JPH098359A - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JPH098359A JPH098359A JP7156482A JP15648295A JPH098359A JP H098359 A JPH098359 A JP H098359A JP 7156482 A JP7156482 A JP 7156482A JP 15648295 A JP15648295 A JP 15648295A JP H098359 A JPH098359 A JP H098359A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead terminal
- lead
- emitting device
- silver paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発光装置に関し、特に
半田付け等の実装に優れた発光装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly to a light emitting device excellent in mounting such as soldering.
【０００２】[0002]
【従来の技術】従来の発光装置は、ＬＥＤ装置を例にと
ると、次のような構成をとっている。このＬＥＤ装置
は、図５に示すように、Ｆｅ等からなる一対のリード端
子２１および２２と、一方のリード端子２１の先端部に
Ａｇ等の導電材２７を介して固着されたＬＥＤ素子２３
と、このＬＥＤ素子２３と他方のリード端子２２とを接
続するためのＡｕ等からなるワイヤ２４と、ＬＥＤ素子
２３およびワイヤ２４を含むリード端子２１、２２の先
端部を覆うエポキシ樹脂等からなる略透明状の樹脂モー
ルド部２５と、を備えてなるものであり、ＬＥＤ素子２
３から照射された光が、樹脂モールド部２５を介してＬ
ＥＤ装置の外部へ放出されるという構成になっている。2. Description of the Related Art A conventional light emitting device has the following configuration, taking an LED device as an example. As shown in FIG. 5, this LED device includes a pair of lead terminals 21 and 22 made of Fe or the like, and an LED element 23 fixed to the tip of one of the lead terminals 21 via a conductive material 27 such as Ag.
A wire 24 made of Au or the like for connecting the LED element 23 and the other lead terminal 22, and an epoxy resin or the like covering the tip portions of the lead terminals 21, 22 including the LED element 23 and the wire 24. And a transparent resin mold portion 25.
The light emitted from No. 3 passes through the resin mold portion 25 to L
It is configured to be released to the outside of the ED device.
【０００３】このようなＬＥＤ装置は、例えば、次のよ
うな方法で製造される。図６に示すように、長尺状のリ
ードフレーム２６の連結バー２６’に一定間隔毎に連結
された一対のリード端子部２１’、２２’のうちリード
端子部２１’の先端部上に、銀ペースト２７’を介して
ＬＥＤ素子２３をダイボンディングし、次いで、この状
態で２００度以上の温度下の加熱炉（図示せず）内に約
３０秒保持することにより加熱硬化させて銀ペースト２
７’とＬＥＤ素子２３とを接着および電気的に結合させ
る。そして、加熱炉内からリードフレーム２６を取り出
した後に、これを２００度程度に加熱されたヒータブロ
ック等に載置してリード端子部２１’、２２’およびＬ
ＥＤ素子２３を予備加熱し、この状態でＬＥＤ素子２３
とリード端子部２２’の先端部とをワイヤ２４でワイヤ
ボンディングする。さらに、ポッティング成形方法によ
り樹脂モールド部２５を成形し、この後に、リード端子
部２１’、２２’の表面をディップ方式によりハンダの
薄い被膜の層を形成する。そして、リード端子部２
１’、２２’の所定位置をせん断加工で切断することに
より、リードフレーム２６から図５に示すような個別の
ＬＥＤ装置を得ている。Such an LED device is manufactured, for example, by the following method. As shown in FIG. 6, of the pair of lead terminal portions 21 ′ and 22 ′ connected to the connecting bar 26 ′ of the elongated lead frame 26 at regular intervals, on the tip portion of the lead terminal portion 21 ′, The LED element 23 is die-bonded through the silver paste 27 ′, and then, in this state, the LED element 23 is held in a heating furnace (not shown) at a temperature of 200 ° C. or higher for about 30 seconds to heat-harden the silver paste 2.
7'and the LED element 23 are bonded and electrically coupled. Then, after taking out the lead frame 26 from the heating furnace, the lead frame 26 is placed on a heater block or the like heated to about 200 degrees and the lead terminal portions 21 ', 22' and L are placed.
