JPH10170229A - Inspection method for positional slippage of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To certainly judge a positional slippage to a surface mounted electronic part having highly luminant electrode part. SOLUTION: A fixed area including a chip resistance attaching part on a printed board 2 is image picked up, and an inspection window DW extending in a direction for perpendicularly crossing the electrode parts 11, 12 at both the ends of the chip resistance 1 is set in an image picked up image plane F. As the inspection window DW is successively moved in a direction for perpendicularly crossing the above set up direction, the rate of picture element in the inspection window DW which displays luminance more than a fixed value at each of moved positions DW1, DW2 is computed, and the positional slippage in a width direction W of the chip resistance I is judged on both the end positions C, D of the movement range of the inspection window DW where the above rate more than the fixed value is shown.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position displacement inspection method suitable for use in electronic components, particularly, surface mount type electronic components having a high-luminance electrode portion.

[0002]

2. Description of the Related Art As a method for inspecting the displacement of electronic components, for example, as proposed in Japanese Patent Application Laid-Open No. Hei 8-210820, a threshold value is obtained from the luminance level of each pixel of an image pickup screen. In some cases, each pixel is classified according to its state based on the state, and the component mounting state is recognized from the classified pixel pattern. However, this method has a problem in that a relatively large amount of screen processing is required until the pixel pattern is extracted, and the inspection takes time.

On the other hand, among electronic components, a surface mount type chip resistor has a relatively simple shape such as a quadrangle, and an example thereof is shown in FIG. The figure shows an imaging screen F of the chip resistor 1 captured by a CCD camera or the like. The chip resistor 1 is a vertically long rectangle, and both ends of the chip resistor 1 have a high luminance and a fixed width.
1,12. The brightness of the surface of the body 13 of the chip resistor 1 is lower than that of the electrodes 11 and 12, and a rectangular seal 14 indicating the resistance value is adhered to the surface, and the brightness of the seal 14 is considerably low. The printed board 2 on which the chip resistor 1 is mounted has the lowest brightness, and the electrodes 21 and 22 formed on the printed board 2
The brightness is lower than that of the electrode portions 11 and 12 because it is covered with the flux solder to be welded. When such a chip resistor 1 is displaced in the width direction (left-right direction in the drawing) W, the substrate electrodes 21 and 22 and the electrode portions 11 and 12 are displaced.
Since the contact area becomes small, it is necessary to eliminate the defective soldering.

A simple method for detecting such a displacement of the chip resistor 1 in the width direction is as follows. That is, an inspection window DL extending left and right is set at the center of the vertical direction (vertical direction in the figure) L, and the luminance of each pixel nW in the inspection window DL is detected. And FIG.
As shown in (B), the width direction deviation is determined based on a position a where the luminance of the pixel exceeds a predetermined luminance determination value and a position b where the luminance of the pixel is lower than the luminance determination value for the second time.

[0005]

However, for example, in the chip resistor 1, the position of the seal 14 applied to the surface of the main body 13 is not always constant. For example, as shown in FIG. May be pasted on the right edge of the. In such a case, FIG.
As shown in (B), the position a where the luminance of the pixel exceeds the predetermined luminance judgment value is detected, but the position b where the luminance of the pixel falls below the luminance judgment value for the second time is not detected, and the displacement in the width direction is detected. Cannot be determined.

Accordingly, the present invention solves such a problem, and a position of an electronic component which can reliably determine a position shift of a surface-mounted electronic component having a high-brightness electrode portion. It is intended to provide a displacement inspection method.

[0007]

In order to achieve the above object, according to the first aspect of the present invention, as shown in FIGS. 2 and 3, a fixed area including an electronic component (1) mounting portion on a substrate (2) is formed. Step (101) of imaging and step (1) of setting an inspection window (DW) extending in a direction crossing the electrode portions (11, 12) of the electronic component (1) in the imaged screen (F).
02) and sequentially moving the inspection window (DW) in a direction orthogonal to the set direction, and moving each of the moving positions (DW1, DW1).
Inspection window (DW
) Calculating the number of pixels in the parentheses, and judging the displacement of the electronic component based on the both ends of the moving range of the inspection window (DW) in which the number of pixels is equal to or larger than a predetermined number (103).
To 111). It is preferable that the inspection window is set so as to extend in a direction orthogonal to the electrode section. Further, in place of the number of pixels whose luminance is equal to or more than a predetermined value, a ratio of the number of pixels to the total number of pixels is calculated,
The position shift of the electronic component may be determined based on both end positions of the moving range of the inspection window in which this ratio is equal to or more than the predetermined value.

