JPH10163163A - Holding mechanism for substrate in rotating treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding mechanism which can prevent various treatment liquids from gathering near the outer circumferential part of a substrate in a rotating treatment apparatus which turns the substrate so as to be treated. SOLUTION: In a rotating treatment apparatus, holding implements 30 which can hold the outer circumferential part of a substrate W at the upper part of a rotary table 21 are installed in at least three places, and the substrate W is turned together with the rotary table 21 so as to be treated in a state that the substrate is held by the holding implements 30. In this case, wire materials 35 which are used to hold the outer circumferential part of the substrate W are arranged at the holding implements 30. By a support mechanism, the outer circumferential part of the substrate W is held by the wire materials 35, contact areas of the holding implements 30 with the substrate W are reduced to a minimum, and it is possible to prevent various treatment liquids from gathering at the outer circumferential part of the substrate W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate holding mechanism in a rotary processing apparatus for performing processing such as cleaning and drying by rotating a substrate such as a semiconductor wafer.

[0002]

2. Description of the Related Art Generally, in the process of manufacturing semiconductor devices, photolithography is used to form circuits, electrode patterns, and the like on a substrate such as a semiconductor wafer. In this photolithography, cleaning and drying of the substrate, formation of a resist film on the substrate, exposure of the resist film,
A series of processing such as development is performed. As a device that performs these series of processes, a rotation processing device that performs various processes by rotating a substrate is known.

In this rotary processing apparatus, a mechanism for firmly holding the substrate is required so that the driving force of a motor or the like can be reliably transmitted to the substrate. A so-called vacuum chuck and a mechanical chuck are used as a substrate holding mechanism in the rotary processing apparatus. The vacuum chuck is a mechanism in which the substrate is directly held on the upper surface of a rotary table (spin chuck) and rotated by vacuum-sucking the center of the lower surface of the substrate. The mechanical chuck is a mechanism that supports and rotates the substrate while floating on a rotary table by holding the outer peripheral surface of the substrate from outside using a holder such as a claw or a ring.

In a rotary processing apparatus, it may be necessary to simultaneously perform processes such as cleaning and drying on the upper and lower surfaces of the substrate. In such a case, the vacuum chuck vacuum-adsorbs the center of the lower surface of the substrate.
There is an inconvenience that the adsorption portion cannot be processed.
Therefore, in a rotary processing apparatus that simultaneously performs processing on the upper and lower surfaces of a substrate, various processes are performed by mainly employing a mechanical chuck and holding and rotating the outer peripheral portion of the substrate.

Here, as a device for drying a substrate employing a mechanical chuck, for example, Japanese Utility Model Publication No.
No. 1 “Single wafer spin dryer” is known.
That is, the substrate holding mechanism in the drying device is configured to hold the substrate by holding a plurality of locations on the outer peripheral surface of the substrate above and below the rotary table with the guide and the holder from above and below.

[0006]

However, as disclosed in Japanese Utility Model Publication No. 7-49791, the mechanical chuck in the conventional rotation processing apparatus sandwiches the upper and lower surfaces of the substrate in the vicinity of the outer peripheral portion of the substrate. Most of them have a mechanism. For this reason, there is a problem that the cleaning liquid and other various processing liquids carried to the outer peripheral portion of the substrate by the centrifugal force due to the rotation easily accumulate near the outer peripheral portion of the substrate in contact with the holder. The processing liquid accumulated in the vicinity of the outer periphery as described above causes contamination and hinders improvement in throughput.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a holding mechanism capable of preventing various processing liquids from being stored near the outer peripheral portion of a substrate in a rotary processing apparatus for rotating and processing a substrate as described above.

[0008]

According to the first aspect of the present invention, at least three or more holding members capable of holding the outer peripheral surface of a substrate above a rotary table are provided, and the substrate is held by the holding members. In a rotary processing apparatus configured to rotate the substrate together with the rotary table to perform processing, a wire for holding an outer peripheral surface of the substrate is disposed on the holder.

