JPH10126917A - Terminal structure of superconducting cable conductor and jointing method therefor - Google Patents

Terminal structure of superconducting cable conductor and jointing method therefor

Info

Publication number
JPH10126917A
JPH10126917A JP8278024A JP27802496A JPH10126917A JP H10126917 A JPH10126917 A JP H10126917A JP 8278024 A JP8278024 A JP 8278024A JP 27802496 A JP27802496 A JP 27802496A JP H10126917 A JPH10126917 A JP H10126917A
Authority
JP
Japan
Prior art keywords
terminal
layer
wire
terminal structure
terminal member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8278024A
Other languages
Japanese (ja)
Other versions
JP3796850B2 (en
Inventor
Norihiro Saga
宣弘 嵯峨
Jun Fujigami
純 藤上
Kazuya Daimatsu
一也 大松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP27802496A priority Critical patent/JP3796850B2/en
Publication of JPH10126917A publication Critical patent/JPH10126917A/en
Application granted granted Critical
Publication of JP3796850B2 publication Critical patent/JP3796850B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Abstract

PROBLEM TO BE SOLVED: To provide a terminal structure, for a superconducting cable conductor having such a structure as a superconducting wire is wound in layer around a core member which can be formed through a simple process while decreasing the resistance. SOLUTION: At the terminal part of a superconducting cable conductor 20 where a superconducting wire is wound in layer around a core member, the wire of each layer is removed partially to form a structure where the wires 21a, 21b, 21c, 21d of respective layers are exposed selectively. The exposed layers are then bonded, respectively, with terminal members 10a 10b, 10c, 10d. The terminal member 10a-10d has a ring part into which the conductor is inserted and secured in place by soldering.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、大容量の電流を低
損失で送ることが可能な超電導ケーブル導体の端末構造
およびその接続方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure of a superconducting cable conductor capable of transmitting a large amount of current with low loss and a method of connecting the terminal structure.

【0002】[0002]

【従来の技術】酸化物超電導線材、たとえばBi222
3高温超電導テープ線材は、液体窒素温度で使用が可能
であり、比較的高い臨界電流密度を有し、さらに長尺化
が容易なため、超電導ケーブルやマグネットへの応用が
期待されている。Bi2223高温超電導テープ線材を
集合した超電導ケーブルの研究もなされており、50m
導体が作製されるまでになってきている。
2. Description of the Related Art Oxide superconducting wires such as Bi222
(3) Since the high-temperature superconducting tape wire can be used at the temperature of liquid nitrogen, has a relatively high critical current density, and can be easily made longer, it is expected to be applied to superconducting cables and magnets. Research has been conducted on superconducting cables composed of Bi2223 high-temperature superconducting tape wires,
Conductors are being manufactured.

【0003】テープ線材をフォーマ上に多数集合した構
造を有するケーブル導体の具体例を図12に示す。図1
2(a)に示すように、超電導ケーブル導体はたとえば
超電導線材が4層でフォーマ110の周りに巻付けられ
た構造を有している。第1層、第2層、第3層および第
4層に、それぞれ複数の線材101a、101b、10
1cおよび101dが円筒状のフォーマ110の周囲に
螺旋状に巻付けられている。図10(b)はケーブル導
体の側面を示すものであり、最外層のテープ状線材10
1dが螺旋状に巻付けられた様子を示している。また、
第1層と第2層との間、第2層と第3層との間、第3層
と第4層との間には、それぞれ絶縁層102a、102
bおよび102cが設けられている。
FIG. 12 shows a specific example of a cable conductor having a structure in which a large number of tape wires are assembled on a former. FIG.
As shown in FIG. 2A, the superconducting cable conductor has, for example, a structure in which a superconducting wire is wound around the former 110 in four layers. A plurality of wire rods 101a, 101b, 10 are provided on the first, second, third and fourth layers, respectively.
1c and 101d are spirally wound around a cylindrical former 110. FIG. 10B shows a side surface of the cable conductor, and the outermost layer of the tape-shaped wire 10
1d shows a state of being spirally wound. Also,
Between the first layer and the second layer, between the second layer and the third layer, and between the third layer and the fourth layer, insulating layers 102a and 102
b and 102c are provided.

【0004】図12に示すような導体に電力を供給する
場合、端末に何らかの処理を施す必要がある。たとえ
ば、図12(b)に示すような導体の末端から所定の長
さLまでの部分について、絶縁層を除き、すべての線材
をはんだ付けにより一体化することができる。このよう
な一体化を行なう場合、端末部の接続抵抗をなるべく小
さくかつ均一にするために、線材を1本ずつはんだ付け
して一体化された構造を形成することができる。
When power is supplied to a conductor as shown in FIG. 12, it is necessary to perform some processing on the terminal. For example, as for the portion from the end of the conductor to a predetermined length L as shown in FIG. 12B, all the wires except for the insulating layer can be integrated by soldering. When performing such integration, in order to make the connection resistance of the terminal portion as small and uniform as possible, it is possible to form an integrated structure by soldering the wires one by one.

【0005】[0005]

【発明が解決しようとする課題】線材を機械的に集合さ
せ長尺の導体を工業的に生産しようとする場合、線材を
1本1本はんだ付けして端末部を形成する方法は非効率
である。また、1本1本はんだ付けを行なう作業によれ
ば、どうしても接続抵抗が数μΩという高いレベルに達
し、またその抵抗値も作業によって比較的大きくばらつ
く。したがって、より簡便でかつ確実な処理により端末
構造を形成することが要求される。また、端末部の抵抗
は小さいほど望ましく、製品毎の抵抗値もばらつきが小
さいほど望ましい。
In the case of industrially producing long conductors by mechanically assembling wires, a method of soldering wires one by one to form a terminal portion is inefficient. is there. Further, according to the work of performing the soldering one by one, the connection resistance always reaches a high level of several μΩ, and the resistance value also varies relatively largely by the work. Therefore, it is required to form a terminal structure by simpler and more reliable processing. Also, the resistance of the terminal portion is desirably smaller, and the resistance value of each product is desirably smaller.