The ED element 23 is preheated, and in this state, the LED element 23
The tip of the lead terminal portion 22 ′ is wire-bonded with the wire 24. Further, the resin mold portion 25 is molded by the potting molding method, and thereafter, the surface of the lead terminal portions 21 'and 22' is formed with a thin coating layer of solder by the dip method. Then, the lead terminal portion 2
Individual LED devices as shown in FIG. 5 are obtained from the lead frame 26 by cutting the predetermined positions 1 ′ and 22 ′ by shearing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来のＬＥＤ装置は、その製造方法において、リード端子
部２１’、２２’は、上記ＬＥＤ素子２３のダイボンデ
ィング時およびワイヤボンディング時の２度にわたり２
００度以上の温度下にさらされることになるので、その
表面が酸化しやすく、この酸化した部分においてハンダ
層が施されにくい。このようにハンダ層が部分的に施さ
れていない状態になると、例えば回路基板への実装時に
半田付け性が悪くなり、電気的特性が悪くなってしまう
という問題があった。However, in the conventional LED device described above, in the method of manufacturing the same, the lead terminal portions 21 'and 22' are connected twice during the die bonding and the wire bonding of the LED element 23.
Since it is exposed to a temperature of 00 ° C. or higher, its surface is easily oxidized, and it is difficult to apply the solder layer to this oxidized portion. When the solder layer is not partially applied in this way, there is a problem that the solderability becomes poor at the time of mounting on a circuit board, and the electrical characteristics become poor.
【０００５】本発明は、以上のような状況下で考え出さ
れたもので、半田付け性がよく且つ電気的特性の安定し
た信頼性の高い発光装置を提供することを目的とする。The present invention has been conceived under the above circumstances, and an object thereof is to provide a light emitting device having good solderability and stable electrical characteristics and high reliability.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記課題を解
決するために、一組のリード端子と、この一組のリード
端子のうちの一つのリード端子上に第１の導電材を介し
て接続された発光素子と、この発光素子とその他のリー
ド端子とを接続する接続体と、を有する発光装置におい
て、前記接続体は、板状もしくは棒状のものであり、そ
の両端部が第２の導電材を介して前記発光素子およびそ
の他のリード端子のそれぞれと接続されていることを特
徴とする発光装置を提供するものである。In order to solve the above problems, the present invention provides a set of lead terminals and a first conductive material on one lead terminal of the set of lead terminals. In a light emitting device having a light emitting element connected by means of a light emitting element and a connecting body for connecting the light emitting element and other lead terminals, the connecting body is plate-shaped or rod-shaped, and both ends thereof are second. The present invention provides a light-emitting device characterized by being connected to each of the light-emitting element and the other lead terminals via the conductive material.
【０００７】また、本発明は、上記発光装置において、
接続体は、その発光素子上における部分に幅狭となる切
欠き部が形成されている発光装置をも提供し得る。さら
に、本発明は、上記発光装置において、その他のリード
端子は、その接続体との接続部分に溝部が形成されてい
る発光装置を提供できる。Further, the present invention provides the above light emitting device,
The connection body can also provide a light emitting device in which a narrow cutout is formed in a portion on the light emitting element. Further, the present invention can provide the above-mentioned light emitting device, in which the other lead terminal has a groove portion formed in a connecting portion with the connecting body.
【０００８】[0008]
【作用および効果】本発明の発光装置によれば、板状も
しくは棒状の接続体は、その両端部が第２の導電材を介
して発光素子およびその他のリード端子のそれぞれと接
続されており、上記発光素子がリード端子上に第１の導
電材を介して接続されているので、例えば、これら第１
および第２の導電材がペースト状態の時に同時に加熱し
て硬化させることができるため、リード端子に対する加
熱もこの１度だけに限ることが可能となる。これによ
り、加熱によるリード端子の酸化を低減させることが可
能となるので、この酸化にともなう電気的特性の不安定
さを低減し得ることになる。また、この発光装置を例え
ば回路基板に導電材を介して実装する場合に、上記酸化
にともなう導電材の被膜形成の不安定さを解消し得る。According to the light emitting device of the present invention, both ends of the plate-shaped or rod-shaped connection body are connected to the light-emitting element and the other lead terminals through the second conductive material, Since the light emitting element is connected to the lead terminal via the first conductive material, for example, these first
Also, since the second conductive material can be heated and cured at the same time when it is in a paste state, it is possible to heat the lead terminal only once. As a result, it becomes possible to reduce the oxidation of the lead terminal due to heating, so that the instability of the electrical characteristics due to this oxidation can be reduced. Further, when the light emitting device is mounted on, for example, a circuit board via a conductive material, it is possible to eliminate the instability of film formation of the conductive material due to the oxidation.
