JPH10135579A - Flexible printed wiring board and its manufacturing method - Google Patents
Flexible printed wiring board and its manufacturing methodInfo
- Publication number
- JPH10135579A JPH10135579A JP8288797A JP28879796A JPH10135579A JP H10135579 A JPH10135579 A JP H10135579A JP 8288797 A JP8288797 A JP 8288797A JP 28879796 A JP28879796 A JP 28879796A JP H10135579 A JPH10135579 A JP H10135579A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- conductor
- wiring board
- opening
- photosensitive permanent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板の製造方法に関し、特に両面露出構造に適し
たフレキシブルプリント配線板の製造方法及びプリント
配線板に関する。The present invention relates to a method for manufacturing a flexible printed wiring board, and more particularly to a method for manufacturing a flexible printed wiring board suitable for a double-sided exposed structure and a printed wiring board.
【０００２】[0002]
【従来の技術】両面露出構造フレキシブルプリント配線
板（以下、ＦＰＣと記す）は、図４に示すように、導体
１とその両側に設けられた絶縁層２，３とを有してお
り、両方の絶縁層から導体パターンの露出部４，５が形
成された構造を有している。2. Description of the Related Art As shown in FIG. 4, a flexible printed circuit board having a double-sided exposure structure (hereinafter referred to as FPC) has a conductor 1 and insulating layers 2 and 3 provided on both sides thereof. The exposed portions 4 and 5 of the conductor pattern are formed from the insulating layer.
【０００３】このような構造の両面露出構造ＦＰＣを製
造するために、従来、以下の２つの方法が採用されてい
る。In order to manufacture a double-sided exposed structure FPC having such a structure, the following two methods have conventionally been adopted.
【０００４】第１の方法は以下の手順で行われる。先
ず、図５（ａ）に示すように、接着剤７を有する絶縁フ
ィルム６に導体パターンに対応した開口部８を形成する
孔明け加工を行い、このフィルム６を、図５（ｂ）に示
すように、銅箔からなる導体９に貼り合わせ、更に図５
（ｃ）に示すように、熱硬化型又は紫外線硬化型のイン
クレジスト１０により開口部８を埋める。ここまでで、
第１段階のベース基材作製が終了する。[0004] The first method is performed in the following procedure. First, as shown in FIG. 5A, an insulating film 6 having an adhesive 7 is perforated to form an opening 8 corresponding to a conductor pattern, and this film 6 is shown in FIG. 5B. 5 to the conductor 9 made of copper foil.
As shown in (c), the opening 8 is filled with a thermosetting or ultraviolet curing type ink resist 10. So far,
The first stage base substrate fabrication is completed.
【０００５】次に、前処理研磨を行い。引き続き図５
（ｄ）に示すように、印刷法（印刷→硬化）又は写真法
（ドライフィルムラミネーション→露光→現像）により
エッチングレジストパターン１１を形成し、続いて図５
（ｅ）に示すように、エッチングにより導体９に導体パ
ターン間隙１２を形成し、図５（ｆ）に示すように、レ
ジストを剥離する。これにより回路が形成される。Next, pretreatment polishing is performed. FIG. 5
As shown in (d), an etching resist pattern 11 is formed by a printing method (printing → curing) or a photographic method (dry film lamination → exposure → development).
As shown in FIG. 5E, a conductor pattern gap 12 is formed in the conductor 9 by etching, and the resist is peeled off as shown in FIG. Thereby, a circuit is formed.
【０００６】その後、図５（ｇ）に示すように回路保護
のために用いる接着剤７’が設けられた絶縁フィルム
６’に開口部８’を形成し、図５（ｈ）に示すように、
これをパターンが形成された導体９に貼り合わせ、両面
露出構造ＦＰＣが完成する。なお、これら回路保護のた
めの工程はレジスト印刷で行う場合もある。Thereafter, as shown in FIG. 5 (g), an opening 8 'is formed in the insulating film 6' provided with an adhesive 7 'used for circuit protection, and as shown in FIG. 5 (h). ,
This is bonded to the conductor 9 on which the pattern is formed, and a double-sided exposed structure FPC is completed. In some cases, these steps for protecting the circuit are performed by resist printing.