【0006】また、多層導体では、層間のインピーダン
スの相違により、各層を流れる電流値が均一ではなくな
る偏流現象が起こる可能性が高い。その場合、導体に生
じる交流損失量が電流分布によって異なってくるため、
各層毎の通電電流分布などの特性を把握しておく必要が
でてくる。また、導体の外層から先に電流が流れるよう
な偏流現象が起きると、各層に均一に電流が流れる場合
に比較して交流損失が大きくなる可能性がある。また、
層と層との間の絶縁が十分に確保されていないと、層間
の接触コンダクタンスにより電流の乗り移りが生じて、
損失の増大を招くことになる。
Further, in a multilayer conductor, there is a high possibility that a drift phenomenon in which a current value flowing in each layer becomes uneven due to a difference in impedance between the layers. In that case, the amount of AC loss generated in the conductor depends on the current distribution,
It is necessary to grasp the characteristics such as the distribution of the conduction current for each layer. Further, when a drift phenomenon in which a current flows first from the outer layer of the conductor occurs, there is a possibility that an AC loss is increased as compared with a case where a current flows uniformly in each layer. Also,
If the insulation between the layers is not ensured, the current conductance occurs due to the contact conductance between the layers,
This results in increased losses.

【0007】本発明の目的は、簡便な処理により形成す
ることができ、かつ抵抗値の小さな端末構造を提供する
ことである。
An object of the present invention is to provide a terminal structure which can be formed by a simple process and has a small resistance value.

【0008】本発明のさらなる目的は、超電導線材が層
状に集合されたケーブル導体において各層の通電電流値
を測定することが可能な端末構造を提供することであ
る。
A further object of the present invention is to provide a terminal structure capable of measuring a current value of each layer in a cable conductor in which superconducting wires are assembled in layers.

【0009】本発明のさらなる目的は、超電導ケーブル
導体における層間の電流分布を均一化することのできる
ような手段を提供することである。
It is a further object of the present invention to provide a means by which the current distribution between layers in a superconducting cable conductor can be made uniform.

【0010】[0010]

【課題を解決するための手段】本発明により、複数の超
電導線材を芯材の周囲に層状に巻付けた構造を有する超
電導ケーブル導体の端末構造であって、複数の線材のう
ち外層にある線材が表面に存在する外層部と、外層部の
周囲に設けられかつ外層部にある線材と接合された端子
部材と、複数の線材のうち外層にある線材がなくかつ内
層にある線材が露出されている内層部と、内層部の周囲
に設けられかつ内層部にある線材と接合された端子部材
とを備える端末構造が提供される。
According to the present invention, there is provided a terminal structure of a superconducting cable conductor having a structure in which a plurality of superconducting wires are wound in a layer around a core material, wherein a wire material in an outer layer of the plurality of wires is provided. The outer layer portion present on the surface, the terminal member provided around the outer layer portion and joined to the wire material in the outer layer portion, and the wire material in the inner layer without the wire material in the outer layer of the plurality of wire materials is exposed. And a terminal member provided around the inner layer portion and connected to a wire rod in the inner layer portion.

【0011】本発明に従う端末構造は、特に、ケーブル
導体の末端にいくに従って、最外層の線材から最内層の
線材まで順に各層の線材が選択的に露出されている構造
を有することが好ましい。露出されている各層の周囲に
は、それぞれ端子部材が接合されている。
The terminal structure according to the present invention preferably has a structure in which the wires of each layer are selectively exposed in order from the outermost wire to the innermost wire as the terminal ends of the cable conductor. A terminal member is bonded to each of the exposed layers.

【0012】本発明の端末構造において、外層と内層と
の間にある絶縁材により、それぞれの層に設けられた端
子部材同士は電気的に絶縁されていることが好ましい。
In the terminal structure of the present invention, it is preferable that the terminal members provided on each layer are electrically insulated from each other by the insulating material between the outer layer and the inner layer.

【0013】各層に接合するための端子部材は、線材の
層を取囲む環状部と、環状部から突き出た突起部とを有
することができる。このような端子部材の環状部にケー
ブル導体の各層を挿入し、接合させることができる。ま
た、この端子部材の突起部には、ロゴスキーコイルを挿
入することもできる。環状部と突起部とを有する該端子
部材を各層毎に設けた場合、各端子部材の突起部にロゴ
スキーコイルを挿入することにより、各層毎の通電電流
分布を検出することができる。
[0013] The terminal member for bonding to each layer may have an annular portion surrounding the wire layer and a projection protruding from the annular portion. Each layer of the cable conductor can be inserted into and joined to the annular portion of such a terminal member. Also, a Rogowski coil can be inserted into the projection of the terminal member. When the terminal member having the annular portion and the protruding portion is provided for each layer, by inserting a Rogowski coil into the protruding portion of each terminal member, it is possible to detect the current distribution for each layer.

【0014】本発明を構成する端子部材は、線材の層を
取囲むように設け、該部材と線材との間にはんだを流し
込むことにより接合することが好ましい。たとえば、ケ
ーブル導体の端末部分において所定の層の部分をリング
状の端子部材に挿入し、その間にはんだを流し込んで固
定することができる。リング状の端子部材とそれに挿入
されるケーブル導体端末部との距離は、流し込まれるは
んだが薄く均一に流れ込むよう、所定の値とされる。ま
た、端子部材には、はんだを流し込むための孔を形成す
ることができる。
It is preferable that the terminal member constituting the present invention is provided so as to surround the layer of the wire, and is joined by pouring a solder between the member and the wire. For example, a predetermined layer portion at the end portion of the cable conductor can be inserted into a ring-shaped terminal member, and solder can be poured between the terminal portions and fixed. The distance between the ring-shaped terminal member and the cable conductor terminal inserted into the ring-shaped terminal member is set to a predetermined value so that the poured solder flows thinly and uniformly. Further, a hole for pouring the solder can be formed in the terminal member.

