JPH10116843A - Method for forming protective coating layer of diode element - Google Patents

Method for forming protective coating layer of diode element

Info

Publication number
JPH10116843A
JPH10116843A JP28738296A JP28738296A JPH10116843A JP H10116843 A JPH10116843 A JP H10116843A JP 28738296 A JP28738296 A JP 28738296A JP 28738296 A JP28738296 A JP 28738296A JP H10116843 A JPH10116843 A JP H10116843A
Authority
JP
Japan
Prior art keywords
groove
diode
liquid protective
liquid
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28738296A
Other languages
Japanese (ja)
Other versions
JP2865081B2 (en
Inventor
Shinichi Tsutsui
伸一 筒井
Masakazu Takahashi
応和 高橋
Akio Tsukamoto
昭夫 塚元
Masayoshi Kujirai
正義 鯨井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP28738296A priority Critical patent/JP2865081B2/en
Publication of JPH10116843A publication Critical patent/JPH10116843A/en
Application granted granted Critical
Publication of JP2865081B2 publication Critical patent/JP2865081B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve productivity of a protective coating layer which protects the side surface of a diode chip, by allowing a liquid-type protective substance to stick to the side surface of a diode chip of a diode element, for forming a protective coating layer at the same time. SOLUTION: After the entire, including the upper surface, of a liquid-like protective resin transportation member 9 is submerged in a liquid-like protective resin 6a in a vessel 11, the transportation member 9 is raised toward a diode chip 5 of a diode element 7, so that a groove 16 on the upper surface of the transportation member 9 faces the diode chip 5 of a plurality of diode elements 7 at the same time, thus, the liquid-like protective resin 6a housed as protruded in the groove 16 contacts to the plurality of diode chips 5 at the same time. At this time, since the diode element 7 is transported in longitudinal direction of the groove 16, the action wherein the liquid-like protective resin 6a stuck to the diode chip 5 is pressed by the liquid-like protective resin 6a remaining in the groove 16 takes place, so that the liquid-like protective resin 6a is evenly applied on the entire periphery of side surface of the diode chip 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は一対の棒状リードを有す
る同軸型ダイオード素子にジャンクションコーティング
レジン(JCR)等の保護被覆層を形成する方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a protective coating layer such as a junction coating resin (JCR) on a coaxial diode element having a pair of rod-shaped leads.

【0002】[0002]

【従来の技術】図1に示すように同軸状に配置された第
1及び第2の棒状リード1、2間に半田3、4で固着さ
れたダイオードチップ5の側面に一般にジャンクション
コーティングレジン(JCR)と呼ばれている保護樹脂
被覆層6を設けることは公知である。なお、棒状リード
1、2は直線的に延びる棒状部分1a、2aの一端にフ
ランジ状頭部1b、2bを有し、この頭部1b、2bの
間にダイオードチップ5が配置されている。ダイオード
チップ5はシリコンP型半導体領域とシリコンN型半導
体領域とアノード電極とカソード電極とを有する周知の
ものであって、フランジ状頭部1b、2bの径よりも小
さい径を有する。
2. Description of the Related Art As shown in FIG. 1, a junction coating resin (JCR) is generally provided on a side surface of a diode chip 5 fixed between first and second rod-shaped leads 1 and 2 arranged coaxially with solders 3 and 4. It is known to provide a protective resin coating layer 6 referred to as). The bar-shaped leads 1 and 2 have flange-shaped heads 1b and 2b at one end of bar-shaped portions 1a and 2a extending linearly, and a diode chip 5 is arranged between the heads 1b and 2b. The diode chip 5 is a well-known one having a silicon P-type semiconductor region, a silicon N-type semiconductor region, an anode electrode, and a cathode electrode, and has a diameter smaller than the diameter of the flange-shaped heads 1b, 2b.

【0003】[0003]

【発明が解決しようとする課題】従来、保護樹脂被覆層
6を形成する時には、流動性のある例えばシリコーン樹
脂をダイオードチップ5の側面にポッティング即ち滴下
した。しかし、ポッティングによって保護樹脂被覆層6
を形成すると、ダイオード素子を量産する時に、保護樹
脂被覆層6の厚さのバラツキが生じるのみでなく、生産
性が悪かった。
Conventionally, when forming the protective resin coating layer 6, a fluid silicone resin, for example, is potted or dropped on the side surface of the diode chip 5. However, the protective resin coating layer 6
Is formed, when the diode elements are mass-produced, not only the thickness of the protective resin coating layer 6 varies, but also the productivity is poor.