According to this support mechanism, when supporting the substrate above the rotary table, the outer peripheral surface of the substrate is held by the wire, so that the contact area between the holder and the substrate is minimized, and the outer peripheral surface of the substrate is reduced. It is possible to prevent various processing liquids from accumulating on the substrate. As a wire for holding the outer peripheral surface of the substrate, in consideration of corrosion to various processing liquids and the reliability of holding the substrate, a wire having chemical resistance and low elongation is preferable. For example, an aromatic material such as Kevlar (registered trademark) is used. Fibers of group III polyamide are preferred.

According to a second aspect of the present invention, in the rotary processing apparatus of the first aspect, the holder is swingably supported with respect to the rotary table, and the outer peripheral surface of the substrate is held above the holder. When the wire is not rotating, the weight hangs down by its own weight, and the wire on the upper part of the holder moves outward to move the outer peripheral surface of the substrate. When the substrate is opened and rotated, the weight moves outward due to centrifugal force, and the wire above the holder moves inward to contact the outer peripheral surface of the substrate. It is characterized in that it is configured to hold a substrate.

According to this support mechanism, when the substrate is carried in and out of the rotary processing apparatus, the rotation of the rotary table is stopped. Therefore, the weight hangs down by its own weight, and the wire above the holder is removed. It moves outward and the substrate is in an open state. On the other hand, when processing is performed by rotating the substrate,
The weight moves outward due to the centrifugal force, and the wire above the holder moves inward to hold the substrate.

The support mechanism according to the second aspect swings integrally with the holder and rises when the rotation is not performed, and rises above the rotary table as described in the third aspect. It is preferable to provide a support pin that supports the substrate in a raised state and that descends during the rotation. Then, when loading / unloading the substrate to / from the rotation processing device,
The substrate can be supported above the rotary table in a state of being lifted by the raised support pins. When the substrate is rotated to perform the processing, the support pins are lowered, so that it does not hinder the processing.

According to a fourth aspect of the present invention, in the rotary processing apparatus of the first aspect, the holder is swingably supported with respect to the rotary table, and the outer peripheral surface of the substrate is held on the holder. Means for urging the swing of the holder so that the wire is brought into contact with the outer peripheral surface of the substrate; and holding the holder against the urging of the urging means. Opening means for swinging the wire rod away from the outer peripheral surface of the substrate is provided.

According to this support mechanism, when the substrate is carried in and out of the rotary processing apparatus, the holding member is swung by the opening means to separate the wire from the outer peripheral surface of the substrate, thereby opening the substrate. It can be in a state that has been. on the other hand,
When processing is performed by rotating the substrate, the holder can be swung by the urging of the urging means to bring the wire into contact with the outer peripheral surface of the substrate, so that the substrate can be held. it can.

In the supporting mechanism according to the fourth aspect, as described in the fifth aspect, when the wire is swung integrally with the holder and the wire is separated from the outer peripheral surface of the substrate by the opening means. Is preferably provided with a support pin which rises to support the substrate in a state of being lifted above the rotary table, and which is lowered when the wire is in contact with the outer peripheral surface of the substrate by the urging means. . Then, as described above, when loading and unloading the substrate to and from the rotary processing apparatus, the substrate can be lifted above the rotary table by the raised support pins, and the substrate can be rotated and processed. When carrying out, since the support pins are lowered, they do not hinder the processing.

Further, in the support mechanism according to the fourth aspect,
The biasing means is, for example, a weight disposed at a lower portion of the holder as described in claim 6, and the lower part of the holder hangs down by its own weight, thereby forming a wire on the upper portion of the holder. Move inward to abut the outer peripheral surface of the substrate to hold the substrate. Also, for example, the urging means is a spring, and the elasticity of the spring causes the wire above the holder to move inward and abut on the outer peripheral surface of the substrate to hold the substrate. Can be configured. Further, the opening means, for example, as a pusher, pushes with the pusher to swing the holder, thereby separating the wire from the outer peripheral surface of the substrate and opening the substrate. It can be configured as follows.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in which a cleaning liquid is supplied while rotating a substrate to clean the upper and lower surfaces of the substrate, and the substrate is dried by rotation. This will be described based on the washing and drying apparatus.

