JPH06273128A - Apparatus for inspecting soldering - Google Patents

Apparatus for inspecting soldering

Info

Publication number
JPH06273128A
JPH06273128A JP6495193A JP6495193A JPH06273128A JP H06273128 A JPH06273128 A JP H06273128A JP 6495193 A JP6495193 A JP 6495193A JP 6495193 A JP6495193 A JP 6495193A JP H06273128 A JPH06273128 A JP H06273128A
Authority
JP
Japan
Prior art keywords
soldering
ccd camera
circuit board
printed circuit
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6495193A
Other languages
Japanese (ja)
Inventor
Isao Fukushima
功 福島
Shirou Moriguchi
士良 森口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6495193A priority Critical patent/JPH06273128A/en
Publication of JPH06273128A publication Critical patent/JPH06273128A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To provide a soldering inspecting apparatus which can easily detect whether the soldering state of a part mounted to a substrate is good or bad. CONSTITUTION:This soldering inspecting apparatus consists mainly of a controller box 15, an X-Y stage 16 and an operation box 17 which are electrically connected each other. When a step switch 27 of the operation box 17 is depressed, an X-Y axis controlling part 20 drives an X-axis shaft 23 and a Y-axis shaft 25 in the corresponding axial directions. Accordingly, a CCD camera 22 is moved over a printed circuit board 26. A CCD camera controller 19 takes images from the CCD camera 22, and accordingly parts on the printed circuit board 26 are displayed on a color monitor 18. When a window switch 28 of the operation box 17 is manipulated, a detection reference image is displayed on the color monitor 18.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、主として基板に装着さ
れた部品の半田付状態を検査する半田付検査装置に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a soldering inspection device for inspecting a soldering state of a component mounted on a board.

【0002】[0002]

【従来の技術】近年、CCDカメラ等を用いて基板に装
着された部品をモニター画面等に映出する半田付検査装
置が主流となってきている。以下、従来の半田付検査装
置について図3及び図4を参照しながら説明する。
2. Description of the Related Art In recent years, a soldering inspection apparatus for displaying a component mounted on a substrate on a monitor screen or the like using a CCD camera or the like has become mainstream. Hereinafter, a conventional soldering inspection apparatus will be described with reference to FIGS. 3 and 4.

【0003】図3に示す通り、半田付検査装置は主とし
てコントローラボックス1、X−Yステージ2及び操作
ボックス3からなり、これらは互いに電気接続されてい
る。コントローラボックス1は、カラーモニター4、C
CDカメラコントローラ5、X−Y軸制御部6からな
り、X−Yステージ2は、CCDカメラ7・X軸8・プ
リント基板受け台9・Y軸10・プリント基板11から
なり、操作ボックス3は、ステップスイッチ12を配し
ている。また、X−Yステージ2の近くには部品点検良
否判定基準書(図示せず)が備えられている。
As shown in FIG. 3, the soldering inspection apparatus mainly comprises a controller box 1, an XY stage 2 and an operation box 3, which are electrically connected to each other. The controller box 1 is a color monitor 4, C
It is composed of a CD camera controller 5 and an XY axis control unit 6, the XY stage 2 is composed of a CCD camera 7, an X axis 8, a printed circuit board pedestal 9, a Y axis 10 and a printed circuit board 11, and the operation box 3 is , A step switch 12 is provided. A parts inspection pass / fail judgment standard document (not shown) is provided near the XY stage 2.

【0004】上記構成において動作を説明すると、操作
ボックス3のステップスイッチ12を押すことにより、
X−Y軸制御部6がX軸8、Y軸10をそれぞれ軸方向
に駆動させ、CCDカメラ7がプリント基板11上に移
動し、CCDカメラコントローラ5がCCDカメラ7よ
り画像を取り込み、プリント基板11に装着されている
部品14がカラーモニター4に映出される。この後部品
点検良否判定基準書に記載の部品14の半田付状態の判
定基準とカラーモニター4に映出されている部品14と
を比較しながらプリント基板11への部品14の半田付
状態の良否を判断する。
The operation of the above structure will be described. By pressing the step switch 12 of the operation box 3,
The XY axis control unit 6 drives the X axis 8 and the Y axis 10 in the axial direction, the CCD camera 7 moves onto the printed circuit board 11, the CCD camera controller 5 captures an image from the CCD camera 7, and the printed circuit board. The component 14 mounted on the component 11 is displayed on the color monitor 4. After that, the quality of the soldering state of the component 14 to the printed circuit board 11 is compared with the criteria of the soldering state of the component 14 described in the quality check document of the component inspection and the component 14 displayed on the color monitor 4. To judge.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
半田付検査装置では、部品14の半田付状態を点検する
際に部品点検良否判定基準書を参照しながら行うため同
時に対比観察を行うことができず、また上記基準書13
にある判定基準は絵で描かれているため、上記状態の良
否判断を誤まりやすいという欠点を有していた。
However, in the conventional soldering inspection apparatus, when the soldering state of the component 14 is inspected, the inspection is performed while referring to the component inspection pass / fail judgment standard document, so that the comparison observation can be performed at the same time. No, the above standard 13
Since the criterion in (1) is drawn by a picture, it has a drawback that it is easy to erroneously judge whether the above condition is good or bad.