【０００７】第２の方法は、第１の方法におけるあらか
じめ開口部を設けた絶縁層６を用いる代わりに、絶縁層
のうち少なくとも片面をエキシマレーザ等のレーザビー
ムを用いて孔明けする技術である。The second method is a technique in which at least one surface of the insulating layer is perforated using a laser beam such as an excimer laser instead of using the insulating layer 6 provided with an opening in advance in the first method. .
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、第１の
方法の場合には、両面露出部を形成するにあたり、絶縁
層を導体に貼り合わせる前に、絶縁層に予め開口部を形
成しておく必要があるため、孔明け済み絶縁フィルムを
取り扱わざるを得ず、従って導体パターンと開口部との
位置合わせが困難であるとともに、工程数が多くなると
いう欠点がある。However, in the case of the first method, when forming the exposed portions on both surfaces, it is necessary to form an opening in the insulating layer before bonding the insulating layer to the conductor. Therefore, it is necessary to handle the perforated insulating film, so that it is difficult to position the conductor pattern and the opening, and the number of steps is increased.
【０００９】また、第２の方法の場合は、開口部を形成
する際の位置合わせ精度は良好であるものの、特殊で高
価なレーザ装置を使用するため、製造コストが高くなる
という欠点がある。In the case of the second method, although the alignment accuracy when forming the opening is good, there is a disadvantage that the manufacturing cost is high because a special and expensive laser device is used.
【００１０】本発明はかかる問題点に鑑みてなされたも
のであって、絶縁層に開口部を形成する際の位置合わせ
精度が良好で、工程数が少なく、かつ高価な装置を用い
ずに製造することができるフレキシブル配線板の製造方
法及びフレキシブル配線板を提供することを目的とす
る。The present invention has been made in view of the above problems, and has a good alignment accuracy when forming an opening in an insulating layer, has a small number of steps, and is manufactured without using expensive equipment. It is an object of the present invention to provide a flexible wiring board manufacturing method and a flexible wiring board that can be manufactured.
【００１１】[0011]
【課題を解決するための手段】本発明に係るフレキシブ
ルプリント配線板の製造方法は、導体の一方の面に感光
性永久絶縁層を形成する工程と、前記感光性永久絶縁層
を露光し現像することにより開口部を形成する工程と、
前記導体の回路を形成する工程と、を有することを特徴
とする。According to the method of manufacturing a flexible printed wiring board of the present invention, a step of forming a photosensitive permanent insulating layer on one surface of a conductor, and exposing and developing the photosensitive permanent insulating layer. Forming an opening by doing
Forming a circuit of the conductor.
【００１２】また、上記フレキシブルプリント配線板の
製造方法において、前記導体の回路の上に、他の感光性
永久絶縁層を形成する工程と、前記他の感光性永久絶縁
層を露光し現像することにより開口部を形成する工程と
を更に有していてもよい。In the above method for manufacturing a flexible printed wiring board, a step of forming another photosensitive permanent insulating layer on the conductor circuit, and exposing and developing the other photosensitive permanent insulating layer. And a step of forming an opening by the method.
【００１３】本発明に係るフレキシブルプリント配線板
は、導体回路と、その両側に設けられ、開口部を有する
感光性永久絶縁層とを有する。A flexible printed wiring board according to the present invention has a conductor circuit and a photosensitive permanent insulating layer provided on both sides thereof and having an opening.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施の形態につい
て具体的に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below.
【００１５】図１（ａ）乃至（ｇ）は、本発明の一実施
形態に係る両面露出構造ＦＰＣの製造方法を工程順に示
す断面図である。この方法は、（１）ベース基材の作
製、（２）回路形成及び片面の開口部形成、（３）回路
保護及びもう一方の片面の開口部形成の３段階からな
る。FIGS. 1A to 1G are sectional views showing a method of manufacturing a double-sided exposure structure FPC according to an embodiment of the present invention in the order of steps. This method comprises three steps: (1) preparation of a base material, (2) formation of a circuit and formation of an opening on one side, and (3) protection of the circuit and formation of an opening on the other side.