FIG. 1 is a perspective view showing an entire processing system 1 including a cleaning / drying apparatus according to an embodiment of the present invention. In the center of the processing system 1, two main transfer arms 2 and 3 are arranged in series with a relay unit 4 interposed therebetween. In the illustrated example, a carrier stage 5 for mounting a carrier C for accommodating and transporting a plurality of substrates W such as semiconductor wafers, for example, is disposed in front of the processing system 1. A carry-in / out mechanism 6 is provided between the arms 2. Further, an exposure apparatus 8 connected via an interface 7 is disposed behind the processing system 1.

On both sides of the main transfer arm 2, two washing / drying apparatuses 10 according to the embodiment of the present invention are arranged in parallel on one side, and an adhesion apparatus 11 and a cooling apparatus 12 are arranged next to each other. Have been. Also, two coating devices 13 are arranged on the other side. Main transfer arm 3
On one side, a plurality of heating devices 15 are arranged on one side, and two developing devices 16 are arranged on the other side.

In the processing system 1,
The substrates W taken out one by one from the carrier C placed on the carrier stage 5 by the loading / unloading mechanism 6 are separated by the main transfer arms 2 and 3 into the respective devices 8, 10, 11, 12, and
By transporting the substrates 13, 15, and 16 in an appropriate order, the substrate W is processed according to photolithography.

Next, the configuration of the cleaning / drying apparatus 10 according to the embodiment of the present invention will be described with reference to FIGS. FIG.
2 is a plan view of a main part of the cleaning / drying apparatus 10 according to the embodiment of the present invention, and FIG. 3 is a sectional view taken along the line AA in FIG.

As shown, the washing and drying apparatus 10 comprises
A cylindrical cup 20 having an open top surface and a closed bottom surface is provided. Through the opening on the upper surface of the cup 20, the substrate W carried into the cleaning / drying apparatus 10 by the above-mentioned main transfer arm 2 is stored inside the cup 20.

Inside the cup 20, a turntable 21 is provided.
Is arranged. A rotating shaft 23 is connected below a base 22 supporting the lower surface of the rotating table 21. The rotary table 21 is configured to be able to rotate by transmitting rotational power to the rotary shaft 23 via a belt 25 that rotates by the operation of the motor 24.

A cleaning liquid supply nozzle 26 is provided so as to pass through the centers of the rotary table 21, the base 22, and the rotary shaft 23. As described above, the cleaning liquid discharged upward from the supply nozzle 26 can be supplied to the lower surface of the substrate W stored in the cup 20.

Around the rotary table 21, there is provided at least a holder 30 capable of holding the substrate W carried into the cup 2010 by the above-mentioned main transfer arm 2 while floating above the rotary table 21. It is provided in three or more places. In the illustrated example, holders 30 are arranged at a total of four locations around the rotary table 21 at 90 ° intervals.

The holder 30 is swingably supported by being attached to the rotary table 21 via a shaft 31. A weight 32 is arranged at the lower end of the holder 30. As shown in FIG. 3, when the rotary table 21 is not rotating, the weight of the weight 32 causes the lower part of the holder 31 to be lower than the shaft 31. As shown in FIG. 3, it is in a posture that hangs vertically downward.

On the other hand, the upper part of the holder 30 above the shaft 31
The holder 30 has a shape that is bent below the shaft 31. At the upper end of the holder 30, a holding member 33 having a U-shape with an opening space formed inward is attached, and the opening space of the holding member 33 is rotatable as described later. When the table 21 is rotating, a wire 35 for holding the outer peripheral surface of the substrate W is arranged in a vertically tensioned state. The wire 35 can be made of, for example, an aromatic polyamide fiber such as Kevlar (registered trademark).

As mentioned above, the holder 3
Since the upper and lower portions of 0 are bent, as shown in FIG. 3, when the turntable 21 is not rotating,
Due to the weight of the weight 32, the lower part of the holder 30 hangs vertically downward, and the upper part of the holder 30 is inclined outward, whereby the wire 35 provided on the holding member 33 is provided.
Are moved outward and away from the outer peripheral surface of the substrate W.

