JP6339781B2 - Card manufacturing method - Google Patents

Description

  The present invention relates to a card excellent in productivity and designability and a manufacturing method thereof.

  Non-contact type IC cards are widely used as alternatives such as commuter passes, boarding passes, cash cards, prepaid cards and the like. This non-contact type IC card is obtained, for example, by sandwiching an electronic substrate (inlet) on which an IC chip, a control unit, an antenna and the like are mounted with a resin base material, and fusing and integrating them by hot pressing.

  In recent years, the design of an IC card has also become an important issue, and a technique for processing a card surface, such as forming a photograph or a pattern on the surface of the IC card, has been studied. For example, Patent Document 1 proposes a method for manufacturing a card having a concavo-convex pattern on the surface.

JP 2012-250526 A

  However, the technology proposed in Patent Document 1 and the like is not sufficient in productivity and design, and there is still room for improvement.

  The present invention has been made to solve the above problems, and provides a card excellent in productivity and designability and a method for manufacturing the card.

In order to solve the above-described problems, a card manufacturing method according to the present invention includes a card base, a transfer sheet having a protrusion pattern formed on one main surface, and a peelable surface. By laminating a pattern forming surface so as to oppose one main surface of the card substrate to form a laminate, and pressing the laminate in the thickness direction while heating, the convexity of the transfer sheet Including a pressing step for transferring a part pattern to one main surface of the card base material and forming a concave pattern on one main surface of the card base material, and a peeling step for peeling the transfer sheet. A laminate in which a resin layer made of polypropylene, polyvinyl alcohol, or polyethylene terephthalate is formed on one main surface of a support base made of fine paper, and a convex pattern is formed on the resin layer forming surface of the laminate. And characterized in that the emissions are formed.

  The card of the present invention is manufactured by the card manufacturing method of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the card | curd excellent in productivity and designability can be provided.

It is a disassembled perspective view for demonstrating an example of the manufacturing method of the card | curd of this invention. It is sectional drawing which shows an example of the card | curd of this invention. It is a partially expanded side view which shows an example of the transfer sheet used with the manufacturing method of the card | curd of this invention. It is a top view which shows an example of the pattern of a pattern layer. It is a disassembled perspective view for demonstrating the other example of the manufacturing method of the card | curd of this invention. It is sectional drawing which shows the other example of the card | curd of this invention. It is a figure for demonstrating an example of the manufacturing method of the transfer sheet used with the manufacturing method of the card | curd of this invention.

  The card manufacturing method of the present invention comprises a card substrate, a transfer sheet having a convex pattern formed on one main surface and having peelability on the surface, and the convex pattern forming surface of the transfer sheet being the card substrate. And laminating the laminated sheet so as to face one main surface, and pressing the laminated body in the thickness direction while heating the laminated body (hereinafter, also referred to as “hot pressing”). The method includes a pressing step of transferring the convex pattern to one main surface of the card base material and forming a concave pattern on the main surface of the card base material, and a peeling step of peeling the transfer sheet. In the present invention, since it is not necessary to use a release film as in the prior art, the step of laminating the release film before the pressing step and the step of peeling the release film after the pressing step can be omitted, and the design is excellent. Card can be manufactured efficiently.

  The card substrate used in the card manufacturing method of the present invention may be one that includes at least one core sheet, but a pair of exterior sheets are disposed on both main surfaces of at least one core sheet. It may be a configuration.

  The core sheet which comprises the said card | curd base material consists of a white or light transmissive base material which has thermoplasticity. The thickness is preferably 50 μm to 840 μm, and the size is preferably 10 mm or more smaller than a metal plate of a hot press apparatus described later. If the size is too large, stacking faults occur at the outer periphery of the card substrate. As the material for the core sheet, plastic films such as vinyl chloride (PVC), polycarbonate (PC), amorphous polyethylene terephthalate (PET-G), polyethylene terephthalate (PET) can be used, but vinyl chloride (PVC). Or amorphous polyethylene terephthalate (PET-G) is preferably used.

  The exterior sheet which comprises the said card | curd base material consists of a white or light transmissive base material. The thickness is preferably 50 μm to 250 μm, and the size is preferably 10 mm or more smaller than a metal plate of a hot press apparatus described later. If the size is too large, stacking faults occur at the outer periphery of the card substrate. As the material of the exterior sheet, plastic films such as vinyl chloride (PVC), polycarbonate (PC), amorphous polyethylene terephthalate (PET-G), polyethylene terephthalate (PET) can be used, but vinyl chloride (PVC). Or amorphous polyethylene terephthalate (PET-G) is preferably used.