【００１６】（１）ベース基材の作製 先ず、図１（ａ）に示すように、銅箔などの導体２１の
両面に、ドライフィルム状のエッチングレジスト２２と
感光性永久絶縁フィルム２３とを、６０〜１００℃の温
度で同時に熱圧着してラミネートする。(1) Preparation of Base Material First, as shown in FIG. 1A, a dry film-shaped etching resist 22 and a photosensitive permanent insulating film 23 are provided on both sides of a conductor 21 such as a copper foil. Laminate by simultaneous thermocompression bonding at a temperature of 60 to 100 ° C.
【００１７】なお、ドライフィルム状のエッチングレジ
スト２２を熱圧着する代わりに、図２に示すようなレジ
ストインク２２’を塗布してもよい。Instead of thermocompression-bonding the dry film-shaped etching resist 22, a resist ink 22 'as shown in FIG. 2 may be applied.
【００１８】（２）回路形成及び片面の開口部形成 次いで、両面を同時に露光し、現像する。これにより、
図１（ｂ）に示すように、エッチングレジスト２２には
回路用パターン２４が形成され、感光性永久絶縁フィル
ム２３には開口部２５が形成される。ここで露光条件と
しては例えば５０〜２５０ｍＪ／ｃｍ2が採用される。
また、現像液としては例えば３０℃の１％炭酸ナトリウ
ム水溶液が採用される。(2) Circuit formation and formation of an opening on one side Next, both sides are simultaneously exposed and developed. This allows
As shown in FIG. 1B, a circuit pattern 24 is formed in the etching resist 22, and an opening 25 is formed in the photosensitive permanent insulating film 23. Here, for example, 50 to 250 mJ / cm 2 is adopted as the exposure condition.
As the developing solution, for example, a 1% aqueous solution of sodium carbonate at 30 ° C. is employed.
【００１９】次いで、図１（ｃ）に示すように、感光性
永久絶縁フィルム２３の開口部２５をレジストインク２
６で印刷法により孔埋めして硬化し、続いて図１（ｄ）
に示すように、導体２１をエッチングし、回路２７を形
成する。この場合に、レジストインクとしては熱硬化型
（硬化条件：８０〜１２０℃、３０分間）又は紫外線
（ＵＶ）硬化型（硬化条件：１．５〜３Ｊ／ｃｍ2）の
ものを採用することができる。Next, as shown in FIG. 1C, the opening 25 of the photosensitive permanent insulating film 23 is
In step 6, the holes are filled by printing and cured, and then FIG.
2C, the conductor 21 is etched to form a circuit 27. In this case, a thermosetting type (curing condition: 80 to 120 ° C., 30 minutes) or an ultraviolet (UV) curable type (curing condition: 1.5 to 3 J / cm 2 ) may be used as the resist ink. it can.
【００２０】その後、レジスト２２、レジストインク２
６を剥離して、図１（ｅ）に示す状態とする。剥離液と
しては例えば２％の水酸化ナトリウムが採用される。こ
の場合に、感光性永久絶縁フィルム２３は、上記図１
（ｃ）の工程におけるレジストインク２６の硬化の際に
ある程度キュアされているのでエッチングされず、エッ
チングレジスト２２とレジストインク２６のみが選択的
に剥離される。Thereafter, the resist 22 and the resist ink 2
6 is peeled off to obtain a state shown in FIG. As the stripping solution, for example, 2% sodium hydroxide is employed. In this case, the photosensitive permanent insulating film 23 corresponds to FIG.
Since the resist ink 26 is cured to some extent during the curing of the resist ink 26 in the step (c), it is not etched and only the etching resist 22 and the resist ink 26 are selectively peeled off.
【００２１】（３）回路保護及びもう一方の片面の開口
部形成 レジスト剥離後、図１（ｆ）に示すように、感光性永久
絶縁フィルム２８を回路２７の上に熱圧着する。(3) Circuit protection and formation of an opening on the other side After the resist is peeled off, a photosensitive permanent insulating film 28 is thermocompression-bonded on the circuit 27 as shown in FIG.
