JP2022146500A - Ic card manufacturing method, ic card, and ic card-formed sheet - Google Patents

Abstract

To harden adhesive to be used in manufacturing an IC card, evenly.SOLUTION: A method for manufacturing an IC card formed by laminating inlets including an IC chip and an antenna between a pair of substrates with adhesive includes: a step of applying first adhesive on one surface of a first substrate sheet and arranging a plurality of inlets on the first adhesive; a step of applying second adhesive on one surface of the second substrate sheet; a step of arranging a ventilation sheet between the first substrate sheet and the second substrate sheet, and clamping the first substrate sheet and the second substrate sheet, while the surface with the first adhesive applied thereon facing the surface with the second adhesive applied thereon, to manufacture an IC card-formed sheet; and a step of hardening the adhesive included in the IC card-formed sheet.SELECTED DRAWING: Figure 2

Description

TECHNICAL FIELD The present disclosure relates to an IC card manufacturing method, an IC card, and an IC card forming sheet.

IC (Integrated
A Circuit card contains an integrated circuit called an inlet, which has an IC chip and an antenna.

Known methods for manufacturing such an IC card include a heat lamination method, an adhesive lamination method, and an injection molding method. Among them, in the moisture-curing adhesive bonding method, a sheet-like first base material on which an adhesive and a number of inlets are arranged and a web-like second base material coated with an adhesive are nipped together by nip rollers. By sandwiching, a laminated structure having uniform thickness is obtained. The obtained laminate structure is cut in the width direction to sequentially produce IC card forming sheets each including a plurality of inlets.

The resulting IC card forming sheets are stacked together and aged. In the aging treatment, the moisture-curable adhesive contained in the IC card forming sheet absorbs moisture and gradually hardens. Individual IC cards are obtained by punching the IC card forming sheet with the cured adhesive into a desired card shape.

In the aging treatment, since the IC card forming sheets were stacked with no space between them, each IC card forming sheet was able to absorb moisture in the peripheral area, but it was difficult to absorb moisture in the central area. For this reason, the adhesive located in the central region is hard to cure, and when an IC card is punched out, the uncured adhesive located in the central region causes cut waste. When the generated cut waste adheres to the surface of the IC card, it adversely affects the print quality and becomes a factor of lowering the production efficiency.

JP 2016-71744 A

An object of the present disclosure is to provide an IC card manufacturing method, an IC card, and an IC card forming sheet that can cure an adhesive used when manufacturing an IC card with less unevenness.

The method for manufacturing an IC card of the present disclosure is a method for manufacturing an IC card in which an inlet including an IC chip and an antenna is laminated between a pair of base materials via an adhesive. applying a first adhesive to one surface and arranging a plurality of inlets on the first adhesive; applying a second adhesive to one surface of a second base sheet; A ventilation sheet is arranged between the first base sheet and the second base sheet, and the first base sheet and the second base sheet are separated from the surface coated with the first adhesive and the second base sheet. The method includes a step of making an IC card forming sheet by pressing the adhesive-applied surface facing each other, and a step of curing the adhesive contained in the IC card forming sheet.

The IC card of the present disclosure includes a first base layer, a first adhesive layer provided on the first base layer and containing an inlet including an IC chip and an antenna, and a first adhesive layer provided on the first adhesive layer. a second adhesive layer provided on the breathable sheet; and a second substrate layer provided on the second adhesive layer.

The IC card forming sheet of the present disclosure includes: a first base sheet; a first adhesive layer provided on the first base sheet and accommodating a plurality of inlets each including an IC chip and an antenna; A ventilation sheet provided on the layer and having a size equal to or larger than the size of the first base sheet, a second adhesive layer provided on the ventilation sheet, and a second substrate provided on the second adhesive layer. and a material sheet.

According to the present disclosure, adhesives used in manufacturing IC cards can be cured with less unevenness.