【0006】本発明は上記従来の問題点を解決するもの
で、微妙な点検箇所でも、基板に装着された部品の半田
付状態の良否を判定し易い半田付検査装置を提供するこ
とを目的とする。
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a soldering inspection apparatus which can easily judge the quality of the soldering state of a component mounted on a board even at a delicate inspection point. To do.

【0007】[0007]

【課題を解決するための手段】上記課題を達成するため
に、本発明の半田付検査装置は、基板に半田付された部
品が表示画面に映出されている状態で前記部品の半田付
状態の良否判定基準を前記表示画面に映出可能なものと
した。
In order to achieve the above-mentioned object, the soldering inspection apparatus of the present invention is a soldering inspection apparatus of the present invention, in which a component soldered to a substrate is displayed on a display screen. The quality criterion of No. 1 was set so that it could be displayed on the display screen.

【0008】[0008]

【作用】この構成により、基板に半田付された部品及び
部品の半田付状態の良否判定基準が同時にかつ同一の表
示画面に映出されるものとなる。
With this configuration, the components soldered to the substrate and the quality determination criteria of the soldering state of the components are displayed simultaneously and on the same display screen.

【0009】[0009]

【実施例】以下、本発明の一実施例について図1及び図
2を参照しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

【0010】半田付検査装置は、主としてコントローラ
ボックス15、X−Yステージ16及び操作ボックス1
7からなり、これらは互いに電気接続されている。
The soldering inspection apparatus mainly comprises a controller box 15, an XY stage 16 and an operation box 1.
7, which are electrically connected to each other.

【0011】コントローラボックス15は、カラーモニ
ター18、CCDカメラコントローラ19、X−Y軸制
御部20、ウィンドウ機能を有するモニター画面制御部
21からなり、X−Yステージ16はCCDカメラ2
2、X軸23、プリント基板受け台24、Y軸25、プ
リント基板26からなり、操作ボックス17は、ステッ
プスイッチ27、ウィンドウスイッチ28を配してい
る。また図2に示すように、カラーモニター18にはモ
ニター画面29、判定基準ウィンドウ30が配され、モ
ニター画面29はCCDカメラ22が映しているもの
を、判定基準ウィンドウ30は部品の半田付状態の判定
基準となる判定基準画像31をそれぞれ映出する機能を
有している。
The controller box 15 comprises a color monitor 18, a CCD camera controller 19, an XY axis control section 20, and a monitor screen control section 21 having a window function, and the XY stage 16 is a CCD camera 2.
2, an X-axis 23, a printed circuit board pedestal 24, a Y-axis 25, and a printed circuit board 26. The operation box 17 has a step switch 27 and a window switch 28. As shown in FIG. 2, a monitor screen 29 and a judgment reference window 30 are arranged on the color monitor 18. The monitor screen 29 shows what the CCD camera 22 shows, and the judgment reference window 30 shows the soldering state of the parts. It has a function of displaying each of the determination reference images 31 which are the determination reference.

【0012】上記構成において動作を説明すると、操作
ボックス17のステップスイッチ27を押すことによ
り、X−Y軸制御部20がX軸23、Y軸25をそれぞ
れ軸方向に駆動させ、CCDカメラ22がプリント基板
26上に移動し、CCDカメラコントローラ19がCC
Dカメラ22より画像を取り組み、プリント基板26に
装着されている部品32がモニター画面29に映出され
る。
To explain the operation in the above configuration, by pressing the step switch 27 of the operation box 17, the XY axis control section 20 drives the X axis 23 and the Y axis 25 in the axial direction, and the CCD camera 22 operates. Moved onto the printed circuit board 26, the CCD camera controller 19 moved to CC
An image is taken from the D camera 22, and the component 32 mounted on the printed circuit board 26 is displayed on the monitor screen 29.

【0013】さらにこの状態で操作ボックス17のウィ
ンドウスイッチ28を押すと、判定基準ウィンドウ30
には判定基準画像31が映出され、これによりプリント
基板26に半田付されている状態の部品32及び判定基
準画像31が共にモニター画面29に映し出されること
になる。
Further, when the window switch 28 of the operation box 17 is pushed in this state, the judgment reference window 30
The judgment reference image 31 is displayed on the screen, so that both the component 32 soldered to the printed circuit board 26 and the judgment reference image 31 are displayed on the monitor screen 29.

