JPH10153510A - Vacuum apparatus and diaphragm vacuum gauge - Google Patents

Vacuum apparatus and diaphragm vacuum gauge

Info

Publication number
JPH10153510A
JPH10153510A JP31029096A JP31029096A JPH10153510A JP H10153510 A JPH10153510 A JP H10153510A JP 31029096 A JP31029096 A JP 31029096A JP 31029096 A JP31029096 A JP 31029096A JP H10153510 A JPH10153510 A JP H10153510A
Authority
JP
Japan
Prior art keywords
filter
vacuum
diaphragm
gauge
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31029096A
Other languages
Japanese (ja)
Inventor
Eiji Hata
英二 畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP31029096A priority Critical patent/JPH10153510A/en
Publication of JPH10153510A publication Critical patent/JPH10153510A/en
Pending legal-status Critical Current

Links

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  • Drying Of Semiconductors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the invasion of particles and prevent accuracy deterioration of a diaphragm vacuum gauge, by connecting a vacuum chamber and the diaphragm vacuum gauge via a filter. SOLUTION: A diaphragm vacuum gauge 2 confirms that the interior of a vacuum chamber 1 is evacuated to a predetermined degree of vacuum by a vacuum pump. A wafer on a heater in the vacuum chamber 1 is heated to a predetermined temperature. After the wafer is heated to the predetermined temperature, a reaction gas is supplied, thereby adhering a deposit onto the wafer. When a filter 3 covering a communication hole 2a is driven without being heated by the heater 4, a product not yet reacting and a side reaction product which sublimate or dissolve by the heating come in touch with and adhere to the filter 3. Therefore, the product not yet reacting and the side reaction product passing through the filter 3 to adhere to the communication hole 2a and diaphragm vacuum gauge 2 are reduced. Particles which do not sublimate or dissolve by the heating also come in touch with and adhere to the filter 3. Accordingly, the diaphragm vacuum gauge 2 is prevented from being deteriorated in accuracy.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、真空装置の真空度
を測定する隔膜真空計およびこの隔膜真空計を配設した
真空装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diaphragm gauge for measuring the degree of vacuum of a vacuum device and a vacuum device provided with the diaphragm gauge.

【0002】[0002]

【従来の技術】真空装置の真空度を測定するのに隔膜真
空計が広く用いられている。CVDやイオンエッチング
用の真空装置の場合には、真空装置の真空チャンバ内に
反応成生物、未反応成生物および副反応成生物が多量に
発生する。これらは、真空チャンバ内に付着し、最終的
にはウェーハ上のパーティクルの発生源になる。これら
の成生物は真空チャンバに連通している隔膜真空計の内
部の接ガス部にも同様に付着する。
2. Description of the Related Art Diaphragm gauges are widely used to measure the degree of vacuum in vacuum equipment. In the case of a vacuum apparatus for CVD or ion etching, a large amount of reaction products, unreacted products, and by-products are generated in a vacuum chamber of the vacuum device. These adhere to the vacuum chamber and eventually become a source of particles on the wafer. These products also adhere to the gas contact inside the diaphragm gauge that communicates with the vacuum chamber.

【0003】これらの成生物が隔膜真空計内部の隔膜に
付着すると、隔膜真空計の精度を悪くし誤差の原因とな
り、隔膜真空計の早期の交換が必要となる。
[0003] If these adults adhere to the diaphragm inside the diaphragm gauge, the accuracy of the diaphragm gauge is deteriorated, causing an error, and the diaphragm gauge needs to be replaced early.

【0004】こういった未反応成生物や副反応生成物の
多くは、一般に100℃以上に加熱すると固着しにくい
ことが知られている。また、一度付着したものも分解ま
たは昇華して離脱することが知られている。この問題を
解決するために、隔膜を含む接ガス部全てを所定温度以
上に加熱する内蔵ヒータを配設した隔膜真空計がある。
[0004] It is known that many of these unreacted products and by-products are generally not easily fixed when heated to 100 ° C or higher. It is also known that once adhered, they are decomposed or sublimated and detached. In order to solve this problem, there is a diaphragm vacuum gauge provided with a built-in heater for heating all gas contact parts including the diaphragm to a predetermined temperature or higher.

