JPH10144736A5 - - Google Patents

Info

Publication number
JPH10144736A5
JPH10144736A5 JP1996296199A JP29619996A JPH10144736A5 JP H10144736 A5 JPH10144736 A5 JP H10144736A5 JP 1996296199 A JP1996296199 A JP 1996296199A JP 29619996 A JP29619996 A JP 29619996A JP H10144736 A5 JPH10144736 A5 JP H10144736A5
Authority
JP
Japan
Prior art keywords
layer
adhesive
adhesive sheet
semiconductor device
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1996296199A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10144736A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP8296199A priority Critical patent/JPH10144736A/ja
Priority claimed from JP8296199A external-priority patent/JPH10144736A/ja
Publication of JPH10144736A publication Critical patent/JPH10144736A/ja
Publication of JPH10144736A5 publication Critical patent/JPH10144736A5/ja
Pending legal-status Critical Current

Links

JP8296199A 1996-11-08 1996-11-08 半導体装置用接着剤シートおよびそれを用いた半導体集積回路接続用基板ならびに半導体装置 Pending JPH10144736A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8296199A JPH10144736A (ja) 1996-11-08 1996-11-08 半導体装置用接着剤シートおよびそれを用いた半導体集積回路接続用基板ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8296199A JPH10144736A (ja) 1996-11-08 1996-11-08 半導体装置用接着剤シートおよびそれを用いた半導体集積回路接続用基板ならびに半導体装置

Publications (2)

Publication Number Publication Date
JPH10144736A JPH10144736A (ja) 1998-05-29
JPH10144736A5 true JPH10144736A5 (enExample) 2004-07-22

Family

ID=17830461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8296199A Pending JPH10144736A (ja) 1996-11-08 1996-11-08 半導体装置用接着剤シートおよびそれを用いた半導体集積回路接続用基板ならびに半導体装置

Country Status (1)

Country Link
JP (1) JPH10144736A (enExample)

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