A support pin 36 swinging integrally with the holder 30 is provided between the shaft 31 and the holding member 33 above the holder 30. In the illustrated example, the support pin 36 is mounted vertically to the upper part of the holder 30, and when the upper part of the holder 30 is inclined outward as described above, as shown in FIG. The pin 36 is in a posture of ascending diagonally upward. Then, as will be described later, when the rotating table 21 is not rotating, the lower surface of the substrate W carried into the cup 20 by the main transfer arm 2 is supported by the tips of the support pins 36 so that the rotating table 21 is rotated. The substrate W can be supported while being lifted upward.

In addition, above the cup 20, a cup 2
A supply nozzle 37 for supplying a cleaning liquid to the upper surface of the substrate W stored in the chamber 0 is provided. Although a detailed description is omitted, when the substrate W is loaded into the cup 20 by the main transfer arm 2 and when the substrate W is unloaded from the cup 20, the supply nozzle 37 is at a position where it does not hinder the loading and unloading. It is configured to be evacuable.

Next, the operation of the washing and drying apparatus 10 will be described. First, in a series of processing steps in the processing system 1 described above, the substrate W is carried into the cleaning / drying apparatus 10 by the operation of the main transfer arm 2. At this time, in the cleaning / drying apparatus 10, the rotating table 21 is not yet rotated, so that the lower part of the holder 30 hangs vertically downward by the weight of the weight 32 as shown in FIG. The wire 35 provided on the holding member 33 at the upper end of the holder 30 has moved outward. Further, as the upper part of the holder 30 moves outward, as shown in FIG. 3, the support pin 36 is in a posture in which the support pin 36 rises obliquely upward. The lower surface of the substrate W carried into the cup 20 by the main transfer arm 2 is supported by the tips of the raised support pins 36, so that the substrate W is supported above the turntable 21 while being lifted. When the substrate W is loaded into the cup 20, the supply nozzle 37 provided above the cup 20 is retracted to a position where the supply nozzle 37 does not hinder the loading of the substrate W.

When the main transfer arm 2 which has finished loading the substrate W into the cup 20 exits from the washing and drying apparatus 10, the operation of the motor 24 starts and the belt 25
The rotational power is transmitted to the rotary shaft 23 via the rotary shaft 23, and the rotary table 21 starts rotating. Then, as shown in FIG.
When the centrifugal force F acts on the weight 32 at the lower end of the holder 30 provided around the rotary table 21, the weight 32 moves outward and is held as shown by the one-dot chain line 32 'in FIG. The tool 30 as a whole swings about the axis 31 and assumes the posture shown by the dashed line 30 '. Thereby, the holding member 3
3 and the wire 35 move inward to the positions indicated by the dashed lines 33 'and 35' in FIG.
5 'comes into contact with the outer peripheral surface of the substrate W, and the substrate W is held from the periphery. On the other hand, as the holder 30 swings, the support pin 36 is lowered as shown by the one-dot chain line 36 'in FIG.

In this way, while the rotary table 21 is rotating, the substrate W is held from the surroundings by the wire 35, and the rotational power is transmitted through the holder 30, and
The substrate W rotates integrally with the turntable 21. Then, during this rotation, the cleaning liquid is discharged from the supply nozzle 37 moved above the cup 20, and the cleaning liquid is supplied to the upper surface of the substrate W. On the other hand, the cleaning liquid is supplied upward to the lower surface of the substrate W from a supply nozzle 26 disposed at the center of the turntable 21. Thus,
By supplying the cleaning liquid to the upper and lower surfaces of the substrate W while rotating the substrate W, the cleaning liquid is spread over the entire upper and lower surfaces of the substrate W by centrifugal force for cleaning.

After the entire upper and lower surfaces of the substrate W are sufficiently cleaned, the supply of the cleaning liquid from the supply nozzles 37 and 26 is stopped. Then, the operation of the motor 24 is further continued to further rotate the substrate W integrally held above the turntable 21. Thus, the cleaning liquid adhering to the upper and lower surfaces of the substrate W is shaken around by the centrifugal force, and the substrate W is dried. In the drying process of the substrate W, the operating speed of the motor 24 may be increased to increase the centrifugal force, so that the washing liquid can be more reliably shaken off.

