JPH10107450A - Method for manufacturing multi-layer printed wiring board, and development processing jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To develop photosensitive resin layers formed on both surfaces of a substrate at the same time, with the substrate kept in an upright state, by spraying developer from both sides of the substrate at the same time, for preventing the occurrence of undeveloped area. SOLUTION: In manufacturing a multi-layer printed wiring substrate, when an inter-layer insulating material layer comprising a viahole opening of a photosensitive resin layer on both surfaces of the wiring substrate, the multi-layer printed wiring substrate is kept in an upright state, a development process is performed by spraying a developer to the both surfaces of the photosensitive resin layer at the same time. Thereby, with undeveloped area left, the photosensitive resin layers formed on the both surfaces of the multi-layer printed wiring substrate are developed uniformly at the same time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board and a jig for development processing, and more particularly, to a development method capable of simultaneously developing photosensitive resin layers formed on both surfaces of a substrate without developing residue. A processing technique and a development processing jig suitable for the development processing technique are proposed.

[0002]

2. Description of the Related Art In recent years, so-called build-up multilayer printed wiring boards have attracted attention due to demands for higher density of the multilayer printed wiring boards. This build-up multilayer printed wiring board is manufactured, for example, by a method as disclosed in Japanese Patent Application Laid-Open No. 4-55555. According to this method, first, an uncured photosensitive resin insulating material (adhesive for electroless plating) is applied on a core substrate by a roll coater or the like, dried, exposed, and developed to form a via hole opening. Is formed. Next, after roughening the surface of the interlayer insulating material layer, a plating resist made of a photosensitive resin composition is provided on the roughened surface, and then a non-resist-formed portion is subjected to electroless plating to form a conductor including via holes. Form a circuit pattern. And it is a manufacturing method of a build-up multilayer printed wiring board characterized by forming a multilayer by repeating such a process a plurality of times.

In such a method for manufacturing a build-up multilayer printed wiring board, when a build-up multilayer wiring layer is to be formed on both surfaces of a substrate, an interlayer insulating material layer or a plating resist is formed on both surfaces of the substrate. It is necessary. When the interlayer insulating material layer or the plating resist is formed, usually, the above-mentioned development processing employs a method of immersing the substrate in a developer while horizontally transporting the substrate.
This method allows the photosensitive resin layers formed on both surfaces of the substrate to be developed simultaneously.

However, in such a development process by the immersion method, the photosensitive resin is eluted into the developer, so that the developer during mass production gradually deteriorates. For this reason, it is necessary to sequentially manage the deterioration state of the developer and replace it.

On the other hand, Japanese Patent Application Laid-Open No. Sho 62-290192 discloses a method of performing development processing using a spray-type developing apparatus instead of the immersion method. According to this developing method, a new developing solution is always sprayed, so that the developing solution does not deteriorate.

However, in the developing process by the spray method, when a build-up multilayer wiring layer is formed on both surfaces of a substrate, a method of spraying a developing solution from above and below while horizontally transporting the substrate is usually employed. (See FIG. 1). Therefore, the development state is different between the upper and lower surfaces of the substrate, and the swelling of the interlayer insulating material and the development residue at the bottom of the via hole opening occur on the upper surface of the substrate, while the lower surface of the substrate is regularly formed along the transport direction. There is a problem that development residue occurs.
Note that such swelling and undeveloped portions are generated not only when an interlayer insulating material layer is formed but also when a plating resist is formed.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to propose a developing method capable of simultaneously developing photosensitive resin layers formed on both surfaces of a substrate without developing residue. Another object of the present invention is to propose a developing jig suitably used in the above developing method.

[0008]

In order to achieve the above object, the present inventor first spray-develops a substrate while horizontally transporting the substrate, leaving undeveloped residues on the upper and lower surfaces of the substrate, and swelling the interlayer insulating material. The cause of the problem of the prior art, that is, the occurrence of the problem, was studied diligently. As a result, on the upper surface of the substrate, the developer in which the photosensitive resin has dissolved is accumulated in the opening for the via hole, and even if the developer is sprayed, the developer is not completely removed, so that residual development occurs, and the developer penetrates into the interlayer insulating material. To swell the resin. On the other hand, on the lower surface of the substrate, the developer in which the photosensitive resin is dissolved adheres to the substrate transport roller, which adheres to the substrate again when the substrate is transported, and the photosensitive resin is reprecipitated due to the evaporation of the solvent. ,
It has been newly found that development residue occurs.