In the first aspect of the present invention, the electrode portion of the electronic component has the highest luminance. Therefore, when an inspection window extending in a direction crossing the electrode portion is set and the inspection window is sequentially moved in a direction orthogonal to the setting direction, as long as the inspection window moves on the electrode portion, the sealing of the surface of the electronic component is performed. Regardless of the presence or absence of the pixel, the number of pixels whose luminance is equal to or more than a predetermined value in the inspection window is always equal to or more than a predetermined number. On the other hand, when the inspection window deviates from above the electrode portion, the number of pixels whose luminance is equal to or higher than the predetermined value in the inspection window is equal to or lower than the predetermined number. Therefore, both end positions of the moving range of the inspection window in which the number of pixels whose luminance is equal to or more than the predetermined value is equal to or more than the predetermined number exactly coincide with both end positions of the electrode unit. Therefore, by knowing both end positions of the moving range of the inspection window, both end positions of the electrode portion of the electronic component can be confirmed, and a position shift can be accurately determined based on this.

In the second invention, as shown in FIG. 6, a plurality of electrode portions (21, 21) of an electronic component (1) on a substrate (2) are provided.
For each of 2), a step of imaging a certain area including the electrode unit (21, 22);
22) In the screen (F1, F2) divided for each, the inspection window (Dw) extending in the direction crossing each electrode portion (21, 22) of the electronic component included in the divided screen (F1, F2). In each setting step, the inspection window (Dw) is sequentially moved in a direction orthogonal to the setting direction in each of the divided screens (F1, F2), and the luminance at each of the moving positions (Dw5, Dw6, Dw7, Dw8). The number of pixels in the inspection window (Dw) in which the number of pixels is equal to or more than the predetermined value is calculated. Determining the position shift of the electronic component based on the

In the second invention, both ends of the moving range of each inspection window in which the number of pixels is equal to or more than a predetermined number are detected for each divided screen in the same procedure as in the first invention. Therefore, since the positions of both ends of the electrode portion of the electronic component can be confirmed for each divided screen, a positional shift due to a change in the angular orientation of the electronic component can also be accurately determined.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) FIG. 1 shows the configuration of an apparatus for implementing the inspection method of the present invention. A printed circuit board 2 on which electronic components (in the present embodiment, surface-mounted chip resistors) 1 are reflow-soldered is placed on an XY table 3, and a moving motor (not shown) of the XY table 3 is positioned. Driven by the output of the circuit 8, the chip resistor 1 to be inspected is
Is positioned immediately below. The chip resistor 1 is soldered to the substrate electrodes 21 and 22 at the electrode portions 11 and 12 at both ends. The illuminating device 4 is composed of a plurality of annular illuminating rings 41, and the illuminating rings 41 are arranged such that the diameter of the illuminating ring 41 decreases and becomes substantially conical as it is positioned upward. Each illumination ring 41 is divided into a plurality in the circumferential direction. Therefore, the chip resistor 1 and its surroundings can be illuminated in desired directions and angles by appropriately lighting each of the illumination rings 41 and the divisions thereof by the illumination control circuit 7. A CCD camera 5 is provided downward above the center of the illuminating device 4 to image the illuminated chip resistor 1 and its surroundings.

A data processing device 6 is provided, which is composed of a personal computer or the like, and has a CPU, various memories including a video RAM, an I / O interface, and a monitor, a printer (not shown), etc. Is connected. An image processing unit 61 and an information processing unit 62 are realized by software, and an image obtained by the CCD camera 5 is sent to the image processing unit 61 according to a command from the information processing unit 61, and a process described later is performed. The information processing unit 62 controls the operations of the illumination control circuit 7 and the positioning circuit 8 and displays the result of the positional deviation determination in the image processing unit 61 on a monitor or prints out the result.