【0015】本発明によれば、端子部材が接合された端
末部分の抵抗値を1μΩ以下にすることができる。
According to the present invention, the resistance value of the terminal portion to which the terminal member is joined can be made 1 μΩ or less.

【0016】本発明は、芯材状に超電導線材が2層以上
で巻付けられた導体に適用される。芯材状に巻かれる超
電導線材は、たとえば酸化物超電導線材とすることがで
きる。特に、(Bi,Pb)2 Sr2 Ca2 Cu3
10-X(0≦X<1)等のビスマス系2223相酸化物超
電導体とそれを覆う安定化マトリックスとを備えるテー
プ状線材が層状に巻かれたケーブル用導体について本発
明を好ましく適用することができる。このテープ状線材
において安定化マトリックスには銀または銀合金が用い
られる。
The present invention is applied to a conductor in which a superconducting wire is wound in two or more layers in a core shape. The superconducting wire wound in a core shape can be, for example, an oxide superconducting wire. In particular, (Bi, Pb) 2 Sr 2 Ca 2 Cu 3 O
The present invention is preferably applied to a cable conductor in which a tape-shaped wire having a bismuth-based 2223-phase oxide superconductor such as 10-X (0 ≦ X <1) and a stabilizing matrix covering the same is wound in a layered manner. Can be. In this tape-shaped wire, silver or a silver alloy is used for the stabilizing matrix.

【0017】さらに、本発明は、上述した端末構造同士
を電気的に接続する方法を提供する。接続すべき1対の
端末構造のうち一方の端末構造において外層部に接合さ
れた端子部材と、他方の端末構造において内層部に接合
された端子部材とを接合する。さらに、該一方の端末構
造における内層部に接合された端子部材と、該他方の端
末構造において外層部に接合された端子部材とを接続す
る。n(nは2以上の整数)層で線材が巻付けられた導
体において各層毎に端子部材が設けられた端末構造同士
を接合する場合、一方の端末構造における最外層(n層
目)の端子部材と、他方の端末構造における最内層(1
層目)の端子部材とが接続される。そして順次、一方の
端末構造における(n−i)層目(iは1以上の整数)
の端子部材と他方の端末構造における(1+i)層目の
端子部材とが接続される。端子部材が環状部と環状部か
ら突き出た突起部とを有するものである場合、突起部同
士を接続することにより、端末構造同士の接続を行なう
ことができる。
Further, the present invention provides a method for electrically connecting the terminal structures described above. The terminal member joined to the outer layer in one terminal structure of the pair of terminal structures to be connected is joined to the terminal member joined to the inner layer in the other terminal structure. Further, the terminal member joined to the inner layer portion of the one terminal structure is connected to the terminal member joined to the outer layer portion of the other terminal structure. When joining terminal structures provided with terminal members for each layer in a conductor wound with a wire in n (n is an integer of 2 or more) layers, the terminal of the outermost layer (nth layer) in one terminal structure The member and the innermost layer (1
Layer) is connected to the terminal member. And sequentially, the (ni) th layer (i is an integer of 1 or more) in one terminal structure
And the terminal member of the (1 + i) th layer in the other terminal structure are connected. When the terminal member has an annular portion and a projection protruding from the annular portion, the terminal structures can be connected to each other by connecting the projections.

【0018】本発明の端末構造では外層部と内層部とに
それぞれ端子部材が接合されている。この構造を採用す
ることにより、以下に具体的に述べるように、端末処理
の工程が簡単なものとなり、端末処理を機械的に行なう
ことも可能になる。また、端末処理のために線材の層を
取囲む端子部材を用いれば、端末部分に発生する抵抗値
も所定の低いレベルに再現性よく抑えることができる。
導体の構造および材質等に応じて端子部材のサイズおよ
び材質等を適宜設定することにより、端末に生ずる抵抗
値を低いレベルにコントロールすることができるからで
ある。さらに、互いに絶縁された層毎に端子部材を設
け、各端子部材に流れる電流によって生成される磁界の
時間的変化に基づく誘導電圧をロゴスキーコイルによっ
て検出すれば、各層毎の通電電流分布を求めることがで
きる。これは、導体の特性を知る上で非常に有用であ
る。また、外層と内層のそれぞれに端子部材を設けれ
ば、上述したような接続方法が可能になる。すなわち、
1対の超電導ケーブル導体を接続するにあたり、一方の
外層部と他方の内層部とを端子部材を介して容易に接続
することができる。このような接続を行なえば、外層に
より多くの電流が流れる偏流現象を抑制し、交流損失を
低減することができる。以下、具体例によって本発明を
より詳細に説明する。
In the terminal structure of the present invention, the terminal members are joined to the outer layer and the inner layer, respectively. By adopting this structure, as will be specifically described below, the terminal processing steps are simplified, and the terminal processing can be performed mechanically. Further, if a terminal member surrounding the wire layer is used for the terminal treatment, the resistance value generated at the terminal part can be suppressed to a predetermined low level with good reproducibility.
This is because the resistance value generated at the terminal can be controlled to a low level by appropriately setting the size and material of the terminal member according to the structure and material of the conductor. Further, a terminal member is provided for each layer that is insulated from each other, and if an induced voltage based on a temporal change of a magnetic field generated by a current flowing through each terminal member is detected by a Rogowski coil, a distribution of a conduction current for each layer is obtained. be able to. This is very useful for knowing the characteristics of the conductor. In addition, if the terminal members are provided in each of the outer layer and the inner layer, the above-described connection method becomes possible. That is,
In connecting a pair of superconducting cable conductors, one outer layer and the other inner layer can be easily connected via a terminal member. By making such a connection, it is possible to suppress the drift phenomenon in which more current flows through the outer layer, and reduce the AC loss. Hereinafter, the present invention will be described in more detail with reference to specific examples.

