JPH10104307A - Instrument for measuring characteristic of laser diode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform the measurement in a short time by moving a laser diode bar after the laser characteristic at one edge side is measured, aligning the other edge side of the long side of the laser diode bar to the other edge side of a measuring stage, and measuring the characteristics of the laser. SOLUTION: A measuring stage 33, on which a laser diode bar 32 is mounted, is moved to a first characteristic measuring position 38. A voltage is applied across the measuring stage 33 and a probe, and the laser characteristic on one edge side of a laser diode element 31 is measured. The measuring stage 33 is moved to a second position 40. The other edge side of the long side of the laser diode bar 32 is aligned to the other edge side of the measuring stage 33. Then, the measuring stage 33 is moved to a second characteristic measuring position 44. A voltage is applied across the measuring stage 33 and the probe, and the laser characteristic on the other edge side of the laser diode element 31 is measured. This method is repeated, and the laser characteristics of the laser diode bar 32 are measured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser diode characteristic measuring device for measuring laser characteristics of two opposite end faces of a laser diode bar to which a compound semiconductor laser diode element is connected.

[0002]

2. Description of the Related Art In a laser diode characteristic measuring apparatus, a laser diode bar in which laser diode elements are connected in a bar state is a characteristic measurement object, and a laser characteristic from an end face is measured. (See, for example, JP-A-60-14488). That is, as shown in FIG. 3, the laser diode element 1 is cut by a mesa groove 8 of a plurality of laser diode bars 2 connected to each other, but the end faces 5 and 6 in the long side direction cleaved in the length direction in a bar state. The end face 7 in the short side direction is cleaved by a mesa groove 8. The upper electrode 3 is at the top,
A lower electrode 4 is formed below.

The laser characteristics from the end surfaces 5 and 6 in the long side direction are measured by using a laser diode bar 12 placed on a measurement stage 13 by a laser diode characteristic measuring device shown in FIG.
Laser characteristics are measured.

The measurement stage 13 is stopped at the first position 15 in the measurement stage moving area 20, and the laser diode bar 12 is placed near the upper end of the measurement stage 13 with the upper electrode facing upward. Stage 1
The laser diode bar 12 is fixed with one end face of the laser diode bar 12 aligned with one end face of the laser diode bar 12. The position of the measurement stage 13 and the positional relationship between the laser diode element 11 mounted thereon are stored in the image recognition processing device 17 at the positioning position 16. The laser characteristic of the laser diode element 11 is measured by the laser characteristic measuring means 19 according to the storage of the image recognition processing device 17 at the characteristic measuring position 18. Similarly, the laser characteristics of the adjacent laser diode elements 11 are sequentially measured, and the laser characteristics of one end face side of all the laser diode elements 11 of the laser diode bar 12 are measured.

[0005]

This laser diode characteristic measuring device can measure only the laser characteristic on one end face side of the long side of the laser diode. Therefore, multiply the man-hours, change the direction, measure the laser characteristics of the other end surface again in the same process, or ignore the laser characteristics of the other end surface without ignoring the decrease in product yield. I could assemble it.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been proposed to solve the above-mentioned problems. A laser diode bar for connecting a plurality of laser diode elements in a row is mounted and the laser diode bar is sucked. A measuring stage that can be held and transported in a predetermined direction;
A first positioning means for arranging one end face side in the longitudinal direction, in which a plurality of laser diode elements of the laser diode bar are connected at one position, on one end face side of a measurement stage parallel to the moving direction; When the laser diode bar is relatively moved to a predetermined position, first laser characteristic measuring means disposed at a position opposite to one end face side in the longitudinal direction, and the length of the laser diode bar at the second position of the measurement stage A second positioning means for arranging the other end face side of the direction on the other end face side of the measuring stage parallel to the transfer direction, and moving the laser diode bar arranged in parallel at the second position relatively to a predetermined position. And a second laser characteristic measuring device disposed at a position facing the other end face in the longitudinal direction. As described above, since the positioning means and the laser characteristic measuring means are provided at two places, the laser characteristic at the both end surfaces of the long sides of the laser diode bar facing each other can be measured only by passing the laser diode characteristic measuring device once.

