JPH10144585A - Processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a fire on the outside of a system from spreading into the system through an exhaust path and a fire in the system from spreading entirely over a factory by providing the exhaust path for exhausting the atmosphere in a processing chamber to the outside of the system and means for closing the exhaust path in case of an emergency. SOLUTION: When a fire takes place in a resist coating/developing system and detected by fire alarms 13-15 in the system, a detection signal is delivered to a control section 104. Consequently, the control section 104 lights an alarm lamp 11 and transmits a closing signal to closing mechanisms 96, 97 which close exhaust paths 94, 95. According to the arrangement, fire in the resist coating/developing system can be prevented from spreading through the exhaust paths 94, 95, 105.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing a resist coating process, a developing process, and the like on a semiconductor wafer, an LCD substrate, and the like.

[0002]

2. Description of the Related Art For example, in a photolithography step in a semiconductor device manufacturing process, a resist coating process for forming a resist film on the surface of a semiconductor wafer (hereinafter, referred to as a "wafer") and a resist coating process on a wafer after resist coating are performed. After the exposure process, a development process of performing a development process on the wafer is performed. Conventionally, the resist coating process and the development process are described in, for example,
As is well known from Japanese Patent Application Publication No. 0194, the processing is performed according to a predetermined sequence in a complex processing system in which various corresponding processing units are provided in one system.

[0003] In such a complex processing system, the resist coating processing, the developing processing, and the like are configured to be performed in independent processing units, for example. Also,
In these processing units, the waste liquid after processing and the solvent atmosphere containing the organic solvent in the processing chamber are led out of the combined processing system through the waste liquid path and the exhaust path,
The derived waste liquid and solvent atmosphere pass through a waste liquid passage and an exhaust passage provided in the factory and are collected in a waste liquid tank and an exhaust tank.

[0004]

However, in the system configured as described above, if a fire occurs in a factory, for example, the fire may pass through the exhaust path filled with the solvent atmosphere and reach the inside of the complex processing system. Also, if a fire occurs in the complex processing system, the fire may pass through the exhaust path and spread to the entire factory.

The present invention has been made in view of the above circumstances, and is a processing which can prevent the fire outside the apparatus from passing through the exhaust path into the apparatus and the fire inside the apparatus from spreading from inside the apparatus to the entire factory. It is intended to provide a device.

[0006]

According to a first aspect of the present invention, there is provided a processing chamber for performing a process using an organic solvent on an object to be processed, and an atmosphere in the processing chamber is provided outside the apparatus. Exhaust passage, and closing means for closing the exhaust passage in an emergency.

According to a second aspect of the present invention, there is provided a processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting the atmosphere in the processing chamber to the outside of the apparatus, and a fire detection signal from the outside of the apparatus. And an closing means for closing the exhaust path when the fire detection signal is input.

According to a third aspect of the present invention, there is provided a processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting an atmosphere in the processing chamber to the outside of the apparatus, and detecting a fire in the apparatus. And a closing means for closing the exhaust path when the fire detecting means detects a fire.

According to a fourth aspect of the present invention, there is provided a processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting an atmosphere in the processing chamber to the outside of the apparatus, an emergency button, and the emergency button. Closing means for closing the exhaust path when the button is pressed.

According to a fifth aspect of the present invention, there is provided the processing apparatus according to any one of the first to fourth aspects, further comprising a notifying means for notifying that the exhaust passage is closed by the closing means. I do.

According to the first aspect of the present invention, since the exhaust passage filled with the solvent atmosphere is closed in an emergency, the exhaust passage and the outside are shut off in an emergency, and, for example, fire spreads through the exhaust passage into the apparatus. And the spread of fire from inside the apparatus to the entire factory can be prevented. According to the second aspect of the present invention, when a fire detection signal is input from the outside of the apparatus, the exhaust path is closed, so that when a fire occurs outside the apparatus, for example, in a factory, the fire passes through the exhaust path. No spillover into the device.