[0009] The inventor conducted further intensive studies based on the above-mentioned findings. As a result, instead of the conventional developing method of performing development while transporting horizontally, the substrate is held vertically and sprayed with a developing solution from both sides of the substrate at the same time. ,
The inventors have found that the photosensitive resin layers formed on both surfaces of the substrate can be developed simultaneously without the developer remaining in the openings, and the method of the present invention has been completed.

That is, the present invention provides: (1) When manufacturing a multilayer printed wiring board, when forming an interlayer insulating material layer having a via hole opening made of a photosensitive resin layer on both surfaces of the wiring board, A method of manufacturing a multilayer printed wiring board, comprising: holding a substrate in an upright state; and performing a developing process by simultaneously spraying a developing solution on both sides of the photosensitive resin layer. (2) In manufacturing a multilayer printed wiring board, when forming a plating resist composed of a photosensitive resin layer on both surfaces of the wiring board, the substrate is held in an upright state, and the photosensitive resin layer is On the other hand, there is provided a method for manufacturing a multilayer printed wiring board, wherein a developing treatment is performed by simultaneously spraying a developing solution on both sides.

[0011] In the method of the present invention, as a developing jig suitably used for the above-mentioned developing process, the present invention provides a metal frame and elastic bodies provided on the left and right frames inside the frame. A metal jig elastically stretched through a jig for development processing, wherein a hook for supplying the jig is provided outside the upper frame of the frame, Inside the upper frame, upper hooks for suspending and supporting the upper end of the substrate are provided, respectively, while, on the metal support, lower hooks for locking the lower end of the substrate to the jig are provided. A jig for development processing (see FIGS. 2A and 2B) is proposed. Here, the metal support is the same as that shown in FIG.
A metal bar as shown in FIG. 2A or a metal frame as shown in FIG. 2B may be used. In the latter case, the displacement of the metal frame in the out-of-plane direction is smaller than that of the metal bar, and the substrate can be stably fixed.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The method for manufacturing a multilayer printed wiring board according to the present invention is characterized in that an interlayer insulating material layer made of a photosensitive resin layer or a plating resist is formed on both surfaces of a wiring board. It is characterized in that the developing process is performed by simultaneously spraying a developing solution on the photosensitive resin layer on both sides while holding it in a standing state and transporting it as needed.

According to the method of the present invention, the substrate is held vertically and the photosensitive resin layer is developed simultaneously on both sides. Unlike this, the developer does not accumulate in the via hole, and there is no need to contact the transport roller. As a result, there is no residual development at the bottom of the via hole opening or at the portion where the plating resist is not formed.

Further, according to the method of the present invention, since the developing solution is sprayed on the photosensitive resin layer while the substrate is transported in an upright state, a roller for supporting and transporting the substrate becomes unnecessary. Also, there is no problem that the developer containing the resin adhered to the roller adheres again to the substrate.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a multilayer printed wiring board according to the present invention will be described below. (1) First, an inner layer copper pattern is formed on the surface of the core substrate. The formation of a copper pattern on this substrate is performed by etching a copper-clad laminate, or an adhesive layer for electroless plating is formed on a substrate such as a glass epoxy substrate, a polyimide substrate, a ceramic substrate, and a metal substrate, There is a method in which the surface of the adhesive layer is roughened to a roughened surface, and electroless plating is performed thereon. Note that a through hole is formed in the core substrate, and the wiring layer on the front surface and the back surface can be electrically connected through the through hole.

(2) Next, an interlayer insulating material layer is formed on the substrate on which the inner layer copper pattern has been formed in (1). In the method of the present invention, when forming the interlayer insulating material layer on both surfaces of the wiring substrate, the substrate is sandwiched between a pair of application rolls in a state where the substrate is vertically set, and the interlayer insulating material is simultaneously applied to both surfaces. desirable.

As an interlayer insulating material constituting the interlayer insulating material layer, a thermosetting resin such as an epoxy resin, a polyimide resin, a bismaleimide triazine resin, a phenol resin, a photosensitive resin obtained by sensitizing these resins, or a polyether sulfone For example, a thermoplastic resin, a composite of a thermoplastic resin and a thermosetting resin, and a composite of a photosensitive resin and a thermoplastic resin can be used. Each of these interlayer insulating materials is an uncured insulating resin, and is simultaneously applied to both surfaces of the substrate using, for example, a roll coater having a pair of application rolls. This conceptual diagram is shown in FIG.