In each position, the measurement stage may be arranged so as to be movable in the same direction, or in each position, the first half is arranged so as to be able to move the measurement stage in the first direction, and the second half is arranged in the second direction. The measurement stage may be provided so as to be transferable, or each position may be provided so that the measurement stage can be transferred in the rotation direction.

In addition, it is possible to increase the efficiency of measuring the laser characteristics by arranging the measurement stages in a circulating manner so that the measurement stages can be transferred from the second position to the first position, or by arranging a plurality of measurement stages.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment of the Invention] The laser characteristics of both ends 5 and 6 of the long side of the laser diode bar 2 shown in FIG. 3 are measured.
FIG. 1 shows a conceptual diagram of an example of the laser diode characteristic measuring device of the present invention. The laser diode bar 2 shown in FIG. 3 has a long side direction in which a plurality of laser diode pellets 1 are connected to each other in a length direction of 10 to 25 mm and a width of 0.2 to 1 mm. Cut at The upper electrode is separated into individual laser diodes by a mesa groove 8. The lower electrode is connected to the entire laser diode bar 2. Further, the lower electrode 4 may be separated one by one similarly to the upper electrode 3.

In FIG. 1, reference numeral 30 denotes a laser diode characteristic measuring device, 31 denotes a laser diode element, 32 denotes a laser diode bar in which a plurality of laser diode elements 31 are connected in a line, and 33 denotes a suction element near the opposing quadrangular end faces. A measuring stage 34 made of a conductive material having a hole (not shown) and movable in a predetermined direction; 34 is one of a measuring stage 33 having a plurality of laser diode elements 31 connected to one end face in the longitudinal direction and parallel to the moving direction; , A first positioning means 35, a first positioning position 36, a first alignment position 37, and a measuring position 33 at a position facing one end surface (upper side in the drawing) of the measuring stage 33. The first image recognition processing device 38, the first characteristic measurement position,
Reference numeral 39 denotes first laser characteristic measuring means disposed at a position facing one end face of the measuring stage 33.

Reference numeral 40 denotes a second position, 41 denotes second positioning means in which the other end face in the longitudinal direction to which the plurality of laser diode elements 31 are connected is arranged on the other end face of the measuring stage 33 parallel to the transfer direction, 42, a second alignment position; 43, a second image recognition processing device disposed on the other end surface side (lower side in the drawing) of the measurement stage 33;
Is a second characteristic measuring position, and 45 is a second laser characteristic measuring means disposed at a position facing the other end face of the measuring stage 33. Reference numeral 46 denotes a measurement stage moving area in which the measurement stage 33 moves.

A description will be given of the use of the apparatus together with its structure. First position 35 in measurement stage moving area 46
Then, the measurement stage 33 is stopped. Subsequently, the laser diode bar 32 is mounted by an automatic vacuum tweezers (not shown) on the upper electrode 3 (see FIG. 3) in a substantially parallel manner near one end surface (upper end in the drawing) of the measurement stage 33. Place. Subsequently, the laser diode bar 32 is pushed by the first positioning means 34 so that one end face side of the measurement stage 33 and one end face side (the upper end in the drawing) of the long side of the laser diode bar 32 are aligned. Subsequently, a vacuum pump (not shown) connected to a plurality of suction holes formed in a row on the measurement stage 33 below the mounted laser diode bar 32.
Then, the laser diode bar 32 is sucked and held, and the first positioning means 34 is returned to the original position.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is transferred to a first positioning position 36. Subsequently, the first image recognition processing device 37
Then, the positional relationship between the measurement stage 33 and the laser diode element 31 at the head (right end in the drawing) of the laser diode bar 32 is stored.