【0004】そこで、本発明はダイオードチップの側面
を被覆する保護被覆層の生産性の向上を図ることができ
る方法を提供することを目的とする。
Accordingly, an object of the present invention is to provide a method capable of improving the productivity of a protective coating layer covering the side surface of a diode chip.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
の本発明は、ダイオ−ドチップが第1及び第2の棒状リ
ード間に固着されたダイオ−ド素子の前記ダイオードチ
ップの側面に液状保護物質を付着させることによって保
護被覆層を形成する方法であって、上面に液状保護物質
を収容することができる溝を有し、前記液状保護物質を
この表面張力によって前記溝の縁の高さよりも高く付着
させることができるように前記溝の幅が設定され、互い
に平行に配置された前記少なくとも2つのダイオ−ド素
子の相互間隔以上に前記溝の長さが設定されている液状
保護物質運搬部材と、前記液状保護物質運搬部材を浸漬
することができるように液状保護物質を収容した容器と
を用意し、前記容器の前記液状保護物質に前記液状保護
物質運搬部材を浸漬して前記溝に前記液状保護物質を収
容し、前記液状保護物質運搬部材を前記容器の中から前
記少なくとも2つのダイオ−ド素子のダイオ−ドチップ
の側面近くに移動することによって前記溝の縁よりも高
くなるように前記溝に収容されている前記液状保護物質
を前記少なくとも2つのダイオ−ド素子の前記ダイオ−
ドチップ側面にそれぞれ接触させ、前記少なくとも2つ
のダイオ−ド素子に前記保護被覆層を同時に形成するこ
とを特徴とするダイオ−ド素子の保護被覆層形成方法に
係わるものである。なお、請求項2に示すように、ダイ
オ−ド素子を移動しながら液状保護物質を付着させるこ
とができる。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a liquid crystal protection device in which a diode chip is fixed between first and second rod-shaped leads on a side surface of the diode chip. A method for forming a protective coating layer by adhering a substance, comprising a groove on an upper surface capable of accommodating a liquid protective substance, wherein the surface tension of the liquid protective substance is greater than the height of an edge of the groove. A liquid protective material carrier member in which the width of the groove is set so as to allow high attachment, and the length of the groove is set to be equal to or greater than the distance between the at least two diode elements arranged in parallel with each other. And a container containing a liquid protective substance so that the liquid protective substance transport member can be immersed therein, and the liquid protective substance transport member is immersed in the liquid protective substance of the container. Then, the liquid protective substance is accommodated in the groove, and the liquid protective substance conveying member is moved from the inside of the container to near the side surface of the diode chip of the at least two diode elements. The liquid protective material contained in the groove so as to increase the height of the at least two diode elements.
A method for forming a protective coating layer on a diode element, wherein the protective coating layer is simultaneously formed on the at least two diode elements by contacting the side surfaces of the diode chip. In addition, as described in claim 2, the liquid protective material can be attached while moving the diode element.

【0006】[0006]

【発明の作用及び効果】各請求項の発明によれば、ダイ
オ−ドチップの側面に液状保護物質を安定的且つ均一に
供給することが可能になる。また請求項1の発明によれ
ば、複数個のダイオ−ド素子に対して同時に液状保護物
質を付着させることが可能になり、生産性が向上する。
また、請求項2の発明によれば、ダイオ−ド素子を移動
しながら液状保護物質を付着させるので生産性が向上す
るのみでなく、比較的粘度の高い液状保護物質であって
もダイオ−ドチップの側面に均一に付着させることが可
能になる。
According to the invention, the liquid protective material can be stably and uniformly supplied to the side surface of the diode chip. Further, according to the first aspect of the present invention, it is possible to simultaneously attach a liquid protective substance to a plurality of diode elements, thereby improving productivity.
According to the second aspect of the present invention, since the liquid protective substance is attached while moving the diode element, not only the productivity is improved, but also the diode chip is used even if the liquid protective substance has a relatively high viscosity. Can be uniformly attached to the side surfaces of

