JPH10116802A - Open/close covering device for cutting area and dicing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent splashes adhered to an open/close cover of a dicing device during cutting from dropping in the form of water drops and contaminating an operating panel or the floor in front of the device. SOLUTION: Open/close covers 13, 14 and 15 for a cutting area A are positioned in front of a cutting means of a dicing device 1 and are joined to the device at their upper ends by hinges 13a, 14a and 15a so that they may open and close. A splash inhibiting plate 17 is suspended through the hinge inside the cover 14 and a guide 19 for restricting the movements of the splash inhibiting plate 17 is provided on an inner side wall of the cutting area A. Splashes produced in the cutting area A are adhered to the inside of the splash inhibiting plate 17 and drop from the plate 17 when the cover is open. Since the splash inhibiting plate 17 is suspended and does not pass in front of the dicing device 1, an operating panel 16 and the floor in front of the device 1 are not contaminated. Also, since movements of the splash inhibiting plate 17 are restricted by the guide 19, it does not swing and does not touch the cutting device accordingly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for cutting a material such as a semiconductor wafer having a plurality of circuits, such as ICs, formed on a surface thereof into chips, and more particularly, to a dicing apparatus having a front surface of a cutting means. The present invention relates to a special opening / closing cover device provided and a dicing device to which the opening / closing cover device is attached.

[0002]

2. Description of the Related Art Generally, as a dicing apparatus of this type, a dicing apparatus having a configuration shown in FIG. 4 is known as a conventional example. The dicing apparatus 1 includes a chuck table 2 for sucking and holding at least a workpiece such as a semiconductor wafer and performing a cutting process, and a spindle unit 4 equipped with a cutting blade 3.

Further, the dicing apparatus 1 has a carry-out means 6 for taking out one by one in order from a cassette 5 on which a large number of workpieces are mounted and storing the work in its original position, and the carrying-out means 6 causes the carry-out means 6 to reach a mounting area 7. The rotating arm 8 transports the unloaded workpiece to the chuck table 2 and the transport arm 10 transports the processed workpiece from the chuck table 2 to the cleaning area 9 for cleaning.
An imaging device 11 is provided on an extension portion 1a of the dicing device 1 extending from the device main body. The imaging device 11 captures an image of a workpiece placed on the chuck table 2 and cuts an area to be cut by image processing such as pattern matching. After the completion of the above alignment, the workpiece is cut by the blade 3.

In this cutting process, a predetermined cutting fluid (pure water) is jetted and supplied to a cutting portion of a workpiece through a cutting fluid supply means such as a nozzle (not shown), while the blade 3 is used for grinding or cutting. Cutting is being performed, and spray of cutting fluid containing cutting chips is generated in the form of mist around the blade 3, that is, in the cutting area. A protective cover 12 made of a transparent resin is provided on the upper part of the dicing apparatus 1 so that the splash does not scatter outside.

In the protective cover 12, opening / closing covers 13, 14, 15 are provided in the cutting area A, the workpiece support area B, and the workpiece insertion / removal area C via hinge members 13a, 14a, 15a, respectively. And gripping member 1
It is provided so that it can be opened and closed by 3b, 14b, 15b.

In particular, as shown in FIG. 5, the opening / closing cover 13 in the cutting area A holds the gripping member 13b from the front side when checking the cutting state of the workpiece or replacing the blade 3, so that the hinge 13 has a hinge. The opening and closing cover is opened by rotating it so as to lift upward about the member 13a, and at the time of opening, the lower end of the opening / closing cover is opened so as to be able to jump up around the front side largely, and is maintained at the open position. Various operations are performed in the state. In the dicing apparatus 1, an operation panel 16 is provided on the front side of the cutting area A and the support area B.

[0007]

The cutting area A
Is the source of the droplets, and because there are many droplets, the droplets contaminated with many cutting chips adhere to the inner surface of the opening and closing cover 13 to form water droplets. When the opening and closing cover 13 is lifted and opened, Water drops adhering to the inner surface of the cover 1
3 from the lower end. Since the lower end portion of the opening / closing cover 13 largely bypasses the front side,
There is a problem that it is dropped on the front operation panel 16 and the floor surface on the front side of the dicing apparatus 1 to contaminate it.

[0008] Therefore, in the prior art opening / closing cover and dicing apparatus, there is a problem to be solved in order to prevent water droplets adhering to the inner surface from dropping to the outside when the opening / closing cover is opened / closed and to prevent contamination. Have.

