JPH0996571A - Heat receiving body of temperature sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inexpensive heat receiving body of temperature sensor having a simple structure and excellent responsiveness by connecting one conductive terminal to a ceramic heat sensitive element, which is bonded to the inner bottom surface of a tubular heat receiving metal body having the bottom. SOLUTION: One conductive terminal 4 is connected to a ceramic heat sensitive element 3, which is bonded to the inner bottom surface 21A of a tubular heat receiving metal body 2 having the bottom, and the heat receiving body 1 of temperature sensor is formed. In the heat receiving body 1, a buffer member is provided between the heat sensitive element 3 and the heat receiving metal body 2, and a buffer member is provided between the heat sensitive element 3 and the conductive terminal 4 at the same time. Furthermore, it is recommendable that the heat receiving metal body 2 and the heat sensitive element 3 are bonded through a bonding layer 5 containing an active metal. The heat sensitive element 3 is an oxide sintered body of crystal structure of any of perovskite type, spinel type, rutile type or corundum type. When the active metal is contained in the bonding layer 5, in general, the brazing filler metal containing Ti beforehand such as AgCuTi-based foil is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature sensor heat receiving body of a temperature sensor for detecting the temperature of an object by contacting the object, and more specifically, it is attached to a cooking appliance such as a gas stove to cook a pot. The present invention relates to a temperature sensor heat receiver for a temperature sensor that detects the temperature of a device.

[0002]

2. Description of the Related Art Conventionally, the temperature sensing element 10 shown in FIG.
3 is connected, for example, a pair of electrodes (leads) are attached to the temperature sensitive elements 103 and 103 ′ (FIGS. 8 and 9) such as the thermistor element that constitutes the main part of the temperature sensor heat receiver 101. (Line) 109, 109 'were connected. That is, the pair of electrodes (lead wires) was used to obtain a positive / negative potential difference.

[0003]

However, these temperature-sensitive elements 103 and 103 'are, for example, when the temperature-sensitive element is a ceramic temperature-sensitive element, a pair of lead wires (at the same time in the manufacturing process of the ceramic temperature-sensitive element). Electrode) 109, 10
Since 9'is integrated with the ceramic thermosensitive element, there is a gap between electrodes (between lead wires) in the pressing step, firing step, etc. (distance between the tips of the lead wires embedded in the ceramic thermosensitive element). Has occurred, and as a result, the output resistance value has varied. Further, in the case of a ceramic temperature-sensitive element whose firing temperature is high in the firing step (for example, 1300 ° C. or higher for rutile type (TiO2 main component)), when the electrodes are fired at the same time as the ceramic temperature-sensitive element and integrated, the cost of platinum or the like is high. Since only metallic materials that can withstand high temperatures, relatively inexpensive electrode (lead wire) materials cannot be selected, resulting in high costs.

An object of the present invention is to provide an inexpensive temperature sensor heat receiving body having a simple structure and excellent responsiveness.

[0005]

[Means for Solving the Problems] The means are a bottomed cylindrical heat receiving metal body, a ceramic temperature sensing element bonded to the inner bottom surface of the bottomed tubular heat receiving metal body, and the ceramic temperature sensing element. The temperature sensor heat receiver is composed of one conductive terminal connected to the temperature sensor. In the temperature sensor heat receiving body, it is preferable that a buffer member is interposed between the ceramic temperature sensing element and the heat receiving metal body. Further, in the temperature sensor heat receiver, it is preferable that a buffer member is interposed between the ceramic temperature sensing element and the conductive terminal. Further, in the temperature sensor heat receiving body, a buffer member is interposed between the ceramic temperature sensing element and the heat receiving metal body, and a buffer member is interposed between the ceramic temperature sensing element and the conductive terminal. Is preferred. Further, in the temperature sensor heat receiving body, it is preferable that the bottomed cylindrical heat receiving metal body and the ceramics temperature sensitive element are bonded via a bonding layer containing an active metal. Further, in the temperature sensor heat receiving body, it is preferable that the ceramics temperature sensing element and the conductive terminal are bonded via a bonding layer containing an active metal. The ceramic thermosensitive element of the above means is a perovskite type, a spinel type (general formula AB ₂ 0 ₄ , for example CoO-Al ₂ 0 ₃ ), a rutile type (general formula AO ₂ , for example, TiO ₂ , ZrO ₂ ) or a corundum type. (General formula A ₂
0 ₃ , for example, Cr ₂ O ₃ —Al ₂ 0 ₃ ) is preferable to be an oxide sintered body.