【0007】[0007]

【実施例】次に、図1〜図3を参照して本発明の実施例
に係わるダイオード素子の保護被覆層形成方法を説明す
る。本実施例で保護被覆層を形成するためのダイオード
素子7は図1及び図2から明らかなように第1及び第2
の棒状リード1、2のフランジ状頭部1b、2b間に半
田3、4でダイオードチップ5を固着し、このダイオ−
ドチップ5の側面に図1に示すように保護樹脂層6を設
けたものである。
Next, a method for forming a protective coating layer of a diode element according to an embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the diode element 7 for forming the protective coating layer is made up of the first and second diodes as apparent from FIGS.
The diode chip 5 is fixed between the flange-shaped heads 1b and 2b of the rod-shaped leads 1 and 2 by solders 3 and 4,
As shown in FIG. 1, a protective resin layer 6 is provided on a side surface of the chip 5.

【0008】本実施例に従って保護樹脂被覆層6を形成
するための装置は、ダイオ−ド素子7の移送装置8と、
液状保護樹脂運搬部材9と、この運搬部材9の上下駆動
装置10と、液状保護樹脂6aを収容した浴槽即ち容器
11とから成る。
An apparatus for forming the protective resin coating layer 6 according to the present embodiment includes a transfer device 8 for a diode element 7 and
It comprises a liquid protective resin carrying member 9, a vertical drive device 10 for the carrying member 9, and a bath or container 11 containing the liquid protective resin 6a.

【0009】ダイオード素子移動装置8は、第1及び第
2の棒状リード1、2の棒状部分1a、2aを支持する
複数の対のリード支持体12と、このリード支持体12
を移動するためのベルト13と、ベルト駆動装置14と
から成る。リード支持体12はリードの棒状部分1a、
2aを受け入れるためのU字状凹部15を有する。ベル
ト13は駆動装置14によって間欠的又は連続的に駆動
される。
The diode element moving device 8 comprises a plurality of pairs of lead supports 12 for supporting the rod portions 1a and 2a of the first and second rod leads 1 and 2, and the lead support 12
, And a belt driving device 14. The lead support 12 has a rod-like portion 1a of the lead,
It has a U-shaped recess 15 for receiving 2a. The belt 13 is driven intermittently or continuously by a driving device 14.

【0010】液状保護樹脂運搬部材9は、板状に形成さ
れており、その上面に断面形状がV字状の溝16を有
し、この溝16の縁の外側に傾斜面17、18を有す
る。即ち三角形の2つの山状突出部を並べて設けること
によって生じた谷部がV字状溝16になっている。V字
状溝16の両側の縁の相互間隔即ち溝16の入口の幅は
ダイオ−ドチップ5の厚さにほぼ一致している。この溝
16の両側の縁の間隔はダイオ−ドチップ5の厚さの
0.5〜2倍程度に設定することが望ましく、一対の頭
部1b、2bの間隔にすることが更に望ましい。即ち、
液状保護樹脂6aの表面張力によって溝16の両縁より
も高く液状保護樹脂6aを突出させた状態に収容するこ
とができるように溝16の入口の幅を設定することが望
ましい。液状保護樹脂運搬部材9の上面の長手方向即ち
溝16が延びている方向はダイオ−ド素子7の棒状リ−
ド1、2の延びている方向に直交している。そして、こ
の上面の長手方向の長さLは互いに平行に配置されてベ
ルト13で移送される少なくとも2つのダイオ−ド素子
7の相互間隔よりも長く設定されている。図3では液状
保護樹脂運搬部材9の上面の長さLの範囲に2つのダイ
オ−ド素子7が入っているが、これよりも多い例えば6
個程度が上面の長さLに入るように運搬部材9を形成す
ることができる。
The liquid protective resin conveying member 9 is formed in a plate shape, has a V-shaped groove 16 in cross section on the upper surface thereof, and has inclined surfaces 17 and 18 outside the edge of the groove 16. . That is, a valley formed by arranging the two triangular protrusions side by side forms the V-shaped groove 16. The distance between the edges on both sides of the V-shaped groove 16, that is, the width of the entrance of the groove 16 substantially corresponds to the thickness of the diode chip 5. It is desirable to set the interval between the edges on both sides of the groove 16 to be about 0.5 to 2 times the thickness of the diode chip 5, and more desirably the interval between the pair of heads 1b and 2b. That is,
It is desirable to set the width of the entrance of the groove 16 so that the liquid protective resin 6a can be accommodated in a state of being protruded higher than both edges of the groove 16 by the surface tension of the liquid protective resin 6a. The longitudinal direction of the upper surface of the liquid protective resin conveying member 9, that is, the direction in which the groove 16 extends, is a rod-shaped lead of the diode element 7.
Are perpendicular to the direction in which the nodes 1 and 2 extend. The length L of the upper surface in the longitudinal direction is set to be longer than the mutual distance between at least two diode elements 7 arranged in parallel with each other and transported by the belt 13. In FIG. 3, two diode elements 7 are included in the range of the length L of the upper surface of the liquid protective resin conveying member 9;
The conveying member 9 can be formed so that about a unit is included in the length L of the upper surface.