FIG. 2 shows an image F around the chip resistor 1 captured by the image processing section 61. The chip resistor 1 is a vertically long rectangle, and both ends of the chip resistor 1 have high brightness and a fixed width.
1,22. The brightness of the surface of the body 13 of the chip resistor 1 is lower than that of the electrodes 11 and 12, and a rectangular seal 14 indicating the resistance value is adhered to the surface, and the brightness of the seal 14 is considerably low. The printed circuit board 2 on which the chip resistor 1 is mounted has the lowest luminance, and the electrodes 21 and 22 formed on the printed circuit board 2 are covered with flux solder which is welded to the electrode portions 11 and 12, and the luminance is equal to the electrode. Part 1
It is lower than 1,12.

Hereinafter, the processing procedure in the image processing unit will be described with reference to the flowchart of FIG. In step 101 of FIG. 3, a rectangular screen F around the chip resistor 1 (this is a screen of an area predetermined by a relative positional relationship with the substrate electrodes 21 and 22) is fetched.
An inspection window DW consisting of a row of pixels extending in the vertical (L) direction orthogonal to the electrode portions 11 and 12 at both ends of the chip resistor 1 is set (step 102). This inspection window DW is set at the left end of the screen F in FIG. In step 103, the luminance level is checked for each pixel nL in the inspection window DW. FIG.
(A) shows a change in luminance level when the pixel nL is scanned in the L direction when the inspection window Dw is at the position DW1 in FIG. 2A, for example. If the brightness determination value is set slightly higher than the brightness values of the board electrodes (that is, flux solders) 21 and 22, the board electrodes 21 and 22, the electrode portions 11 and 12 of the chip resistor 1, and the body 13 of the chip resistor Only the pixel group corresponding to the electrode portions 21 and 22 (pixels in the hatched portion in FIG. 4A) has the luminance level of the pixel nL exceeding the luminance determination value on the surface, and the ratio of the pixel to the total number of pixels is as follows. In this embodiment, it exceeds 25%.

In step 104, the number of pixels whose luminance level exceeds the luminance judgment value is counted, and the number of pixels is divided by the total number of pixels to calculate the ratio M. In the subsequent step 105, it is confirmed that M> 25%, and if affirmative, "1" level is given to the inspection window Dw1 (step 106). If negative, the inspection window D
A "0" level is given to w1 (step 107). In addition,
The value of 25% can be appropriately changed depending on how much the electrode portions 21 and 22 occupy the surface of the main body 13 of the chip resistor 1. In step 108, the inspection window Dw is moved to the final position in the screen F (FIG. 2).
It is confirmed whether the inspection window Dw has moved to the right end of the screen (A), and if it has not moved, the inspection window Dw is moved by one pixel in the W direction (to the right in FIG. 2A). repeat. In the course of this movement, the inspection window Dw
Reaches the DW2 position in FIG. 2A, the pixel n in the L direction.
FIG. 4B shows a change in luminance level when L is scanned.
At this position, the luminance level of the central pixel nL to be scanned becomes very low corresponding to the seal 14, but the pixel nL
The luminance level of L exceeds the judgment value because
Only the pixel groups corresponding to 1 and 12 (pixels in the hatched portions in FIG. 2B) do not affect the determination in step 105. Therefore, the inspection window Dw is set to the electrode portions 11 and 1.
Inspection window D while moving on
The level of w is "1", otherwise it is "0".

In step 108, the inspection window D
If w has moved to the final position in the screen F, the level of the inspection window Dw is set to “0” in step 110.
Pixel position changed from “1” to “1” (c position in FIG. 2B)
And the level of the inspection window Dw is changed from "1" to "0".
Confirm the pixel position (d position in FIG. 2B) changed to
In step 111, it is determined whether or not a positional deviation in the width direction (W direction in FIG. 2A) has occurred by comparing with a previously stored reference position.

According to the present embodiment, regardless of where the seal 14 is attached on the chip resistor body 13, the level of the inspection window Dw is always set to the chip resistor body 13 regardless of this.
Of the chip resistor in the width direction can be reliably determined.

(Second Embodiment) As shown in FIG. 5A, if the chip resistor 1 is soldered at an angle between the substrate electrodes 21 and 22, the method according to the first embodiment will perform an inspection. Until the window Dw reaches the position of Dw3 in FIG. 5A, the window Dw only passes over the lower electrode portion 12, and its level remains "0". When the inspection window Dw passes through the position of Dw4 in FIG. 5A, it passes only over the upper electrode portion 11, so that the level becomes "0" again. Therefore, the pixel position at which the level of the inspection window Dw is "1" is between the position e and the position f in FIG. 5B, which is greatly different from the actual position of the chip resistor 1.