【０００９】[0009]
【実施例】以下、本発明の発光装置の実施例を、図１〜
図４を参照しつつ説明するが、本発明はこれらに限定さ
れるものでない。本発明の発光装置は、ランプ型ＬＥＤ
を例にとると、図１に示すように、次のような構成から
なるものである。EXAMPLES Examples of the light emitting device of the present invention will be described below with reference to FIGS.
Although described with reference to FIG. 4, the present invention is not limited thereto. The light emitting device of the present invention is a lamp type LED.
As an example, as shown in FIG. 1, it has the following configuration.
【００１０】このランプ型ＬＥＤは、表面にハンダ被膜
を形成した鉄からなる一組のリード端子１および２と、
一方のリード端子（一つのリード端子）１の先端部１ａ
に銀層３ａ（第１の導電材）を介して固着されたＬＥＤ
素子４（発光素子）と、ＬＥＤ素子４と他方のリード端
子（その他のリード端子）２とを銀層３ｂ、３ｃ（第２
の導電材）を介して電気的に接続する銅からなる棒状の
接続体５と、ＬＥＤ素子４および接続体５を含むリード
端子１および２を覆うエポキシ樹脂からなるドーム形状
の樹脂モールド部６と、を有するものである。This lamp-type LED includes a pair of lead terminals 1 and 2 made of iron with a solder coating formed on the surface,
Tip portion 1a of one lead terminal (one lead terminal) 1
Attached to the LED via the silver layer 3a (first conductive material)
The element 4 (light emitting element), the LED element 4 and the other lead terminal (other lead terminal) 2 are connected to the silver layers 3b and 3c (second).
A rod-shaped connecting body 5 made of copper and electrically connected to the lead terminals 1 and 2 including the LED element 4 and the connecting body 5, and a dome-shaped resin molded portion 6 made of an epoxy resin. , With.
【００１１】上記接続体５は、直径０．１ｍｍ程度、長
さ３ｍｍ程度の円柱形状のものであり、その両端部が銀
層３ａおよび３ｂを介してＬＥＤ素子４および他方のリ
ード端子２に電気的にそれぞれ接続されている。このよ
うな構成のＬＥＤ装置は、次のような方法で製造され
る。まず、図２に示すように、長尺状の鉄からなるリー
ドフレーム７における連結バー８に連結された一対のリ
ード端子部１’、２’のうちリード端子部１’の先端部
１ａ’にＬＥＤ素子４を銀ペースト３ａ’を介してダイ
ボンディングする。次いで、このＬＥＤ素子４上および
リード端子部２’の先端部上に、予め従来から用いられ
るシリンジ９内に収納した銀ペースト３ｂ’、３ｃ’を
塗布する。さらに、接続体５を、その両端部が銀ペース
ト３ｂ’、３ｃ’上に接するように載置する。この接続
体５は、パーツフィーダ（図示せず）内に複数個収納さ
れ、このパーツフィーダを稼働させることにより個別分
離した状態で搬送され、さらに、従来から用いられる吸
着パッド１０により保持されて銀ペースト３ｂ’、３
ｃ’上へと順次移送されるのである。そして、この状態
のリードフレーム７を、２００度以上の温度に設定され
た加熱炉（図示せず）内に約３０秒間保持し、銀ペース
ト３ａ’，３ｂ’，３ｃ’を同時に加熱硬化させる。The connecting body 5 has a cylindrical shape with a diameter of about 0.1 mm and a length of about 3 mm, and both ends thereof are electrically connected to the LED element 4 and the other lead terminal 2 through the silver layers 3a and 3b. Are connected to each other. The LED device having such a configuration is manufactured by the following method. First, as shown in FIG. 2, of the pair of lead terminal portions 1 ′ and 2 ′ connected to the connecting bar 8 in the lead frame 7 made of elongated iron, the tip portion 1 a ′ of the lead terminal portion 1 ′ is attached. The LED element 4 is die-bonded through the silver paste 3a '. Next, the silver pastes 3b 'and 3c' previously stored in the conventional syringe 9 are applied onto the LED element 4 and the tip of the lead terminal portion 2 '. Further, the connecting body 5 is placed so that both ends thereof are in contact with the silver pastes 3b 'and 3c'. A plurality of the connecting bodies 5 are accommodated in a parts feeder (not shown), and are individually separated by operating the parts feeder. Further, the connecting body 5 is held by a conventionally used suction pad 10 Paste 3b ', 3
It is sequentially transferred onto c '. Then, the lead frame 7 in this state is held in a heating furnace (not shown) set to a temperature of 200 ° C. or higher for about 30 seconds, and the silver pastes 3a ′, 3b ′, 3c ′ are simultaneously heated and hardened.