【0019】[0019]

【発明の実施の形態】図1は、本発明に用いる端子部材
の一具体例を示している。端子部材10は、円筒状であ
るパイプ部12と板状の突起部14とからなる。パイプ
部12には2つの孔16aおよび16bが形成されてい
る。これらのうち1つは後述するようにはんだを流し込
むための孔として働き、もう1つははんだを流し込む際
の空気抜きの孔として働く。パイプ部12からは所定の
長さで板状の突起部14が突き出している。突起部14
にはねじ止めのための孔18が形成されている。このよ
うな形状を有する端子部材を用いて端末処理を行なうプ
ロセスの一具体例を図2に示す。
FIG. 1 shows a specific example of a terminal member used in the present invention. The terminal member 10 includes a cylindrical pipe portion 12 and a plate-shaped protrusion 14. The pipe portion 12 has two holes 16a and 16b. One of these functions as a hole for pouring the solder as described later, and the other functions as a hole for venting the air when the solder is poured. A plate-shaped protrusion 14 projects from the pipe 12 with a predetermined length. Projection 14
Is formed with a hole 18 for screwing. FIG. 2 shows a specific example of a process for performing terminal processing using a terminal member having such a shape.

【0020】たとえば、図12に示すような4層導体に
ついて端末処理を行なう。まず、図2(a)に示すよう
に最外層の超電導線材21dが表面に露出している超電
導ケーブル導体20を準備する。次に、導体の末端から
所定の長さの分だけ最外層(4層目)にある線材をすべ
て除去する。露出した3層目を覆う絶縁材を部分的に除
去した後、露出した3層目の線材を所定の長さだけ残
し、導体の末端から所定の長さの分除去する。露出した
絶縁材を部分的に除去した後、露出した2層目の線材を
部分的に除去する。露出した絶縁材を部分的に除去すれ
ば、1層目の線材が露出する。このようにして図2
(b)に示すような段差構造が得られる。すなわち、導
体20の末端にいくに従って内側の各層が露出された構
造が得られる。導体の末端では第1層目の線材21aが
露出され、順に第2層目の線材21b、第3層目の線材
21cが所定の長さだけ露出されている。各層の線材同
士は、層間に設けられた絶縁層によって絶縁されてい
る。次に、各層の線材に図1に示すような構造の端子部
材を取付ける。端子部材の材質は、たとえば銅とするこ
とができるが、その他の抵抗値が低い金属を任意に用い
ることができる。図1に示すような構造において、パイ
プ部のサイズ、特にその内径が導体各層の直径に応じて
調整された4つの端子部材を準備し、それぞれの層に取
付ける。取付けに際しては、端子部材のパイプ部に導体
を差込み、所定の層上に配置する。次いで、パイプ部に
形成された2つの孔の一方から溶融したはんだを流し込
み、端子部材のパイプ部と線材との間にはんだを行き渡
らせる。パイプ部の内径は、はんだがなるべく薄く均一
に流れ込むよう、たとえば各層の導体外径より1mm程
度大きい値に設定することができる。また、パイプ部の
長さは、はんだ付けを行なう部分の接続抵抗等を考慮し
て適当な値に設定することができる。各層に端子部材を
それぞれ配置し、はんだ付けにより固定した状態を図2
(c)に示す。1層目、2層目、3層目および4層目に
それぞれ適当なサイズの端子部材10a、10b、10
cおよび10dが設けられている。各層間は絶縁材によ
り電気的に絶縁されているので、それぞれの層に設けら
れた端子部材同士も電気的に絶縁されている。
For example, terminal processing is performed on a four-layer conductor as shown in FIG. First, as shown in FIG. 2A, a superconducting cable conductor 20 having the outermost superconducting wire 21d exposed on the surface is prepared. Next, all wires in the outermost layer (fourth layer) are removed by a predetermined length from the end of the conductor. After partially removing the insulating material covering the exposed third layer, the exposed third-layer wire is removed by a predetermined length from the end of the conductor, leaving a predetermined length. After partially removing the exposed insulating material, the exposed second-layer wire is partially removed. If the exposed insulating material is partially removed, the first-layer wire is exposed. Thus, FIG.
A step structure as shown in FIG. That is, a structure in which the inner layers are exposed toward the end of the conductor 20 is obtained. At the end of the conductor, the first-layer wire 21a is exposed, and the second-layer wire 21b and the third-layer wire 21c are sequentially exposed by a predetermined length. The wires of each layer are insulated by an insulating layer provided between the layers. Next, a terminal member having a structure as shown in FIG. 1 is attached to the wire of each layer. The material of the terminal member can be, for example, copper, but any other metal having a low resistance value can be used. In the structure as shown in FIG. 1, four terminal members are prepared in which the size of the pipe portion, particularly the inner diameter thereof is adjusted according to the diameter of each conductor layer, and attached to each layer. At the time of attachment, a conductor is inserted into the pipe portion of the terminal member and is arranged on a predetermined layer. Next, molten solder is poured from one of the two holes formed in the pipe portion to spread the solder between the pipe portion of the terminal member and the wire. The inner diameter of the pipe portion can be set to a value that is, for example, about 1 mm larger than the outer diameter of the conductor of each layer so that the solder flows as thinly and uniformly as possible. Further, the length of the pipe portion can be set to an appropriate value in consideration of the connection resistance and the like of the portion to be soldered. FIG. 2 shows a state in which terminal members are arranged on each layer and fixed by soldering.
It is shown in (c). Terminal members 10a, 10b, and 10 having appropriate sizes for the first, second, third, and fourth layers, respectively.
c and 10d are provided. Since each layer is electrically insulated by the insulating material, the terminal members provided in each layer are also electrically insulated.