【0014】このように本発明の一実施例によれば、プ
リント基板26に半田付されている状態の部品32及び
判定基準画像31共にモニター画面29に映し出すこと
ができるので、両者の対比が容易に行え、これにより、
検査部品の半田付状態の良否判定が容易に行えるものと
なる。
As described above, according to the embodiment of the present invention, both the component 32 soldered to the printed circuit board 26 and the judgment reference image 31 can be displayed on the monitor screen 29, so that they can be easily compared. You can do this,
The quality of the soldered state of the inspection component can be easily determined.

【0015】[0015]

【発明の効果】以上の説明から明らかなように、本発明
の半田付検査装置は、半田付状態の検査をしようとする
部品を表示画面に映出している状態で、部品の半田付状
態の良否判定基準となる画像をこの表示画面に映出可能
としたので、上記部品及び上記画像を共に同一の表示画
面に映出することができ、これにより上記部品と上記画
像の対比が容易に行え、その結果部品の半田付状態の良
否判定が容易に行えるものとなる。
As is apparent from the above description, the soldering inspection apparatus of the present invention shows the soldering state of the component while the component to be inspected for the soldering state is displayed on the display screen. Since it is possible to display the image that is the quality criterion on this display screen, it is possible to display both the parts and the image on the same display screen, which makes it easy to compare the parts and the images. As a result, the quality of the soldering state of the component can be easily determined.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における半田付検査装置の斜
視図
FIG. 1 is a perspective view of a soldering inspection apparatus according to an embodiment of the present invention.

【図2】同装置の部分正面図FIG. 2 is a partial front view of the device.

【図3】従来の半田付検査装置の斜視図FIG. 3 is a perspective view of a conventional soldering inspection device.

【図4】同装置の部分正面図FIG. 4 is a partial front view of the device.

【符号の説明】[Explanation of symbols]

15 コントローラボックス 17 操作ボックス 18 カラーモニター 21 モニター画面制御部 22 CCDカメラ 26 プリント基板 27 ステップスイッチ 28 ウィンドウスイッチ 29 モニター画面 30 判定基準ウィンドウ 31 判定基準画像 32 部品 15 Controller Box 17 Operation Box 18 Color Monitor 21 Monitor Screen Control Unit 22 CCD Camera 26 Printed Circuit Board 27 Step Switch 28 Window Switch 29 Monitor Screen 30 Judgment Reference Window 31 Judgment Reference Image 32 Parts

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 表示画面を有する筐体と、基板に半田付
された部品を前記表示画面に映出可能な第1の映出手段
と、前記部品が前記表示画面に映出されている状態で前
記部品の半田付状態の良否判定基準となる画像を前記表
示画面に映出可能な第2の映出手段とを備えた半田付検
査装置。
1. A housing having a display screen, a first projecting means capable of projecting a component soldered to a substrate on the display screen, and a state in which the component is projected on the display screen. 2. A soldering inspection apparatus comprising: a second projecting means capable of projecting an image, which is a standard for determining the quality of soldering of the component, on the display screen.
JP6495193A 1993-03-24 1993-03-24 Apparatus for inspecting soldering Pending JPH06273128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6495193A JPH06273128A (en) 1993-03-24 1993-03-24 Apparatus for inspecting soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6495193A JPH06273128A (en) 1993-03-24 1993-03-24 Apparatus for inspecting soldering

Publications (1)

Publication Number Publication Date
JPH06273128A true JPH06273128A (en) 1994-09-30

Family

ID=13272859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6495193A Pending JPH06273128A (en) 1993-03-24 1993-03-24 Apparatus for inspecting soldering

Country Status (1)

Country Link
JP (1) JPH06273128A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503919A (en) * 2000-05-24 2004-02-05 アーテーゲー、テスト、ジステムス、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー、コマンディット、ゲゼルシャフト Method for inspecting a circuit board in a predetermined area of the circuit board and apparatus for performing the method
KR100424442B1 (en) * 2001-11-28 2004-03-24 (주) 인텍플러스 Solder paste inspection system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503919A (en) * 2000-05-24 2004-02-05 アーテーゲー、テスト、ジステムス、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー、コマンディット、ゲゼルシャフト Method for inspecting a circuit board in a predetermined area of the circuit board and apparatus for performing the method
KR100424442B1 (en) * 2001-11-28 2004-03-24 (주) 인텍플러스 Solder paste inspection system

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