Here, in order to contain the active metal in the bonding layer, it is necessary to preliminarily use T like an AgCuTi-based or AgTi-based foil.
A method using a brazing material containing i is general, but other methods such as AgCu alloy foil and Ti foil or Cu foil and Ti foil are used, and a paste containing Ti is applied for brazing and joining. There are ways to do it. When joining with a brazing material containing no active metal such as an AgCu alloy brazing material, an AgPd alloy brazing material, a pure Ag brazing material, or a Cu brazing material, the bonding surface of the ceramic temperature sensing element may be metallized in advance. . On the other hand, when joining with an active brazing material containing an active metal such as Ti, Zr, or Hf, the active metal forms a reaction product at the interface with the ceramics, and therefore the bonding surface of the ceramic temperature-sensitive element is metalized in advance. There is no need to keep it. Therefore, the step of metallizing the bonding surface on the surface of the ceramics temperature sensitive element can be eliminated, and the manufacturing cost can be reduced.
Here, the heat receiving metal body may be made of any material as long as the electric resistance is not extremely large, but when exposed to a high temperature, stainless steel, heat resistant steel, nickel or the like is preferable. Further, the coefficient of thermal expansion of the ceramic material is preferably close to that of the ceramic material forming the ceramic thermosensitive element. Further, the conductive terminal does not require heat resistance as much as the heat-receiving metal body, and a mild steel,
Nickel, copper and the like can be preferably used. Kovar, Fe42Ni alloy and the like having a small thermal expansion coefficient are also preferably used. In addition, platinum, rhodium, palladium or alloys thereof are preferable except that they are expensive. Then, this conductive terminal can be connected to the ceramic temperature sensitive element by a metal plate by diffusion bonding by hot pressing, friction welding or the like. Further, it can be formed on the ceramic temperature sensitive element by sputtering, vapor deposition, plating, thick film, or the like. On the other hand, it is also possible to apply a brazing filler metal paste to the temperature-sensitive element before sintering and co-firing with the temperature-sensitive element to form it on the ceramic temperature-sensitive element. Alternatively, the brazing material for bonding can be formed as a conductive terminal by applying the brazing material for bonding onto the ceramic temperature-sensitive element and heat-treating it. The conductive terminal is preferably provided so as to cover the entire one surface of the ceramics temperature sensitive element. In particular, if it is provided so as to be parallel to the heat receiving metal body, an electrically stable output can be obtained.

The cushioning member is preferably a member made of a low expansion metal such as W, Mo, W alloy, Kovar or a soft metal such as Ni or Cu. Only one of these buffer members may be used, or a plurality of these buffer members may be stacked and used.
The thickness of the cushioning member is preferably about 0.1 mm to 1 mm. This is because if it is less than 0.1 mm, the thermal shock may not be sufficiently absorbed, and if it exceeds 1 mm, the effect of alleviating the stress against the thermal shock will not be further improved and the response will be rather deteriorated. The bottomed tubular heat receiving metal body can be manufactured by pressing a metal plate. It is also possible to manufacture by connecting a metal tubular portion to a metal plate by welding, friction welding or the like.