As shown in FIG. 3, according to the method of the present invention, the wiring board is sandwiched between a pair of coating rolls of a roll coater in a state of standing upright, and is conveyed from the lower side to the upper side so that the wiring board is disposed on both sides of the substrate. It is desirable to apply an interlayer insulating material simultaneously. The roll coater used here is provided with a doctor bar that makes complete contact with each roll on the application surface side or that has a certain gap of 0.6 mm or less. The doctor bar also forms a varnish reservoir for storing uncured interlayer insulating material between each roll. On the other hand, the surface of each roll is made of a resin such as rubber or urethane, and a number of grooves are formed in the resin surface in the rotational direction as shown in FIG. For this reason, when the roll rotates, the interlayer insulating material stored in the varnish reservoir enters the groove of the roll, and when the interlayer insulating material contacts the substrate, it is transferred to the substrate side and the interlayer insulating material is applied to the substrate. Is performed.

The substrate is transported as shown in FIG.
The method of transferring from the lower side to the upper side is more preferable than the method of transferring from the upper side to the lower side in that the upper side edges of the substrate can be easily transferred to the drying furnace, which is the next step. is there. The conveying speed is desirably 0.5 to 5 m / min.

In the method of the present invention, it is preferable that the length of the coating roll is shorter than the width of the substrate. The reason for this is that, as shown in FIG. 5, gripping portions without interlayer insulating material can be provided on both side edges of the substrate. When the grip portion is provided, handling can be performed by holding the grip portion, and a transport jig can be fixed to the grip portion and transported. As a result, at the time of handling or transporting, the hand of the worker or the transporting machine / equipment does not come into contact with the interlayer insulating material layer, and no dust or the like adheres to the interlayer insulating material layer. The roll length is 1 to 3 from the width of the substrate.
It is desirable to be shorter by cm. As a result, both sides of the substrate
This is because a grip portion having a thickness of 0.5 to 1.5 cm without an interlayer insulating material can be provided.

In the method of the present invention, when the interlayer insulating material is simultaneously applied to both surfaces of the substrate as described above, the drying treatment of the interlayer insulating material by the drying furnace is also performed simultaneously on both surfaces. As a result, the shrinkage of the insulating resin accompanying the volatilization of the solvent occurs simultaneously on both surfaces of the substrate, so that the substrate does not warp. Therefore, it is possible to prevent the via hole formed in the interlayer insulating material layer from being displaced and the conductor pattern from being displaced.

In the method of the present invention, it is desirable to use an adhesive for electroless plating as the interlayer insulating material. As the adhesive for electroless plating, an adhesive obtained by dispersing cured heat-resistant resin particles soluble in an acid or an oxidizing agent in an uncured heat-resistant resin hardly soluble in an acid or an oxidizing agent is optimal. . This is because, by dissolving and removing the heat-resistant resin particles soluble in an acid or an oxidizing agent, an octopus-shaped anchor can be formed on the surface and the adhesion to the conductor circuit can be improved.

In the above-mentioned adhesive for electroless plating, the heat-resistant resin which is hardly soluble in an acid or an oxidizing agent is preferably a sensitized thermosetting resin or a composite of a sensitized thermosetting resin and a thermoplastic resin. . Exposure by photosensitization,
This is because via holes can be easily formed by development. In addition, by forming a composite with a thermoplastic resin, the toughness can be improved, and the peel strength of the conductor circuit can be improved,
This is because the occurrence of cracks in the via holes due to the heat cycle can be prevented. Specifically, epoxy acrylate obtained by reacting an epoxy resin with acrylic acid, methacrylic acid, or the like, or a composite of epoxy acrylate and polyether sulfone is preferable. The epoxy acrylate is preferably one in which 20 to 80% of all epoxy groups have reacted with acrylic acid or methacrylic acid.

In the above-mentioned adhesive for electroless plating, the heat-resistant resin particles include a heat-resistant resin powder having an average particle size of 10 μm or less and a heat-resistant resin powder having an average particle size of 2 μm or less, and Agglomerated particles having a size of 2 to 10 μm, a mixture of a heat-resistant resin powder having an average particle size of 10 μm or less and a heat-resistant resin powder having an average particle size of 2 μm or less, and a heat-resistant resin powder having an average particle size of 2 to 10 μm It is desirable to select from pseudo particles obtained by adhering at least one of a heat-resistant resin powder and an inorganic powder having an average particle diameter of 2 μm or less on the surface. These are because they can form complex anchors. As the resin of the heat-resistant resin particles, epoxy resin, amino resin (melamine resin, urea resin, guanamine resin) and the like are preferable. Particularly, the solubility of an epoxy resin in an acid or an oxidizing agent can be arbitrarily changed by changing the type of the oligomer, the type of the curing agent, and the crosslinking density. For example, a bisphenol A-type epoxy resin oligomer cured with an amine-based curing agent is easily dissolved in an oxidizing agent. However, the novolak epoxy resin oligomer cured with an imidazole-based curing agent is hardly dissolved in the oxidizing agent.