【0011】容器11は上方が開放された箱型であっ
て、液状保護樹脂運搬部材9の高さよりも深く形成さ
れ、液状保護樹脂運搬部材9の全体を浸漬することがで
きる深さにシリコ−ン樹脂のJCRから成る液状保護物
質6aが収容されている。
The container 11 has a box shape with an open top, and is formed to be deeper than the height of the liquid protective resin transporting member 9 so that the silicon resin can be immersed in the entire liquid protective resin transporting member 9. A liquid protective material 6a made of resin JCR is contained.

【0012】液状保護樹脂運搬部材9を容器11の中か
らダイオ−ドチップ5の近くまで移動させるために、運
搬部材9にはクランク状の一対の腕部19、20が設け
られており、これ等に昇降装置即ち上下駆動装置10が
結合されている。
In order to move the liquid protective resin conveying member 9 from the inside of the container 11 to the vicinity of the diode chip 5, the conveying member 9 is provided with a pair of crank-shaped arms 19, 20. , A lifting device, that is, a vertical driving device 10 is connected.

【0013】ダイオ−ド素子7のダイオ−ドチップ5に
液状保護樹脂6aを塗布する時には、容器11にJCR
のような液状保護樹脂6aを入れ、ここに運搬部材9の
上面を含む全部を浸漬し、しかる後、上下駆動装置10
によって運搬部材9をダイオ−ド素子7のダイオ−ドチ
ップ5に向かって上昇させる。運搬部材9は容器11の
外に出てもこの上面に溝16を有するので、この溝に液
状保護樹脂6aが収容されている。溝に対する液状保護
樹脂6aの収容形態は、液状保護樹脂6aの表面張力に
よって溝16の両縁よりも盛り上がった状態即ち突出状
態となる。この実施例では、運搬部材9の上昇と同時に
複数のダイオ−ド素子7を互いに平行に配置してベルト
13で溝16の長手方向に移動している。溝16は長手
に形成され、且つダイオ−ド素子7のダイオ−ドチップ
5に対応するように図2における左右方向の位置が予め
設定されている。従って、溝16の長手方向におけるダ
イオ−ドチップ5に対する位置決めを特別に行わなくて
も、運搬部材9を上昇させると溝16が複数のダイオ−
ド素子7のダイオ−ドチップ5に同時に対向し、溝16
に突出状態に収容されている液状保護樹脂6aを複数の
ダイオ−ドチップ5に同時に接触させることができる。
この時、ダイオ−ド素子7が溝16の長手方向に移送さ
れているので、ダイオ−ドチップ5に付着した液状保護
樹脂6aを溝16に残っている液状保護樹脂6aによっ
て押圧する動作が生じ、液状保護樹脂6aのダイオ−ド
チップ5の側面全周に対する均一性の良い塗布を助け
る。なお、液状保護樹脂6aの粘度が比較的高い場合で
あっても、液状保護樹脂6aは流動性を有しているの
で、ダイオ−ドチップ5の側面の一部に液状保護樹脂6
aが付着すると、この流動によってダイオ−ドチップ5
の側面の全部が液状保護樹脂6aで被覆される。
When applying the liquid protective resin 6a to the diode chip 5 of the diode element 7, the JCR
The liquid protective resin 6a as described above is put, and the whole including the upper surface of the transport member 9 is immersed in the liquid protective resin 6a.
As a result, the carrying member 9 is raised toward the diode chip 5 of the diode element 7. Since the carrying member 9 has the groove 16 on its upper surface even when it goes out of the container 11, the liquid protective resin 6a is accommodated in this groove. The accommodation state of the liquid protective resin 6a in the groove is a state in which the liquid protective resin 6a rises from both edges of the groove 16 due to the surface tension of the liquid protective resin 6a, that is, projects. In this embodiment, a plurality of diode elements 7 are arranged in parallel with each other at the same time when the transport member 9 is raised, and are moved in the longitudinal direction of the groove 16 by the belt 13. The groove 16 is formed longitudinally, and the position in the left-right direction in FIG. 2 is set in advance so as to correspond to the diode chip 5 of the diode element 7. Therefore, even if the positioning of the groove 16 with respect to the diode chip 5 in the longitudinal direction is not particularly performed, when the carrying member 9 is raised, the groove 16 is formed with a plurality of diodes.