[0008]

The temperature sensor heat receiving body of the present invention is connected to the ceramic temperature sensing element and the ceramic temperature sensing element bonded to the inner bottom surface of the bottomed cylindrical heat receiving metal body and the bottomed cylindrical heat receiving metal body. Therefore, the heat receiving metal body can be used as one electrode, and one conductive terminal can be used as another electrode. Therefore, as compared with the conventional case where two electrodes (two lead wires) are used, it is possible to reduce the amount of material constituting the conductive terminal to be the electrodes (lead wires). Further, platinum materials and the like are generally low in resistance value and expensive, but even if the conductive terminals are made of platinum materials, the amount of platinum materials used can be reduced. Further, since the heat-receiving metal body is used as one electrode, the resistance up to the ceramic temperature-sensing element can be reduced by the amount that the other electrode becomes unnecessary. Further, a stable output resistance value can be obtained by using a ceramic temperature sensitive element having a predetermined shape or size, and by extension, a highly reliable temperature sensor heat receiver can be obtained. Furthermore, when the heat-receiving metal body and the ceramic temperature-sensitive element are joined by a joining layer containing an active metal,
The thermal response of the sensor becomes good.

Further, in the case of bonding through the bonding layer, the heat receiving metal body or the conductive terminal and the ceramic temperature sensing element are
The components in the bonding layer diffuse chemically at the interface with the two, so that they are chemically bonded and thus firmly bonded. As a result, the temperature sensor heat receiver of the present invention is excellent in the thermal shock characteristics of a sudden temperature change, and also has a good thermal response. When the bonding layer contains an active metal, a reaction generation layer (for example, TiO ₂ , Ti, etc.) is formed at the bonding interface of the ceramic thermosensitive element.
O and the like) are formed, and the reaction generation layer thereof effectively functions to firmly bond the ceramics temperature sensitive element, and further effectively functions to heat conductivity, that is, responsiveness. Further, by interposing a cushioning member in addition to the bonding layer between the heat receiving metal body or the conductive terminal and the ceramic temperature sensing element, the bonding layer is peeled off due to a sudden temperature change (cooling, heating) and the ceramic temperature sensing element. Can be more effectively prevented. Further, by interposing a buffer member between the conductive terminal and the ceramics temperature sensing element in addition to the bonding layer, the stress received from the heat receiving metal body by the ceramics temperature sensing element is canceled out and balanced. The stress state can be obtained. In addition, the cushioning member is interposed between the conductive terminal and the ceramics temperature sensing element in addition to the bonding layer, so that the stress that the ceramics temperature sensing element receives from the cushioning member between the heat-receiving metal and the ceramics temperature sensing element is further reduced. It is possible to cancel the stress received from the buffer member and to obtain a balanced stress state. Further, by providing the ceramic temperature-sensitive element with a conductive terminal in advance, it is not necessary to bond the conductive terminal to the ceramic temperature-sensitive element after the subsequent step, for example, the step of bonding the ceramic temperature-sensitive element and the heat-receiving metal body. The process can be simplified. On the other hand, the temperature sensor heat receiving body of the present invention can simplify the structure, and thus can reduce the manufacturing cost.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A method of using a temperature sensor-heat receiving body of the present invention will be described with reference to FIG. When the outer bottom surface 21B of the bottomed tubular heat receiving metal body 2 comes into contact with an object, the temperature of the object is detected. Specifically, it is attached to a cooking utensil (not shown) such as a gas stove and comes into contact with the bottom of a pan or the like to detect the temperature. Then, according to the temperature (heat amount), the heat receiving metal body 2 is used as one electrode and the conductive terminal 4 is used as another electrode, and a predetermined amount of current flows to function as a temperature sensor. In the temperature sensor heat receiving body 1 of the present invention, the output resistance value can be easily set to a predetermined value by finishing the thickness and the like of the ceramic temperature sensing element 3 in advance to a predetermined dimension.

-Example 1- As shown in FIG. 1 (FIG. 6), the temperature sensor heat receiving body 1 of the present embodiment has a bottomed cylindrical heat receiving metal body 2 and the bottomed cylindrical heat receiving metal body 2. The ceramic temperature sensitive element 3 is joined to the inner bottom surface 21 of the and the one conductive terminal 4 connected to the ceramic temperature sensitive element 3. The bottomed tubular heat-receiving metal body 2 and the ceramics temperature-sensitive element 3 may either be directly joined or joined via a joining layer. When joining is performed via a joining layer, the joining layer must be made of a conductive material. For example, the joining layer may be formed of a brazing material. The ceramics temperature sensitive element 3 and the conductive terminal 4 may be directly bonded or bonded via a bonding layer. When joining via the joining layer, the joining layer must be made of a conductive material. For example, the joining layer may be formed of a brazing material. Although the lead wire 9 is connected to the conductive terminal 4, the lead wire 9 may be formed integrally with the conductive terminal 4 in advance. A method of manufacturing the temperature sensor heat receiver of this embodiment will be specifically described.