【0005】[0005]

【発明が解決しようとする課題】しかし、所定温度に加
熱しても、分解または昇華を起こさない未反応成生物、
副反応成生物および反応成生物のパーティクルがあり、
このらのもののうち真空計に入ったものは除去ができな
かった。このために、隔膜真空計の精度の劣化を早めて
いた。
However, unreacted products that do not decompose or sublime even when heated to a predetermined temperature,
There are particles of by-products and by-products,
Of these, those that entered the vacuum gauge could not be removed. This hastened the deterioration of the accuracy of the diaphragm gauge.

【0006】[0006]

【課題を解決するための手段】本発明は上記課題を解決
するために提案されたもので、真空チャンバに隔膜を加
熱するヒータを有する隔膜真空計を連通した真空装置に
おいて、真空チャンバと隔膜真空計とをフィルタを介し
て連通したことを特徴とする真空装置を提供する。この
ことにより、真空チャンバからパーティクルが真空計に
入るのを防止し、真空計の精度の劣化を防止する。
SUMMARY OF THE INVENTION The present invention has been proposed to solve the above-mentioned problems. In a vacuum apparatus in which a vacuum gauge having a heater for heating a diaphragm is connected to a vacuum chamber, a vacuum chamber and a diaphragm vacuum are provided. A vacuum device is provided, wherein the vacuum device is connected to a meter via a filter. This prevents particles from entering the vacuum gauge from the vacuum chamber and prevents the accuracy of the vacuum gauge from deteriorating.

【0007】加えて、フィルタにフィルタ加熱用ヒ−タ
を配設した真空装置を提供する。このことにより、フィ
ルタに付着した分解または昇華可能な未反応成生物およ
び副反応成生物を加熱除去することができる。
In addition, there is provided a vacuum apparatus in which a filter heating heater is provided on a filter. As a result, unreacted products and by-products that can be decomposed or sublimated and adhere to the filter can be removed by heating.

【0008】加えて、フィルタを取り替え可能に配設し
た真空装置を提供する。このことにより、加熱で分解ま
たは昇華しないパーティクルでフィルタが目詰まりした
ときに、フイルタを交換することにより、隔膜真空計は
継続して使用できる。
In addition, there is provided a vacuum apparatus in which filters are exchangeably disposed. Thus, when the filter is clogged with particles that are not decomposed or sublimated by heating, the diaphragm gauge can be continuously used by replacing the filter.

【0009】また、隔膜真空計の真空チャンバへの連通
部にフィルターを配設した隔膜真空計を提供したり、フ
ィルタにフィルタ加熱用ヒ−タを配設したり、フィルタ
を取り替え可能に配設したりしてもよい。
In addition, the present invention provides a diaphragm gauge in which a filter is provided in a communication part of the diaphragm gauge with a vacuum chamber, a filter heating heater is provided in the filter, and a filter is replaceably provided. Or you may.

【0010】[0010]

【発明の実施の形態】本発明の実施の形態を図1から説
明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG.

【0011】図において、1はCVD装置の真空チャン
バ、2は真空チャンバ1と連通する連通孔2aとヒータ
2cを配設した隔膜2bを有する隔膜真空計、3は連通
孔2aの先端を被覆したフィルタ、4はフィルタ3に巻
いたフィルタ3を加熱するヒータである。
In FIG. 1, reference numeral 1 denotes a vacuum chamber of a CVD apparatus, 2 denotes a diaphragm gauge having a communication hole 2a communicating with the vacuum chamber 1 and a diaphragm 2b provided with a heater 2c, and 3 denotes a tip of the communication hole 2a. The filters 4 and 4 are heaters for heating the filter 3 wound around the filter 3.

【0012】以下に稼働状況を構造を交えて説明する。The operation status will be described below together with the structure.

