JPH10154330A - Vacuum vapor deposition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remarkably enhance working ratio and productivity of a device by running band shaped stick proof materials which covering the periphery of the opening part of a mask and providing a machanism cooling the stick proof materials. SOLUTION: In this vapor deposition device, material to be deposited by evaporation being in a crucible 6 is melted and evaporated by a heating device to form a film on a film 4. In this case, cooling water is circulated in water- cooling guide rolls 14, 15, 16, 17, 28, 29 and water-cooling rolls 20, 24, 25, 26, 27 and a water-cooling pipe 9 and band shaped stick proof materials (stick proof tapes) 10, 11, 23 and 35 are respectively run at respective prescribed speeds while being cooled. Then, the material to be deposited by evaporation adhered on the periphery of the opening of the mask conventionally is adhered on surfaces of these stick proof tapes. Since staying times of the tapes at the periphery of the opening of the mask are made to be limited times, it never occurs that adhered materials grow up and the materials drop down as a consequence.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum deposition apparatus for depositing a deposition material.

[0002]

2. Description of the Related Art An evaporation process is widely used as a means for attaching a different kind of material to a substrate surface. As the base material, a plate-like material such as a glass plate may be used. For example, in the fields of packaging materials, magnetic recording media, and the like, vapor deposition is performed using a polymer film as a base material.
When vapor deposition is performed on a polymer film, a film serving as a base material is a material having a length of thousands to tens of thousands of meters wound in a roll shape. It is common to perform vapor deposition continuously.

FIGS. 4 and 5 are views showing the structure of a main part of a conventional vapor deposition apparatus. FIG. 4 is a view seen from an end face of a cooling roll 3 described later, and FIG. Roll 3
It is a perspective view of. 4, a substrate unwinding roll, a substrate winding roll (both not shown), substrate guide rolls 1 and 2 and a cooling roll 3 are placed in a vacuum chamber (not shown).
Are arranged, and a film 4 as a base material is wound between these rolls, and travels in a direction indicated by an arrow in the figure.
A container (here, a crucible) 6 for accommodating the vapor deposition material 5 is disposed below the cooling roll 3, and the vapor deposition material 5 is heated by a heating device (not shown) to melt and vaporize the vapor deposition material 5. A deposition material 5 is adhered to 4. The crucible 6 is surrounded by a deposition preventing plate (not shown) in order to prevent the evaporation material 5 from scattering into the apparatus.

When a material having a high melting point exceeding 1,000 ° C. is deposited for manufacturing a magnetic recording medium or the like, such a film 4, for example, a polymer film, may not have sufficient heat resistance. For this reason, a cooling device (not shown) is provided inside the cooling roll 3, and when the film 4 is vapor-deposited on the film 4, this film 4
To prevent deformation. Therefore, it is necessary to make the film 4 adhere to the cooling roll 3 in the deposition region. In general, as shown in FIG. 5, since the width of the film 4 is smaller than the width of the cooling roll 3,
Both ends of the outer peripheral surface are exposed.

[0005] In the apparatus having such a configuration, in order to prevent the evaporated material from adhering to the cooling roll 3,
It is necessary to cover both ends of the outer peripheral surface of the cooling roll 3.
In addition, for example, when manufacturing a magnetic recording medium, it is necessary to control the adhesion and growth direction of the vapor deposition material on the surface of the film 4 due to the requirement of the electromagnetic conversion characteristics. It is required to prevent this from happening. Therefore, a mask 7 is provided to cover these inappropriate regions. As shown in FIG.
Is composed of a curved surface 7f facing the outer peripheral surface of the cooling roll 3, and flat surfaces 7g and 7h covering both end surfaces of the cooling roll, and the curved surface has an opening 7e corresponding to a deposition area on the film 4. And the periphery of the opening 7e is
Regions 7a and 7b covering between the above-described end of the film 4 and the end of the cooling roll 3, and regions 7c and 7 for regulating the incidence of the vapor deposition material 5 on the film 4 and the growth angle.
d.

In the vapor deposition apparatus provided with the cooling roll 3 and the mask 7 as described above, the vapor deposition material 5 evaporated from the crucible 6 during the vapor deposition process adheres to the film 4 and the opening peripheral portion 7a of the mask 7 , 7b, 7c and 7
Also adheres to d. For example, when vapor deposition is continuously performed on a long film, the amount of the deposit 8 on the mask 7 increases. In an extreme case, the material grows inward of the opening 7e to reduce the opening area. Use efficiency decreases. In addition, the generation of dust due to the falling of lump of attached matter,
Similarly, since a problem such as scattering of the vapor deposition material 5 due to falling of the lump of the adhering matter into the crucible 6 occurs, there is a limit to the length of the film that can be continuously vapor-deposited.