【００２２】次いで、感光性永久絶縁フィルム２８を露
光し、現像して開口部２９を形成すし、最後に感光性永
久絶縁フィルム２３，２８をキュアさせる。ここで露光
条件としては例えば５０〜２５０ｍＪ／ｃｍ2が採用さ
れ、現像液としては例えば３０℃の１％炭酸ナトリウム
水溶液が採用される。また、感光性永久絶縁フィルムの
キュア条件としては、例えば１５０〜１７０℃、５０〜
７０分が採用される。Next, the photosensitive permanent insulating film 28 is exposed and developed to form an opening 29, and finally, the photosensitive permanent insulating films 23 and 28 are cured. Here, for example, the exposure condition is 50 to 250 mJ / cm 2 , and the developing solution is, for example, a 1% aqueous solution of sodium carbonate at 30 ° C. The curing condition of the photosensitive permanent insulating film is, for example, 150 to 170 ° C., 50 to 170 ° C.
70 minutes are employed.
【００２３】以上の工程により、導体回路２７と、その
両側に設けられ、それぞれ開口部（露出部）２５及び２
９を有する感光性永久絶縁フィルム２３及び２８とを備
えた両面露出構造のＦＰＣが得られる。Through the above steps, the conductor circuit 27 and the openings (exposed portions) 25 and 2 provided on both sides thereof are provided.
Thus, an FPC having a double-sided exposure structure including the photosensitive permanent insulating films 23 and 28 having a thickness of 9 is obtained.
【００２４】このように、従来の接着剤付き絶縁フィル
ムの代わりに、感光性を有する永久絶縁層を使用するの
で、開口部の形成は、絶縁フィルムを導体に貼り合わせ
た後にすることができ、しかも開口部の形成を写真法で
行うので、従来の孔明け済み絶縁フィルムを貼り合わせ
る方法に比較して位置合わせ精度が向上する。As described above, since the permanent insulating layer having photosensitivity is used instead of the conventional insulating film with an adhesive, the opening can be formed after the insulating film is bonded to the conductor. Moreover, since the openings are formed by a photographic method, the positioning accuracy is improved as compared with the conventional method of bonding a perforated insulating film.
【００２５】また、従来のように、柔らかくて薄く、い
わゆる腰のないフィルムを枚葉で取り扱う工程がなくな
るため、自動化工程への置き換えが可能になり、結果と
して工程数を減少させることができる。In addition, since there is no step of handling a soft and thin, so-called stiff film in a single sheet as in the conventional case, it is possible to replace the film with an automatic step, and as a result, the number of steps can be reduced.
【００２６】更に、レーザのような特殊で高価な装置を
用いる必要はなく、従来から用いられてきたプリント板
製造装置を適用することができるので、低コストで製造
することができる。Further, it is not necessary to use a special and expensive apparatus such as a laser, and a conventionally used printed board manufacturing apparatus can be applied, so that the manufacturing can be performed at low cost.
【００２７】なお、本発明は上記実施の形態に限定され
ることなく、種々の変形が可能である。例えば上記例で
は、両面露出構造のＦＰＣを製造する例について示した
が、これに限ものではない。また、上記各工程の条件等
もそれに限るものではなく、得ようとするＦＰＣに応じ
て適宜設定すればよい。The present invention is not limited to the above embodiment, but can be variously modified. For example, in the above example, an example of manufacturing an FPC having a double-sided exposure structure has been described, but the present invention is not limited to this. Further, the conditions and the like of each of the above steps are not limited thereto, and may be appropriately set according to the FPC to be obtained.
【００２８】なお、本発明で使用する感光性永久絶縁フ
ィルムは、材料の有する機能・特性に依存するが、ドリ
ル又はパンチングでは形成することができない微小孔を
写真法により形成することができる。従って、図３に示
すように、ベース絶縁層３１上に導体回路３２を形成
し、その上に感光性永久絶縁フィルム３３を形成して、
そのフィルム３３に微小孔を形成し、そこにメッキ法で
マイクロバンプ３４を形成することにより、マイクロ接
続部を有するＦＰＣ構造を得ることができる。The photosensitive permanent insulating film used in the present invention can form micropores, which cannot be formed by drilling or punching, by a photographic method, depending on the functions and characteristics of the material. Accordingly, as shown in FIG. 3, a conductive circuit 32 is formed on the base insulating layer 31, and a photosensitive permanent insulating film 33 is formed thereon,
By forming micro holes in the film 33 and forming micro bumps 34 thereon by plating, an FPC structure having a micro connection portion can be obtained.