1 is a plan view of an IC card according to an embodiment of the present disclosure; FIG. 2 is a cross-sectional view of an IC card according to the same embodiment; FIG. 3a and 3b are cross-sectional views and plan views for explaining the method of manufacturing an IC card. 4a and 4b are cross-sectional and plan views for explaining the method of manufacturing an IC card. 5a and 5b are cross-sectional and plan views for explaining the method of manufacturing an IC card. 6a and 6b are a cross-sectional view and a perspective view for explaining the IC card manufacturing method. It is a figure which shows the state which laminated|stacked the IC card formation sheet. FIG. 4 is a schematic diagram showing the flow of air entering the inside of the IC card forming sheet. FIG. 4 is a plan view of a ventilation sheet according to another embodiment; It is sectional drawing explaining the manufacturing method of an IC card. 11a and 11b are plan views of a breathable sheet according to another embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings and the like. It should be noted that the present disclosure can be embodied in many different modes and should not be construed as being limited to the description of the embodiments exemplified below. In addition, in order to clarify the description, the drawings may schematically show the width, thickness, etc. of each part compared to the actual embodiment, but this is only an example and limits the interpretation of the present disclosure. not a thing

As shown in FIGS. 1 and 2, the IC card 70 according to the embodiment of the present disclosure incorporates an integrated circuit called an inlet 80 for recording information and performing calculations. The IC card 70 is used, for example, as an employee ID card, a student ID card, or the like to prove an individual's identity.

The IC card 70 includes a printed layer 71, a receiving layer 72, a cushion layer 73, a first base material layer 74, an adhesive layer 75a, an air-permeable sheet 4, an adhesive layer 75b, and a second base material layer 76, which are arranged from the front side to the back side. Include in that order toward . The inlet 80 is accommodated in the adhesive layer 75a.

The print layer 71 is typically formed by thermally transferring a colorant from a thermal transfer sheet to the receiving layer 72 . The printed layer 71 shown in FIG. 2 includes a pre-printed layer printed in advance before the IC card 70 is manufactured. Examples of information printed as the pre-printed layer include printed information common to other IC cards 70, such as patterns, patterns, or frames. Moreover, the printed layer 71 may further include an individual printed layer that is printed after the IC card 70 is manufactured, if necessary. An example of information printed as an individual print layer is individual print information such as an image or written information about an individual.

Receiving layer 72 is a layer configured to receive colorant that is thermally migrated from the thermal transfer sheet. As a material for the receiving layer 72, a resin material or the like is used which easily receives a thermally migratable coloring material such as a sublimation dye or a hot-melt ink. Examples of materials for the receiving layer 72 include vinyl chloride resins, acrylic-styrene resins, polyester resins, and the like.

The cushion layer 73 exhibits appropriate cushioning properties and contributes to stable recording of the print layer 71 thermally transferred to the receiving layer 72 . As an example, the cushion layer 73 is obtained by dispersing inorganic hollow particles in a gelatin binder resin.

The first base material layer 74 and the second base material layer 76 protect the inlet 80 accommodated in the IC card 70 and constitute the main body of the IC card 70 . The material forming the first base material layer 74 and the second base material layer 76 is not particularly limited, but examples thereof include polyester resin such as polyethylene terephthalate. A writing layer may be further laminated on the second base material layer 76 as necessary.

Between the first base material layer 74 and the second base material layer 76, an adhesive layer 75a, the ventilation sheet 4 and an adhesive layer 75b are arranged. The adhesive layer 75a (first adhesive layer) adheres the first base material layer 74 and the ventilation sheet 4 together and houses and protects the inlet 80 . The adhesive layer 75b (second adhesive layer) bonds the ventilation sheet 4 and the second base material layer 76 together. As the material forming the adhesive layers 75a and 75b, typically, a moisture-curable adhesive that gradually hardens by absorbing moisture is used. Such materials include hot melt adhesives.

Although not shown, the inlet 80 includes a plate-shaped inlet base material, an IC chip arranged on the inlet base material, an antenna electrically connected to the IC chip, and the like. The inlet base material is composed of a film, a non-woven fabric, or the like. The antenna is composed of a conductor such as Al, Cu, Ag, or the like.

The IC chip has a memory section for storing information, and a control section for controlling an operation of storing information in the memory section, an operation of reading information from the memory section, and an operation of wireless communication. This IC chip reads information to an interrogator (interrogator) such as a reader/writer (not shown) via an antenna, or stores information input from the interrogator via an antenna.

The permeable sheet 4 is a resin sheet having air permeability, and is, for example, a non-woven fabric sheet using polyester fiber, polyethylene fiber, polypropylene fiber, or the like. The permeable sheet 4 preferably has a basis weight of 10 g/m ² or more and 80 g/m ² or less, more preferably 30 g/m ² or more and 70 g/m ² or less. The thickness of the permeable sheet 4 is preferably 100 μm or more and 400 μm or less, more preferably 200 μm or more and 350 μm or less. By setting the permeation weight and thickness of the ventilation sheet 4 within this range, the permeation of the adhesive to the ventilation sheet 4 is suppressed to ensure the ventilation of the ventilation sheet 4, and the thickness of the entire IC card does not meet the card standard. can be fulfilled. In the example shown in FIG. 2 , the ventilation sheet 4 is provided over the entire surface of the IC card 70 , and the peripheral edge portion of the ventilation sheet 4 is exposed at the end face of the IC card 70 .