【0021】上述したような構造を有する端子部材を用
いることにより、導体を端子部材に差し込んではんだを
流し込むだけという、非常に簡便な工程で端末部を形成
することができる。また、適当なサイズの端子部材を用
い、各層をこの端子部材で覆えば、ほぼ均等な端末抵抗
が常に得られる。はんだ付けも容易であり、はんだ付け
層による抵抗値もばらつきが小さく一定の低いレベルに
抑えられる。したがって、端末部全体の抵抗値も一定の
低いレベルに抑えることができる。本発明によれば、た
とえば50mの超電導ケーブル導体当たり、端末部の抵
抗値を1μΩ以下にすることができる。この抵抗値は、
導体の通電電流分布にほとんど影響を与えない程度のも
のである。
By using the terminal member having the above-described structure, the terminal portion can be formed in a very simple process of merely inserting a conductor into the terminal member and pouring solder. Also, if a terminal member having an appropriate size is used and each layer is covered with this terminal member, a substantially uniform terminal resistance can always be obtained. Soldering is easy, and the resistance value due to the soldering layer has a small variation and can be suppressed to a certain low level. Therefore, the resistance value of the entire terminal unit can be suppressed to a certain low level. According to the present invention, for example, the resistance value of the terminal portion can be 1 μΩ or less per 50 m superconducting cable conductor. This resistance value is
This is such that it hardly affects the current distribution of the conductor.

【0022】図2(c)に示すような端末構造では、各
層毎に独立して端子部材が取付けられているため、それ
ぞれの端子部材を介して各層の通電電流値を測定するこ
とができる。各層の通電電流値は、たとえば、図3に示
すようなロゴスキーコイルを端子部材の突起部に取付け
ることによって測定することができる。ロゴスキーコイ
ル30は、たとえば繊維強化プラスチック(FRP)等
からなる巻枠32に銅線34を巻付けることによって構
成することができる。各層の通電電流を測定する場合、
それぞれの層に配置された端子部材の突起部にリング状
のロゴスキーコイルを差し込めばよい。
In the terminal structure as shown in FIG. 2 (c), the terminal members are independently attached to each layer, so that the current flowing through each layer can be measured via each terminal member. The current value of each layer can be measured, for example, by attaching a Rogowski coil as shown in FIG. 3 to the projection of the terminal member. The Rogowski coil 30 can be configured by winding a copper wire 34 around a winding frame 32 made of, for example, fiber reinforced plastic (FRP). When measuring the conduction current of each layer,
A ring-shaped Rogowski coil may be inserted into the protrusions of the terminal members arranged on each layer.

【0023】電源から導体に通電する場合には、たとえ
ば図4に示すようなブスバーを用いて各層を一括し、通
電用の末端を構成することができる。図に示すブスバー
40は、各層に取付けられた端子部材と接続するための
接続板42と、電源に接続されるリードを取付けるため
の端子部46とから構成されている。接続板42には、
4つのねじ止め用孔44a、44b、44cおよび44
dが所定の間隔で形成されている。リード板42の中央
部に設けられた端子部46にも、リードをねじ止めする
ための孔48が設けられている。
When power is supplied from the power source to the conductor, the layers for the power supply can be collectively formed using, for example, a bus bar as shown in FIG. The bus bar 40 shown in the figure includes a connection plate 42 for connecting to terminal members attached to each layer, and a terminal portion 46 for attaching a lead connected to a power supply. In the connection plate 42,
Four screw holes 44a, 44b, 44c and 44
d are formed at predetermined intervals. The terminal portion 46 provided at the center of the lead plate 42 is also provided with a hole 48 for screwing the lead.

【0024】各層に取付けられた端子部材の突起にそれ
ぞれロゴスキーコイルを取付け、図4に示すブスバーか
ら一括して各層に電流を供給するための構造を図5およ
び図6に示す。各層に接合された端子部材10a、10
b、10cおよび10dの各突起部にロゴスキーコイル
30が取付けられている。各突起部はブスバー40の接
続板42にねじ60によって接合される。ブスバーの材
質は、銅やその他の抵抗値の低い金属とすることができ
る。各端子部には、ブスバー40の端子部46を介して
電流が供給される。なお、各端子部の突起の厚みを調整
することによって、各突起を接続板の面上に配置するこ
とが容易になる。接合された端子部材10a〜dおよび
ブスバー40は、支持材62上に固定することができ
る。このような端末構造において各ロゴスキーコイルに
誘起される電圧から電流を計算によって求めることによ
り、各層の通電電流値を測定することができる。このよ
うな構造は、導体の特性を知る上で重要である。
FIGS. 5 and 6 show a structure for attaching a Rogowski coil to each of the protrusions of the terminal members attached to each layer and supplying current to each layer collectively from the bus bar shown in FIG. Terminal members 10a, 10 joined to each layer
A Rogowski coil 30 is attached to each of the projections b, 10c and 10d. Each projection is joined to the connection plate 42 of the bus bar 40 by a screw 60. The material of the bus bar may be copper or another metal having a low resistance value. A current is supplied to each terminal via the terminal 46 of the bus bar 40. In addition, by adjusting the thickness of the projection of each terminal portion, it becomes easy to arrange each projection on the surface of the connection plate. The joined terminal members 10 a to 10 d and the bus bar 40 can be fixed on the support member 62. In such a terminal structure, the current value of each layer can be measured by calculating the current from the voltage induced in each Rogowski coil. Such a structure is important for knowing the characteristics of the conductor.

