the core sheet. Filling is performed by filling in irregularities generated due to the difference between the shape of the IC module and the thickness of the core module and the thickness of the core module. Next, by pressing and laminating the overlay sheet from above the core sheet with a pressure roll, excess ultraviolet curable resin is scraped out, and the overlay sheet is laminated while maintaining flatness. Further, by irradiating the laminated state with ultraviolet rays, a laminated sheet having a built-in IC module having a surface shape without unevenness is completed. A desired pattern is printed on the obtained laminated sheet and punched into a desired shape to form a non-contact card.

According to the present invention, a non-contact IC card having no irregularities on its surface can be easily manufactured. Furthermore, the manufacturing process of the present invention can process all the processes online, for example, by using equipment such as a form rotary printing machine, and solves the productivity problem which has been a problem of the conventional process, and provides a card. Can be manufactured at low cost.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A core sheet and a transparent underlay sheet punched according to the shape of an IC module are adhered to each other with an adhesive mainly composed of an ultraviolet curable resin, cured by ultraviolet irradiation, laminated, and then a gap is formed. Insert the IC module into the part, fully apply a filler mainly composed of an ultraviolet curable resin to the entire surface of the core sheet including the void, and apply a transparent overlay film from a certain surface of the core sheet using a pressure roll. Lamination, curing and bonding by UV irradiation.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

FIG. 1 is a sectional view showing a non-contact IC card manufacturing process according to an embodiment of the present invention. FIG. 2 is a sectional view of a non-contact IC card according to one embodiment of the present invention. The contactless IC card according to one embodiment of the present invention is manufactured as follows.

First, as shown in FIG.
A core sheet 3 made of white polyethylene terephthalate (PET) having a thickness of 0 μm was punched out, and a void 13 containing an IC module was provided later. Next, an adhesive 2 made of an ultraviolet curable resin is applied to the entire surface of an underlay sheet 1 made of transparent PET having a thickness of 75 μm using an applicator having a gap of 30 μm, and the core sheet 3 is bonded while pressing with a rubber roll. After that, the ultraviolet irradiation device 11
Cured.

Next, as shown in FIG.
After inserting an IC module 4 composed of a coil and an IC chip into the core 3, a filler 5 made of an ultraviolet-curable resin is applied to the entire surface of the core sheet 3 having a gap using an applicator having a gap of 250 μm. After filling the gap 13, the excess filler 5 was further removed with a knife doctor having a gap of 30 μm.

Next, as shown in FIG. 1 (c), an overlay sheet 6 made of transparent PET having a thickness of 75 μm was placed on the surface of the applied filler 5 by a stainless steel having a diameter of 20 mm.
It was attached while applying pressure using a pressure roll 12 of mm.

Further, as shown in FIG. 1 (d), this laminated sheet was cured by an ultraviolet irradiation device 11 with a conveyor, and contained an IC module 4 to obtain a laminated sheet having uniform flatness.

Next, as shown in FIG. 2, a shielding layer 7 made of white ink is printed on both sides of the obtained laminated sheet by screen printing, and then a picture 8 and a thermal transfer ink receiving layer 9 are formed on one side. Was printed with a letter 10 as a precautionary statement on one side and punched out into a card shape to obtain a non-contact IC card having a thickness of 0.8 mm.

When a non-contact type IC card obtained here was printed with a face photograph and characters such as a name using a sublimation type thermal transfer printer, it could be printed without any problem.

In this embodiment, the core sheet is white,
Although the underlay sheet and the overlay sheet are transparent, the invention is not limited to this, and any two of them may be transparent.

As the UV-curable resin, various acrylic compounds including polyether, polyester, epoxy, polyurethane, and silicone-based acrylate can be used.

[0026]

According to the present invention, it is possible to provide a non-contact IC card which is inexpensive, has high reliability and has no irregularities on its surface, and a method for manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a non-contact IC card manufacturing process according to an embodiment of the present invention.

FIG. 2 is a sectional view of a non-contact IC card according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Underlay sheet 2 Adhesive 3 Core sheet 4 IC module 5 Filler 6 Overlay sheet 7 Shielding layer 8 Picture 9 Thermal transfer ink receiving layer 10 Character 11 Ultraviolet irradiation device 12 Pressure roll 13 Void

Claims (3)

[Claims] 1. A non-contact IC in which an IC module is included in a gap formed by a core sheet and an underlay sheet and an overlay sheet laminated on both sides of the core sheet.
In a card, an adhesive and an IC between the core sheet and an underlay sheet or an overlay sheet
A non-contact IC card, wherein the filler of the module is an ultraviolet curable resin. 2. The non-contact IC card according to claim 1, wherein at least two of the core sheet, the underlay sheet, and the overlay sheet are made of a transparent sheet. 3. The method for manufacturing a non-contact IC card according to claim 1, wherein the curing of the adhesive and the filler is performed by ultraviolet irradiation.