According to the third aspect of the present invention, when the fire is detected in the apparatus, the exhaust path is closed, so that the fire in the apparatus can be prevented from spreading from inside the apparatus to the entire factory. .

According to the fourth aspect of the present invention, when the emergency button is pressed, the above-mentioned exhaust passage is closed, which is particularly effective when, for example, a fire alarm does not operate. According to the fifth aspect of the present invention, since it is configured to notify that the exhaust path is blocked, an operator or the like can know that the apparatus is in an emergency state.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the processing apparatus of the present invention is applied to a system for applying and developing a resist on a semiconductor wafer will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a resist coating and coating method according to this embodiment.
FIG. 2 is a front view of FIG. 1, and FIG. 3 is a rear view of FIG.

This processing system transfers a wafer W between a cassette station 10, a processing station 20 having a plurality of processing units, and an exposure apparatus (not shown) provided adjacent to the processing station 20. And an interface unit 30.

The cassette station 10 loads a plurality of semiconductor wafers W as objects to be processed, for example, in units of 25 wafers, into the wafer cassette 1 from another system, or loads the semiconductor wafers W from this system into another system. This is for unloading and carrying the wafer W between the wafer cassette 1 and the processing station 20.
In the cassette station 10, as shown in FIG. 1, a plurality of (four in the figure) projections 3 are formed on the cassette mounting table 2 along the X direction in the figure. The cassettes 1 can be placed in a line with the respective wafer entrances facing the processing station 20. In the wafer cassette 1, the wafers W are arranged in a vertical direction (Z direction). The cassette station 10 has a wafer transfer mechanism 4 located between the wafer cassette mounting table 2 and the processing station 20. The wafer transfer mechanism 4 is arranged in the cassette arrangement direction (X
Direction) and a wafer transfer arm 4a movable in the wafer arrangement direction (Z direction) of the wafers W therein.
Can be selectively accessed. The wafer transfer arm 4a is configured to be rotatable in the θ direction, and a group G on the side of the processing station 20 described later is provided.
3 and the transfer unit (TR) 46 belonging to
Can be transported.

The processing station 20 includes a plurality of processing units for performing a series of steps for coating and developing the semiconductor wafer W. These processing units are arranged at predetermined positions in multiple stages. The semiconductor wafer W
Are processed one by one. This processing station 20
As shown in FIG. 1, a main wafer transfer mechanism 21 which is movable in a vertical direction is provided at a central portion.
All the processing units are arranged around one wafer transfer path 22. The plurality of processing units are divided into a plurality of processing units, and each processing unit includes a plurality of processing units arranged in multiple stages along a vertical direction. In this embodiment, the five processing units G1, G2, G3, G4 and G
5 are arranged around the wafer transfer path 22, and the wafer transfer path 22 is a substantially closed space.

Of these processing units G1, G2, G3, G4 and G5, the processing units G1 and G2 are located at the front of the system (FIG. 1).
, The processing unit G3 is disposed adjacent to the cassette station 10, and the processing unit G4 is disposed adjacent to the cassette station 10.
Is disposed adjacent to the interface unit 30, and the processing unit G5 is disposed on the back side.

In this case, as shown in FIG.
In this embodiment, two spinner-type processing units for performing a predetermined process by placing the wafer W on a spin chuck (not shown) in the cup 23 are vertically arranged. And a developing unit (DEV) for developing a resist pattern are stacked in two stages from the bottom. Similarly, in the processing section G2, a resist coating unit (COT) and a developing unit (DEV) are stacked in two stages from the bottom as two spinner type processing units. The reason for disposing the resist coating unit (COT) on the lower side in this way is that the waste liquid of the resist liquid is inherently more complicated than the waste liquid of the developer both mechanically and in terms of maintenance. This is because by arranging (COT) in the lower stage, its complexity is reduced. Further, as will be described later, the cleanliness of each part is increased by supplying a vertical laminar flow in the system. However, by disposing a developing unit (DEV) requiring a higher degree of cleanliness in the upper stage, a resist coating unit (DEV) is provided. The adverse effect of the solvent atmosphere discharged from COT) can be suppressed. But,
If necessary, a resist coating unit (COT) can be arranged in the upper stage.