In the method of the present invention, the interlayer insulating material layer does not need to be formed by one application, but may be formed by applying a plurality of times. In this case, an uncured resin insulating material is applied first, and after drying, an adhesive for electroless plating is further applied to form a two-layered interlayer insulating material layer.

(3) After drying the interlayer insulating material layer formed in the above (2), exposure and development are performed to provide openings for via holes. In particular, in the method of the present invention, the substrate on which the interlayer insulating material layer is formed is held in an upright state,
A developing solution is sprayed onto both surfaces of the interlayer insulating material layer at the same time to form an interlayer insulating material layer having a via hole opening made of a photosensitive resin layer on both surfaces of the wiring board. There is a feature. Preferably,
The development processing is performed using a development processing jig as shown in FIG.

Here, the developing jig comprises a metal frame and a metal bar or a metal frame elastically stretched via elastic bodies to left and right frames inside the frame. A processing jig, wherein a hook for providing a jig is provided outside the upper frame of the frame, and an upper portion for suspending and supporting the upper end of the substrate is provided inside the upper frame. Hooks, respectively, while the metal bar or metal frame has
The jig is provided with a lower hook for locking a lower end of the substrate.

In such a developing jig, a spring or rubber can be used as the elastic body. For example, in the developing jig shown in FIG. 2, the metal bar or the metal frame is elastically connected to the left and right frames inside the frame via a spring. Further, in the developing jig of the present invention, an upper hook and a lower hook for supporting a substrate are provided on surfaces opposed to each other inside the metal bar or the metal frame and the upper frame. ing. Thus, as shown in FIGS. 2 (a) and 2 (b), for example, the substrate is supported by the upper and lower holes through the upper hook and the lower hook, and is connected to one side of the metal bar or the metal frame. It is pulled downward and fixed by the body.

The substrate fixed to the developing jig is transported to the developing chamber by hooking a hook provided outside the upper frame of the jig frame on the transport rail. And
In the developing chamber, as shown in FIGS. 2A and 2B, a developing solution is sprayed from both right and left sides of the jig toward both sides of the substrate.

As described above, according to the method of the present invention, since the development is carried out with the substrate standing upright, the developer containing the photosensitive resin is always washed down by the action of gravity, and the vial is removed. It does not remain at the bottom of the hole opening or between the plating resists. Furthermore, according to the method of the present invention, the substrate is transported while being suspended and supported in a vertically upright state.
There is no contact with a transport roller or the like, and there is no development residue due to re-adhesion of the developer containing the photosensitive resin. Therefore, according to the method of the present invention, the photosensitive resin layers formed on both surfaces of the substrate can be uniformly developed.

As the developing solution, a glycol ether organic solvent having the following chemical structural formula such as DMDG (diethylene glycol dimethyl ether) and DMTG (triethylene glycol dimethyl ether) is preferable.
This developer contains NMP (N-methylpyrrolidone), N,
It may contain N-dimethylformamide (DMF), water and the like.

Embedded image CH ₃ O— (CH ₂ CH ₂ O) _n —CH ₃ (n = 1 to 5)

(4) After roughening the surface of the interlayer insulating material layer provided with the opening for the via hole in the above (3) with an acid or an oxidizing agent, a catalyst nucleus is provided. Here, examples of the acid that can be used for the above-mentioned roughening treatment include phosphoric acid, hydrochloric acid, sulfuric acid, and organic acids such as formic acid and acetic acid, and organic acids are particularly desirable. This is because when the roughening treatment is performed, the metal conductor layer exposed from the via hole is hardly corroded. On the other hand, as the oxidizing agent, chromic acid and permanganate (such as potassium permanganate) are desirable. In particular, in the case of dissolving and removing the amino resin, it is preferable to perform a roughening treatment alternately with an acid and an oxidizing agent. In addition, it is desirable to use a noble metal ion or a noble metal colloid for providing the catalyst nucleus. Generally, palladium chloride or a palladium colloid is used.
Note that it is desirable to perform a heat treatment to fix the catalyst core. Palladium is preferred as such a catalyst core.

