JPH10114425A - Boat - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a transfer failure when a semiconductor wafer is conveyed out from a boat by arranging a wafer supporting block supporting the semiconductor wafer via point contact on a semiconductor wafer supporting face in a groove of a boat supporting column arranged on the inside face of the boat. SOLUTION: On a semiconductor wafer 1 supporting face in a groove 62 of a boat supporting column 61 arranged on the inside face of a boat, a wafer supporting block 64 supporting a semiconductor wafer 1 via point contact is arranged. The wafer supporting block 64 is arranged in the position covered by the semiconductor wafer 1, even when a thick film such as a CVD film 63 and the like is formed, a transfer failure, which is caused when the CVD films 63 are accumulated in the clearance and the semiconductor wafer 1 adheres to the groove 62, can be prevented because there is a sufficient clearance between the semiconductor wafer 1 and the groove 62.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boat used for carrying semiconductor wafers into and out of a reactor in a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view schematically showing a semiconductor manufacturing apparatus having a vertical furnace.

[0005] A semiconductor wafer 1 to be processed in this apparatus is carried into a wafer transfer device 2, stored in a cassette stocker 3, and then mounted on a boat 6 via a transfer machine 4. The boat 6 on which the semiconductor wafer 1 is mounted is carried into the reaction furnace 7 by the boat elevator 5, and the semiconductor wafer 1 is subjected to a predetermined process in the reaction furnace 7.

FIG. 5 is a partial sectional view showing details of a conventional boat 6 on which the semiconductor wafer 1 is mounted.

[0005] As shown in the figure, a boat support 61 is provided on the inner surface of a conventional boat 6.
1, a plurality of grooves 62 for supporting the ends of the semiconductor wafer 1 and having a support surface perpendicular to the longitudinal direction of the boat support 61 and parallel to each other are provided. The semiconductor wafer 1 to be processed is mounted on the boat 6 with its end inserted into the groove 62,
It is carried into the reaction furnace 7 and subjected to predetermined processing.

FIG. 6 shows that a semiconductor wafer 1 is mounted on such a boat 6, loaded into a reaction furnace 7, and a thick film such as a CVD (chemical vapor deposition) film 63 (polycrystalline silicon having a thickness of 100 ° or more). FIG. 4 is a diagram showing a state in which a film or the like is formed. As shown in the figure, the contact area between the semiconductor wafer 1 and the support surface of the groove 62 is large, and the CVD film 63 is deposited in the gap between the semiconductor wafer 1 and the groove 62.

[0007]

In the above-mentioned conventional boat 6, the clearance between the semiconductor wafer 1 and the groove 62 is also CV.
Since the D film 63 is deposited and the contact area between the semiconductor wafer 1 and the support surface of the groove 62 is large, the semiconductor wafer 1 and the groove 62 are in a bonded state, and after the boat 6 is carried out of the reaction furnace 7, From the boat 6 is difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a boat from which semiconductor wafers can be easily taken out.

[0009]

According to the present invention, there is provided a wafer support for supporting a semiconductor wafer in point contact with a semiconductor wafer support surface of a groove of a boat support provided on an inner surface of a boat. Blocks are provided.

[0010]

FIG. 1 is a partial cross-sectional view showing a boat according to the present invention, FIG. 2 is an enlarged view of FIG. 1A, and FIG.
It is -B sectional drawing.

As shown in the figure, in the boat according to the present invention, a wafer support block 64 for supporting the semiconductor wafer 1 in point contact is provided on the semiconductor wafer 1 support surface of the groove 62 of the boat support 61.

In such a boat in which the wafer support block 64 is provided on the support surface of the groove 62, as shown in FIG.
Since the semiconductor wafer 1 is located at a position covered by the semiconductor wafer 1, even if CVD or the like is performed, a point contact state of the semiconductor wafer 1 is maintained by the wafer support block 64. Also, as shown in FIG. 2, even when a thick film such as the CVD film 63 is formed, a sufficient gap exists between the semiconductor wafer 1 and the groove 62, so that the CVD film 63 is deposited in the gap. As a result, the semiconductor wafer 1 and the groove 62 are not bonded to each other and become difficult to take out.

[0013]

As described above, in the boat according to the present invention, since the semiconductor wafer and the groove of the boat support of the boat do not adhere to each other, the semiconductor wafer is transferred when the semiconductor wafer is unloaded from the boat. Failures can be prevented. Therefore, damage to the semiconductor wafer and the boat can be prevented, the number of steps required for maintenance of the boat can be reduced, and the efficiency and economy of the semiconductor manufacturing process can be improved.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing a boat according to the present invention.

FIG. 2 is an enlarged view of a portion shown in FIG. 1A.

FIG. 3 is a sectional view taken along line BB of FIG. 2;

FIG. 4 is a perspective view schematically showing a semiconductor manufacturing apparatus having a vertical furnace.

FIG. 5 is a partial cross-sectional view showing details of a conventional boat on which a semiconductor wafer is mounted.

FIG. 6 shows CVD on a semiconductor wafer using a conventional boat.
It is a figure which shows the state at the time of forming a thick film, such as a film.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor wafer 2 wafer transfer device 3 cassette stocker 4 transfer machine 5 boat elevator 6 boat 7 reactor reactor 61 boat support 62 groove 63 CVD film 64 wafer support block

Claims (1)

[Claims] 1. A boat used for carrying semiconductor wafers into and out of a reactor in a semiconductor manufacturing apparatus, wherein the semiconductor wafer support surface of a groove of a boat support provided on an inner surface of the boat has A boat provided with a wafer support block for supporting a semiconductor wafer by point contact.