In the processing section G3, as shown in FIG. 3, there are provided seven stages of oven-type processing units for performing a predetermined processing by mounting the wafer W on the mounting table 24 (see FIG. 1). Specifically, an adhesion processing unit (AD) 47, a transport unit (TR) 46, two chill plate units (CP) 44, 45, and 3
Hot plate units (HP)) 41, 42, 4
3 are arranged.

Among these, the hot plate units (HP) 41, 42, and 43 are for subjecting the semiconductor wafer W to a heating process such as a pre-bake process or a post-bake process, and the chill plate unit (CP) 4
Reference numerals 4 and 45 are for cooling the semiconductor wafer W, and a transfer unit (TR) 46 is for transferring the semiconductor wafer W. The adhesion processing unit (AD) 47 performs a hydrophobic treatment on the semiconductor wafer W.

Similarly, the processing unit G4, as shown in FIG.
7 stages of oven type processing units are arranged. Specifically, the transport / chill plate unit (T
R / CP) 54, chill plate unit (CP) 53,
And five hot plate units (HP) 52, 5
1, 50, 49 and 48 are arranged.

The processing section G5 located on the back side of the main wafer transfer mechanism 21 basically has a structure in which oven-type processing units are stacked in multiple stages, similarly to the processing sections G3 and G4. The processing section G5 can be moved laterally along the guide rail 67 when viewed from the main wafer transfer mechanism 21. Therefore, since a space is secured by sliding the processing unit G5, maintenance work can be easily performed from behind the main wafer transfer mechanism 21.

The interface section 30 has the same length in the X direction as the processing station 20. As shown in FIGS. 1 and 2, a portable pickup cassette 3 is provided at the front of the interface section 30.
1 and stationary buffer cassettes 32 are arranged in two stages,
A peripheral exposure device 33 is provided on the back, and a central
A wafer transfer arm 34 is provided. The wafer transfer arm 34 moves in the X and Z directions to move both cassettes 3.
The wafers can be transported to the peripheral exposure devices 1 and 32 and the peripheral exposure device 33. The wafer transfer arm 34 is rotatable in the θ direction, and is a transfer / chill plate unit (TR / C) belonging to the processing section G4 on the processing station 20 side.
P) 54 and the wafer W can be transferred to a wafer transfer table (not shown) on the adjacent exposure apparatus side.

As shown in FIG. 2, an alarm lamp 11 which is turned on in the event of an emergency such as a fire is provided above the cassette station 10 as described later. In addition, an emergency button 12 is provided on the front of the cassette station 10 for an operator or the like to take measures such as stopping the system in an emergency such as a fire as described later. The alarm lamp 11 and the emergency button 12 may be provided in the processing station 20 and the interface unit 30.

The processing system configured as described above includes:
Although it is installed in a clean room and thereby increases the cleanliness, the cleanliness of each part is further enhanced by efficiently supplying a vertical laminar flow in the system.
4 and 5 show the flow of clean air in the system.

As shown in FIG. 4, air supply chambers 10a, 20a, and 30a are provided above the cassette station 10, the processing station 20, and the interface section 30, and each of the air supply chambers 10a, 20a, and 30a is provided.
A filter with a dust-proof function, for example, an ULPA filter 55 is attached to the lower surface of the device. Of these, the air supply chamber 10
a, air is introduced into the 30a through a pipe,
The A filter 55 allows the clean air to flow down through the cassette station 10 and the interface 30.
Supplied to

As shown in FIG. 5, an air supply port 25 for supplying air thereto is provided above the wafer transfer path 22 of the main wafer transfer mechanism 21, and below the wafer transfer path 22. An exhaust port 26 for exhausting the air supplied to 22 is provided.