【0025】図2(c)に示す端末構造を2つの導体に
ついて形成すれば、導体同士を図7および図8に示すよ
うな構造で接続することができる。図7に示すように、
一方の導体における1層目の端子部材10aと他方の導
体における4層目の端子部材10′dとが接続される。
さらに2層目の端子部材10bと3層目の端子部材1
0′cとが接続され、3層目の端子部材10cと2層目
の端子部材10′bとが接続され、4層目の端子部材1
0dと1層目の端子部材10′dとが接続される。接続
は、図に示すようにねじ止めによって行なってもよい
し、その他の方法、たとえばろう付け等によって行なっ
てもよい。端子部材の突起部同士を接合することによ
り、層間の接続が容易になる。突起部同士を接続する場
合、図8(a)に示すように、突起部に対して環状部が
同じ側に来るように接合を行なってもよいし、図8
(b)に示すように突起部に対して環状部が互いに反対
側に来るよう接合を行なってもよい。また、図9に示す
ように接続を行なえば、よりコンパクトな接続が可能に
なる。さらに、図10(a)に示すように、突起部のな
い端子部材同士を突き合わせて接合することもできる。
接合は、たとえばろう付け等により行なうことができ
る。この場合、図10(b)に示すように、接合すべき
部分が平らになったリング状の端子部材を用いることが
より好ましい。一般に、多層導体では外側の層に電流が
流れやすくなるが、このように外側の層と内側の層とを
接続することにより、導体間において偏流の現象を抑制
し、交流損失の増大を防ぐことができる。
If the terminal structure shown in FIG. 2C is formed with respect to two conductors, the conductors can be connected by a structure as shown in FIGS. As shown in FIG.
The first layer terminal member 10a of one conductor is connected to the fourth layer terminal member 10'd of the other conductor.
Furthermore, the terminal member 10b of the second layer and the terminal member 1 of the third layer
0′c, the third-layer terminal member 10c and the second-layer terminal member 10′b are connected, and the fourth-layer terminal member 1
0d is connected to the terminal member 10'd of the first layer. The connection may be made by screwing as shown in the figure, or by another method, for example, brazing. By joining the projections of the terminal members, connection between the layers is facilitated. When connecting the protruding portions, as shown in FIG. 8A, the joining may be performed such that the annular portion is on the same side as the protruding portion.
As shown in (b), the joining may be performed such that the annular portions are opposite to each other with respect to the protruding portions. Further, if the connection is made as shown in FIG. 9, a more compact connection becomes possible. Further, as shown in FIG. 10A, terminal members having no protrusions can be joined by abutting each other.
Joining can be performed, for example, by brazing or the like. In this case, as shown in FIG. 10B, it is more preferable to use a ring-shaped terminal member having a flat portion to be joined. In general, current easily flows to the outer layer in a multi-layer conductor, but by connecting the outer layer and the inner layer in this way, it is possible to suppress the phenomenon of drift between conductors and prevent an increase in AC loss. Can be.

【0026】なお、上述した具体例は、4層の導体にお
いて各層に端子部材を取付けているが、場合によって
は、複数の層、たとえば1層目と2層目、3層目と4層
目、2層目と3層目等をまとめ、まとめたものに対して
端子部材を取付けてもよい。しかしながら、この場合で
も、内側の層と外側の層とに対して少なくとも2つの端
子部材が必要とされる。
In the specific example described above, the terminal member is attached to each layer in the four-layer conductor, but depending on the case, a plurality of layers, for example, the first and second layers, the third and fourth layers, may be used. The terminal member may be attached to the combined second and third layers, and the like. However, even in this case, at least two terminal members are required for the inner layer and the outer layer.

【0027】[0027]

【実施例】 例1 図1に示すような形状の銅ブロックを用いて、50m長
の4層導体の端末処理を行なった。導体は、フォーマの
周りにビスマス系2223相酸化物超電導体が銀で覆わ
れたテープ状線材を4層で螺旋状に巻付けたものであっ
た。層と層の間はマイラーテープで絶縁されていた。図
2(b)に示すように、各層の表面が13cmずつ露出
するよう、末端部の線材を最外層から順に除去していっ
た。次いで、図2(c)に示すように、各層に銅ブロッ
クを取付け、はんだ付けを行なった。具体的には、銅ブ
ロックのパイプ部に導体を通し、パイプの両端を耐熱テ
ープによってシールした状態でパイプ部を加熱し、パイ
プ部の一方の孔から溶融したはんだを流し込んだ。もう
一方の孔からはんだがあふれ出す直前ではんだの流し込
みを中止した。はんだを固化させ、銅ブロックを各層に
接合した。銅ブロックにおけるパイプ部の内径を、各層
について導体外径+1mmとすることで、はんだをスム
ーズに流し込むことができ、端末部の抵抗を1μΩ以下
の非常に小さい値に抑えることができた。複数回同じ端
末構造を形成した結果、得られた端末部の抵抗値のばら
つきも小さかった。なお、接続抵抗を低くするため、銅
ブロックの長さは10cm程度が望ましかった。
Example 1 Using a copper block having a shape as shown in FIG. 1, a 50 m long four-layer conductor was subjected to terminal treatment. The conductor was formed by spirally winding a tape-like wire rod in which a bismuth-based 2223 phase oxide superconductor was covered with silver around a former in four layers. The layers were insulated with Mylar tape. As shown in FIG. 2B, the wire at the end was removed in order from the outermost layer so that the surface of each layer was exposed by 13 cm. Next, as shown in FIG. 2C, a copper block was attached to each layer and soldering was performed. Specifically, a conductor was passed through the pipe portion of the copper block, the pipe portion was heated in a state where both ends of the pipe were sealed with heat-resistant tape, and molten solder was poured from one hole of the pipe portion. Immediately before the solder overflowed from the other hole, the pouring of the solder was stopped. The solder was solidified and a copper block was joined to each layer. By setting the inner diameter of the pipe portion in the copper block to the outer diameter of the conductor +1 mm for each layer, the solder could be poured smoothly, and the resistance of the terminal portion could be suppressed to a very small value of 1 μΩ or less. As a result of forming the same terminal structure a plurality of times, variation in the resistance value of the obtained terminal portion was small. In order to reduce the connection resistance, the length of the copper block was desirably about 10 cm.