The groove 16 is opposed to the diode chip 5 of the diode element 7 at the same time.
The liquid protective resin 6a housed in a protruding state can be brought into contact with a plurality of diode chips 5 at the same time.
At this time, since the diode element 7 is transported in the longitudinal direction of the groove 16, the operation of pressing the liquid protective resin 6a attached to the diode chip 5 by the liquid protective resin 6a remaining in the groove 16 occurs. The liquid protective resin 6a is applied with good uniformity to the entire periphery of the side surface of the diode chip 5. Even when the viscosity of the liquid protective resin 6a is relatively high, since the liquid protective resin 6a has fluidity, the liquid protective resin 6a
a is attached, this flow causes the diode chip 5
Is covered with the liquid protective resin 6a.

【0014】ダイオ−ドチップ5に対する液状保護樹脂
6aの塗布が終了したら、運搬部材9を容器11の中の
液状保護樹脂6aに再び浸漬し、次のダイオ−ド素子に
対する液状保護樹脂6aの塗布を行う。
When the application of the liquid protective resin 6a to the diode chip 5 is completed, the transport member 9 is immersed again in the liquid protective resin 6a in the container 11 to apply the liquid protective resin 6a to the next diode element. Do.

【0015】ダイオードチップ5に塗布された液状保護
樹脂6aは例えば加熱によって硬化させ、図1に示すよ
うに保護樹脂被覆層6とする。保護樹脂6aの硬化はダ
イオード素子7を移送装置8で移送しながら行う。
The liquid protective resin 6a applied to the diode chip 5 is cured by heating, for example, to form a protective resin coating layer 6 as shown in FIG. The hardening of the protective resin 6a is performed while transferring the diode element 7 by the transfer device 8.

【0016】上述から明らかなように、本実施例は次の
利点を有する。 (イ) 長手に形成された溝16に液状保護樹脂6aを
収容して複数のダイオ−ドチップ5の側面に同時に液状
保護樹脂6aを付着させるので、保護樹脂層6の形成の
生産性が向上する。 (ロ) ダイオ−ド素子7を移送しながら液状保護樹脂
層6aをダイオ−ドチップ5に付着させるので、比較的
粘度の高い保護樹脂6を良好に付着させることができ
る。 (ハ) ダイオードチップ5のPN接合が設けられてい
る部分の径よりも大きい頭部1b、2bの間にダイオー
ドチップ5が配置されているので、一対の頭部1b、2
bの間に凹部が生じる。従って、ダイオードチップ5の
側面に対して液状保護樹脂6aが良好に付着する。
As is apparent from the above, this embodiment has the following advantages. (A) Since the liquid protective resin 6a is accommodated in the groove 16 formed in the longitudinal direction and the liquid protective resin 6a is simultaneously attached to the side surfaces of the plurality of diode chips 5, the productivity of forming the protective resin layer 6 is improved. . (B) Since the liquid protective resin layer 6a is adhered to the diode chip 5 while transferring the diode element 7, the protective resin 6 having a relatively high viscosity can be satisfactorily adhered. (C) Since the diode chip 5 is disposed between the heads 1b and 2b which are larger than the diameter of the portion of the diode chip 5 where the PN junction is provided, the pair of heads 1b and 2b
A recess is formed between b. Therefore, the liquid protective resin 6a adheres favorably to the side surface of the diode chip 5.