The above-mentioned air supply chamber 20 is provided at a connection portion between the air supply port 25 and the air supply pipe. The ULPA filter 55 is attached to the lower surface thereof. A chemical filter 56 having a function of removing contaminants is attached.

An exhaust chamber 20b is provided at the connection between the exhaust port 26 and the exhaust pipe, and a perforated plate 57 having the exhaust port 26 is attached to the upper surface of the exhaust chamber 20b.
An exhaust fan 55 is provided in the exhaust chamber 20b.
Further, a pressure adjusting means, for example, a slit damper 59 is provided at a connection portion between the exhaust chamber 20b and the exhaust pipe. Then, the inside of the conveyance path 22 is supplied with an air supply port
5, a downflow of clean air is formed toward the exhaust port 26.

In the cassette station 10, as shown in FIG. 4, the space above the cassette mounting table 2 and the space for moving the wafer transfer tweezers 4 are separated from each other by a vertical partition plate 5, and the space is lowered. The flow space flows separately in both spaces.

In the processing station 20, as shown in FIGS. 4 and 5, an ULPA filter 55a is provided on a ceiling surface of a resist coating unit (COT) disposed at a lower stage in the processing sections G1 and G2. The air supplied from the circulation pipeline 52 into the transport path 22 flows through the ULPA filter 55a into the resist coating unit (COT).

As shown in FIG. 4, the main wafer transfer mechanism 2 of each spinner type processing unit (COT), (DEV)
The side wall facing 1 is provided with an opening 64 for the wafer W and the transfer arm to enter and exit. Each opening 6
A shutter (not shown) is attached to 4 to prevent verticles or organic contaminants from each unit from entering the main wafer transfer mechanism 21 side.

As shown in FIG. 4, each of the cassette station 10, the processing station 20, and the interface unit 30, or at least one of the
Fire detectors 13, 14, 15 for detecting a fire are attached.

FIG. 6 is a sectional view showing the structure of the resist coating unit (COT) to the developing unit (DEV).

In the resist coating unit (COT) or the developing unit (DEV), an annular cup CP is disposed at the center of the bottom of the unit, and a spin chuck 71 is disposed inside the cup CP. The spin chuck 71 is configured to rotate with the rotational driving force of the driving motor 72 in a state where the semiconductor wafer W is fixedly held by vacuum suction. The drive motor 72 is arranged so as to be able to move up and down in an opening 74 provided in the unit bottom plate 73, and is connected to a lifting drive unit 76 and an up-and-down guide unit 77 made of, for example, an air cylinder via a cap-shaped flange member 75 made of aluminum, for example. Are combined. A cylindrical cooling jacket 78 made of, for example, SUS is attached to a side surface of the drive motor 72, and a flange member 75 is attached so as to cover an upper half of the cooling jacket 78.

At the time of resist application or development, the lower end 75a of the flange member 75 is in close contact with the unit bottom plate 73 near the outer periphery of the opening 74, so that the inside of the unit is sealed. When the transfer of the semiconductor wafer W is performed between the spin chuck 71 and the main wafer transfer mechanism 21, the lifting drive unit 76 is driven by the drive motor 72 or the spin chuck 7.
The lower end of the flange member 75 is lifted from the unit bottom plate 73 in order to lift the upper part 1 upward.

A water passage for flowing cooling water is provided in the cooling jacket 78 so that cooling water CW whose temperature has been adjusted to a constant temperature from a cooling water supply unit (not shown) is circulated and supplied into the jacket. It has become.