Therefore, conventionally, when the amount of deposits on the mask 7 increases in the vapor deposition step, the vacuum in the apparatus is temporarily released to return to normal pressure, and the heating of the crucible 6 is also interrupted before the vacuum chamber. Was released to remove deposits. These operations need to be performed on a regular basis,
The stop and restart of vacuum and heating had to be repeated. These operations require a great deal of labor and time, and as a result, the operation rate of the apparatus and the productivity are remarkably reduced. As a solution to such a problem, the present inventors have recently used a band-shaped anti-adhesion material running along the peripheral edge of the opening of the mask, for example, an anti-adhesion tape, so that the adhered substance stays in one place. A vapor deposition apparatus that prevented growth was developed prior to the present invention (this technique is new and not part of the prior art).

[0008]

However, in the case of a vapor deposition apparatus using a material having a melting point of 1,000 ° C. or more, for example, in the production of a magnetic recording medium, the material for preventing the adhesion around the crucible, especially the radiant heat of the crucible, Since the temperature rises to several hundred degrees due to the reflected heat, when a general polymer film is used as the adhesion-preventing tape, there is a problem that a cut due to thermal damage occurs. Therefore, it is necessary to use a metal or a composite material of a metal and a polymer having excellent heat resistance as a material of the anti-adhesion tape. However, since these materials are expensive, the production cost is increased.

[0009]

Means for Solving the Problems The present inventors have made various studies to solve the above problems and to improve the operation rate and productivity of the apparatus without increasing the production cost. As a result, a belt-shaped anti-adhesive material is run around the opening edge of the mask, and if the anti-adhesive material is to be cooled,
Since the deposits move sequentially, they can be grown at one location to prevent the mask opening area from being narrowed or dropped, and to prevent the temperature of the anti-adhesive material from rising. It was inspired that even when using, the occurrence of cutting was prevented.

That is, according to the present invention, a band-shaped deposition-preventing material is provided so as to cover a peripheral portion of an opening of the mask of a vacuum deposition apparatus provided with a mask having an opening for limiting a deposition region on a substrate. A mechanism provided with a mechanism for running and a mechanism for cooling the band-shaped anti-adhesive material is provided. In addition, if a mechanism for cooling the band-shaped anti-adhesive material by using a refrigerant of 20 ° C. or less is provided, it is possible to more reliably prevent the anti-adhesive material from being cut.

[0011]

FIG. 1 and FIG. 2 show an example of the structure of the above-mentioned vacuum vapor deposition apparatus. This vacuum deposition apparatus is an apparatus that uses a deposition material having a melting point of, for example, 1,000 ° C. or more, as in the process of manufacturing a magnetic recording medium. In FIG. 4, FIG.
The same components as those in FIG. 5 are denoted by the same reference numerals. Further, in FIG. 1, a plane 7g of the mask 7 is omitted in order to explain a cooling mechanism arranged on the mask 7.

The left and right side edges 7a of the opening 7e of the mask 7,
7b (FIG. 5), a band-shaped anti-adhesive material, for example, anti-adhesion tapes 10 and 11 runs while being in close contact with these surfaces. Specifically, from the unwinding rolls 12 and 13 (only the roll 13 is shown), water-cooling guide rolls 14, 15, 1
After the rolls 6 and 17, winding rolls 18 and 19 (roll 19)
(Only shown), the protection tapes 10 and 11 respectively wound from top to bottom in the figure. And the adhesion tape 10,
For example, a water-cooling pipe 9 is provided on the back surface of the left and right end portions 7a and 7b of the mask 7 to which the 11 adheres, that is, the surface facing the cooling roll 3 to cool the adhesion tapes 10 and 11 during running. . The water-cooled pipe 9 can be provided between the mask 7 and the adhesion tapes 10 and 11 instead of the back surface of the mask 7. It is preferable to dispose them in

A water-cooling roll 20 is disposed in a portion of the mask 7 along the upper edge 7c of the opening 7e in the width direction of the cooling roll 3, and as shown in FIG. The roll 21 travels from the roll 21 through the water-cooled roll 20 to the winding roll 22. Further, in the vicinity of the lower edge 7d of the opening 7e of the mask 7, four water-cooling rolls 24, 25, 26, and 27 having a gradually increasing diameter are arranged close to each other,
Below these water-cooled rolls, a water-cooled guide roll 28,
29, cooling guide rolls 30, 31, 32, an unwind roll 33 and a take-up roll 34, and an adhesion-preventing tape 35 is wound between these rolls and runs in the direction indicated by the arrow in the figure. I do.