【００１２】その後に、加熱炉内からリードフレーム７
を取り出し、従来から用いられるポッティング成形方法
により樹脂モールド部６を成形し、リード端子部１’、
２’の表面をディップ方式によりハンダ被膜を形成し
て、リード端子部１’、２’の所定位置をせん断加工で
切断することにより、リードフレーム７から図１に示す
ような個別のＬＥＤ装置を得ている。After that, from the inside of the heating furnace, the lead frame 7
Then, the resin mold portion 6 is molded by the conventional potting molding method, and the lead terminal portion 1 ',
By forming a solder coating on the surface of 2'by a dip method and cutting predetermined positions of the lead terminal portions 1 ', 2'by shearing processing, an individual LED device as shown in FIG. It has gained.
【００１３】本実施例における接続体５は、丸棒状のも
のであるが、これに限定するものでなく、角材等の多角
柱状のもの、切り口が楕円形の円柱状のもの、板状のも
の等を使用することにより、載置状態を安定化させるこ
とも可能である。また、この接続体５は、ＬＥＤ素子４
からの光をできるだけ遮断することがないものがよく、
丸棒状のものであれば直径ができるだけ小さいものが好
ましく、板状のものであれば、図３（ａ）にその要部平
面図を示すように、そのＬＥＤ素子４上に位置する形状
が幅狭となる切欠き部５ａを設けたものが好ましい。ま
た、接続体５は、直線状に形成されているものに限定さ
れるものでなく、図３（ｂ）にその要部平面図を示すよ
うに屈曲した形状にしてもよい。さらに、リード端子部
２の先端部に、図３（ｃ）に示すような溝部１１を設け
ることにより、接続体５をこの溝部１１内に嵌合もしく
は入れ込むことにより、接続体５の載置状態の安定およ
び位置決めを図ることもできる。尚、上記溝部１１は、
その側壁が底面に向かって幅狭となるテーパ部を設けて
もよく、この場合には接続体５を溝部１１内に嵌合もし
くは入れ込みやすくなる。加えて、接続体５の材質は、
銀、ステンレス、４２−アロイ等のものを幅広く使用で
き、これを限定するものでない。The connecting body 5 in this embodiment is in the shape of a round bar, but is not limited to this, and is in the form of a polygonal column such as a square bar, a column having an oval cut end, or a plate. It is also possible to stabilize the mounting state by using such as. In addition, the connecting body 5 is the LED element 4
It is good that it does not block the light from
If it is a round bar, it is preferable that the diameter is as small as possible, and if it is a plate, the shape located on the LED element 4 is the width as shown in the plan view of the main part of FIG. It is preferable to provide the notch 5a that becomes narrow. Further, the connecting body 5 is not limited to the one formed in a linear shape, but may be formed in a bent shape as shown in a plan view of relevant parts in FIG. Further, by providing a groove portion 11 as shown in FIG. 3C at the tip of the lead terminal portion 2, the connection body 5 is fitted or inserted into the groove portion 11 to mount the connection body 5. It is also possible to stabilize the state and position it. The groove 11 is
A tapered portion whose side wall becomes narrower toward the bottom surface may be provided, and in this case, the connector 5 can be easily fitted or inserted into the groove 11. In addition, the material of the connecting body 5 is
A wide variety of materials such as silver, stainless steel, 42-alloy, etc. can be used, and the present invention is not limited thereto.
【００１４】また、本実施例においては、接続体５を吸
着パッドにより移送させているが、これに限定するもの
でなく、従来から用いられているメカ的にチャッキング
してこの状態で移送させることも可能である。さらに、
本発明における発光装置は、リード端子を３本以上有
し、２つ以上の発光素子を有する複数色発光型のものに
も適用可能であり、例えば、図４（ａ）に示すように、
１つのリード端子１２ａ上にＬＥＤ素子１３、１４を搭
載し、このリード端子１２ａの左右に配置されたリード
端子１２ｂ、１２ｃとＬＥＤ素子１３、１４とをそれぞ
れ接続体１５、１６で接続するといった構造のものにも
適用可能である。尚、この場合には、図４（ｂ）に示す
ように、接続体１５、１６を予め絶縁性樹脂１７等の絶
縁物により一体的に接続しておくことにより、接続体の
載置回数を一回にとどめて生産性を向上させることも可
能である。Further, in the present embodiment, the connection body 5 is transferred by the suction pad, but the invention is not limited to this, and mechanically chucked conventionally and transferred in this state. It is also possible. further,
The light emitting device of the present invention can be applied to a multi-color light emitting type having three or more lead terminals and two or more light emitting elements. For example, as shown in FIG.