A gap 79 is provided between the lower surface of the cup CP and the unit bottom plate 73. The clean air whose temperature and humidity are controlled to be constant from the ULPA filter 55 on the ceiling as described above is supplied into the unit in a downflow manner. The clean air that has hit the unit bottom plate 73 around the cup CP passes through the gap 79 below the cup CP and turns inside the cup CP. At the time of resist application, as described above, the lower end 75a of the flange member 75 is in close contact with the unit bottom plate 73 near the outer periphery of the opening 74 to seal the inside of the unit. The incoming clean air rises along the side surface of the flange member 58 as shown by the dotted line A, and enters the cup CP through the gap 80 between the peripheral portion of the wafer W and the cup CP. As described above, the airflow passes through the gap 80 from the inside to the outside, thereby preventing the resist liquid from flowing to the back surface of the wafer.

The heat generated by the drive motor 72 is quickly absorbed by the cooling jacket 78 and, since the flange member 75 covers the periphery of the cooling jacket 78, the heat flows through the gap 79 to the inside of the cup CP. The clean air is not heated when passing near the drive motor 72. As described above, since the clean air from the ULPA filter 55 on the ceiling is supplied to the gap 80 by bypassing under the cup CP while keeping the temperature and the humidity substantially constant.
The peripheral portion of the semiconductor wafer W is not heated by the airflow on the back surface side, and the uniformity of the resist film is guaranteed.

In the cup CP, one chamber is formed by the outer peripheral wall surface, the inner peripheral wall surface, and the bottom surface.
One or a plurality of drain ports 81 are provided. The drain port 81 is connected to a tank 83 via a drain pipe 82. The tank 83 is a closed container, and has a drain port 83a provided on the bottom surface thereof and an exhaust port 83b provided on the top surface thereof, so that the tank 83 is discharged to the outside of the system via pipes 84 and 85 as described later. Has become.
Outside the tank 83, liquid level sensors 86 and 87 for detecting the liquid level in the tank are respectively provided at predetermined height positions.

The resist liquid scattered in all directions from the semiconductor wafer W during resist coating and development is collected in the cup CP as shown by a solid line B, and is drained from the drain port 81 at the bottom of the cup CP to the drain pipe 82 as waste liquid. Through the tank 83. At this time, the gas in the cup CP is also exhausted from the drain port 81 together with the waste liquid as exhaust gas. A solvent such as thinner is supplied to the tank 83 via a pipe (not shown), and the resist is temporarily stored in the tank in a liquid state without solidification. Tank 8
When the liquid level in the tank 3 rises to the upper limit position, a control circuit (not shown) opens the on-off valve 88 of the pipe 84 in response to the output signal SH from the liquid level sensor 86, and the liquid level in the tank 83 becomes lower limit position. When the output signal SL from the liquid level sensor 87 falls.
The control circuit closes the on-off valve 88 in response to the control signal. In this manner, the waste liquid from the cup CP is temporarily stored in the tank 83, and then sent out of the system through the pipe 84. On the other hand, the exhaust gas sent to the tank 83 is sent from the exhaust port 83b to the outside of the system through the pipe 85.

A nozzle 89 for supplying a resist solution or a developing solution to the wafer surface of the semiconductor wafer W is connected via a supply pipe 90 to a resist liquid or developing solution supply section (not shown). The nozzle 89 is detachably attached to the tip of the nozzle scan arm 91 at a nozzle standby portion (not shown) disposed outside the cup CP, and has a predetermined liquid discharge position set above the spin chuck 71. To be transported. The nozzle scan arm 91 is
A vertical support member 93 that can move horizontally on a guide rail 92 laid in one direction (Y direction) on the unit bottom plate 73.
And is integrally moved with the vertical support member 93 in the Y-direction by a Y-direction drive mechanism (not shown).

FIG. 7 is a schematic front view showing an exhaust path and a waste liquid path of the resist coating unit (COT) and the developing unit (DEV).

In this resist coating / developing system, the exhaust gas and the waste liquid discharged from the resist coating unit (COT) and the developing unit (DEV) are discharged to the outside of the system through the exhaust path and the waste liquid path. ing.