Then, these four adhesion tapes 10,
A region surrounded by 11, 23, and 35 (a region indicated by oblique lines in FIG. 2) substantially corresponds to the opening 7e of the mask 7 described above. That is, the incident angle and the growth angle of the vapor deposition material 5 on the surface of the film 4 are regulated by these four adhesion tapes. By the way, since the vicinity of the lower edge 7d of the opening of the mask 7 is a region exposed to the highest temperature in the peripheral portion of the mask, it is desirable to make the contact area between the anti-adhesive tape 35 and the water-cooling rolls 24 to 27 as large as possible. . Therefore, the larger the diameter of the water-cooling rolls 24 to 27 is, the more effective it is. However, since the deposition tape 35 also has a role of limiting the vapor deposition region as described above, the water-cooling roll 24 closest to the opening lower edge 7d is formed. If the diameter is too large, the vapor deposition material is wrapped around, and this function cannot be sufficiently performed. Therefore, a plurality of water cooling rolls 24
27 are provided and their diameters are sequentially increased to ensure a sufficient contact area with the adhesion preventing tape 35.

Further, such a multi-stage water-cooled roll 2
Instead of 4 to 27, a cooling water circulates inside as shown in FIG.
6 on the surface of the water-cooled belt 36,
5 may be transported while being in close contact with each other. In this case, the contact area with the adhesion tape 35 can be increased in a small space, and the sectional shape can be elongated as shown in the figure.
It is possible to effectively prevent the material from wrapping around. In addition, in the said structure, although the case where a water-cooled roll or a water-cooled belt was used was described as a suitable example of the mechanism which cools an anti-adhesion tape, it is not limited to this, The refrigerant | coolant (20 degreeC or less) For example, any material may be used as long as it uses ethylene glycol or liquid nitrogen.

Here, as described above, since the vapor deposition material 5 has a melting point of 1,000 ° C. or more, the adhesion-preventing tape 1
As materials of 0, 11, 23, and 35, in the case of a conventional device, it is necessary to use an expensive metal or a composite material of a metal and a polymer. Since a mechanism for cooling each of 11, 23 and 35 is provided, an inexpensive polymer film having low heat resistance, such as polyimide (PI), a less expensive polymer film having low heat resistance, polyethylene, etc. Naphthalate (PEN), polyethylene terephthalate (PE
T) and the like, and paper with good surface properties can also be used.

In addition, such protective tapes 10, 11,
As for the running speeds of 23 and 35, the cooling temperature of each anti-adhesion tape, the running speed of the base material, that is, the film 4 in the vapor deposition process, and the evaporation of the material from the crucible which determines the thickness of the vapor deposition material formed on the film 4 The amount is determined by the amount, the amount of deposits allowed by the adhesion preventing tape, the configuration of the vapor deposition device, and the like, and is not particularly limited.

In this vapor deposition apparatus, the vapor deposition material 5 in the crucible 6 is melted and evaporated by a heating device (not shown) to form a film on the film 4, and the water-cooled guide roll 1
4, 15, 16, 17, 28, 29 and water-cooled roll 2
0, 24, 25, 26, 27 and the cooling water circulate through the water-cooling pipe 9, respectively, and each of the adhesion-preventing tapes 10, 11, 2
The cooling materials 3 and 35 run at a predetermined speed while being cooled, and the deposition material that has conventionally adhered to the periphery of the opening 7e of the mask 7 adheres to the surface of these adhesion-preventing tapes. Since the staying time of the anti-adhesion tape at the periphery of the opening of the mask 7 is limited, it is possible to prevent the attached matter from growing large and falling as a result.

Here, the vapor deposition apparatus having a mechanism for running the four adhesion-preventing tapes while cooling along the peripheral edge of the opening of the mask 7 has been described, but the configuration of the present invention is not limited to this. Instead, for example, the number of the adhesion-preventing tapes, the location where the cooling mechanism for the adhesion-preventing tapes are installed, and the like may be appropriately determined according to the type of the evaporation material, the configuration of the apparatus, the evaporation conditions, and the like.

[0020]

The present invention will be described in detail with reference to the following examples. 1 and 2, a cooling roll 3 having a diameter of 1,000 mm and a width of 300 mm, and a width of 28 mm.
Using a film 4 of 0 mm and a crucible 6 of 300 mm in width,
The width of the film 4 formed on the film 4 was 250 mm, and the evaporation material 5 in the crucible 6 was melted and evaporated using a pierce-type electron gun with an output of 100 kW and a deflection of 90 °. The following experiment was performed using this apparatus.