【0028】得られた端末構造に図5および図6に示す
ようにロゴスキーコイルを取付けた。ロゴスキーコイル
は、銅ブロックの突起をちょうど通すことのできるサイ
ズのリングになっている。各銅ブロックの突起にロゴス
キーコイルを取付けた後、さらに図4に示すような銅ブ
スバーをねじ止めによって各層の銅ブロックに接合し
た。これにより、各銅ブロックは一体化された。銅ブロ
ックおよび銅ブスバーは、図6に示すように、FRP製
の支持材に固定した。銅ブスバーの端子部に電源からの
リード線を繋いで通電を行なった。各コイルに誘起され
る電圧の出力波形をアナライジングレコーダで記録し
た。各コイルからの出力波形と、それらの波形から求め
た通電電流波形を図11(a)および図11(b)にそ
れぞれ示す。これらの図から、図5および図6に示す構
造によって、各層の通電電流波形を測定できたことが明
らかになった。また、通電電流波形の解析結果から端末
部の抵抗値は通電電流波形に実質的に影響を与えないほ
どの低いレベルであることがわかった。
A Rogowski coil was attached to the obtained terminal structure as shown in FIGS. The Rogowski coil is a ring sized to just pass the protrusions on the copper block. After attaching the Rogowski coil to the projection of each copper block, a copper bus bar as shown in FIG. 4 was further joined to the copper block of each layer by screwing. Thereby, each copper block was integrated. As shown in FIG. 6, the copper block and the copper busbar were fixed to a support made of FRP. Power was supplied by connecting a lead wire from a power supply to the terminal portion of the copper busbar. The output waveform of the voltage induced in each coil was recorded by an analyzing recorder. FIGS. 11A and 11B show the output waveforms from the coils and the current waveform obtained from the waveforms. From these figures, it became clear that the structure shown in FIGS. 5 and 6 could measure the current waveform of each layer. In addition, the analysis result of the conduction current waveform showed that the resistance value of the terminal portion was at a low level that did not substantially affect the conduction current waveform.

【0029】例2 図2(c)に示すように銅ブロックを取付けた端末構造
を有する導体を2本準備した。次いで、図7および図8
に示すように2本の導体間で銅ブロックを接続した。1
本ずつ単独に通電したときの端末部の損失も含んだ導体
損失に比較して、2本を接続した場合には、単位長さ当
たりの損失量が低減していた。
Example 2 As shown in FIG. 2C, two conductors having a terminal structure to which a copper block was attached were prepared. Then, FIGS. 7 and 8
The copper block was connected between the two conductors as shown in FIG. 1
When two wires were connected, the loss per unit length was reduced as compared with the conductor loss including the loss at the terminal when the wires were individually energized.

【0030】[0030]

【発明の効果】以上説明してきたように、本発明によれ
ば、シンプルな工程によって形成することができ、かつ
抵抗値の低い端末構造を得ることができる。本発明の端
末構造は、各層の通電電流波形を測定するのに適してい
る他、2本の導体を接続する場合にも導体の交流損失を
低減することができる。
As described above, according to the present invention, a terminal structure which can be formed by a simple process and has a low resistance value can be obtained. INDUSTRIAL APPLICABILITY The terminal structure of the present invention is suitable for measuring the current waveform of each layer, and can reduce the AC loss of a conductor even when two conductors are connected.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に用いる端子部材の一具体例を示す斜視
図である。
FIG. 1 is a perspective view showing a specific example of a terminal member used in the present invention.

【図2】本発明に従う端末構造を製造するためのプロセ
スの一具体例を示す模式図である。
FIG. 2 is a schematic view showing one specific example of a process for manufacturing a terminal structure according to the present invention.

【図3】ロゴスキーコイルの一具体例を示す斜視図であ
る。
FIG. 3 is a perspective view showing a specific example of a Rogowski coil.

【図4】各端子部材に接続する電力供給のためのブスバ
ーを示す(a)平面図および(b)側面図である。
4A is a plan view and FIG. 4B is a side view showing a bus bar for supplying power connected to each terminal member.

【図5】本発明に従う端末構造にロゴスキーコイルおよ
びブスバーを取付けた状態を示す平面図である。
FIG. 5 is a plan view showing a state where a Rogowski coil and a bus bar are attached to the terminal structure according to the present invention.

【図6】図5に示す構造の部分断面図である。6 is a partial cross-sectional view of the structure shown in FIG.

【図7】本発明に従って1対の端末構造を接続した状態
を示す平面図である。
FIG. 7 is a plan view showing a state where a pair of terminal structures are connected according to the present invention.

【図8】本発明に従って1対の端末構造を接続した状態
の具体例を示す側面図である。
FIG. 8 is a side view showing a specific example of a state in which a pair of terminal structures are connected according to the present invention.

【図9】本発明に従って1対の端末構造を接続した構造
の他の具体例を示す側面図である。
FIG. 9 is a side view showing another specific example of a structure in which a pair of terminal structures are connected according to the present invention.

【図10】本発明に従って1対の端末構造を接続したも
う1つの状態を示す図である。
FIG. 10 is a diagram showing another state in which a pair of terminal structures are connected according to the present invention;

【図11】各層に接合された各端子部材を介して測定さ
れた(a)コイル出力電圧波形および(b)通電電流波
形を示す図である。
FIG. 11 is a diagram showing (a) a coil output voltage waveform and (b) an energizing current waveform measured via each terminal member joined to each layer.

【図12】超電導ケーブル導体の一例を模式的に示す
(a)断面図および(b)側面図である。
12A and 12B are a cross-sectional view and a side view schematically illustrating an example of a superconducting cable conductor.