[0009]

As a specific means for solving the above-mentioned problems of the prior art, the present invention is directed to a dicing apparatus, which is located on the front side of a cutting means, and has an upper end portion which is freely opened and closed by a hinge member. An opening / closing cover for a cutting area, wherein a splash prevention plate is vertically provided via a hinge member inside the opening / closing cover, and a guide member for regulating the movement of the splash prevention plate is provided on an inner wall of the cutting area. And a cover device for opening and closing the cutting area.

Further, in the present invention, there is provided a dicing apparatus having an opening / closing cover for a cutting area which is located on the front side of the cutting means and whose upper end is openably and closably attached by a hinge member. A dicing apparatus is provided with a drip-prevention plate suspended via a hinge member, and a guide member for restricting the movement of the drip-prevention plate is provided on the inner wall of the cutting area. .

[0011] In any of the devices, an additional component that the upper portion of the guide member is curved or bent inward is included.

In the opening / closing cover device and the dicing device according to the present invention, since the splash prevention plate is provided vertically inside the cover, the splash generated in the cutting area adheres to the inside of the splash prevention plate. Then, droplets hardly adhere to the inside of the front side of the cover, and when the cover is opened, water droplets do not drop from the lower end of the cover that bypasses the front side of the dicing device, and the droplets adhere. Water droplets will be dropped from the splash prevention plate, but since the splash prevention plate is in a vertically suspended state, it does not bypass the front side of the dicing device, so that the operation panel and the floor surface on the front side are not contaminated. It is.

[0013] Further, since the guide member is provided, even if the splash-prevention plate is in a vertically suspended state, the cover does not shake while opening or closing the cover or during operation, and moves under a predetermined restriction. Therefore, water droplets dropped from the splash prevention plate surely drop into the cutting area.

[0014]

Next, the present invention will be described in more detail with reference to the illustrated embodiments. To facilitate understanding, the same parts as those in the conventional example are denoted by the same reference numerals and described.
First, in the embodiment illustrated in FIGS. 1 to 3, the dicing apparatus 1 chucks and holds at least a workpiece such as a semiconductor wafer and performs chucking with a chuck table 2 serving as a support unit for cutting. Spindle unit 4 equipped with blade 3 as cutting means for performing
And

Further, the dicing apparatus 1 has a carry-out means 6 for taking out one by one from the cassette 5 in which a large number of workpieces are mounted and storing it in its original position, and the carrying-out means 6 to the mounting area 7. The rotating arm 8 transports the unloaded workpiece to the chuck table 2 and the transport arm 10 transports the processed workpiece from the chuck table 2 to the cleaning area 9 for cleaning.

The dicing apparatus 1 is provided with a photographing device 11 at an extension 1a extending from the main body of the dicing machine, and picks up an image of a workpiece placed on the chuck table 2 and performs image processing such as pattern matching. After the alignment of the region to be cut is completed, the workpiece is cut by the blade 3.

In this cutting process, while a predetermined cutting fluid (pure water) is jetted and supplied to a cutting portion of the workpiece through a cutting fluid supply means (not shown) such as a nozzle or the like, the blade 3 grinds or cuts. Cutting is being performed, and spray of cutting fluid containing cutting chips is generated in the form of mist around the blade 3, that is, in the cutting area. A protective cover 12 made of a transparent resin is provided on the upper part of the dicing apparatus 1 so that the splash does not scatter outside.

In this protective cover 12, opening / closing covers 13, 14 and 15 are provided at the cutting area A, the support area B for the workpiece and the loading / unloading area C of the workpiece via hinge members 13a, 14a and 15a, respectively. And gripping member 1
It is provided so that it can be opened and closed by 3b, 14b, 15b. In the dicing apparatus 1, an operation panel 16 is provided on the front side of the cutting area A and the support area B. The components described above are almost the same as those of the conventional example.

In the present invention, a splash prevention plate 17 is suspended from a hinge member 18 inside the opening / closing cover 13 provided in the cutting area A, and the movement of the splash prevention plate 17 is regulated. The configuration is characterized in that a strip-shaped guide plate 19 is provided on the wall surface of the cutting area A.

That is, as shown in FIGS. 2 and 3, a splash prevention plate 17 made of a transparent resin plate is provided inside the opening / closing cover 13 so as to hang down by its own weight. It can follow the opening and closing. The guide plate 19 guides the movement of the splash prevention plate 17 in accordance with the opening and closing of the splash prevention plate 17, and is formed by bending in a substantially "<" shape so that the upper half thereof is located inside as it goes to the upper end. ing. With such a configuration, the splash prevention plate 17 can be smoothly guided by following the movement of the opening / closing cover 13 associated with the opening and closing of the arc.

In the cutting area A, since the splash prevention plate 17 is provided inside the opening / closing cover 13, water droplets (cutting liquid) scattered around when the wafer is diced by the blade 3 as the cutting means. Water droplets do not adhere to the inner surface of the opening / closing cover 13 because they are received by the splash prevention plate 17.