<Experiment 1> A PET (polyethylene terephthalate) film having a thickness of 5 μm was used as the film 4, Co (cobalt) was used as a vapor deposition material, the running speed of the film was 100 m / min, and the film thickness was 0.2 μm. The film was formed under the following conditions. In order to evaporate the material based on the initial conditions, the vapor concentration of the material immediately above the crucible was monitored by an atomic absorption monitor, and the evaporation amount was kept constant. Under these conditions, cold water (0 to 20) is applied to a water-cooled guide roll or a water-cooled roll for cooling the adhesion-preventing tape and a water-cooled pipe.
C.) was circulated at 5 to 10 (l / min), and the case where the cold water was drained and released to the atmosphere was continuously formed.

At this time, the materials shown in Table 1 below were used as the material for the deposition and the material for the adhesion-preventing tape. Protective tape 1
The feed speeds of 0, 11, 23, and 35 were fixed at 1 m / min, which was 1/100 of the running speed of the film 4, and a test was performed to determine whether the anti-adhesive tape was cut. The results are shown in Tables 2 and 3, where x indicates that any one of the four adhesion-preventing tapes was cut, and ○ indicates that all the tapes were not cut.

[0023]

[Table 1] Evaporation material Lead (melting point 327 ° C) 〃 Aluminum (melting point 660 ° C) 銅 Copper (melting point 1,083 ° C) 〃 Cobalt (melting point 1,492 ° C) 鉄 Iron (melting point 1,535 ° C) A Polyimide film having a thickness of 200 microns B Polyimide film having a thickness of 50 microns B Polyethylene naphthalate film having a thickness of 50 microns D Polyethylene terephthalate film having a thickness of 200 microns E Polyethylene terephthalate film having a thickness of 50 microns F A paper having a thickness of 100 microns and having good surface properties The above five types of vapor deposition materials were used, but the power of the electron beam was adjusted in order to keep the film formation rate constant.

[0024]

[Table 2]

[0025]

[Table 3]

From the results in Tables 2 and 3, when film formation is performed using an apparatus having a mechanism for cooling the adhesion-preventing tape,
Cuts do not occur even with an adhesion tape made of a polymer film or paper with low heat resistance, but if there is no cooling mechanism, the adhesion tape will be cut. Was found to be difficult.

[0027]

As described in detail above, according to the present invention, a belt-shaped anti-adhesive tape is run over the peripheral edge of the mask opening and a mechanism for cooling the anti-adhesive material is provided. Even if an inexpensive polymer film or paper is used as the material of the anti-adhesion material, undesired deposits at the time of vapor deposition can be transported without stagnation in one place without cutting due to thermal damage. As described above, it is not necessary to perform complicated operations such as releasing vacuum inside the equipment to remove deposits, and it is possible to manufacture products with the specified characteristics over a long period of time, greatly increasing the operation rate and productivity of the equipment. Can be improved.

[Brief description of the drawings]

FIG. 1 is a conceptual configuration diagram of a vapor deposition apparatus of the present invention as viewed from an end face direction of a cooling roll.

FIG. 2 is a view of the vapor deposition apparatus of FIG. 1 as viewed from the front of an outer peripheral surface of a cooling roll.

FIG. 3 is a conceptual diagram showing another configuration of the multi-stage cooling roll in the vapor deposition apparatus of FIG.

FIG. 4 is a conceptual configuration diagram of a conventional vapor deposition apparatus viewed from an end face direction of a cooling roll.

FIG. 5 is a perspective view of a cooling roll and a mask in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1, 2 Guide roll 3 Cooling roll 4 Base material (film) 5 Vapor deposition material 6 Crucible 7 Mask 7a, 7b, 7c, 7d Opening edge 7e Opening 8 Attachment to mask 9 Water cooling pipe 10, 11, 23, 35 Anti-adhesion material (anti-adhesion tape) 12, 13, 21, 33 Unwinding roll 14, 15, 16, 17, 28, 29 Water-cooling guide roll 18, 19, 22, 34 Rewinding roll 20, 24, 25, 26, 27 water cooling rolls 30, 31, 32 cooling guide rolls 36 water cooling belt

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mansun Mitsuru Nakagawa 3-12-13 Moriyacho, Kanagawa-ku, Yokohama-shi, Kanagawa Prefecture Inside Japan Victor Company of Japan (72) Inventor Yoshiteru Matsubayashi 3 Moriyacho, Kanagawa-ku, Yokohama-shi, Kanagawa Prefecture 12th Street Inside JVC

Claims (2)

[Claims] 1. A vacuum deposition apparatus comprising a mask having an opening for limiting a deposition region on a substrate, wherein a mechanism for running a band-shaped anti-adhesive material so as to cover an opening peripheral portion of the mask, and A vacuum evaporation apparatus comprising a mechanism for cooling the band-shaped anti-adhesive material. 2. The vacuum vapor deposition apparatus according to claim 1, further comprising a mechanism for cooling the band-shaped deposition-preventing material using a refrigerant having a temperature of 20 ° C. or less.