【0017】[0017]

【変形例】本発明は上述の実施例に限定されるものでな
く、例えば次の変形が可能なものである。 (1) 図2で点線で示すようにダイオード素子7を回
転するためのモータMを設け、ダイオード素子7を回転
しながら液状保護樹脂6aをダイオードチップ5の側面
に供給することができる。 (2) 複数のダイオ−ド素子7を間欠的に移送しなが
ら液状保護樹脂6aを塗布することができる。 (3) ダイオ−ドチップ5を複数のダイオ−ドチップ
を積層した積層ダイオ−ドチップとすることができる。
また、ダイオ−ドチップ5の側面を高耐圧化のために傾
斜面にすることができる。 (4) 溝16を凹形にすることができる。 (5) 溝16の長手方向の両端に液状保護樹脂6aの
流出止めを設けることができる。
[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) As shown by a dotted line in FIG. 2, a motor M for rotating the diode element 7 is provided, and the liquid protective resin 6a can be supplied to the side surface of the diode chip 5 while rotating the diode element 7. (2) The liquid protective resin 6a can be applied while intermittently transferring the plurality of diode elements 7. (3) The diode chip 5 can be a stacked diode chip in which a plurality of diode chips are stacked.
Further, the side surface of the diode chip 5 can be formed as an inclined surface for increasing the breakdown voltage. (4) The groove 16 can be made concave. (5) Stoppage of the liquid protective resin 6a can be provided at both ends of the groove 16 in the longitudinal direction.

【図面の簡単な説明】[Brief description of the drawings]

【図1】ダイオード素子を示す断面図である。FIG. 1 is a sectional view showing a diode element.

【図2】本発明の実施例に従う保護樹脂層形成装置を原
理的に示す図3のB−B線に相当する部分の断面図であ
る。
FIG. 2 is a cross-sectional view of a portion corresponding to line BB in FIG. 3, which basically shows the protective resin layer forming apparatus according to the embodiment of the present invention.

【図3】図2の保護樹脂層形成装置のA−A線に相当す
る部分の断面図である。
3 is a cross-sectional view of a portion corresponding to line AA of the protective resin layer forming device of FIG.

【符号の説明】[Explanation of symbols]

1、2 棒状リード 5 ダイオードチップ 6a 液状保護樹脂 9 液状保護樹脂運搬部材 16 溝 1, 2 rod-shaped lead 5 diode chip 6a liquid protective resin 9 liquid protective resin carrying member 16 groove