Accordingly, the opening / closing cover 13 in the cutting area A is
As shown in FIG. 3, when checking the cutting state of the workpiece or replacing the blade 3, hold the gripping member 13 b from the front side and rotate the hinge member 13 a to lift upward with the hinge member 13 a as an axis. When opened, the splash-prevention plate 17 hanging down by its own weight is lifted upward following the opening / closing cover 13, but since the splash-prevention plate 17 is guided by the guide plate 19, its lower end is in an unstable state. Guide plate 1
The water droplets adhering to 9 fall into the cutting area A without fail and do not drop onto the operation panel 16 or the floor surface.

In particular, if the splash prevention plate 17 is simply attached in a hanging state, its lower end is in an unstable state where it is loose, and when the opening / closing cover 13 is opened or closed or swings due to external factors, and when it is extremely severe, When the cover 13 is closed, the splash prevention plate 17 swings inward when the cover 13 is closed, the cutting means catches the splash prevention plate 17, and the cover 13 is not closed.

Also in this regard, the splash prevention plate 1 of the present invention.
7 is a state in which the movement is restricted by the guide plate 19 even in the hanging state.
There is no swinging movement with the wobble due to external factors such as opening and closing of No. 3 and the safety and reliability are high.

[0025]

As described above, the cover device for opening and closing the cutting area according to the present invention is located on the front side of the cutting means in the dicing apparatus, and has an upper end portion which is attached to be openable and closable by the hinge member. Wherein a splash prevention plate is vertically provided via a hinge member inside the opening / closing cover, and a guide member for regulating the movement of the splash prevention plate is provided on an inner side wall of the cutting area. As a result, the splash prevention plate does not wobble, the splash generated in the cutting area adheres to the inside of the splash prevention plate, and when the opening / closing cover is opened, the water drops dripping from the splash prevention plate are reliably cut An excellent effect is obtained in that the dripping into the area does not contaminate the operation panel and the floor on the front side.

Further, the dicing apparatus according to the present invention is a dicing apparatus having an opening / closing cover for a cutting area, which is located on the front side of the cutting means and whose upper end is openably and closably attached by a hinge member. A splash prevention plate is vertically provided on the inside of the cover via a hinge member, and a guide member for regulating the movement of the splash prevention plate is provided on the inner side wall of the cutting region, so that it is generated in the cutting region. The splashes do not adhere to the inside of the opening / closing cover but adhere to the inside of the splash prevention plate, so when opening and closing the opening / closing cover, the water droplets attached to the splash prevention plate surely drop into the cutting area, Of course, the operation panel and the floor surface are not contaminated, but the movement of the splash-prevention plate is restricted by the presence of the guide member, so that the cutting means is swung inward without shaking. Disadvantages such as the cover does not close caught in an excellent effect that can be solved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dicing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view showing only a main part in the embodiment.

FIG. 3 is an enlarged side view showing an opening and closing operation of a main part in the embodiment.

FIG. 4 is a perspective view of a conventional dicing apparatus.

FIG. 5 is an enlarged side view showing an opening and closing operation of a main part in the conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Dicing apparatus, 1a ... Extension part, 2 ... Chuck table, 3 ... Blade, 4 ... Spindle unit, 5 ... Cassette, 6 ... Unloading means, 7 ...
... Placement area, 8 ... Slewing arm, 9 ... Washing area,
10: transfer arm, 11: imaging device, 12:
Protective cover, 13, 14, 15 ... Open / close cover, 13
a, 14a, 15a ... hinge member, 13b, 14b,
15b: gripping member, 16: operation panel, 17:
Splash prevention plate, 18 Hinge member, 19 Guide member, A Cutting area, B Support area, C Work-in / out area.

Claims (4)

[Claims] 1. An opening / closing cover for a cutting area, which is located on the front side of a cutting means in a dicing device and has an upper end attached to be openable and closable by a hinge member. And a guide member for regulating the movement of the splash prevention plate is provided on an inner wall of the cutting region. 2. The cover device according to claim 1, wherein an upper portion of the guide member is curved or bent inward. 3. A dicing apparatus having an opening / closing cover in a cutting area which is located on the front side of a cutting means and whose upper end is openably and closably attached by a hinge member, wherein a hinge member is provided inside the opening / closing cover. A dicing apparatus, wherein a splash prevention plate is vertically provided with a guide member for regulating movement of the splash prevention plate provided on an inner wall of a cutting area. 4. The dicing apparatus according to claim 3, wherein an upper portion of the guide member is curved or bent inward.