The exhaust pipe 85 of the tank 83 of each developing unit (DEV) is connected to a common exhaust path 94, and the exhaust pipe 85 of the tank 83 of each resist coating unit (COT) is connected to a common exhaust pipe. The exhaust passages 94 and 95 are connected to a passage 95 and are led to the outside. Exhaust passage 9
Exhaust passages 9 at the time of emergency such as fire, respectively
For example, a closing mechanism 96 as closing means for closing the
97 are provided.

The waste liquid piping 84 of the tank 83 of each developing unit (DEV) is connected to a common waste liquid passage 98, and the waste liquid piping 84 of the tank 83 of each resist coating unit (COT) is shared. Are connected to a waste liquid path 99, and these waste liquid paths 98 and 99 are led out.

The exhaust passages 96 and 97 are connected to the developing unit (DEV) and the resist coating unit (C
OT) is provided separately, but can be shared by one exhaust path. The same applies to the waste liquid passages 98 and 99, and it is possible to use one waste liquid passage in common.

FIG. 8 is a diagram showing an example of the closing mechanisms 96 and 97 as the above-mentioned closing means. A circular closing plate 100 having substantially the same inner diameter as the exhaust passages 94 and 95 is disposed in the exhaust passages 94 and 95, and a shaft 101 provided below the closing plate 100 is rotated in the θ direction by the exhaust passages 94 and 95. The shaft 102 is supported so as to be rotatable, and is rotatably supported in the θ direction by the exhaust paths 94 and 95, and is led out of the exhaust paths 94 and 95.

The upper shaft 102 is connected to a rotary motor 103, and the closing plate 100 is driven to rotate in the θ direction by the rotary motor 103. FIG. 8 shows an emergency state, that is, the closing plate 1.
Reference numeral 00 denotes a state in which the exhaust passages 94 and 95 are closed so that the exhaust gas cannot pass therethrough. Normally, the closing plate 100 is in a state of being rotated 90 ° in the θ direction from this state.

FIG. 9 is a diagram showing a configuration of a control system of the resist coating / developing processing system. The control unit 104 controls the entire system as a whole, and receives signals from, for example, the emergency button 12 described above, the fire alarms 13, 14, 15 and other units in the device, and turns on the alarm lamp 11,
The opening / closing of the closing mechanisms 96 and 97 and other components are controlled.

When the resist coating / developing processing system is arranged in a factory, for example, as shown in FIG. 9, exhaust paths 94 and 95 led out of the system are exhausted in the factory. The exhaust gas is connected to the passage 105, and is collected through, for example, an exhaust tank (not shown) through the exhaust passage 105. The resist coating / developing processing system is connected to a host computer 106 installed in a factory, so that centralized management is performed. For example, upon receiving a signal indicating that a fire has occurred from the fire alarm 107 installed in the factory, the host computer 106 notifies the resist coating / developing processing system of the signal.

Here, the control operation by the control unit 104 will be described.

For example, if a fire occurs in the resist coating / developing processing system and the fire is detected by any of the fire alarms 13, 14, 15 in the system,
The control unit 104 is notified of the detection signal. Upon receiving this notification, the control unit 104 turns on the alarm lamp 11 and sends a closing signal for closing the closing mechanisms 96 and 97. In the closing mechanisms 96 and 97, the motor 103 rotates the closing plate 100 by 90 ° in the θ direction according to the above-described closing signal to bring the state shown in FIG. 8 and close the exhaust passages 94 and 95.
Thus, the fire in the resist coating / developing processing system does not spread to the outside via the exhaust paths 94, 95, and 105. That is, the resist solution and the developing solution usually contain an organic solvent such as thinner, and the fire may reach the outside through the exhaust paths 94, 95, and 105 filled with the solvent atmosphere. , 95, the exhaust paths 94, 95 and the exhaust path 105 are shut off, thereby preventing such a situation.