(How to make a ceramic temperature sensitive element) Y2O3 having an average particle size of about 1 μm and Sr having an average particle size of 1 μm or less
CO3, Cr2O3, TiO2 and Fe2O3 are added to (Y
0.71Sr0.29) (Cr0.76Fe0.19Ti0.05) O3 is weighed at a ratio (atomic%), wet mixed, dried, and then calcined in the atmosphere at 1400 ° C for 2 hours. Then, 1% by weight of SiO2 powder having an average particle size of 0.6 .mu.m (calcined powder as 100%) is added to the calcined powder, wet mixed and dried. After drying, PVB (poly
Vinyl butyral), DBP (dibutyl phthalate), MEK (methyl ethyl ketone) and toluene are added in appropriate amounts and granulated. By press-molding this granulated powder and then firing it in the atmosphere at 1550 ° C.,
A perovskite type ceramic temperature sensitive device 3 (thermistor device) was obtained. The thermistor element has a diameter of 4 mm.
mm thickness 2 mm (FIG. 7). 0.2m at the corner
C chamfer of about m is applied.

(Method for manufacturing heat-receiving metal body) Thickness 0.3 mm
The heat-receiving metal body 2 was obtained by pressing the metal plate (JIS SUS430) of (1) into a cylindrical shape with a bottom (outer diameter 16 mm, height 10 mm, thickness 0.3 mm).
After that, electrolytic Ni plating was applied. (Conductive Terminal) As the conductive terminal 4, a conductive terminal plate (S
US430 diameter 4 mm and thickness 0.3 mm) prepared by plating Ni was prepared and bonded by friction pressure welding to the ceramic temperature sensitive element 3.

(Joining of heat-receiving metal body and ceramic temperature-sensitive element) A brazing material (Ag4 wt% Ti alloy brazing material having a thickness of 0.05 mm and a diameter of 4 mm) is prepared, and the brazing material is bonded to the heat-receiving metal body 2 and a ceramic material. In the vacuum through the temperature element 3
Bonding was performed at 020 ° C. In the temperature sensor heat receiving body 1 of the present embodiment, the conductive terminals 4 can be provided in advance on the ceramic temperature sensing element 3 by friction welding, which is one of diffusion bonding, so that the heat receiving metal body 2 and the ceramic temperature sensing element 3 are connected to each other. It is not necessary to provide a step of connecting the "conductive terminal" in the joining step or the subsequent step, and it is possible to prevent defective products by a simple manufacturing process.

Embodiment 2 As shown in FIG. 2, the temperature sensor heat receiving body 21 of this embodiment has a bottomed cylindrical heat receiving metal body 22 and an inner bottom surface 221A of the bottomed cylindrical heat receiving metal body 22. The ceramic temperature sensing element 23 bonded to the ceramic temperature sensing element 23 and one conductive terminal 24 connected to the ceramic temperature sensing element 23. The bottomed cylindrical heat-receiving metal body 22 and the ceramics temperature-sensitive element 23 may be directly joined together or may be joined together via a joining layer. When joining via a joining layer, the joining layer must be made of a conductive material. For example, the joining layer may be formed of a brazing material. A method of manufacturing the temperature sensor heat receiver of this embodiment will be specifically described. (How to Make Ceramic Temperature Sensitive Element) Obtained by the same method as in Example 1. (Method for producing heat-receiving metal body) Obtained by the same method as in Example 1. (Conductive Terminal) As the conductive terminal 24, a conductive terminal plate (a nickel plate having a purity of 99% or more, a diameter of 3 mm and a thickness of 0.3) is used.
mm) was prepared. (Joining the heat-receiving metal body, the ceramic temperature-sensitive element and the conductive terminal) A brazing material (Ag5 wt% Ti alloy brazing material having a thickness of 0.05 mm and a diameter of 4 mm) is prepared, and the brazing material and the ceramic-sensing metal are used. Bonding was performed at 1020 ° C. in vacuum with the temperature sensor 23 and the ceramic temperature sensor 23 and the conductive terminal 24 interposed.