A structure in which the LED elements 13 and 14 are mounted on one lead terminal 12a, and the lead terminals 12b and 12c arranged on the left and right of the lead terminal 12a are connected to the LED elements 13 and 14 by connecting bodies 15 and 16, respectively. It is also applicable to In this case, as shown in FIG. 4 (b), the connecting bodies 15 and 16 are integrally connected in advance with an insulating material such as an insulating resin 17 so that the number of mounting times of the connecting body can be reduced. It is also possible to improve productivity by keeping it once.
【００１５】加えて、本発明における導電材は、Ａｇに
限るものでなく、ＣｕやＣ等を適用することも可能であ
る。In addition, the conductive material in the present invention is not limited to Ag, and Cu, C or the like can be applied.
【図１】本発明の発光装置である、ランプ型ＬＥＤを示
す要部切り欠き断面図である。FIG. 1 is a cutaway sectional view showing a main part of a lamp type LED which is a light emitting device of the present invention.
【図２】本実施例のランプ型ＬＥＤの製造方法を説明す
る説明図である。FIG. 2 is an explanatory diagram illustrating a method of manufacturing the lamp-type LED of the present embodiment.
【図３】本発明の発光装置の接続体の変形例を説明する
説明図である。FIG. 3 is an explanatory diagram illustrating a modified example of the connection body of the light emitting device of the present invention.
【図４】本発明の発光装置の変形例を示す要部切り欠き
断面図である。FIG. 4 is a cutaway sectional view of a main part showing a modified example of the light emitting device of the present invention.
【図５】従来の発光装置である、ランプ型ＬＥＤを示す
要部切り欠き断面図である。FIG. 5 is a cutaway sectional view of a main part showing a lamp type LED, which is a conventional light emitting device.
【図６】従来のランプ型ＬＥＤの製造方法を説明する説
明図である。FIG. 6 is an explanatory diagram illustrating a conventional method for manufacturing a lamp-type LED.
１、２ リード端子 ３ 導電材 ４ ＬＥＤ素子 ５ 接続体 ６ 樹脂モールド部 ７ リードフレーム ８ 連結バー ９ シリンジ １０ 吸着パッド １１ 溝部 1, 2 Lead terminal 3 Conductive material 4 LED element 5 Connection body 6 Resin mold part 7 Lead frame 8 Connecting bar 9 Syringe 10 Adsorption pad 11 Groove part
Claims (3)
端子のうちの一つのリード端子上に第１の導電材を介し
て接続された発光素子と、この発光素子とその他のリー
ド端子とを接続する接続体と、を有する発光装置におい
て、 前記接続体は、板状もしくは棒状のものであり、その両
端部が第２の導電材を介して前記発光素子およびその他
のリード端子のそれぞれと接続されていることを特徴と
する発光装置。1. A set of lead terminals, a light emitting element connected to one lead terminal of the set of lead terminals via a first conductive material, the light emitting element and other lead terminals. In a light emitting device having a connecting body for connecting with, the connecting body is plate-shaped or rod-shaped, and both ends of the light emitting element and the other lead terminals are respectively connected via a second conductive material. A light-emitting device characterized by being connected to.
部分に幅狭となる切欠き部が形成されていることを特徴
とする請求項１に記載の発光装置。2. The light emitting device according to claim 1, wherein the connection body is provided with a notch portion having a narrow width in a portion above the light emitting element.
との接続部分に溝部が形成されていることを特徴とする
請求項１に記載の発光装置。3. The light emitting device according to claim 1, wherein each of the other lead terminals has a groove formed in a connecting portion with the connecting body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7156482A JPH098359A (en) | 1995-06-22 | 1995-06-22 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7156482A JPH098359A (en) | 1995-06-22 | 1995-06-22 | Light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH098359A true JPH098359A (en) | 1997-01-10 |
Family
ID=15628729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7156482A Pending JPH098359A (en) | 1995-06-22 | 1995-06-22 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH098359A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210677A (en) * | 2005-01-28 | 2006-08-10 | Hitachi Aic Inc | Heat block for led and led device using the same |
-
1995
- 1995-06-22 JP JP7156482A patent/JPH098359A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210677A (en) * | 2005-01-28 | 2006-08-10 | Hitachi Aic Inc | Heat block for led and led device using the same |
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