【００２９】[0029]
【発明の効果】以上説明したように、本発明によれば、
従来の接着剤付き絶縁フィルムの代わりに、感光性を有
する永久絶縁層を使用するので、貼り合わせた後に写真
法により開口部を形成することができ、孔明け済み絶縁
フイルムを位置合わせしながら貼り合わせる必要がなく
なるので、位置合わせ精度が向上する。また、従来の接
着剤付き絶縁層で問題となる接着剤の開口部ないへのし
み出しがなくなり、設計値との不整合がなくなる。更
に、従来のように、柔らかくて薄いフィルムを枚葉で取
り扱う工程がなくなるため、自動化が容易になり、結果
として工程数を減少させることができ、品質も向上す
る。更にまた、レーザのような特殊で高価な装置を用い
る必要はなく、従来装置をそのまま適用することができ
るので、低コストで製造することができる。As described above, according to the present invention,
Since a permanent insulating layer with photosensitivity is used instead of the conventional insulating film with adhesive, an opening can be formed by photographic method after lamination, and the perforated insulating film can be bonded and aligned. Since there is no need for alignment, the alignment accuracy is improved. In addition, the problem of a conventional insulating layer with an adhesive that does not exude to the opening of the adhesive, which is a problem, is eliminated, and the mismatch with the design value is eliminated. Furthermore, since there is no step of handling a soft and thin film in a single wafer as in the conventional case, automation is facilitated, and as a result, the number of steps can be reduced and the quality is improved. Furthermore, it is not necessary to use a special and expensive device such as a laser, and the conventional device can be applied as it is, so that the device can be manufactured at low cost.
【図１】本発明の一実施形態に係る両面露出構造ＦＰＣ
の製造方法を説明するための図である。FIG. 1 is a double-sided exposure structure FPC according to an embodiment of the present invention.
FIG. 7 is a diagram for explaining the manufacturing method of the first embodiment.
【図２】エッチングレジストにレジストインクを使用し
た際の状態を示す図である。FIG. 2 is a diagram showing a state when a resist ink is used as an etching resist.
【図３】本発明を適用したマイクロ接続部を有するＦＰ
Ｃの構造を示す断面図である。FIG. 3 is an FP having a micro connection portion to which the present invention is applied.
It is sectional drawing which shows the structure of C.
【図４】従来の両面露出構造ＦＰＣを示す断面図であ
る。FIG. 4 is a cross-sectional view showing a conventional double-sided exposure structure FPC.
【図５】従来の両面露出構造ＦＰＣの製造方法を説明す
るための図である。FIG. 5 is a view for explaining a method of manufacturing a conventional double-sided exposure structure FPC.
２１：導体 ２２：エッチングレジスト ２３、２８：感光性永久絶縁フィルム ２４：回路パターン ２５、２９：開口部 ２６：レジストインク ２７：回路 21: Conductor 22: Etching resist 23, 28: Photosensitive permanent insulating film 24: Circuit pattern 25, 29: Opening 26: Resist ink 27: Circuit
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１０月３１日[Submission date] October 31, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】図面[Document name to be amended] Drawing
【補正対象項目名】図１[Correction target item name] Fig. 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図１】 FIG.
Claims (3)
成する工程と、 前記感光性永久絶縁層を露光し現像することにより開口
部を形成する工程と、 前記導体の回路を形成する工程と、を有することを特徴
とするフレキシブルプリント配線板の製造方法。1. A step of forming a photosensitive permanent insulating layer on one surface of a conductor, a step of exposing and developing the photosensitive permanent insulating layer to form an opening, and forming a circuit of the conductor. And a process for producing a flexible printed wiring board.