Third Embodiment As shown in FIG. 3, the temperature sensor heat receiving body 31 of the present embodiment has a bottomed cylindrical heat receiving metal body 32 and an inner bottom surface 321A of the bottomed cylindrical heat receiving metal body 32. The ceramic temperature-sensitive element 33 bonded to the ceramic temperature-sensitive element 33 and one conductive terminal 34 connected to the ceramic temperature-sensitive element 33. Conductive terminal 3
4 is a lead wire 39 for electrical connection with the outside.
(Made of nickel with a purity of 99% or more) is connected.
The lead wire 39 may be formed integrally with the conductive terminal 34. The bottomed tubular heat receiving metal body 32 and the ceramics temperature sensitive element 33 are joined together via a buffer member 37 made of a low expansion metal. The bottomed tubular heat-receiving metal body 32 and the cushioning member 37 made of a low expansion metal are joined via a joining layer 35. The ceramics temperature-sensitive element 33 and the buffer member 37 made of a low expansion metal are bonded via a bonding layer 36. These bonding layers 35 and 36 must be made of a conductive material. For example, the joining layer may be formed of a brazing material. The ceramics temperature sensitive element 33 and the conductive terminal 34 may be directly bonded or bonded via a bonding layer. When joining through the joining layer,
It must be a bonding layer made of a conductive material. For example,
The joining layer may be formed of a brazing material. Conductive terminal 34
A lead wire 39 is connected to the lead wire 3.
9 may be previously formed integrally with the conductive terminal 34. A method of manufacturing the temperature sensor heat receiver of this embodiment will be specifically described. (How to Make Ceramic Temperature Sensitive Element) Obtained by the same method as in Example 1. (Method for manufacturing heat receiving metal body) Metal plate having a thickness of 0.4 mm (J
IS SUS430) is pressed into a cylindrical shape with a bottom (outer diameter 15 mm, height 11 mm, thickness 0.4 mm).
Thus, the heat receiving metal body 32 was obtained. Then, electrolytic Ni plating was applied. (Joining of Heat-Responsive Metal Body and Ceramics Temperature Sensitive Element and Formation of Conductive Terminal) A brazing material (past brazing material made of Ag powder of 5 wt% Ti) is prepared, and the brazing material is used as the heat-receiving metal body 3
2 and the buffer member 37 and the ceramic temperature sensing element 33.
And the buffer member 37, and applied to the surface of the ceramic temperature-sensitive element, and heat-treated at 1020 ° C. in vacuum. A disk made of W alloy (thickness 0.5 mm, diameter 3 mm) was used as the buffer member 37 made of a low expansion metal.
The temperature sensor heat receiving body 31 of this embodiment is a heat receiving metal body 32.
Since the ceramic thermosensitive element 33 and the ceramic thermosensitive element 33 are joined via the buffer member 37, the stress generated between the heat receiving metal body 32 and the ceramic thermosensitive element 33 due to the difference in the coefficient of thermal expansion between them is effectively relieved. Further, since the conductive terminal 34 can be formed by using a brazing filler metal paste for joining, it can be easily formed by one heat treatment.