【符号の説明】[Explanation of symbols]

10、10a、10b、10c、10d 端末部材 12 パイプ部 14 突起部 20 超電導ケーブル導体 21a、21b、21c、21d 超電導線材 30 ロゴスキーコイル 40 ブスバー 10, 10a, 10b, 10c, 10d Terminal member 12 Pipe part 14 Projection part 20 Superconducting cable conductor 21a, 21b, 21c, 21d Superconducting wire 30 Rogowski coil 40 Busbar

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 複数の超電導線材を芯材の周囲に層状に
巻付けた構造を有する超電導ケーブル導体の端末構造で
あって、 前記複数の線材のうち外層にある前記線材が表面に存在
する外層部と、 前記外層部の周囲に設けられ、かつ前記外層部にある線
材と接合された端子部材と、 前記複数の線材のうち外層にある前記線材がなく、かつ
内層にある前記線材が露出されている内層部と、 前記内層部の周囲に設けられ、かつ前記内層部にある線
材と接合された端子部材とを備えることを特徴とする、
超電導ケーブル導体の端末構造。
1. A terminal structure of a superconducting cable conductor having a structure in which a plurality of superconducting wires are wound around a core in a layered manner, wherein the outer layer of the plurality of wires has an outer layer on the surface. A terminal member provided around the outer layer portion and joined to a wire material in the outer layer portion; and the wire material in the inner layer without the wire material in the outer layer of the plurality of wire materials is exposed. An inner layer portion, comprising a terminal member provided around the inner layer portion and joined to a wire rod in the inner layer portion,
Terminal structure of superconducting cable conductor.
【請求項2】 前記ケーブル導体の末端にいくに従っ
て、最外層の前記線材から最内層の前記線材まで順に各
層の前記線材が選択的に露出されており、 露出されている各層の周囲にそれぞれ前記端子部材が接
合されていることを特徴とする、請求項1記載の端末構
造。
2. The wire rods of each layer are selectively exposed in order from the outermost wire rod to the innermost wire rod toward the end of the cable conductor. The terminal structure according to claim 1, wherein the terminal member is joined.
【請求項3】 前記外層と前記内層との間にある絶縁材
により前記端子部材同士が電気的に絶縁されていること
を特徴とする、請求項1または2記載の端末構造。
3. The terminal structure according to claim 1, wherein the terminal members are electrically insulated from each other by an insulating material between the outer layer and the inner layer.
【請求項4】 前記端子部材が、前記線材の層を取囲む
環状部と、前記環状部から突き出た突起部とを有するこ
とを特徴とする、請求項1〜3のいずれか1項記載の端
末構造。
4. The terminal member according to claim 1, wherein said terminal member has an annular portion surrounding said wire layer and a projection projecting from said annular portion. Terminal structure.
【請求項5】 前記突起部にロゴスキーコイルを挿入す
ることができることを特徴とする、請求項4記載の端末
構造。
5. The terminal structure according to claim 4, wherein a Rogowski coil can be inserted into the protrusion.
【請求項6】 前記環状部と前記突起部とを有する前記
端子部材が前記線材の各層毎に設けられ、 各端子部材の前記突起部にロゴスキーコイルを挿入する
ことにより、各層毎の通電電流分布を検出することがで
きることを特徴とする、請求項4記載の端末構造。
6. The terminal member having the annular portion and the protrusion is provided for each layer of the wire, and a Rogowski coil is inserted into the protrusion of each terminal member, so that a current flowing through each layer is provided. The terminal structure according to claim 4, wherein a distribution can be detected.
【請求項7】 前記端子部材は、前記線材の層とその周
囲に設けられた前記端子部材との間に流し込まれたはん
だにより、前記線材と接合されていることを特徴とす
る、請求項1〜6のいずれか1項記載の端末構造。
7. The terminal member according to claim 1, wherein the terminal member is joined to the wire member by solder poured between the layer of the wire member and the terminal member provided therearound. The terminal structure according to any one of claims 1 to 6.
【請求項8】 前記端子部材は、前記はんだを流し込む
ための孔を有していることを特徴とする、請求項7記載
の端末構造。
8. The terminal structure according to claim 7, wherein the terminal member has a hole into which the solder is poured.
【請求項9】 抵抗値が1μΩ以下であることを特徴と
する、請求項1〜8のいずれか1項記載の端末構造。
9. The terminal structure according to claim 1, wherein the resistance value is 1 μΩ or less.
【請求項10】 前記超電導線材が、ビスマス系222
3相酸化物超電導体とそれを覆う安定化マトリックスと
を備えるテープ状線材であることを特徴とする、請求項
1〜9のいずれか1項記載の端末構造。
10. The superconducting wire is made of bismuth-based 222.
The terminal structure according to any one of claims 1 to 9, wherein the terminal structure is a tape-shaped wire including a three-phase oxide superconductor and a stabilizing matrix covering the three-phase oxide superconductor.
【請求項11】 請求項1〜10のいずれか1項に記載
の1対の端末構造同士を電気的に接続する方法であっ
て、 一方の端末構造における前記外層部と接合された端子部
材と他方の端末構造における前記内層部と接合された端
子部材とを接続し、 前記一方の端末構造における前記内層部と接合された端
子部材と前記他方の端末構造における前記外層部と接合
された端子部材とを接続することを特徴とする、端末構
造の接続方法。
11. A method for electrically connecting a pair of terminal structures according to any one of claims 1 to 10, further comprising: a terminal member joined to the outer layer portion in one terminal structure. A terminal member connected to the inner layer portion in the other terminal structure and a terminal member bonded to the inner layer portion in the one terminal structure and a terminal member bonded to the outer layer portion in the other terminal structure. And a connection method for a terminal structure.
JP27802496A 1996-10-21 1996-10-21 Terminal structure of superconducting cable conductor and connection method thereof Expired - Fee Related JP3796850B2 (en)

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