  As a method for laminating the members constituting the card base, known methods such as a roll-to-roll method and a single wafer method can be used. The number of layers to be laminated may be determined as necessary, but usually the final card thickness is set within the range of 0.68 to 0.84 mm.

  The transfer sheet used in the card manufacturing method of the present invention has a convex pattern of a predetermined shape on one main surface, and there is no thermal deformation when performing hot pressing, and the convex pattern is applied to the surface of the card substrate. There is no particular limitation as long as it can be transferred. For example, the transfer sheet is a laminate in which a resin layer is formed on one main surface of a support substrate, and a convex pattern is formed on the resin layer forming surface of the laminate.

  Here, a method for forming a transfer sheet will be described with reference to FIG. First, a resin is applied on one main surface of the support substrate 21 to form the resin layer 22, and then the resin layer formation of the support substrate 21 is performed while rolling the uneven roller 70 having the desired uneven pattern 70a in the direction of the arrow. By pressing the surface, the concavo-convex pattern 70a of the concavo-convex roller 70 is transferred to the resin layer forming surface of the support base 21, and a transfer sheet having the convex pattern 22a on the resin layer forming surface is obtained. The thickness of the resin layer is preferably 10 μm to 50 μm. This is because if the thickness becomes too small, it becomes difficult to form a convex pattern, and if the thickness becomes too large, the convex pattern becomes large and the card substrate bites into the transfer sheet, and the transfer sheet in the peeling step. It is because it becomes difficult to peel off. In addition, the thickness of the support substrate is usually preferably 100 μm to 300 μm. If the thickness is too thick, heat conduction from a metal plate of a hot press apparatus described later may be interrupted, resulting in poor stacking. The heat resistant temperature of the resin layer and the supporting substrate is preferably 100 ° C to 210 ° C.

  The transfer sheet is preferably provided with peelability on the surface. This is because the transfer sheet can be prevented from sticking to the metal plate or card substrate of the hot press apparatus during the pressing process. For example, the material of the resin layer includes polypropylene (PP), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), and the like, and the support base material includes high-quality paper. As the transfer sheet in the present invention, it is more preferable to use high-quality paper having a resin layer made of PP, PVA, or PET formed on the surface. In this case, since the resin layer forming surface of the transfer sheet is arranged on the card substrate side during the lamination step, the paper fiber of the high-quality paper that is the support substrate is prevented from biting into the card substrate during the pressing step. Thus, the transfer sheet can be prevented from sticking to the card substrate, and there is no need to dispose a release sheet between the transfer sheet and the card substrate as in the prior art. Moreover, since the metal plate of the hot press apparatus mentioned later contacts the fine paper which is a support base material at the time of a press process, it can prevent that a transfer sheet sticks to a metal plate. That is, by using high-quality paper on which a resin layer made of PP, PVA, or PET is formed as a transfer sheet, it is not necessary to use a release film as in the prior art, so that card productivity can be improved.

  In the pressing step in the card manufacturing method of the present invention, each base material constituting the card base material is integrally formed by hot pressing, and a concave pattern is formed on the card base material. As the hot press condition, it is preferable that the temperature is not lower than the glass transition temperature of a card substrate, for example, a sheet used for a core sheet or an exterior sheet. Usually, the press temperature is set within a range of 100 ° C to 160 ° C. The press pressure is set within a range of 0.5 MPa to 3 MPa, and the press time varies depending on the press machine, but in the case of a multi-stage press machine, it is usually set within a range of 20 minutes to 40 minutes.

  The depth of the concave pattern formed on one principal surface of the card substrate is preferably 5 μm to 150 μm. In the case of a fine ridge-shaped concave pattern, if the depth of the concave pattern is too deep, it is difficult to peel off the transfer sheet in the peeling step. In the case of a relatively large concave pattern such as a leather pattern such as a reptile, the density of the wrinkles is small even if the concave pattern is deep, so there is no problem that it is difficult to release the transfer sheet in the peeling process. If it is too large, the texture of the leather pattern such as reptiles cannot be reproduced.