【0013】真空ポンプ(図示せず)で排気して、CV
D装置の真空チャンバ1内が所定の真空になったことを
隔膜真空計2で確認したのち、真空チャンバ1内のヒー
タ(図示せず)上に載置されたウェーハ(図示せず)を
所定温度に加熱する。ウェーハが所定温度になったら反
応ガスを供給し、加熱されたウェーハ上に析出物を付着
させる。このとき、ウェーハ上以外の場所にも少量の反
応析出物が付着する。この反応析出物はパーティクルと
して飛散することがある。また、未反応成生物および副
反応成生物も付着する。これらの付着はガスと接触する
真空チャンバ1、隔膜真空計2およびこれらを連通する
連通孔2a、フィルタ3にもおこる。また、一度ウェー
ハに付着した付着物が剥離し、飛散して他の場所に付着
することがある。
Evacuation is performed by a vacuum pump (not shown),
After confirming with the diaphragm vacuum gauge 2 that the inside of the vacuum chamber 1 of the D apparatus has reached a predetermined vacuum, the wafer (not shown) mounted on the heater (not shown) in the vacuum chamber 1 is removed by a predetermined amount. Heat to temperature. When the temperature of the wafer reaches a predetermined temperature, a reaction gas is supplied to deposit a precipitate on the heated wafer. At this time, a small amount of reaction precipitate also adheres to places other than on the wafer. This reaction precipitate may be scattered as particles. Unreacted products and by-products also adhere. These deposits also occur in the vacuum chamber 1, the diaphragm gauge 2, which is in contact with the gas, and the communication holes 2a and the filter 3, which communicate these. Further, the deposit once adhered to the wafer may be peeled off, scattered, and adhered to another place.

【0014】連通孔2aに被覆してあるフィルタ3をヒ
ータ4で加熱しないで稼働すると、加熱で昇華または分
解する未反応成生物および副反応成生物はこのフィルタ
3に接触して付着し、このフィルタ3を通り抜け連通孔
2aおよび隔膜真空計2に付着する未反応成生物および
副反応成生物は著しく少なくなる。また、真空チャンバ
1内の反応成生物等の加熱で昇華または分解しないパー
ティクルも、このフィルタ3に付着し、このフィルタ3
を通り抜け連通孔2aから隔膜真空計2に付着する量も
非常に少なくなる。このとき、加熱で昇華または分解す
るパーティクルもフィルタ3に付着するので、フィルタ
3が目詰まりして、細かいパーティクルも付着する。フ
ィルタ3の目詰まりが多くなったら、CVD成長をして
いないときに、フィルタ3をヒータ4で加熱して加熱で
昇華または分解するパーティクルを除去する。
When the filter 3 covered with the communication hole 2a is operated without being heated by the heater 4, unreacted products and sub-reacted products sublimated or decomposed by heating come into contact with the filter 3 and adhere thereto. The amount of unreacted products and side-reacted products that pass through the filter 3 and adhere to the communication hole 2a and the diaphragm vacuum gauge 2 is significantly reduced. Particles that do not sublimate or decompose due to heating of reaction products and the like in the vacuum chamber 1 also adhere to the filter 3,
Through the communication hole 2a and adhere to the diaphragm vacuum gauge 2 very little. At this time, particles sublimated or decomposed by heating also adhere to the filter 3, so that the filter 3 is clogged and fine particles also adhere. When the clogging of the filter 3 increases, the filter 3 is heated by the heater 4 to remove particles which sublime or decompose by heating when the CVD growth is not performed.

【0015】CVD装置を稼働時に、隔膜真空計2のヒ
ータ2cで隔膜2bを加熱することにより、加熱により
昇華または分解する物質が隔膜真空計2の隔膜2bに付
着することはなく、真空度の精度に影響することはな
い。一方、加熱により昇華または分解しない物質のパー
ティクルの影響は受ける。しかし、フイルタ3により、
大部分の加熱により昇華または分解しない物質のパーテ
ィクルは除去されているので、パーティクルの影響は減
少する。
By heating the diaphragm 2b with the heater 2c of the diaphragm vacuum gauge 2 during operation of the CVD apparatus, the substance which sublimates or decomposes due to the heating does not adhere to the diaphragm 2b of the diaphragm vacuum gauge 2; It does not affect accuracy. On the other hand, particles of a substance that does not sublimate or decompose due to heating are affected. However, due to the filter 3,
Most of the heating removes particles of substances that do not sublime or decompose, thus reducing the effects of the particles.