Subsequently, the measurement stage 33 on which the laser diode bar 32 is mounted is moved to the first characteristic measurement position 3.
Transfer to 8. Subsequently, in accordance with the storage of the first image recognition processing device 37, an end needle (not shown) of the first laser characteristic measuring means 39 is brought into contact with a predetermined region of the first laser diode element 31, and the measuring stage 33 and the probe are brought into contact. A voltage is applied between the two to measure the laser characteristic on one end face side of the laser diode element 31. If there is a defect in the characteristic, the surface of the laser diode element 31 is scratched with a diamond pen (not shown). In the step, it is removed as a defect. Then,
The measurement stage 33 is moved by one laser diode element 31, and the laser characteristics of the adjacent laser diode element 31 are measured in the same manner. The laser characteristics on one end face side of all the laser diode elements 31 of the laser diode bar 32 are measured in the same manner.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is transferred to the second position 40. Subsequently, the vacuum state is broken, and the laser diode bar 32 is made movable. Subsequently, the laser diode bar 32 is pushed by the second positioning means 41, and the other end face side of the long side of the laser diode bar 32 (the lower end in the drawing) is placed on the other end face side (the lower end in the drawing) of the measurement stage 33. At the bottom)
To match. Subsequently, a vacuum pump (not shown) communicating with a suction hole on the other end face side of the measurement stage 33 formed in a plurality of rows along the long side of the laser diode bar 32.
Then, the laser diode bar 32 is sucked and held, and the second positioning means 41 is returned to the original position.

Subsequently, the measurement stage 33 on which the laser diode bar 32 is mounted is moved to the second alignment position 4.
Transfer to 2. Subsequently, the second image recognition processing device 43 stores the positional relationship between the measurement stage 33 and the laser diode element 31 at the head (right end in the drawing) of the laser diode bar 32.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is moved to the second characteristic measuring position 44.
Transfer to Subsequently, according to the memory of the second image recognition processing device 43, the end needle (not shown) of the second laser characteristic measuring means 45 is brought into contact with a predetermined area of the first laser diode element 31 to search the measuring stage 33. A voltage is applied between the needles, and the laser characteristic of the other end face side of the laser diode element 31 is measured. If there is a defect in the characteristic, the surface of the laser diode element 31 is scratched with a diamond pen (not shown). It will be removed in a later step. Subsequently, the measurement stage 33 is moved by one laser diode element 31, and the laser characteristic of the other end face side of the adjacent laser diode element 31 is similarly measured. By repeating this operation, all the laser diode elements 31 of the laser diode bar 32 are
The laser characteristics on the other end face side are measured in the same manner.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is transferred to the first position 35. Subsequently, the vacuum state of the measurement stage 33 is once broken, and the laser diode bar 32 whose laser characteristics have been measured is taken out to a predetermined place by automatic vacuum suction tweezers.
The laser diode bar 32 whose laser characteristics have not been measured is placed on the measurement stage 33.

Subsequently, the above-mentioned method of use is repeated to measure the laser characteristics of the laser diode bar 32.

In the measurement order of the laser diode elements 31 in the laser diode bar 32, it is not necessary to start the measurement from the head, but the movement of the measurement stage 33 becomes smoother when the measurement is sequentially performed from the head.

Also, with the measurement stage 33 stopped,
Positioning means 34, 41, image recognition processing devices 37, 43
Alternatively, any or all of the laser characteristic measuring means 39 and 45 may be relatively moved.

The defective pellet may be damaged by sapphire, a tungsten needle or the like, instead of being damaged by diamond, or ink may be applied as a mark.

Since the first image recognition processing device 37 and the second image recognition processing device 43 have the same function, devices having the same structure are desirable. However, the apparatus does not need to be an image recognition processing apparatus as long as the apparatus stores the positional relationship between the measurement stage 33 and the laser diode element 31 and can retrieve the information later.

Since the first laser characteristic measuring means 39 and the second laser characteristic measuring means 45 measure the same laser characteristic, it is desirable that the devices have the same structure.

The transfer of the measuring stage 33 is performed by X, Y
A stage or a method of moving on a rail may be used, but a structure capable of accurately moving by 0.3 mm is required.

When measuring the laser characteristics, the measuring stage 33 may be fixed and the laser characteristic measuring means 39, 45 may be moved by one laser diode element 31.

The positions 35, 36, 38, 4
0, 42, and 44 do not necessarily have to be straight because of the area occupied by peripheral devices.