Therefore, in the present embodiment, as shown in FIG. 6B, the imaging screen is divided into two rectangular regions around the substrate electrodes 21 and 22. Then, each divided screen F1, F
The processing procedure of FIG. 3 in the first embodiment is performed for every 2 (however, the procedure of step 111 is excluded). As a result, in the split screen F1, while the inspection window Dw moves from the position of Dw5 moving on the electrode portion 11 of the chip resistor 1 to the position of Dw6,
As shown in FIG. 6A, g of the pixel position corresponding to this is
The level of the inspection window Dw becomes "1" between the position and the position h. On the other hand, in the divided screen F2, while the inspection window Dw moves from the position of Dw7 to the position of Dw8 moving on the electrode portion 12 of the chip resistor 1, as shown in FIG.
The level of the inspection window Dw becomes "1" between the i position and the j position of the corresponding pixel position. Therefore, in the present embodiment, the pixel position g, i at which the level of the inspection window Dw scanned in each divided screen F1, F2 changes from "0" to "1", and the level of the inspection window Dw is "1". It is assumed that there are both ends of the chip resistor at the positions i and h where the length in the width direction W is the longest among the pixel positions h and j that have changed from “0” to “0” with respect to the reference position stored in advance. It is determined whether or not a displacement in the width direction has occurred.

As described above, according to the present embodiment, it is possible to reliably determine the positional deviation in the width direction caused by the inclination during the soldering.

[0021]

As described above, according to the method for inspecting the displacement of an electronic component of the present invention, it is possible to reliably determine the displacement of a surface-mounted electronic component having a high-luminance electrode portion. it can.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an apparatus configuration for performing a position shift inspection method according to a first embodiment of the present invention.

FIGS. 2A and 2B are a front view of an imaging screen by a CCD camera and a diagram showing a level change of an inspection window.

FIG. 3 is a flowchart illustrating a processing procedure of the data processing device.

FIG. 4 is a diagram showing a luminance change of a pixel in an inspection window.

FIGS. 5A and 5B are a front view of a screen captured by a CCD camera and a diagram showing a change in the level of an inspection window with respect to an electronic component in which a position shift has occurred due to a change in angle and orientation in the method of the first embodiment.

FIG. 6 is a diagram showing a front view of a screen captured by a CCD camera and a change in level of an inspection window according to a second embodiment of the present invention.

7A and 7B are a front view of a screen captured by a CCD camera and a diagram showing a change in luminance of a pixel in an inspection window in a conventional method.

FIG. 8 is a front view of a screen captured by a CCD camera and a diagram showing a change in luminance of a pixel in an inspection window in a conventional method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chip resistance, 11 and 12 ... Electrode part, 2 ... Printed circuit board, 21 and 22 ... Electrode part, 3 ... XY table, 4 ... Illumination device, 5 ... CCD camera, 6 ... Data processing device, DW
1, Dw5, DW6, Dw7, Dw8 ... inspection window, F, F
1, F2 ... screen.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Adachi 100 Kanayama, Ichiriyama-cho, Kariya City, Aichi Prefecture Inside Toyota Auto Body Co., Ltd. Ground 1 Inside Toyota Central Research Laboratory

Claims (2)

[Claims] A step of imaging a predetermined area including an electronic component mounting portion on a substrate; setting an inspection window extending in a direction crossing an electrode portion of the electronic component in the imaged screen; While sequentially moving in the direction orthogonal to the setting direction, the number of pixels in the inspection window where the luminance is equal to or greater than the predetermined value at each movement position is calculated, and the number of pixels in the inspection window in which the number of pixels is equal to or greater than the predetermined number is calculated. Determining a displacement of the electronic component based on both end positions. 2. A method according to claim 1, wherein each of the plurality of electrode parts of the electronic component on the substrate includes a step of imaging a predetermined area including the electrode part, and the step of capturing an image included in the divided screen for each electrode part. Setting an inspection window extending in a direction crossing each of the electrode portions of the electronic component,
While sequentially moving the inspection window in a direction orthogonal to the setting direction in each divided screen, the number of pixels in the inspection window at which the luminance is equal to or greater than a predetermined value at each moving position is calculated, and the number of pixels in each divided screen is calculated. Determining a positional shift of the electronic component based on both end positions of the moving range of each inspection window in which the number of the electronic components exceeds a predetermined number.