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鯨井 正義 埼玉県新座市北野三丁目6番3号 サンケ ン電気株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masayoshi Wakurai 3-6-1 Kitano, Niiza-shi, Saitama Sanken Electric Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ダイオ−ドチップが第1及び第2の棒状
リード間に固着されたダイオ−ド素子の前記ダイオード
チップの側面に液状保護物質を付着させることによって
保護被覆層を形成する方法であって、 上面に液状保護物質を収容することができる溝を有し、
前記液状保護物質をこの表面張力によって前記溝の縁の
高さよりも高く付着させることができるように前記溝の
幅が設定され、互いに平行に配置された前記少なくとも
2つのダイオ−ド素子の相互間隔以上に前記溝の長さが
設定されている液状保護物質運搬部材と、前記液状保護
物質運搬部材を浸漬することができるように液状保護物
質を収容した容器とを用意し、 前記容器の前記液状保護物質に前記液状保護物質運搬部
材を浸漬して前記溝に前記液状保護物質を収容し、 前記液状保護物質運搬部材を前記容器の中から前記少な
くとも2つのダイオ−ド素子のダイオ−ドチップの側面
近くに移動することによって前記溝の縁よりも高くなる
ように前記溝に収容されている前記液状保護物質を前記
少なくとも2つのダイオ−ド素子の前記ダイオ−ドチッ
プ側面にそれぞれ接触させ、前記少なくとも2つのダイ
オ−ド素子に前記保護被覆層を同時に形成することを特
徴とするダイオ−ド素子の保護被覆層形成方法。
1. A method of forming a protective coating layer by attaching a liquid protective material to a side surface of a diode chip of a diode element in which the diode chip is fixed between first and second rod-shaped leads. Having a groove on the top surface capable of containing a liquid protective substance,
The width of the groove is set so that the liquid protective substance can be attached higher than the height of the edge of the groove by the surface tension, and the distance between the at least two diode elements arranged in parallel with each other. As described above, a liquid protective substance transport member having the length of the groove set therein, and a container containing a liquid protective substance so that the liquid protective substance transport member can be immersed, are prepared. Immersing the liquid protective substance transport member in a protective substance, accommodating the liquid protective substance in the groove, and placing the liquid protective substance transport member in the container from the side of the diode chip of the at least two diode elements. Moving the liquid protective material contained in the groove so as to be higher than the edge of the groove by moving closer to the die of the at least two diode elements; - each brought into contact with the Dochippu aspect, the at least two diodes - diode and forming de element the protective coating layer at the same time - de protective coating layer forming method of the element.
【請求項2】 ダイオ−ドチップが第1及び第2の棒状
リード間に固着されたダイオ−ド素子の前記ダイオード
チップの側面に液状保護物質を付着させることによって
保護被覆層を形成する方法であって、 上面に液状保護物質を収容することができる溝を有し、
前記液状保護物質をこの表面張力によって前記溝の縁の
高さよりも高く付着させることができるように前記溝の
幅が設定された液状保護物質運搬部材と、前記液状保護
物質運搬部材を浸漬することができるように液状保護物
質を収容した容器とを用意し、 前記第1及び第2の棒状リ−ドが水平になるように前記
ダイオ−ド素子を前記容器の上方に配置し、 前記容器の前記液状保護物質に前記液状保護物質運搬部
材を浸漬して前記溝に前記液状保護物質を収容し、 前記液状保護物質運搬部材を前記容器の中から前記ダイ
オ−ド素子のダイオ−ドチップの側面近くに移動するこ
とによって前記溝の縁よりも高くなるように前記溝に収
容されている前記液状保護物質を前記ダイオ−ド素子の
前記ダイオ−ドチップ側面に接触させ、且つ前記ダイオ
−ド素子を前記溝が延びている方向に移動させることに
よって前記保護被覆層を形成することを特徴とするダイ
オ−ド素子の保護被覆層形成方法。
2. A method for forming a protective coating layer by attaching a liquid protective material to a side surface of a diode chip of a diode element in which the diode chip is fixed between first and second rod-shaped leads. Having a groove on the top surface capable of containing a liquid protective substance,
Immersing the liquid protective substance transporting member having the width of the groove set so that the liquid protective substance can be attached higher than the height of the edge of the groove by the surface tension; and the liquid protective substance transporting member. A container containing a liquid protective substance so that the first and second rod-shaped leads are horizontal, and the diode element is disposed above the container so that the first and second rod-shaped leads are horizontal. The liquid protective substance carrier is immersed in the liquid protective substance to accommodate the liquid protective substance in the groove, and the liquid protective substance carrier is moved from the inside of the container to a side of a diode chip of the diode element. Moving the liquid protective material contained in the groove so as to be higher than the edge of the groove to contact the side surface of the diode chip of the diode element; Protective coating layer forming method of de elements - diode, wherein forming the protective coating layer by moving the de element in a direction in which the groove extends.
JP28738296A 1996-10-09 1996-10-09 Method for forming protective coating layer of diode element Expired - Fee Related JP2865081B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28738296A JP2865081B2 (en) 1996-10-09 1996-10-09 Method for forming protective coating layer of diode element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28738296A JP2865081B2 (en) 1996-10-09 1996-10-09 Method for forming protective coating layer of diode element

Publications (2)

Publication Number Publication Date
JPH10116843A true JPH10116843A (en) 1998-05-06
JP2865081B2 JP2865081B2 (en) 1999-03-08