The first position, the second position 3
Some of the 5, 40 alignment positions 36, 42 and the characteristic measurement positions 38, 44 may also be used. For example, first position, second position 3
The alignment may be performed after the parallel positioning at the first position 35 and the second position 35 40 by setting the positions 5 and 40 and the alignment positions 36 and 42 as one location.

The transfer of the measurement stage 33 from the second position 44 to the first position 35 may be different from the transfer path from the first position 35 to the second characteristic measurement position 44 where the process has been advanced. At this time, if a plurality of steps are performed simultaneously using a plurality of measurement stages 33, the processing of the plurality of laser diode bars 32 can be performed simultaneously.

[Second Embodiment] The concept of another example of the laser diode characteristic measuring apparatus of the present invention for measuring the laser characteristics of both ends 5 and 6 of the long side of the laser diode bar 2 shown in FIG. The figure is shown in FIG. The same parts as those in FIG. 1 are denoted by the same reference numerals and description thereof will be omitted. 31 to 39 are the same as those in FIG.

In the figure, reference numeral 50 denotes a laser diode characteristic measuring device; 51, a measuring stage moving area in which the measuring stage 33 moves; 52, a second position on the diagonal line of the first position 35; , 54
Is the second diagonal of the first alignment position 36
An alignment position 55 is a second image recognition processing device disposed on the other end surface side (lower side in the drawing) of the measurement stage 33, and a second characteristic 56 on a diagonal line of the first characteristic measurement position 38. The measurement position 57 is a second laser characteristic measuring means disposed on the other end face side of the measurement stage 33. The arrow in the figure indicates the traveling direction of the measurement stage 33.

The structure and use of this device will be described. The process up to the measurement of the laser characteristic on one end face side of the laser diode bar 32 by the first laser characteristic measuring means 39 is the same as in [Embodiment 1] and will not be described.

The measurement stage 33 on which the laser diode bar 32 is mounted is moved from the first characteristic measurement position 38 in the measurement stage moving area 51 to the right end in the drawing from left to right in the first direction, which is the first direction. Thereafter, it is transferred to the second position 52 at the lower end on the drawing. Subsequently, the vacuum of the measurement stage 33 is once broken. Subsequently, the laser diode bar 32 is pushed by the second positioning means 53, and the other end face side (the lower end in the drawing) of the measuring stage 33 is connected to the other end face side of the longer side of the laser diode bar 32 (in the drawing). Bottom). Subsequently, the laser diode bar 32 is sucked and held by being evacuated by a vacuum pump (not shown) communicating with a plurality of suction holes (not shown) formed in a row along the long side below the laser diode bar 32. I do.
Subsequently, the second positioning means 53 is returned to the original position.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is moved to the second alignment position 5.
Transfer to 4. Subsequently, the positional relationship between the measurement stage 33 and the laser diode element 31 at the head (left end in the drawing) of the laser diode bar 32 is stored in the second image recognition processing device 55.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is moved to the second characteristic measuring position 5.
Transfer to 6. Subsequently, the second image recognition processing device 55
According to the storage of the above, the probe (not shown) of the second laser characteristic measuring means 57 is brought into contact with a predetermined region of the laser diode element 31 at the head of the laser diode bar 32 to apply a voltage between the measuring stage 33 and the probe. Then, the laser characteristic of the other end of the laser diode element 31 is measured, and if there is a defect in the characteristic, the surface of the laser diode element 31 is scratched with a diamond pen (not shown) and removed in a later step. . Subsequently, the measurement stage 33 is moved by one laser diode element 31, and the laser characteristic of the other end face side of the adjacent laser diode element 31 is measured in the same manner.
The laser characteristics on the other end face side of all the laser diode elements 31 of the laser diode bar 32 are similarly measured.

Subsequently, the measuring stage 33 on which the laser diode bar 32 is mounted is moved to the measuring stage moving area 51.
After being transferred from the right end to the left end, which is the second direction, along the lower end inside, the transfer is made to the first position 35 at the upper end. Subsequently, the vacuum of the suction hole of the measurement stage 33 is turned off, the laser diode bar 32 whose laser characteristics have been measured with automatic vacuum suction tweezers is taken out to a predetermined place, and the laser diode bar 32 whose laser characteristics have not been measured is removed with vacuum suction tweezers. It is supplied on the measurement stage 33.

