JPH03131985A - Device for inspecting mounted substrate - Google Patents

Device for inspecting mounted substrate

Info

Publication number
JPH03131985A
JPH03131985A JP1270601A JP27060189A JPH03131985A JP H03131985 A JPH03131985 A JP H03131985A JP 1270601 A JP1270601 A JP 1270601A JP 27060189 A JP27060189 A JP 27060189A JP H03131985 A JPH03131985 A JP H03131985A
Authority
JP
Japan
Prior art keywords
land
data
parts
registered
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1270601A
Other languages
Japanese (ja)
Inventor
Toshio Nakagawa
中川 敏夫
Toshihiro Kawahara
河原 敏弘
Hideya Ohata
大畑 秀弥
Takashi Tamura
尚 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1270601A priority Critical patent/JPH03131985A/en
Publication of JPH03131985A publication Critical patent/JPH03131985A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To improve the efficiency of teaching work by registering the past data directly as the current formal data when a registered land shape is superposed to the real image of the land. CONSTITUTION:The shape and size of the land and a norm for the positional relation to the parts to be inspected are set up so as to be included within a recommended value provided from a parts manufacture and all the kinds of parts to be inspected are previously calculated and registered in a memory 45. A central processing part 41 moves an XY stage 11 based upon parts mounting data, sets up the land pattern to be inspected on the visual center of a TV camera 31 and sends its image to an image processing part 44. The processing part 41 retrieves a land normal shape matched with the parts based upon the parts sort data out of the parts mounting data and displays the land normal shape so as to superpose it on the real image of the land on the position regulated by the parts mounting data. When the correction of the superposition is unnecessary, the past data are directly considered as the current formal data and registered in the memory 45.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は基板に実装された部品の映像を個別にチエツク
し装着状態の良否を判定するという作業を行わせるため
の、検査装置のティーチング方法に関する。
Detailed Description of the Invention (a) Industrial Application Field The present invention is directed to teaching an inspection device to individually check images of components mounted on a board to determine whether the mounting condition is good or not. Regarding the method.

(ロ)従来の技術 電子回路を構成するにあたり、近年ますます多くの表面
実装型部品が用いられるようになっている。基板のスル
ーホールにリードを挿入するものに比べ、表面実装型部
品はランドに対し位置ずれを生じやすく、そのため半田
付工程の前に装着状態を検査して、その部品が良好な半
田接続を得られるか、どうかを調べる必要がある。この
ような目的に用いられる装置の例として、特開昭63−
90707号公報に記載されたもの、あるいは特開昭6
4−26983号公報に記載されたものを挙げることが
できる。これらの装置はいずれも、テレビカメラにより
基板の映像をとり込み、検査対象部品の画像を個別にチ
エツクして装着状態の良否判定を行っている。
(b) Conventional technology In recent years, more and more surface-mounted components have been used in constructing electronic circuits. Compared to those where the leads are inserted into through-holes on the board, surface-mounted components are more likely to be misaligned with respect to the land, so the mounting condition must be inspected before the soldering process to ensure that the component has a good solder connection. I need to find out if it is possible. As an example of a device used for this purpose, there is
What is described in Publication No. 90707 or JP-A No. 6
Examples include those described in Japanese Patent No. 4-26983. In all of these devices, images of the board are captured by a television camera, and the images of the parts to be inspected are individually checked to determine whether the mounted state is good or bad.

(ハ)発明が解決しようとする課題 装着状態の良否判定にあたっては、部品とランドの重な
り具合が重要なファクターになる。そこで、部品とラン
ドの位置及び形状寸法を個々に求め、双方のデータをつ
き合わせて重なり具合をチエツクする、という作業を行
う。そのため部品形状とランド形状を実際の基板からテ
ィーチングしておかねばならない。本発明はこのティー
チングの能率を向上させようとするものである。
(c) Problems to be Solved by the Invention In determining whether the mounted state is good or bad, the degree of overlap between the component and the land is an important factor. Therefore, the positions and shapes and dimensions of the parts and lands are determined individually, and the data of both are compared to check the degree of overlap. Therefore, it is necessary to teach the component shape and land shape from the actual board. The present invention aims to improve the efficiency of this teaching.

に)課題を解決するための手段 本発明では、基板のランドを画像として映し出し、この
ランド画像に基づきティーチングを行ってランドデータ
を登録するものにおいて、過去にランドデータの登録を
行った部品と同種の部品に組み合わせられるランドに遭
遇した時には、メモリから登録済のランド形状を自動的
に読み出し、実画像のランドに重ねて表示すると共にそ
の表示形状をそのまま正式のランドデータとして登録で
きるようにした。
2) Means for Solving the Problems In the present invention, the land of the board is projected as an image, and the land data is registered by performing teaching based on this land image. When a land that can be combined with a part is encountered, the registered land shape is automatically read out from memory and displayed overlaid on the land in the actual image, and the displayed shape can be registered as is as official land data.