Fourth Embodiment As shown in FIG. 4, the temperature sensor heat receiving body 41 of the present embodiment has a bottomed cylindrical heat receiving metal body 42 and an inner bottom surface 421A of the bottomed cylindrical heat receiving metal body 42. The ceramic temperature sensitive element 43 is bonded to the ceramic temperature sensitive element 43, and one conductive terminal 44 connected to the ceramic temperature sensitive element 43. Conductive terminal 4
4 is a lead wire 49 for electrical connection with the outside.
(Made of nickel with a purity of 99% or more) is connected.
The lead wire 49 may be formed integrally with the conductive terminal 44. A method of manufacturing the temperature sensor heat receiver of this embodiment will be specifically described. (How to Make Ceramic Temperature Sensitive Element) Obtained by the same method as in Example 1. (Manufacturing method of heat-receiving metal body) A metal plate (coval) having a thickness of 0.5 mm is pressed into a cylindrical shape with a bottom (outer diameter 1
4 mm, a height of 11 mm, and a thickness of 0.3 mm), a heat receiving metal body 42 was obtained. Then, electrolytic nickel plating was applied. (Conductive Terminal) As the conductive terminal 44, a copper conductive film having a thickness of 3 μm was provided on the ceramic temperature sensitive element 43 by sputtering. (Bonding of heat-receiving metal body and ceramic temperature-sensitive element) A brazing material (Ag5 wt% Ti alloy brazing material having a thickness of 0.04 mm and a diameter of 3 mm) is prepared, and the brazing material is used as the heat-receiving metal body 42 and the ceramic temperature-sensitive element 43. Between and 1020 ℃ in vacuum
Joined together. The temperature sensor heat receiver 41 of this embodiment is
Since the conductive terminal 44 is thin, the stress acting on the ceramic temperature sensitive element at the time of joining by brazing or during use can be reduced, and as a result, damage to the ceramic temperature sensitive element can be prevented.

Fifth Embodiment As shown in FIG. 5, a temperature sensor heat receiving body 51 of this embodiment has a bottomed tubular heat receiving metal body 52 and an inner bottom surface 521A of the bottomed tubular heat receiving metal body 52. And a ceramic thermosensitive element 53 joined to the ceramic thermosensitive element 53 and one conductive terminal 54 connected to the ceramic thermosensitive element 53. Conductive terminal 5
4 is a lead wire 59 for electrical connection to the outside.
(Made of nickel with a purity of 99% or more) is connected.
The lead wire 59 may be formed integrally with the conductive terminal 54. Here, the bottomed tubular heat receiving metal body 52 and the ceramics temperature sensitive element 53 are joined via a buffer member 57 made of a soft metal. The bottomed tubular heat receiving metal body 52 and the cushioning member 57 made of a soft metal are joined via a joining layer 55. The ceramics temperature sensitive element 53 and the cushioning member 57 made of soft metal are joined via the joining layer 56. These bonding layers 56 and 57 must be made of a conductive material. For example, the joining layer may be formed of a brazing material. Then, the ceramics temperature sensitive element 53 and the conductive terminal 54 are joined via a buffer member 58 made of a low expansion metal. The ceramic temperature-sensitive element 53 and the cushioning member 58 made of a low-expansion metal form the bonding layer 5
It is joined via 6. These bonding layers 56 must be made of a conductive material. For example, the joining layer may be formed of a brazing material. A method of manufacturing the temperature sensor heat receiver of this embodiment will be specifically described. (How to Make Ceramic Temperature Sensitive Element) Obtained by the same method as in Example 1. (Method for manufacturing heat receiving metal body) Metal plate having a thickness of 0.4 mm (J
IS SUS430) is pressed into a cylindrical shape with a bottom (outer diameter 15 mm, height 11 mm, thickness 0.4 mm).
Thus, the heat receiving metal body 52 was obtained. Then, electrolytic Ni plating was applied. (Conductive Terminal) As the conductive terminal 54, a conductive terminal plate (a nickel plate having a diameter of 2.5 mm and a thickness of 0.15 mm and a purity of 99% or more) was prepared. (Joining of the heat-receiving metal body, the ceramic temperature-sensitive element and the cushioning member) A brazing material (Ag5 wt% Ti alloy brazing material having a thickness of 0.04 mm and a diameter of 3 mm) is prepared, and the brazing material is formed from the heat-receiving metal body 52 and the soft metal. Between the ceramic temperature sensitive element 53 and the buffer member 57 made of a soft metal, between the ceramic temperature sensitive element 53 and the buffer member 58 made of a low expansion metal, and between the conductive terminal 54 and the low expansion. Bonding was performed at 1020 ° C. in a vacuum via a buffer member 58 made of metal. As the cushioning member 57 made of a soft metal, a nickel disc having a purity of 99% or more (thickness 0.15 mm, diameter 3 mm) was used. Buffer member 58 made of low expansion metal
As a disc made of W alloy (thickness 0.5 mm, diameter 3 m
m) was used.