  Here, the manufacturing method of the card | curd of this invention is demonstrated in detail, referring drawings. FIG. 1 is an exploded perspective view for explaining an example of a card manufacturing method of the present invention, and shows a state before a pressing step. FIG. 2 is a sectional view showing an example of the configuration of the card of the present invention, and FIG. 3 is a partially enlarged side view showing an example of the configuration of the transfer sheet. 2 and 3, the same components as those in FIG. 1 are denoted by the same reference numerals.

  First, in the laminating step, as shown in FIG. 1, an outer sheet 31, core sheets 32, 33, 34 (here, a three-layer core sheet) and an outer sheet 35 are laminated in this order to form a card substrate 3. Then, the transfer sheet 2 is laminated on both main surfaces of the card base 3 to form a laminate. Here, as shown in FIG. 3, the transfer sheet 2 is obtained by forming a resin layer 22 having a convex pattern 22 a having a predetermined shape on a support base 21.

  In the next pressing step, the laminate is placed between a pair of metal plates 1 of a hot press apparatus (not shown) and hot-pressed in the thickness direction of the laminate, so that the convex pattern 22a of the transfer sheet 2 is formed on the card base. Transfer to both surfaces of material 3.

  In the next peeling step, the transfer sheet 2 is peeled off. Thereby, as shown in FIG. 2, the card | curd which has the recessed part pattern 30 corresponding to the convex part pattern 22a of the transfer sheet 2 on both surfaces is obtained.

  The card substrate in the present invention may have a pattern layer. In this case, a card having better design properties can be manufactured. The pattern layer can be provided on the core sheet surface or the exterior sheet surface constituting the card substrate. The pattern layer is formed by printing the ink composition on a substrate by a known printing method such as a gravure printing method, an offset printing method or a silk screen printing method. As an ink composition, a colorant, a binder, a solvent, a plasticizer, a curing agent and the like are appropriately mixed.

  Moreover, the outstanding texture can be provided to a card | curd by providing a recessed part on the surface of the card | curd which has the said pattern layer. FIG. 4 is a plan view showing an example of the pattern of the pattern layer. For example, when the pattern layer has the pattern shown in FIG. 4, a convex pattern along the solid line 41 in FIG. 4 is formed on the convex pattern forming surface of the transfer sheet, and this convex pattern is transferred to the card substrate. As a result, not only the pattern but also the three-dimensional processing corresponding to the pattern can be applied to the card surface, so that a card with more excellent design can be manufactured. Specifically, when the pattern layer has a leather pattern, the appearance of the card finally obtained is made closer to the leather material by forming the convex pattern so that it has a leather pattern. This makes it possible to produce a card with a better texture. In addition, when the pattern layer has a grain pattern, the appearance of the card finally obtained can be made closer to wood by forming the convex pattern so as to have a grain pattern. However, the shape of the pattern layer and the shape of the convex pattern need not match.

  The laminating step in the production method of the present invention may include a step of further laminating a thin film resin sheet between the card substrate and the transfer sheet. In this case, in the next pressing step, the convex portion pattern of the transfer sheet and the surface property of the thin film resin sheet can be transferred to the card substrate by hot pressing, and in the next peeling step, the transfer sheet and the thin film resin can be transferred. By peeling the sheet, a card having a desired concave pattern and surface properties can be obtained. Examples of the thin film resin sheet include a mirror-finished film and a matte-finished film. When a mirror-finished film is used, a card having gloss on the surface can be produced, and when a matte-finished film is used, a card having no gloss on the surface can be produced. Examples of the material for the thin film resin sheet include polypropylene (PP) and the like. Specifically, a trade name “Trephan” manufactured by Toray Industries, Inc., and a trade name “PACOTANE” manufactured by PACOTANE Technologies can be used. . The thickness of the thin film resin sheet is preferably 25 μm to 40 μm. When the thickness is too thick, the convex pattern is difficult to be transferred, and when the thickness is too thin, workability is lowered.

  Here, the manufacturing method of the card | curd at the time of providing a thin film resin sheet is demonstrated. FIG. 5 is an exploded perspective view for explaining another example of the card manufacturing method of the present invention, and shows a state before the pressing step. 5, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 5, a thin film resin sheet 5 and a transfer sheet 2 are laminated on both main surfaces of the card base material 3 to form a laminate, and then hot pressing is performed, so that a thin film resin is formed on both surfaces. A card on which the surface property of the sheet 5 and the convex pattern of the transfer sheet 2 are transferred is obtained. When high gloss is required by the design, gloss can be imparted to the card surface by using a mirror finish film as the thin film resin sheet 5. On the other hand, the gloss of the card surface can be erased by using a matte finish film as the thin film resin sheet 5. In this way, the gloss of the card surface can be controlled.