(ホ)作用 登録済のランド形状をランド実画像に重ね、満足できる
程度に重なっていれば、ランド実画像からティーチング
し直す手間を省いて、過去のブタをそのまま今回に関し
ての正式データとして登録できる。従ってティーチング
作業の能率が向上する。
(e) Overlay the registered land shape on the actual land image, and if the overlap is satisfactory, you can save the trouble of re-teaching from the actual land image and register the past pig as the official data for this time. . Therefore, the efficiency of teaching work is improved.

(へ)実施例 第1図に実装基板検査装置1の全体構成を示す。10は
XYステージ部で、実装基Fi2を載置するXYステー
ジ11を備えている。20は基板2に対し所定の方向か
ら所定の光量、スペクトル構成の光を照射する照明部、
30は基板2の一定領域を視野におさめるテレビカメラ
31を備えた撮像部、40は各種処理と指令を行う処理
部である。41は処理部40の中枢をなす中央処理部で
、これにはパスライン42を介し、A/D変換部43、
画像処理部44、メモリ45、撮像コントローラ46、
XYステージコントローラ47、映像用デイスプレィ装
置48、データ用デイスプレィ装置49、キーボード5
0、プリンタ51が接続されている。撮像コントローラ
46は撮像部30及び照明部20を制御するものであり
、撮像部30においてはテレビカメラ31のズーミング
や露出調整を、照明部20においては照度調整や照明方
向の切替を行う。
(F) Embodiment FIG. 1 shows the overall configuration of a mounted board inspection apparatus 1. Reference numeral 10 denotes an XY stage section, which includes an XY stage 11 on which the mounting board Fi2 is placed. 20 is an illumination unit that irradiates the substrate 2 with light of a predetermined amount and spectrum configuration from a predetermined direction;
30 is an imaging section equipped with a television camera 31 that keeps a certain area of the substrate 2 in view, and 40 is a processing section that performs various processes and commands. 41 is a central processing unit that forms the core of the processing unit 40, which is connected to the A/D conversion unit 43 via a pass line 42;
Image processing unit 44, memory 45, imaging controller 46,
XY stage controller 47, video display device 48, data display device 49, keyboard 5
0, printer 51 is connected. The imaging controller 46 controls the imaging section 30 and the illumination section 20, and the imaging section 30 performs zooming and exposure adjustment of the television camera 31, and the illumination section 20 performs illuminance adjustment and switching of illumination direction.

上記装置1におけるランドパターンのティーチングは、
次の手順を踏んで行われる。
Land pattern teaching in the device 1 is as follows:
This is done by following the steps below:

ステップA:検査対象とする基板に用いられる部品につ
き、ランドの形状・寸法と部品に対する位置関係の規範
を、部品メーカーの推奨値におさまるよう設定する。こ
れは、部品形状を与えてやれば計算プログラムで自動的
に計算される。第2図に、部品3と、計算によって得ら
れたランド規範形状4を示す。検査対象部品全種につき
予め計算を済ませ、メモリ45に登録してお(。
Step A: For the parts used on the board to be inspected, the standards for the shape and dimensions of the land and the positional relationship with respect to the parts are set so that they fall within the values recommended by the parts manufacturer. This is automatically calculated by the calculation program if the part shape is given. FIG. 2 shows the component 3 and the land standard shape 4 obtained by calculation. Calculations are completed in advance for all types of parts to be inspected and registered in the memory 45 (.

ステップB:中央処理部41が部品装着データに基づき
XYステージ11を移動させてテレビカメラ31の視野
中央に検査対象のランドパターンを置く。この場合、部
品装着用の部品位置データをXYステージの移動データ
としてそのまま利用することができる。テレビカメラ3
1のとり込んだ映像はA/D変換部43を経て画像処理
部44へ送られ、コントラスト強調等必要な処理を施さ
れた上で映像用デイスプレィ装置48に表示される。こ
こで中央処理部41が、部品装着データ中の部品種類デ
ータに基きその部品にマツチするランド規範形状を検索
して、部品装着データにより規定される位置に、ランド
の実画像5に重ねて表示する(第3図)。6は部品を装
着すべき位置、すなわち部品中心を示す十字マークであ
る。
Step B: The central processing unit 41 moves the XY stage 11 based on the component mounting data to place the land pattern to be inspected at the center of the field of view of the television camera 31. In this case, component position data for component mounting can be used as is as movement data for the XY stage. TV camera 3
The image taken in No. 1 is sent to the image processing section 44 via the A/D conversion section 43, subjected to necessary processing such as contrast enhancement, and then displayed on the video display device 48. Here, the central processing unit 41 searches for a land reference shape that matches the component based on the component type data in the component mounting data, and displays it superimposed on the actual land image 5 at the position specified by the component mounting data. (Figure 3). 6 is a cross mark indicating the position where the component is to be mounted, that is, the center of the component.