(5) After providing the catalyst nucleus in the above (4), a plating resist is formed. In particular, in the method of the present invention, on both surfaces of the wiring board, a photosensitive resin layer made of epoxy acrylate or the like is also exposed and developed to form a plating resist. It is characterized in that a plating resist is formed on both surfaces of the wiring substrate by holding the device in an upright state and performing a developing process by simultaneously spraying a developing solution on both surfaces. Desirably, development processing is performed using a development processing jig as shown in FIG.

As the plating resist, commercially available products may be used, but a photosensitive resin composition comprising an epoxy acrylate obtained by reacting an epoxy resin with acrylic acid or methacrylic acid and an imidazole curing agent, or an epoxy acrylate, It is desirable to use a photosensitive resin composition comprising a polyether sulfone and an imidazole curing agent.

Here, the ratio of epoxy acrylate to polyether sulfone is preferably about 50/50 to 80/20. This is because if the amount of epoxy acrylate is too large, the flexibility is reduced, and if the amount is too small, the photosensitivity, base resistance, acid resistance and antioxidant properties are reduced. Epoxy acrylate,
It is desirable that 20 to 80% of all epoxy groups have reacted with acrylic acid or methacrylic acid. If the acrylate ratio is too high, the hydrophilicity due to the OH group increases and the hygroscopicity increases, and if the acrylate ratio is too low, the resolution decreases. As the epoxy resin as the basic skeleton resin, a novolak type epoxy resin is desirable. This is because the crosslinking density is high, the water absorption of the cured product can be adjusted to 0.1% or less, and the base resistance is excellent. Novolak type epoxy resins include cresol novolak type and phenol novolak type.

(6) Primary plating is applied to a portion where the plating resist is not formed in the process of (5). At this time, not only a copper pattern but also a via hole is formed. The primary plating is desirably an alloy plating using at least two or more metal ions selected from copper, nickel, cobalt and phosphorus. This is because these alloys have high strength and can improve the peel strength. In the electroless plating solution for the primary plating, it is necessary to use at least two kinds of metal ions selected from copper, nickel and cobalt. The reason for this is that these alloys have high strength and peel strength. This is because it can be improved.

In the above electroless plating solution for primary plating, it is desirable to use hydroxycarboxylic acid as a complexing agent for forming a stable complex with copper, nickel and cobalt ions under basic conditions. In the electroless plating solution for the primary plating, a reducing agent for reducing metal ions to a metal element is selected from aldehyde, hypophosphite (referred to as phosphinate), borohydride, and hydrazine. Desirably, at least one kind is used. This is because these reducing agents are water-soluble and have excellent reducing power. In particular, hypophosphite is desirable in terms of depositing nickel. In the electroless plating solution for the primary plating, at least one basic compound selected from sodium hydroxide, potassium hydroxide, and calcium hydroxide may be used as a pH adjuster for adjusting under basic conditions. desirable. This is because under basic conditions, hydroxycarboxylic acid forms a complex with nickel ions and the like. As the hydroxycarboxylic acid, citric acid, malic acid, tartaric acid and the like are desirable. This is because these easily form a complex with nickel, cobalt, and copper.
The concentration of the hydroxycarboxylic acid is preferably 0.1 to 0.8M. The reason for this is that if it is less than 0.1 M, a sufficient complex cannot be formed, resulting in abnormal precipitation and decomposition of the liquid. On the other hand, if it exceeds 0.8 M, problems such as a low deposition rate and an increase in generation of hydrogen occur.

It is desirable that the electroless plating solution for the primary plating contains bipyridyl. The reason for this is that bipyridyl can suppress the generation of metal oxides in the plating bath and the generation of nodules. Note that copper ions, nickel ions, and cobalt ions are supplied by dissolving a compound of copper, nickel, and cobalt such as copper sulfate, nickel sulfate, cobalt sulfate, copper chloride, nickel chloride, and cobalt chloride.

The primary plating film formed by such an electroless plating solution has excellent followability to the roughened surface of the adhesive layer for electroless plating, and traces the form of the roughened surface as it is. Therefore, the primary plating film has an anchor like the roughened surface. Therefore, the adhesion of the secondary plating film formed on the primary plating film is secured by the anchor. Therefore, in order to control the peel strength, the primary plating film is desirably a plating film having a high strength to be deposited by the electroless plating solution as described above, while the secondary plating film has a high electric conductivity and a high deposition rate. Therefore, a plating film deposited with a simple copper plating solution is more desirable than composite plating.