【0016】一方、稼働時にフィルタ3をヒータ4で加
熱すると、加熱により昇華または分解が可能な物質はフ
ィルタ3に付着することなく通過し、加熱により昇華ま
たは分解が不可能なパーティクルのみがフィルタ3に付
着する。また、隔膜2bもヒータ2cで加熱しているの
で、加熱により昇華または分解が可能な物質は隔膜真空
計2の精度に影響は与えないが、加熱により昇華または
分解が不可能なパーティクルのみが影響を与える。この
とき、加熱により昇華または分解が可能な物質はフィル
タ3に付着することなく通過するので、フィルタの目詰
まりは少ない。したがって、より多くの加熱により昇華
または分解が不可能なパーティクルが隔膜2bに付着す
る。このために、稼働時にフィルタ3を加熱しないとき
に比較すると、隔膜真空計2の精度への影響は早く現れ
る。
On the other hand, when the filter 3 is heated by the heater 4 during operation, substances which can be sublimated or decomposed by heating pass without adhering to the filter 3 and only particles which cannot be sublimated or decomposed by heating are filtered. Adheres to Further, since the diaphragm 2b is also heated by the heater 2c, substances that can be sublimated or decomposed by heating do not affect the accuracy of the diaphragm vacuum gauge 2, but only particles that cannot be sublimated or decomposed by heating are affected. give. At this time, the substance that can be sublimated or decomposed by heating passes without adhering to the filter 3, so that clogging of the filter is small. Therefore, particles that cannot be sublimated or decomposed by more heating adhere to the diaphragm 2b. For this reason, when compared with the case where the filter 3 is not heated during operation, the influence on the accuracy of the diaphragm gauge 2 appears earlier.

【0017】これらの、現象はCVD装置のみならずイ
オンエッチング装置等の広い範囲の真空装置で効果を上
げることができる。
These phenomena can be effectively achieved not only in a CVD apparatus but also in a wide range of vacuum apparatuses such as an ion etching apparatus.

【0018】隔膜真空計2を真空装置に組み込むときに
連通孔2aをフィルタ3で被覆してもよいし、このフィ
ルタ3にヒータ4を配設してもよい。また、連通孔2a
にフィルタ3を被覆し、このフィルタ3にヒータ4を配
設した隔膜真空計2として取り扱ってもよい。フィルタ
3にはグラスファイバが広く用いられ、昇華または分解
に必要な100℃の加熱では溶融する等の影響はない。
When the diaphragm gauge 2 is incorporated in a vacuum device, the communication hole 2a may be covered with a filter 3, or a heater 4 may be provided in the filter 3. In addition, the communication hole 2a
May be treated as a diaphragm gauge 2 in which a heater 4 is disposed on the filter 3. Glass fiber is widely used for the filter 3, and there is no influence such as melting at 100 ° C. heating required for sublimation or decomposition.

【0019】さらに、フィルタ3を取り替え可能にする
ことによって、フィルタ3の目詰まりがあっても、フィ
ルタ3を取り替えることにより、隔膜真空計2の精度へ
の影響を長期間に渡って防ぐことができる。
Further, by making the filter 3 replaceable, even if the filter 3 is clogged, it is possible to prevent the influence on the accuracy of the diaphragm gauge 2 for a long time by replacing the filter 3. it can.

【0020】フィルタ3自身またはフィルタ3が目詰ま
りして、隔膜真空計2の真空度に対する応答が遅くなら
ないようなフイルタ3の選択および管理は必要である。
It is necessary to select and manage the filter 3 so that the filter 3 itself or the filter 3 is not clogged and the response of the diaphragm gauge 2 to the degree of vacuum is not delayed.

【0021】[0021]

【発明の効果】真空チャンバと隔膜真空計の連通孔にフ
ィルタを被せることにより、未反応成生物や副反応成生
物およびパーティクルが真空計に入るのを防ぐことによ
り、真空計の精度を悪くすることがなくなる。また、精
度の劣化を遅らせることができる。
According to the present invention, by covering the communication hole between the vacuum chamber and the diaphragm gauge with a filter, unreacted products, by-products and particles are prevented from entering the gauge, thereby deteriorating the accuracy of the gauge. Disappears. Further, the deterioration of accuracy can be delayed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の真空装置の要部断面図FIG. 1 is a sectional view of a main part of a vacuum apparatus of the present invention.