After the substrate W is dried, the operation of the motor 24 is stopped, and the rotation of the turntable 21 is also stopped. Then, due to the weight of the weight 32, the holder 30 swings to a position shown by a solid line in FIG. As a result, the wire 35 provided on the holding member 33 separates from the outer peripheral surface of the substrate W and opens the substrate W.
Further, with the swing of the holder 30, the support pins 36 are in a posture of rising obliquely upward, and support the lower surface of the substrate W.

The substrate W having been subjected to the cleaning and drying processes is then carried out of the cleaning / drying device 10 by the main transfer arm 2 and a series of processing steps in the processing system 1 are continuously performed on the substrate W. Will be

As described above, according to the cleaning / drying apparatus 10, when the cleaning and drying processes are performed, the periphery of the substrate W is held by the wire 35, so that the contact area between the holder 30 and the substrate W is reduced. This minimizes the accumulation of the cleaning liquid on the outer peripheral surface of the substrate W. Therefore, the occurrence of contamination around the substrate W can be prevented, and the throughput can be improved. When the rotary table 21 is not rotating, the support pins 36 are raised to support the lower surface of the substrate W, so that the substrate W can be easily loaded and unloaded into the cup 20.

Next, the structure of a cleaning / drying apparatus 40 according to another embodiment of the present invention will be described with reference to FIGS.
FIG. 5 is a sectional view of a main part of a cleaning / drying apparatus 40 according to another embodiment of the present invention.

The cleaning and drying apparatus 40 has a holder 41 having a different configuration from the holder 30 of the cleaning and drying apparatus 10 described above.
The cleaning and drying apparatus 1 described above is provided except that
It has a configuration substantially similar to that of 0. Therefore, in the cleaning and drying apparatus 40 shown in FIGS. 5 and 6, the same components as those in the cleaning and drying apparatus 10 described above with reference to FIGS.

In the washing / drying device 40, similarly,
Holders 41 are arranged at four positions around the rotary table 21 at 90 ° intervals. Each of the holders 41 is swingably supported by being attached to the rotary table 21 via a shaft 42. At the upper end of the holder 41, a U-shaped holding member 43 having an opening space formed inward is attached, and the opening space of the holding member 43 is provided with the outer peripheral surface of the substrate W. A wire 45 for holding is arranged in a vertically tensioned state. This wire 45 is also made of, for example, Kevlar (registered trademark).
And the like.

At the lower end of the holder 41, a weight 46 is arranged. As shown in FIG.
Due to its own weight of 6, the lower part of the shaft 42 of the holder 41 is in a vertically hanging downward posture. However, in the washing / drying device 40, since the upper part of the shaft 42 of the holder 41 and the lower part of the shaft 42 of the holder 41 are formed in a linear shape, the holding member 41 is thus self-weighted by the weight 46. When the lower part hangs vertically downward, the holding member 43 and the wire 45 move inward, and the wire 45 contacts the outer peripheral surface of the substrate W, as shown in FIG. It is in a state.

On the inner wall of the cup 20, a pusher 47 is disposed as an opening means for pressing the lower part of the holder 41 inward to swing the holder 41. The pusher 47 is, for example, an air cylinder. By extending a rod 48 of the pusher 47, the lower part of the holder 41, which normally hangs vertically downward by the weight of the weight 46, can be pressed toward the inside of the cup 20. It is configured to be able to.

In addition, in the washing and drying apparatus 40, similarly, the shaft 42 and the holding member 33 are provided above the holding tool 41.
A support pin 49 swinging integrally with the holder 41
Is provided. In the illustrated example, the support pins 49
Is vertically attached to the upper part of the holder 41, and as will be described later, when the substrate W is carried in and out of the cup 20, the support pins 49 are tilted upward with the swing of the holder 41. And the lower surface of the substrate W is supported by the tips of the support pins 36 so that the substrate W
Can be supported in a raised state.