Family

ID=17716636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28738296A Expired - Fee Related JP2865081B2 (en) 1996-10-09 1996-10-09 Method for forming protective coating layer of diode element

Country Status (1)

Country Link
JP (1) JP2865081B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100355047C (en) * 2003-09-29 2007-12-12 三垦电气株式会社 Method for manufacturing semiconductor device and protective resin coating device of semiconductor chip assembly
US8009333B2 (en) 1998-11-09 2011-08-30 Silverbrook Research Pty Ltd Print controller for a mobile telephone handset
US8025393B2 (en) 1998-11-09 2011-09-27 Silverbrook Research Pty Ltd Print media cartridge with ink supply manifold
US8030079B2 (en) 1998-11-09 2011-10-04 Silverbrook Research Pty Ltd Hand-held video gaming device with integral printer
US8938062B2 (en) 1995-12-11 2015-01-20 Comcast Ip Holdings I, Llc Method for accessing service resource items that are for use in a telecommunications system
US9191505B2 (en) 2009-05-28 2015-11-17 Comcast Cable Communications, Llc Stateful home phone service

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8938062B2 (en) 1995-12-11 2015-01-20 Comcast Ip Holdings I, Llc Method for accessing service resource items that are for use in a telecommunications system
US8009333B2 (en) 1998-11-09 2011-08-30 Silverbrook Research Pty Ltd Print controller for a mobile telephone handset
US8025393B2 (en) 1998-11-09 2011-09-27 Silverbrook Research Pty Ltd Print media cartridge with ink supply manifold
US8030079B2 (en) 1998-11-09 2011-10-04 Silverbrook Research Pty Ltd Hand-held video gaming device with integral printer
CN100355047C (en) * 2003-09-29 2007-12-12 三垦电气株式会社 Method for manufacturing semiconductor device and protective resin coating device of semiconductor chip assembly
US9191505B2 (en) 2009-05-28 2015-11-17 Comcast Cable Communications, Llc Stateful home phone service

Also Published As

Publication number Publication date
JP2865081B2 (en) 1999-03-08

Similar Documents

Publication Publication Date Title
KR100356455B1 (en) Semiconductor device and fabricating method thereof
US3658618A (en) Method of providing individual bodies on a basic body
KR950704837A (en) METHOD OF FORMING INTERFACE BETWEEN DIE AND CHIP CARRIER
EP0747942A2 (en) Improvements in or relating to integrated circuits
JP2865081B2 (en) Method for forming protective coating layer of diode element
CN1337739A (en) Method for producing semi-conductor device
US6199743B1 (en) Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
US6686652B1 (en) Locking lead tips and die attach pad for a leadless package apparatus and method
US6344161B1 (en) Device encapsulation process utilizing pre-cut slots in flexible film substrate
US4724030A (en) Adhesive aided transfer of chips
KR920003498A (en) Semiconductor manufacturing device
JPH1066933A (en) Protective coating layer formation for diode element
CN216250718U (en) Lead frame and semiconductor device package
GB1435135A (en) Electroluminescent semiconductor devices method of machining a fixing slot in a fixed b
KR101121484B1 (en) Method for Attaching Ribbon onto Solar Cell
KR900010673Y1 (en) Package for semiconductor device
JPH1154534A (en) Potting method and mechanism, and die bonder using method and mechanism thereof
JPS6234153B2 (en)
KR20010037252A (en) Mold for manufacturing semiconductor package
JP2677335B2 (en) Cure device
KR200211727Y1 (en) Lead Frame Current Applicator of Plating Machine
JPH10209194A (en) Semiconductor device, its manufacture, and device for resin molding process used therefor
US20120315728A1 (en) Saw Type Package without Exposed Pad
Patterson et al. Laser dambar and flash removal for plastic molded surface mount components with lead spacing under 20 mils
JP2000195897A (en) Flux transfer device and its transfer method

Legal Events

Date Code Title Description
FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 9

Free format text: PAYMENT UNTIL: 20071218

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081218

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091218

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 12

Free format text: PAYMENT UNTIL: 20101218

LAPS Cancellation because of no payment of annual fees