A plurality of measurement stages 33 are put in the measurement stage moving area 51, and the positions 35, 40, the alignment positions 38, 44, the characteristic measurement positions 38,
Different processes of measuring the laser characteristics of the laser diode bar 32 by the positioning means 34 and 41 at the same time can be performed simultaneously at 44, and the laser characteristics of the plurality of laser diode bars 32 can be measured at the same time. Therefore, the characteristics of the laser diode element 31 can be measured quickly.

The first in the measurement stage moving area 51
Position 35, first alignment position 36, first
The second position 52, the first alignment position 54, and the first characteristic measurement position 56 are provided below the characteristic measurement position 38 in the drawing, and if the target processing can be performed, the width of the measurement stage moving area is reduced. Is also good.

Further, if the laser diode bar 32 can be accurately placed at a predetermined position on the measurement stage 33, the image recognition processing devices 37 and 55 may be omitted.

The other items described in the first embodiment of the invention that can be adopted by this method are not particularly described in order to avoid redundant description.

[0041]

According to the present invention, the laser characteristic of one end face of the laser diode bar is measured by aligning one end face of the long side of the laser diode bar with one end face of the measurement stage, and then the laser diode bar is moved and measured. The other end face of the long side of the laser diode bar is aligned with the other end face of the stage, and the laser characteristic of the other end face of the laser diode bar is measured. Therefore, laser characteristics on both end surfaces of the laser diode bar can be measured in a short time.

Further, the measurement stage is returned from the characteristic measurement position on the other end face side of the long side of the laser diode bar to a position for positioning one end face side of the long side of the laser diode bar directly to one end face of the measurement stage. By using a plurality of measurement stages at the same time, it is possible to perform processing of different laser characteristic measurement steps for a plurality of laser diode bars at a time.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a laser diode characteristic measuring apparatus according to the present invention.

FIG. 2 is a conceptual plan view of another embodiment of FIG. 1;

FIG. 3 is a perspective view of a laser diode bar.

FIG. 4 is a conceptual plan view of a conventional laser diode characteristic measuring device.

[Explanation of symbols]

 Reference Signs List 31 laser diode 32 laser diode bar 33 measurement stage 34 first position determining means 35 first position 39 first laser characteristic measuring means 40, 52 second position 41, 53 second position determining means 45, 57 second Laser characteristic measuring means

Claims (6)

[Claims] 1. A measuring stage in which a laser diode bar in which a plurality of laser diode elements are connected in a row is placed, adsorbed and held, and can be moved in a predetermined direction, and the laser diode is placed at a first position of the measuring stage. First positioning means for arranging one end face side in the longitudinal direction of the bar in which a plurality of laser diode elements are connected in parallel on the end face side of the measurement stage parallel to a transfer direction; and the laser arranged in parallel at the first position. When the diode bar is transferred to a predetermined position, first laser characteristic measuring means disposed at a position opposite to one end face side in the longitudinal direction, and a longitudinal direction of the laser diode bar at a second position of the measuring stage. A second positioning means for arranging the other end face side of the measurement stage on the other end face side of the measurement stage parallel to the transfer direction; A laser diode characteristic measuring device comprising: a second laser characteristic measuring means disposed at a position facing the other end face side in the longitudinal direction when the laser diode bars arranged in two positions in parallel are transferred to a predetermined position. . 2. The laser diode characteristic measuring apparatus according to claim 1, wherein each of said positions is disposed so as to be able to move said measuring stage in the same direction. 3. The laser diode characteristic measurement according to claim 1, wherein each of the positions is arranged so that the measurement stage can be moved in the first direction in the first half, and can be moved in the second direction in the second half. apparatus. 4. The laser diode characteristic measuring device according to claim 1, wherein each of said positions is disposed so as to be able to move said measuring stage in a rotating direction. 5. The laser diode characteristic measuring device according to claim 2, wherein said measuring stage is provided so as to be able to be transferred from said second position to said first position. 6. The laser diode characteristic measuring apparatus according to claim 3, wherein a plurality of said measuring stages are provided.