【符号の説明】[Explanation of symbols]

1 真空チャンバ 2 隔膜真空計 2b 隔膜 2c ヒータ 3 フィルタ Reference Signs List 1 vacuum chamber 2 diaphragm vacuum gauge 2b diaphragm 2c heater 3 filter

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】真空チャンバに隔膜を加熱するヒータを有
する隔膜真空計を連通した真空装置において、 前記真空チャンバと前記隔膜真空計とをフィルタを介し
て連通したことを特徴とする真空装置。
1. A vacuum apparatus, wherein a vacuum gauge having a heater for heating a diaphragm is connected to a vacuum chamber, wherein the vacuum chamber and the diaphragm gauge are connected via a filter.
【請求項2】前記フィルタにフィルタ加熱用ヒータを配
設したことを特徴とする請求項1記載の真空装置。
2. The vacuum apparatus according to claim 1, wherein a heater for heating the filter is provided on the filter.
【請求項3】前記フィルタを取り替え可能に配設したこ
とを特徴とする請求項1または請求項2記載の真空装
置。
3. The vacuum apparatus according to claim 1, wherein the filter is replaceably disposed.
【請求項4】真空チャンバへの連通部にフィルタを配設
したことを特徴とする隔膜真空計。
4. A diaphragm gauge in which a filter is provided in a communication part with a vacuum chamber.
【請求項5】前記フィルタにフィルタ加熱用ヒ−タを配
設したことを特徴とする請求項4記載の隔膜真空計。
5. A diaphragm vacuum gauge according to claim 4, wherein a heater for heating the filter is provided on said filter.
【請求項6】前記フィルタを取り替え可能に配設したこ
とを特徴とする請求項4または請求項5記載の隔膜真空
計。
6. The diaphragm vacuum gauge according to claim 4, wherein said filter is replaceably disposed.
JP31029096A 1996-11-21 1996-11-21 Vacuum apparatus and diaphragm vacuum gauge Pending JPH10153510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31029096A JPH10153510A (en) 1996-11-21 1996-11-21 Vacuum apparatus and diaphragm vacuum gauge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31029096A JPH10153510A (en) 1996-11-21 1996-11-21 Vacuum apparatus and diaphragm vacuum gauge

Publications (1)

Publication Number Publication Date
JPH10153510A true JPH10153510A (en) 1998-06-09

Family

ID=18003445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31029096A Pending JPH10153510A (en) 1996-11-21 1996-11-21 Vacuum apparatus and diaphragm vacuum gauge

Country Status (1)

Country Link
JP (1) JPH10153510A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000025121A (en) * 1998-10-08 2000-05-06 윤종용 Vacuum gauge of process chamber
CN100362621C (en) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 Device and method for reducing thin-film type capacitance vacuum gauge zero-point drift
KR100956270B1 (en) * 2007-12-13 2010-05-10 송종규 Particle Protector
JP2010175294A (en) * 2009-01-27 2010-08-12 Ulvac Japan Ltd Pressure sensor
CN102062667A (en) * 2009-11-17 2011-05-18 刘保龙 Pressure sensing vacuum measurement device
JP2013205011A (en) * 2012-03-27 2013-10-07 Sukegawa Electric Co Ltd Vacuum measuring device
US8656787B2 (en) 2009-03-30 2014-02-25 Azbil Corporation Electrostatic capacitive pressure sensor
EP2921837A1 (en) 2014-03-20 2015-09-23 Azbil Corporation Electrostatic capacitance type pressure sensor
CN108593198A (en) * 2018-04-23 2018-09-28 武汉华星光电技术有限公司 Capacitance diaphragm gauge and dry etching apparatus chamber pressure test system
JP2019153738A (en) * 2018-03-06 2019-09-12 株式会社Screenホールディングス Substrate processing apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000025121A (en) * 1998-10-08 2000-05-06 윤종용 Vacuum gauge of process chamber
CN100362621C (en) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 Device and method for reducing thin-film type capacitance vacuum gauge zero-point drift
KR100956270B1 (en) * 2007-12-13 2010-05-10 송종규 Particle Protector
JP2010175294A (en) * 2009-01-27 2010-08-12 Ulvac Japan Ltd Pressure sensor
US8656787B2 (en) 2009-03-30 2014-02-25 Azbil Corporation Electrostatic capacitive pressure sensor
CN102062667A (en) * 2009-11-17 2011-05-18 刘保龙 Pressure sensing vacuum measurement device
JP2013205011A (en) * 2012-03-27 2013-10-07 Sukegawa Electric Co Ltd Vacuum measuring device
EP2921837A1 (en) 2014-03-20 2015-09-23 Azbil Corporation Electrostatic capacitance type pressure sensor
JP2019153738A (en) * 2018-03-06 2019-09-12 株式会社Screenホールディングス Substrate processing apparatus
CN108593198A (en) * 2018-04-23 2018-09-28 武汉华星光电技术有限公司 Capacitance diaphragm gauge and dry etching apparatus chamber pressure test system

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