Next, the operation of the washing and drying apparatus 40 will be described. As described above, in a series of processing steps in the processing system 1, the substrate W is carried into the cleaning / drying device 40 by the operation of the main transfer arm 2. At this time, in the cleaning / drying device 40, the turntable 21 has not yet rotated. When the substrate W is carried into the cup 20 by the main transfer arm 2, the pusher 47 provided on the inner wall of the cup 20 is operated to extend, so that the rod 48 is moved to the dashed line 48 ′ in FIG. It is in the state shown by. As a result, the lower part of the holder 41 is pressed inward, and the holder 41 is brought into the state shown by the dashed line 41 ′ in FIG. 6, and the wire 45 provided on the holding member 43 at the upper end of the holder 41. Is in a state 45 'moved outward. In addition, as the holding tool 41 is swung by the pusher 47, the support pin 49 is in a posture ascending obliquely upward as shown by a dashed line 49 'in FIG.

In this state, the substrate W carried into the cup 20 is supported by the tips of the support pins 49, and is supported in a state of being lifted above the turntable 21. As described above, when the substrate W is loaded into the cup 20, the supply nozzle 37 is retracted to a position where it does not hinder the loading of the substrate W.

When the transfer of the substrate W into the cup 20 is completed, the pusher 47 operates in a shortened manner. As a result, the lower part of the holding tool 41 is vertically suspended downward by the weight of the weight 46, and the holding member 43 and the wire 45 move inward, and as shown by the solid line in FIG. The substrate W comes into contact with the outer peripheral surface and is held from the periphery. On the other hand, with the swing of the holder 41, the support pin 49 is lowered as shown by the solid line in FIG.

After the main transfer arm 2 has exited from the washing and drying apparatus 10, the operation of the motor 24 starts, and
The turntable 21 starts rotating. In this way, while the rotary table 21 is rotating, the substrate W rotates integrally with the rotary table 21 while maintaining the state where the substrate W is held from the surroundings by the wire 45. During the rotation, the cleaning liquid is supplied from the supply nozzle 37 and the supply nozzle 26 to clean the upper and lower surfaces of the substrate W. After the cleaning is completed, the operation of the motor 24 is further continued to dry the substrate W. After this drying, the operation of the motor 24 stops,
The rotation of the turntable 21 also stops.

When the rotation of the rotary table 21 is stopped, the pusher 4 provided on the inner wall of the cup 20 is again pressed.
7 is extended, and the holder 41 is in the state shown by the dashed line 41 'in FIG. As a result, the wire 45 provided on the holding member 43 at the upper end of the holding tool 41 is moved outward 45 ′, and the substrate W is released. The substrate W released in this manner is in a state of being supported by the tips of the support pins 49 that have risen with the swing of the holder 41.

The substrate W having been subjected to the cleaning and drying processes is thereafter carried out of the cleaning / drying device 40 by the main transfer arm 2 and a series of processing steps in the processing system 1 are continuously performed on the substrate W. Will be

As described above, the cleaning and drying apparatus 40 also performs the cleaning and drying processes in the same manner.
Since the contact area between the substrate 1 and the substrate W is minimized, the accumulation of the cleaning liquid on the outer peripheral surface of the substrate W can be prevented, the generation of contamination around the substrate W can be prevented, and the throughput can be improved.

As described above, the preferred embodiments of the present invention have been described by way of examples. However, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, in the cleaning / drying apparatus 40 described with reference to FIGS. 5 and 6, an example in which the weight 46 is attached as the urging means for urging the swing of the holder 41 has been described, but as shown in FIG. The swing of 41 may be urged by using a spring 50. In FIG. 7, the spring 50 presses the lower part of the holder 41 outward, and the elasticity of the spring 50 causes the wire 4 on the upper part of the holder 41 to move.
5 is configured to move inward and contact the outer peripheral surface of the substrate W to hold the substrate W. Even with such a configuration, the substrate W can be held by the wire 45 from the surroundings while the turntable 21 is rotating, similarly to the cleaning and drying apparatus 40 described with reference to FIGS. When the substrate W is loaded and unloaded, the pusher 4
7, the lower part of the holding tool 41 is pressed inward against the spring 50, so that the holding tool 41 is moved in the dashed line 4 in FIG.
The wire 45 is moved outward as shown by 1 ',
The substrate W can be opened.