Next, a method for manufacturing an IC card according to this embodiment will be described with reference to FIGS. 3 to 8. FIG.

As shown in FIGS. 3a and 3b, a sheet-shaped first base sheet 10 is prepared. The first base sheet 10 includes the first base layer 74, the cushion layer 73, the receiving layer 72 and the printing layer 71 described above. The printed layer 71 of the first base sheet 10 is preliminarily formed with a pre-printed layer such as a pattern, a pattern or a frame.

The adhesive 20 that forms the adhesive layer 75a is applied to the surface of the first base material sheet 10 on the side of the first base material layer 74 . The adhesive 20 is applied in a molten state by being heated. A method of applying the adhesive 20 is not limited, and a die coating method, a gravure method, a roll method, or the like can be used. The adhesive 20 may be applied intermittently according to the arrangement of the IC cards.

Next, as shown in FIGS. 4a and 4b, a plurality of inlets 80 are two-dimensionally arranged on the surface of the first base sheet 10 coated with the adhesive 20 on the first base layer 74 side. In this embodiment, the plurality of inlets 80 are arranged in a so-called grid pattern. That is, a plurality of inlets 80 are arranged at predetermined intervals in the vertical and horizontal directions of FIG. 4b.

Next, as shown in FIGS. 5a and 5b, the ventilation sheet 4 is placed on the surface of the first base material layer 74 side of the first base material sheet 10 so as to cover the inlet 80 . The size of the ventilation sheet 4 is equal to or larger than the size of the first base sheet 10 , and preferably larger than the first base sheet 10 . For example, the size of the permeable sheet 4 is the size of the first base material sheet 10 which is increased by about 10% in length and width. As shown in FIG. 5B, it is preferable to dispose the permeable sheet 4 so that the perimeter of the perimeter of the permeable sheet 4 is located outside the peripheral edge of the first base sheet 10 .

Next, as shown in FIGS. 6a and 6b, one surface of the second base sheet 30 is coated with the adhesive 20 that will form the adhesive layer 75b. The second base material sheet 30 constitutes the second base material layer 76 of the IC card 70 . Then, the surface of the second base sheet 30 coated with the adhesive 20 faces the ventilation sheet 4 on the first base sheet 10, and the first base sheet 10 and the second base sheet 30 are sandwiched. pressure. In other words, the ventilation sheet 4 is arranged between the first base sheet 10 and the second base sheet 30, and the adhesive 20 is applied between the first base sheet 10 and the second base sheet 30. The surfaces of are opposed to each other and pressed. As a result, the IC card forming sheet 3 in which the first base sheet 10 and the second base sheet 30 are bonded with the adhesive 20 with the ventilation sheet 4 interposed therebetween is obtained.

The second base sheet 30 is preferably in the form of a sheet having approximately the same size as the first base sheet 10 . In the IC card forming sheet 3 , the permeable sheet 4 extends outside the peripheral edge portions of the first base sheet 10 and the second base sheet 30 .

As shown in FIG. 7, the IC card forming sheets 3 are stacked and aged to cure the adhesive 20 . Conditions such as temperature, humidity, and aging time in the aging process are appropriately determined according to the specifications of the adhesive.

As shown in FIG. 8, the ventilation sheet 4 serves as a path for air from the outside. Since the ventilation sheet 4 extends outside the peripheral edges of the first base sheet 10 and the second base sheet 30, it is easy to take in air. The air reaches not only the peripheral portion of the IC card forming sheet 3 but also the central portion, and the adhesive 20 absorbs moisture in the air and hardens. As a result, the adhesive 20 contained in the IC card forming sheet 3 can be cured evenly within the plane.

Thereafter, the individual IC cards 70 are obtained by punching out the IC card forming sheet 3 in which the adhesive 20 has been cured into a desired card shape.