絶縁層を形成する工程と、前記他の感光性永久絶縁層を
露光し現像することにより開口部を形成する工程とを更
に有することを特徴とする請求項１に記載のフレキシブ
ルプリント配線板の製造方法。2. The method according to claim 1, further comprising: forming another photosensitive permanent insulating layer on the conductor circuit; and exposing and developing the other photosensitive permanent insulating layer to form an opening. The method for manufacturing a flexible printed wiring board according to claim 1, wherein:
部を有する感光性永久絶縁層とを備えたことを特徴とす
るフレキシブルプリント配線板。3. A flexible printed wiring board comprising a conductor circuit and a photosensitive permanent insulating layer provided on both sides thereof and having an opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8288797A JPH10135579A (en) | 1996-10-30 | 1996-10-30 | Flexible printed wiring board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8288797A JPH10135579A (en) | 1996-10-30 | 1996-10-30 | Flexible printed wiring board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10135579A true JPH10135579A (en) | 1998-05-22 |
Family
ID=17734863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8288797A Pending JPH10135579A (en) | 1996-10-30 | 1996-10-30 | Flexible printed wiring board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10135579A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076535A (en) * | 2000-08-31 | 2002-03-15 | Sumitomo Metal Mining Co Ltd | Wiring board, substrate therefor, and their manufacturing methods |
| KR100396866B1 (en) * | 2001-02-26 | 2003-09-03 | 산양전기주식회사 | manufacturing method of flexible printed circuit board used photosensitivity insulating material |
-
1996
- 1996-10-30 JP JP8288797A patent/JPH10135579A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076535A (en) * | 2000-08-31 | 2002-03-15 | Sumitomo Metal Mining Co Ltd | Wiring board, substrate therefor, and their manufacturing methods |
| JP4505700B2 (en) * | 2000-08-31 | 2010-07-21 | 住友金属鉱山株式会社 | Wiring substrate base material and method for manufacturing wiring substrate. |
| KR100396866B1 (en) * | 2001-02-26 | 2003-09-03 | 산양전기주식회사 | manufacturing method of flexible printed circuit board used photosensitivity insulating material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100688826B1 (en) | Manufacturing method of rigid flexible printed circuit board | |
| JP2000174435A (en) | Printed circuit card and manufacture thereof | |
| US4597177A (en) | Fabricating contacts for flexible module carriers | |
| JP3031042B2 (en) | Printed wiring board for surface mounting | |
| KR20020050720A (en) | Processes for manufacturing multilayer flexible wiring boards | |
| JPH10135599A (en) | Method of manufacturing flexible printed wiring board | |
| JPH07263837A (en) | Manufacture of double-sided wiring board | |
| JPH10135579A (en) | Flexible printed wiring board and its manufacturing method | |
| JPH09232741A (en) | Printed-wiring board | |
| US6274291B1 (en) | Method of reducing defects in I/C card and resulting card | |
| JP2003017852A (en) | Rigid flex printed-wiring board and manufacturing method therefor | |
| JPH1079561A (en) | Wiring board and forming method thereof | |
| JP2003273510A (en) | Manufacturing method for printed substrate | |
| JP2910261B2 (en) | Printed wiring board and its manufacturing method | |
| KR100797695B1 (en) | Manufacturing method of rigid-flexible printed circuit board | |
| JPH0567871A (en) | Printed-wiring board and manufacture thereof | |
| JP2001332840A (en) | Manufacturing method of printed-wiring board | |
| JPH118465A (en) | Manufacture of printed wiring board through additive method | |
| JP4359991B2 (en) | Film carrier manufacturing method | |
| JPH06177505A (en) | Manufacture of printed wiring board | |
| KR100366414B1 (en) | The circuit pattern making method for PCB | |
| JP2000181074A (en) | Method for exposing photosensitive layer | |
| JP2002164637A (en) | Method for manufacturing flexible wiring board | |
| JP2833601B2 (en) | Manufacturing method of printed wiring board | |
| JPH11289151A (en) | Surface protection layer forming method for circuit substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 5 Free format text: PAYMENT UNTIL: 20080704 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20090704 |
|
| LAPS | Cancellation because of no payment of annual fees |