ステップC:ランドの実画像5と規範形状4との重なり
具合をチエツクし、規範形状4がランドの実際形状に相
当するものとして無修正のまま登録して良いか、どうか
を決定する。この決定もパターンマツチングのプログラ
ムによって自動的に行うことができる。
Step C: Check the degree of overlap between the actual image 5 of the land and the reference shape 4, and decide whether or not the reference shape 4 may be registered without modification as corresponding to the actual shape of the land. This determination can also be made automatically by a pattern matching program.

ステップDニステップCで規範形状4の流用不可となっ
たランドにつき、実際形状に則してティーチングを行う
。第4図に、規範形状4と実直像5との不一致により要
修正となった例を示す。この時には第5図のように中央
処理部41により十字形のカーソル7を表示させる。キ
ーボード50の操作によりランド実画像5の対角の隅に
カーソル7を合わせて、ランドの寸法及び位置をティー
チングする。
For lands whose standard shape 4 cannot be used in step D and step C, teaching is performed in accordance with the actual shape. FIG. 4 shows an example in which correction is required due to mismatch between the standard shape 4 and the actual direct image 5. At this time, a cross-shaped cursor 7 is displayed by the central processing unit 41 as shown in FIG. By operating the keyboard 50, the cursor 7 is placed on the diagonal corner of the actual land image 5, and the dimensions and position of the land are taught.

ステップEニステップCで修正の必要なしと判定された
ランドデータ(すなわち規範データ)またはステップD
で修正を施したランドデータ(実際のランド形状からテ
ィーチングしたデータ)をキーボード50の操作により
正式のランドデータとして登録する。修正を施したラン
ドデータはメモリ45のバッファ領域52に登録される
Land data (i.e. standard data) determined as not requiring correction in Step E, Step C or Step D
The modified land data (data taught from the actual land shape) is registered as official land data by operating the keyboard 50. The modified land data is registered in the buffer area 52 of the memory 45.

以下同様の手順を繰り返し、検査対象個所のすべてにつ
きランドパターンのティチングを進めてΔ 行く。その間の処理の流れは第7図に示すとおりである
。データ用デイスプレィ装置49は、部品3またはラン
ド4に関するデータを文字・数字で時々刻々に表示する
のに用いる。
Thereafter, the same procedure is repeated, and the teaching of the land pattern is continued for all of the locations to be inspected. The flow of processing during that time is as shown in FIG. The data display device 49 is used to display data regarding the part 3 or the land 4 in characters and numbers from time to time.

さて本発明では、ステップDで修正を施したランドデー
タを後のティーチング作業に利用する。
Now, in the present invention, the land data corrected in step D is used for later teaching work.

すなわち過去にランド形状のティーチングを行いランド
データを登録した部品と同種の部品に組み合わせられる
ランドに遭遇した時には、中央処理部41がメモリ45
から登録済のランド形状を自動的に読み出し、ランドの
実画像5に重ねて表示する(第6図)。重なり具合が満
足すべきものであれば、キーボード50の操作によりメ
モリ45に登録する。計算により求めた規範形状よりも
、こちらの方が重なりの確率が高くなる。処理の流れは
第8図のとおりである。
That is, when a land that can be combined with a part of the same type as a part for which land shape teaching was performed and land data was registered in the past, the central processing unit 41 stores data in the memory 45.
The registered land shape is automatically read out from the map and displayed superimposed on the actual land image 5 (FIG. 6). If the degree of overlapping is satisfactory, it is registered in the memory 45 by operating the keyboard 50. This has a higher probability of overlap than the standard shape obtained by calculation. The flow of processing is as shown in FIG.

(ト)  発明の効果 本発明によれば、過去に登録したランドデータを再び利
用して、カーソルによるティーチングの手間を省くこと
ができるから、ティーチング作業を大幅にスピードアッ
プできる。
(g) Effects of the Invention According to the present invention, the land data registered in the past can be reused and the effort of teaching using a cursor can be omitted, so the teaching work can be greatly speeded up.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明により実装基板の検査を行う検査装置の
構成を示すブロック図、第2図乃至第6図はデイスプレ
ィ画面の模型図、第7図及び第8図は処理のフローチャ
ートである。
FIG. 1 is a block diagram showing the configuration of an inspection apparatus for inspecting a mounted board according to the present invention, FIGS. 2 to 6 are model diagrams of display screens, and FIGS. 7 and 8 are process flowcharts.