In the temperature sensor heat receiving body 51 of the present embodiment, the heat receiving metal body 52 and the ceramic temperature sensing element 53 are joined together via the buffer member 57 made of a soft metal, so that the heat receiving metal body 52 and the ceramic temperature sensing body are joined together. The stress generated between the element 53 and the element 53 due to the difference in coefficient of thermal expansion is effectively relaxed. In addition, the conductive terminal 54 and the ceramic temperature sensing element 53
, And the ceramic thermosensitive element 53, since they are joined via a buffer member 57 made of a low expansion metal.
Effectively relieves the stress generated between the two due to the difference in thermal expansion coefficient between and. Furthermore, the ceramic temperature sensitive element 53
Are sandwiched between the cushioning member 57 made of a soft metal and the cushioning member 57 made of a low expansion metal, even if the heat receiving metal body 52 and the conductive terminal 54 receive stress due to the difference in thermal expansion coefficient. The inclination of the internal stress can be eliminated and a balanced stress state can be obtained.

[0020]

According to the present invention, it is possible to provide an inexpensive temperature sensor heat receiver having a simple structure and excellent responsiveness.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a temperature sensor heat receiver of the present invention (Example 1).

FIG. 2 is a cross-sectional view of a temperature sensor heat receiver of the present invention (Example 2).

FIG. 3 is a cross-sectional view of a temperature sensor heat receiving body (Example 3) of the present invention.

FIG. 4 is a cross-sectional view of a temperature sensor heat receiving body (Example 4) of the present invention.

FIG. 5 is a cross-sectional view of a temperature sensor heat receiving body (Example 5) of the present invention.

FIG. 6 is a schematic perspective view of a temperature sensor heat receiving body of the present invention.

FIG. 7 is a perspective view of a ceramics temperature sensitive element that constitutes the temperature sensor heat receiver of the present invention.

FIG. 8 is a perspective view showing a conventional temperature sensitive element.

FIG. 9 is a perspective view showing a conventional temperature sensitive element.

FIG. 10 is a cross-sectional view of a conventional temperature sensor heat receiver.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Temperature sensor heat receiving body 2 Bottomed cylindrical heat receiving metal body 21 Internal bottom surface of bottomed cylindrical heat receiving metal body 3 Ceramics temperature sensitive element 4 Conductive terminal 5 Bonding layer 6 Bonding layer 7 Buffer member 8 Buffer member 9 Lead wire

Claims (7)

[Claims] 1. A bottomed tubular heat-receiving metal body, a ceramic temperature-sensitive element bonded to an inner bottom surface of the bottomed tubular heat-receiving metal body, and one conductive element connected to the ceramics temperature-sensitive element. A temperature sensor heat receiver comprising a terminal. 2. The temperature sensor heat receiving body according to claim 1, further comprising a cushioning member interposed between the ceramics temperature sensitive element and the heat receiving metal body. 3. The temperature sensor heat receiver according to claim 1, wherein a buffer member is interposed between the ceramics temperature sensitive element and the conductive terminal. 4. A cushioning member is interposed between the ceramics temperature sensitive element and the heat receiving metal body, and a cushioning member is interposed between the ceramics temperature sensitive element and the conductive terminal. The temperature sensor heat receiver according to claim 1. 5. The cylindrical heat-receiving metal body having a bottom and the ceramics temperature-sensitive element are bonded to each other via a bonding layer containing an active metal. Temperature sensor heat receiver. 6. The temperature sensor heat receiving body according to claim 1, wherein the ceramics temperature sensitive element and the conductive terminal are bonded to each other through a bonding layer containing an active metal. . 7. The ceramic temperature-sensitive element has a perovskite type, spinel type, rutile type or corundum type crystal structure.
The temperature sensor heat receiver according to any one of 6 above.