As shown in FIG. 9, a permeable sheet 4A having an opening H corresponding to an IC card punching area may be used. When the ventilation sheet 4A is placed on the first base sheet 10 coated with the adhesive 20, the inlet 80 is adjusted to be positioned within the opening H as shown in FIG. Even when such a permeable sheet 4A is used, air can easily enter the central portion of the IC card forming sheet 3, and the adhesive 20 can be cured quickly.

When the ventilation sheet 4A is used, the IC card 70 punched out from the IC card forming sheet 3 does not include the ventilation sheet 4A.

As shown in FIG. 11a, a plurality of striped ventilation sheets 4B may be arranged in parallel at predetermined intervals. It is preferable that the length of the ventilation sheet 4B in the longitudinal direction is longer than the length of one side of the first base sheet 10 and that both longitudinal ends of the ventilation sheet 4B are positioned outside the first base sheet 10 .

The ventilation sheet 4B may be arranged so as to cover the inlets 80 as shown in FIG. 11a, or may be arranged between the inlets 80 so as not to cover the inlets 80 as shown in FIG. 11b. good.

When the ventilation sheet 4B is arranged so as to cover the inlet 80, the adhesive 20 in the portion punched out as an IC card can be cured more quickly.

When the ventilation sheet 4B is arranged so as not to cover the inlet 80, the punched IC card does not include the ventilation sheet 4B.

In the above embodiment, the ventilation sheets 4 may be provided above and below the inlet 80 .

EXAMPLES The present disclosure will be described in more detail below using examples, but the present disclosure is not limited to these examples. A ventilation sheet for each sample was prepared as described below, and it was evaluated whether the adhesive contained in the IC card forming sheet was evenly cured in the curing process when each ventilation sheet was used. Sample 1 did not use the ventilation sheet.

(Samples 2-6)
A so-called non-woven fabric sheet was used as the ventilation sheet for samples 2 to 6. Table 1 shows the main physical properties of the ventilation sheets of Samples 2 to 6.

An IC card forming sheet was produced using the air-permeable sheet according to the sample, and a plurality of IC card forming sheets were stacked and stored in an aging chamber to cure the adhesive contained in the IC card forming sheet. After the standing time had passed, the degree of hardening of the adhesive in each IC card forming sheet was confirmed and evaluated based on the following evaluation criteria. Table 1 shows the results.

(Evaluation criteria)
A: No difference was found in the curing of the adhesive between the peripheral portion and the central portion.
B: Almost no adhesive curing unevenness.
C: There was relatively little unevenness in curing of the adhesive.
D: The curing of the adhesive was uneven.

3 IC card forming sheet 4 Ventilation sheet 10 First base sheet 20 Adhesive 30 Second base sheet 70 IC card 80 Inlet

Claims (7)

A method for manufacturing an IC card by laminating an inlet including an IC chip and an antenna between a pair of base materials via an adhesive, the method comprising:
applying a first adhesive to one surface of a first base sheet and arranging a plurality of inlets on the first adhesive;
applying a second adhesive to one surface of the second base sheet;
A ventilation sheet is arranged between the first base sheet and the second base sheet, and the first base sheet and the second base sheet are separated from the surface coated with the first adhesive and the a step of making an IC card forming sheet by making the surface to which the second adhesive is applied face and pressing, and
a step of curing the adhesive contained in the IC card forming sheet;
A method of manufacturing an IC card comprising 2. The method of manufacturing an IC card according to claim 1, wherein said ventilation sheet is larger than said first base sheet. 3. The method of manufacturing an IC card according to claim 2, wherein the perimeter of the permeable sheet extends outward from the perimeter of the first base sheet. The ventilation sheet is formed with a plurality of openings,
4. The method of manufacturing an IC card according to claim 1, wherein said ventilation sheet is arranged so that said inlet is positioned within said opening. a first base material layer;
a first adhesive layer provided on the first base layer and accommodating an inlet including an IC chip and an antenna;
a ventilation sheet provided on the first adhesive layer;
a second adhesive layer provided on the ventilation sheet;
a second base material layer provided on the second adhesive layer;
IC card with a first base sheet;
a first adhesive layer provided on the first base sheet and accommodating a plurality of inlets each including an IC chip and an antenna;
a ventilation sheet provided on the first adhesive layer and having a size equal to or larger than the size of the first base sheet;
a second adhesive layer provided on the ventilation sheet;
a second base sheet provided on the second adhesive layer;
An IC card forming sheet comprising: 7. The IC card forming sheet according to claim 6, wherein at least part of said permeable sheet extends outside peripheral edge portions of said first base sheet and said second base sheet.

Images