Claims (1)

【特許請求の範囲】[Claims] (1)基板のランドを画像として映し出し、このランド
画像に基づきティーチングを行ってランドデータを登録
するものにおいて、 過去にランドデータの登録を行った部品と同種の部品に
組み合わせられるランドに遭遇した時には、メモリから
登録済のランド形状を自動的に読み出し、実画像のラン
ドに重ねて表示すると共に、その表示形状をそのまま正
式のランドデータとして登録できるようにしたことを特
徴とする実装基板検査装置。
(1) In devices that display the land of the board as an image and perform teaching based on this land image to register land data, when a land that can be combined with a component of the same type as a component for which land data has been registered in the past is encountered. A mounted board inspection device is characterized in that a registered land shape is automatically read out from a memory, is displayed superimposed on a land in an actual image, and the displayed shape can be registered as is as official land data.
JP1270601A 1989-10-18 1989-10-18 Device for inspecting mounted substrate Pending JPH03131985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1270601A JPH03131985A (en) 1989-10-18 1989-10-18 Device for inspecting mounted substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1270601A JPH03131985A (en) 1989-10-18 1989-10-18 Device for inspecting mounted substrate

Publications (1)

Publication Number Publication Date
JPH03131985A true JPH03131985A (en) 1991-06-05

Family

ID=17488371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1270601A Pending JPH03131985A (en) 1989-10-18 1989-10-18 Device for inspecting mounted substrate

Country Status (1)

Country Link
JP (1) JPH03131985A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003014434A (en) * 2001-07-04 2003-01-15 Yamaha Fine Technologies Co Ltd Positioning device of work, positioning method of work, and program for realizing the positioning method
JP2007242817A (en) * 2006-03-07 2007-09-20 Matsushita Electric Ind Co Ltd Method of teaching part mounting position
JP2008091711A (en) * 2006-10-03 2008-04-17 Yamaha Motor Co Ltd Illumination controller and surface mounting equipment
JPWO2014033815A1 (en) * 2012-08-27 2016-08-08 富士機械製造株式会社 NG component display method and NG component display system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190448A (en) * 1986-02-18 1987-08-20 Omron Tateisi Electronics Co Inspecting device for parts mounted board
JPS62261047A (en) * 1986-05-07 1987-11-13 Omron Tateisi Electronics Co Printed circuit board processor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190448A (en) * 1986-02-18 1987-08-20 Omron Tateisi Electronics Co Inspecting device for parts mounted board
JPS62261047A (en) * 1986-05-07 1987-11-13 Omron Tateisi Electronics Co Printed circuit board processor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003014434A (en) * 2001-07-04 2003-01-15 Yamaha Fine Technologies Co Ltd Positioning device of work, positioning method of work, and program for realizing the positioning method
JP2007242817A (en) * 2006-03-07 2007-09-20 Matsushita Electric Ind Co Ltd Method of teaching part mounting position
JP2008091711A (en) * 2006-10-03 2008-04-17 Yamaha Motor Co Ltd Illumination controller and surface mounting equipment
JPWO2014033815A1 (en) * 2012-08-27 2016-08-08 富士機械製造株式会社 NG component display method and NG component display system

Similar Documents

Publication Publication Date Title
JP2570239B2 (en) Mounting component inspection data generation method and mounting component inspection apparatus used for implementing the method
JPH03131985A (en) Device for inspecting mounted substrate
JP2000004079A (en) Solder inspection equipment
JP3264020B2 (en) Inspection data creation method and mounted component inspection device
JPH0535850A (en) Teaching data preparation method
JP2002124799A (en) Method and device for teaching mounting position, and recording medium of mounting position teaching program
JPH03131984A (en) Teaching method for mounted substrate inspecting device
JPH0749932B2 (en) Teaching method for mounting board inspection device
JP3146644B2 (en) Teaching method of mounted part inspection data
JP3189308B2 (en) Method and apparatus for displaying soldering inspection results, method for correcting soldering failure, and soldering inspection apparatus
JPH03277949A (en) Teaching method for mounted board inspecting apparatus
KR20000056739A (en) Inspecting apparatus for pcb and teaching method and library modifying method thereof
JP3189441B2 (en) Teaching data correction method for mounted component inspection equipment
JPH03131983A (en) Device for inspecting mounted substrate
JPH11258176A (en) Apparatus and method for inspection
JPS63113681A (en) Inspection device for mounted substrate
JPH0274849A (en) Inspection region setting method in board inspection apparatus
JPH06258244A (en) Instruction method of mounting part inspection data
JPH0526815A (en) Method for teaching mounted parts inspection data
JPS63113682A (en) Inspecting device for mounted substrate
JP2576815B2 (en) Mounting board inspection equipment
JPS62277506A (en) Inspecting device for package of parts
JP3380075B2 (en) How to create mounting inspection data
JP3273378B2 (en) Characteristic parameter determination device in substrate inspection device
JPS6390707A (en) Inspection device for mounted substrate