  The card of the present invention can also be applied to a non-contact type IC card, a contact type IC card, and a magnetic card.

  In the case of a non-contact type IC card, the card base material in the present invention further includes an inlet base material. For example, a core sheet is laminated on each main surface of the inlet base material, and an exterior sheet is further laminated on the surface of the core sheet. It becomes the composition which was done. However, the exterior sheet may be omitted. The inlet base material is an IC chip or IC module that is a component necessary for wireless communication such as an antenna or a semiconductor component on the mounting surface of the film substrate. The film substrate is formed of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), vinyl chloride (PVC), amorphous polyethylene terephthalate (PET-G), or the like.

  FIG. 6 shows an example of the card of the present invention having an inlet base material. 6, the same components as those in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 6, an inlet base 36 is obtained by mounting an IC chip 36b on the mounting surface of a film substrate 36a. The card shown in FIG. 6 can be manufactured in the same manner as the card shown in FIG. 2 except that the core sheet 33 corresponding to the intermediate layer of the card shown in FIG.

  In the case of a contact IC card, the finally obtained card has a configuration in which an IC chip with contact terminals is mounted on the outermost surface. In the case of a magnetic card, the finally obtained card has a configuration in which a magnetic tape is arranged on the outermost surface of the card. However, the concave pattern of the contact IC card and magnetic card can be formed only on the non-mounting surface of the contact IC and magnetic tape.

  The present invention can produce a card having excellent productivity and design, and the card can be used as a contact IC card, a non-contact IC card, a magnetic card, or the like.

DESCRIPTION OF SYMBOLS 1 Metal plate 2 Transfer sheet 21 Support base material 22 Resin layer 22a Convex pattern 3 Card base material 30 Concave pattern 31 Exterior sheet 32 Core sheet 33 Core sheet 34 Core sheet 35 Exterior sheet 36 Inlet base material 36a Film base material 36b IC chip 5 Thin resin sheet 70 Concave and convex roller 70a Concave and convex pattern

Claims (9)

A card substrate and a transfer sheet having a convex pattern formed on one main surface and having peelability on the surface, such that the convex pattern forming surface of the transfer sheet faces one main surface of the card substrate. A stacking step of stacking to form a stack,
By pressing the laminate in the thickness direction while heating, the convex pattern of the transfer sheet is transferred to one main surface of the card substrate, and a concave pattern is formed on one main surface of the card substrate. Pressing process;
A peeling step of peeling the transfer sheet,
The transfer sheet is a laminate in which a resin layer made of polypropylene, polyvinyl alcohol, or polyethylene terephthalate is formed on one main surface of a support base made of fine paper, and the resin layer is formed on the resin layer forming surface of the laminate. A method for producing a card, wherein a convex pattern is formed.   The card manufacturing method according to claim 1, wherein a depth of the concave pattern formed on one main surface of the card base is 5 μm to 150 μm. The laminating step includes a step of further laminating a thin film resin sheet between the card substrate and the transfer sheet,
The pressing step transfers the convexity pattern of the transfer sheet and the surface property of the thin film resin sheet to the card substrate by the press,
The card manufacturing method according to claim 1, wherein in the peeling step, the transfer sheet and the thin film resin sheet are peeled off.   The card manufacturing method according to claim 1, wherein the card base includes a pattern layer. The pattern layer has a leather pattern,
The card manufacturing method according to claim 4, wherein the convex pattern of the transfer sheet has a leather pattern shape. The pattern layer has a wood grain pattern,
The card manufacturing method according to claim 4, wherein the convex pattern of the transfer sheet has a wood grain pattern.   The card manufacturing method according to claim 1, wherein the card base includes at least one core sheet.    The card production according to any one of claims 1 to 7, wherein the card substrate includes at least one core sheet and a pair of exterior sheets disposed on both main surfaces of the core sheet. Method. The card substrate further includes an inlet substrate in which an IC chip is mounted on the mounting surface of the film substrate,
The card manufacturing method according to claim 7, wherein the inlet base material is disposed between a pair of core sheets.

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