In each of the above embodiments, the apparatus for cleaning and drying the substrate W has been described. However, various processing is performed by rotating the substrate, such as a scrubber processing apparatus, a development processing apparatus, and a resist coating apparatus. The present invention can be similarly applied to other devices. Also, the semiconductor wafer has been described as an example of the substrate, but the present invention is not limited to this, and the present invention can be similarly applied to an apparatus for processing a printed substrate, a glass mask, an LCD substrate, and the like.

[0053]

According to the present invention, by minimizing the contact area between the holder and the substrate, it is possible to prevent the accumulation of various processing liquids on the outer peripheral surface of the substrate and to prevent the generation of contamination around the substrate. Thus, the throughput can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire processing system including a cleaning / drying apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a main part of the cleaning / drying apparatus according to the embodiment of the present invention.

FIG. 3 is a sectional view taken along the line AA in FIG. 2;

FIG. 4 is an operation explanatory diagram of the cleaning / drying apparatus according to the embodiment of the present invention.

FIG. 5 is a sectional view of a main part of a cleaning / drying apparatus according to another embodiment of the present invention.

FIG. 6 is an operation explanatory view of a cleaning / drying apparatus according to another embodiment of the present invention.

FIG. 7 is an operation explanatory view of a cleaning / drying apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 W substrate 10 cleaning / drying apparatus 21 rotating table 30 holder 32 weight 35 wire rod 36 support pin

Claims (8)

[Claims] A holder capable of holding an outer peripheral surface of a substrate above a rotary table is provided at at least three places.
In a rotary processing apparatus configured to rotate and process a substrate together with a rotary table while being held by the holder, a wire for holding an outer peripheral surface of the substrate is disposed on the holder. A substrate support mechanism in a rotary processing device. 2. A holder for swingably supporting a rotary table, a wire for holding an outer peripheral surface of a substrate disposed above the holder, and a weight disposed below the holder. When the rotary table is not rotating, the weight hangs down by its own weight, and the wire above the holder moves outward and separates from the outer peripheral surface of the substrate. When the substrate is opened and the rotary table is rotating, the weight moves outward due to centrifugal force, and the wire above the holder moves inward to abut the outer peripheral surface of the substrate. 2. The substrate holding mechanism in the rotary processing apparatus according to claim 1, wherein the substrate is held. 3. The apparatus swings integrally with the holder, rises when the rotation is not performed, supports the substrate in a state of being lifted above the turntable, and lowers when the rotation is performed. 3. The substrate holding mechanism in the rotation processing apparatus according to claim 2, further comprising: 4. A holder for swingably supporting the rotary table with respect to a rotary table, and a wire for holding an outer peripheral surface of the substrate is disposed above the holder, and the wire is mounted on the outer peripheral surface of the substrate. Urging means for urging the swing of the holding tool so as to abut the holding member, and opening means for swinging the holding tool against the urging of the urging means to separate the wire from the outer peripheral surface of the substrate. The substrate holding mechanism in the rotary processing apparatus according to claim 1, further comprising: 5. When the wire is separated from the outer peripheral surface of the substrate by the opening means, the substrate is swung integrally with the holder, and the wire is raised to support the substrate raised above the turntable. 5. A support pin which is lowered when the wire is in contact with the outer peripheral surface of the substrate by the urging means.
A substrate holding mechanism in the rotary processing apparatus according to (1). 6. The urging means is a weight disposed at a lower part of the holder, and the lower part of the holder hangs down by its own weight, whereby the wire above the holder moves inward. The substrate holding mechanism in the rotary processing apparatus according to claim 4, wherein the substrate processing mechanism is configured to contact the outer peripheral surface of the substrate and hold the substrate. 7. The apparatus according to claim 7, wherein said urging means is a spring, and the elasticity of the spring causes the wire above the holder to move inward and abut on the outer peripheral surface of the substrate to hold the substrate. A substrate holding mechanism in the rotary processing device according to 4 or 5. 8. The apparatus according to claim 8, wherein the opening means is a pusher, and the pusher is pressed to swing the holder, thereby separating the wire from the outer peripheral surface of the substrate and opening the substrate. Item 8. A substrate holding mechanism in the rotation processing apparatus according to any one of Items 4, 5, 6, and 7.