(7) Secondary plating is performed on the primary plating film formed in (6) to form a conductor circuit including a via hole composed of the primary plating film and the secondary plating film. The plating film formed by the secondary plating is preferably a copper plating film. The electroless plating solution for the above-mentioned secondary plating has a copper ion concentration of 0.005 in an electroless plating solution comprising copper ions, trialkanolamine, a reducing agent and a pH adjuster.
~ 0.015mol / l, concentration of pH adjuster is 0.25 ~ 0.35mol
/ L, and it is preferable to use an electroless plating solution having a reducing agent concentration of 0.01 to 0.04 mol / l. This is because the plating solution has a stable bath and generates little nodules and the like.

In the above electroless plating solution for secondary plating, the concentration of trialkanolamine is desirably 0.1 to 0.8M. This is because the plating precipitation reaction most easily proceeds in this range. This trialkanolamine is triethanolamine, triisopanolamine,
Desirably, at least one selected from trimethanolamine and tripropanolamine. Because it is water-soluble. In the above electroless plating solution for secondary plating, the reducing agent is desirably at least one selected from aldehyde, hypophosphite, borohydride, and hydrazine. This is because it is water-soluble and has a reducing power under basic conditions. The pH adjuster is desirably at least one selected from sodium hydroxide, potassium hydroxide, and calcium hydroxide.

(8) In the surface layer of the multilayer printed wiring board thus obtained, the surface of the interlayer insulating material layer is roughened, a plating resist is formed on the roughened surface, and a conductive circuit is formed on the non-formed surface of the plating resist. Is provided in an exposed state. Therefore, the exposed conductor circuit is protected by covering with a solder resist having an opening in a portion where a solder layer is to be formed.

(9) Then, nickel-gold plating is applied to the portion (pad portion) of the solder resist opening where the solder layer is to be formed. Form. In the solder transfer method, a solder pattern is formed on a film,
In this method, the solder pattern is heated and reflowed while being in contact with the pad to transfer the solder to the pad. In addition,
The solder layer may be a solder bump.

(10) Finally, the grip portion provided on the wiring board is cut and removed. In the case of mass production, a plurality of product pieces are cut out from a substrate of one work size by processing with a dicing machine or the like. In this processing, the grip portion can be cut and removed.

[0045]

As described above, according to the present invention, the photosensitive resin layers formed on both surfaces of the substrate can be simultaneously and uniformly developed without developing residue.

[Brief description of the drawings]

FIG. 1 is a view showing a conventional developing method for performing spray development while horizontally transporting a substrate.

FIG. 2 is a view showing a developing method using a developing jig according to the present invention.

FIG. 3 is a conceptual diagram showing a use state of a double-sided roll coater used in the manufacturing method of the present invention.

FIG. 4 is a view showing a surface structure of a coating roll used in the method of the present invention.

FIG. 5 is a diagram showing a state in which a grip portion without an interlayer insulating material is provided at both end portions of the substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal frame 2 Metal support 3 Elastic body (spring) 4 Hook 5 Roll 6 Doctor bar 7 Interlayer insulating material 8 Wiring board 9 Holding part

Claims (3)

[Claims] 1. A method of manufacturing a multilayer printed wiring board, in which an interlayer insulating material layer having a via hole opening made of a photosensitive resin layer is formed on both sides of a wiring board, and the board is set upright. And performing a developing process by simultaneously spraying a developing solution on both surfaces of the photosensitive resin layer. 2. When manufacturing a multilayer printed wiring board, when forming a plating resist composed of a photosensitive resin layer on both surfaces of a wiring board, the board is held in an upright state, and the photosensitive resin is A method for producing a multilayer printed wiring board, wherein a developing treatment is performed by simultaneously spraying a developing solution on both sides of the layer. 3. A jig for developing processing comprising a metal frame and a metal support elastically stretched via left and right frames inside left and right frames inside the frame, wherein the frame is a frame. Outside the upper frame of the body, a hook for providing the jig is provided, and inside the upper frame, an upper hook for suspending and supporting the upper end of the substrate is provided. A jig for developing processing, wherein a lower hook for locking a lower end of the substrate to the jig is provided on the support.