On the other hand, when a fire occurs in a factory, for example, and the fire alarm 107 detects the fire, a detection signal is sent to the control unit 104 in the system via the host computer 106. The control unit 104 that has received the notification turns on the alarm lamp 11 in the same manner as described above, sends a closing signal for closing the closing mechanisms 96 and 97, and closes the exhaust paths 94 and 95. As a result, the fire in the factory does not spread through the exhaust passages 94, 95, and 105 into the resist coating and developing system.

When the operator presses the emergency button 12, the control unit 104 receiving the notification presses the alarm lamp 1 in the same manner as described above.
1 is turned on, and a closing signal for closing the closing mechanisms 96 and 97 is sent to close the exhaust paths 94 and 95. The closing operation by the emergency button 12 is particularly effective, for example, when the fire alarm does not operate.

In the above-described embodiment, the alarm lamp is turned on and the closing mechanism is closed in the event of an emergency such as a fire. However, the resist solution is supplied from the supply unit to the nozzle 89 shown in FIG. Alternatively, the supply of the developer may be stopped. Thereby, the range over which the fire reaches can be narrowed. Further, after the closing operation, the entire resist coating / developing processing system may be shut down.

In the above-described embodiment, the semiconductor wafer is described as an example of the object to be processed. However, the present invention is not limited to this, and the present invention is applicable to an LCD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, and the like. It is also applicable to ceramic substrates and the like.

[0060]

As described in detail above, according to the present invention,
The exhaust path that discharges the atmosphere inside the processing chamber to the outside of the equipment in the event of an emergency such as a fire inside or outside the equipment is closed, so that the fire outside the equipment can spread through the exhaust path into the equipment and the fire inside the equipment can It can be prevented from spreading from inside to the whole factory.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist coating / developing processing system according to an embodiment of a processing apparatus of the present invention.

FIG. 2 is a front view of the resist coating and developing system shown in FIG.

FIG. 3 is a rear view of the resist coating / developing processing system shown in FIG. 1;

FIG. 4 is a schematic diagram showing a flow of clean air in the resist coating / developing system shown in FIG.

FIG. 5 is a schematic diagram showing a flow of clean air in the resist coating / developing processing system shown in FIG.

FIG. 6 is a cross-sectional view showing a configuration of a resist coating unit (COT) to a developing unit (DEV) in the resist coating / developing processing system shown in FIG.

7 is a schematic front view showing an exhaust path and a waste liquid path of a resist coating unit (COT) and a developing unit (DEV) in the resist coating / developing processing system shown in FIG.

8 is a diagram illustrating a configuration example of a closing mechanism illustrated in FIG. 7;

FIG. 9 is a diagram showing a configuration of a control system of the resist coating / developing processing system shown in FIG.

[Explanation of symbols]

 Reference Signs List 11 alarm lamp 12 abnormal button 13, 14, 15 fire alarm 94, 95 exhaust path 96, 97 closing mechanism 104 control unit 106 host computer W wafer COT resist coating unit DEV developing unit

Claims (5)

[Claims] 1. A processing chamber for performing a process using an organic solvent on an object to be processed, an exhaust path for exhausting an atmosphere in the processing chamber to the outside of the apparatus, and a closing means for closing the exhaust path in an emergency. A processing device characterized by the above-mentioned. 2. A processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting the atmosphere in the processing chamber to the outside of the apparatus, and input means for inputting a fire detection signal from outside the apparatus. A processing device, comprising: a closing unit that closes the exhaust path when the fire detection signal is input. 3. A processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting an atmosphere in the processing chamber to the outside of the apparatus, fire detection means for detecting a fire in the apparatus, A processing apparatus comprising: a closing unit that closes the exhaust path when the fire detecting unit detects a fire. 4. A processing chamber for performing processing using an organic solvent on an object to be processed, an exhaust path for exhausting an atmosphere in the processing chamber to the outside of the apparatus, an emergency button, and when the emergency button is pressed, And a closing means for closing the exhaust passage. 5. The processing apparatus according to claim 1, further comprising a notifying unit for notifying that the exhaust path has been closed by the closing unit. apparatus.