JPH0980757A - Method for thermally transferring photoresist film formed into substrate and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the formation of wrinkles and air bubbles at the time of thermally transferring a photoresist film formed in a film form on substrates. SOLUTION: While the photoresist film A formed in a film form is successively let off, the photoresist film is successively thermally transferred on at least one surface of two sheets of the front and rear substrates 11 , 12 being sent at a prescribed interval on the same transporting path by a heating and pressing roller 2. The feed of the long-sized photoresist film A is stopped and the substrate 11 on the front side is stopped to impart a slack to the photoresist film (a) between the substrate on the front side and the substrate 12 on the rear side when the photoresist film A is formed on the one surface of the substrate 12 on the rear side. The substrate 12 on the rear side is thereafter stopped. The photoresist film (a) between the substrate 11 on the front side and the substrate 12 on the rear side is reparated from both substrates 11 , 12 by a moving means 4 to spread the part tautly. The two points at the front and rear of the part are cut in this state. The photoresist film (a) separated by the cutting is attracted by an attraction device 6 and is discarded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION A film-shaped photoresist film is formed on a liquid crystal substrate of a semiconductor device. The present invention relates to a method and an apparatus for thermally transferring this photoresist film onto a substrate.

[0002]

2. Description of the Related Art Conventionally, in transferring a photoresist film formed in a film shape onto a substrate 1'by heating, a long photoresist film A formed in a film shape is usually used as shown in FIG. This photoresist film that was cut by cutting with a cutter 2 at a predetermined position while sequentially feeding
A method is adopted in which a'is heated and transferred to the substrate 1'which is sent on the transport path by the heating / pressing roller 3 '.

[0003]

When this method is adopted, as shown in FIG. 4, the end portion of the photoresist film a'being transferred by heating on the substrate 1'is heated and pressure-bonded to the roller 3 '.
Before it is pressed down by, it hangs down and overlaps on the substrate 1 ', and wrinkles and bubbles are created in that part. In order to prevent the formation of wrinkles and bubbles as much as possible, it has been devised to heat transfer onto the substrate 1'while adsorbing the end part of the photoresist film a'with the adsorbing device 4 ', but passing through the adsorbing device 4'. It is unavoidable that the trailing end portion hangs down before being pressed by the heating / compression roller 3 '. A liquid crystal substrate of a semiconductor device having wrinkles or bubbles is a defective product and cannot be used. It is an object of the present invention to prevent such wrinkles and bubbles from occurring when a photoresist film formed into a film is transferred by heating onto a substrate. In addition, such a wrinkle or bubble is not formed, a substrate having a photoresist film is automatically and
The purpose is to manufacture efficiently.

[0004]

In order to achieve the above object, in transferring a photoresist film A formed into a film onto a substrate by heating, as shown in FIGS. 1 (a) to 1 (f), While continuously feeding out the long photoresist film A formed in a film shape, by the heating / pressing roller 2,
Same transport path of two front and rear transmitted at a predetermined interval substrate 1 _1, 1 ₂ of at least one side gradually and sequentially heated transfer, rear photoresist film A on one surface of the substrate 1 ₂ of forming when [FIG 1 (g)], as shown in FIG. 1 (h), the photoresist film a between the substrate 1 ₂ of the front substrate 1 ₁ and the rear from both the substrate 1 _1, 1 ₂ Tighten this part away from you, and cut it in two places before and after under this condition. When taken with this method, a photoresist film A is the two substrates 1 ₁ heat and pressure roller 2 remains elongated, 1 ₂ to be heated transferred to the substrate 1 ₂ of the rear front substrate 1 ₁ of a side is pressed against the upper, there is no necessity imposed after being cut in a conventional manner, never wrinkles and bubbles occur even overlapping them on both substrates 1 _1, 1 _2.

[0005] with order to cut the photoresist film a between the substrate 1 ₁ and the substrate on the rear side 1 ₂ front, stopping the feed of the elongated photoresist film A being successively fed, the front preferred both the substrate 1 ₁ and the substrate 1 ₂ of the rear side carried out in a state of stopping. In this way, always because it can be a constant slack amount of the photoresist film a between the substrate 1 and _second front substrate 1 ₁ and the rear,
It is possible to cut the photoresist film a at two positions before and after the photoresist film a at predetermined positions. Therefore, it is possible to precisely heat-transfer the photoresist film A to the substrates that are successively sent, while sequentially feeding out the long-sized photoresist film A formed in a film shape.

Further, the photoresist film a separated by the cutting is adsorbed by the adsorbing device 6 and discarded as shown in FIG. 1 (i). In this way, the unnecessary photoresist film a that has been separated can be easily removed and discarded.

Further, the heat transfer apparatus of the present invention has two substrates, one before and one after the other, which are sent on the same transport path at a predetermined interval.
1 _1, 1 ₂ at least one surface, a heating and pressure roller 2 for sequentially heating transferring elongated photoresist film A formed into a film, is disposed thereto from the front, the front side of the substrate 1 ₁
Both substrates photoresist film a between the substrate 1 ₂ rear when
1 _1, 1 and ₂ from away moving means 4 for tensioning the portion pin and cutting the front and rear portions of the substrate 1 _1, 1 ₂ moved away from the pin and stretched photoresist film a by the moving means 4 It is composed of a pair of front and rear cutting devices 5. When this heat transfer device is used, the long-sized photoresist film A formed in a film shape and fed out successively is sent by the heating / pressing roller 2 on the same conveying path at a predetermined interval. come before and after the two substrates 1 ₁ is successively heated transfer to a _second at least one side. When the photoresist film A is formed on one surface of the substrate 1 ₂ of the rear,
When actuating the moving means 4, and the photoresist film a is the substrates 1 _1, 1 ₂ moved away from the portion between the substrate 1 and _second moving means 4 by the front of the substrate 1 ₁ and the rear pin It is stretched, and under this state, the front and rear two places can be cut by a pair of front and rear cutting devices 5. Thus, as shown in FIG. 2, the substrate 1 ₁ with the photoresist film A is formed,
You can get 1 ₂ . And the substrates 1 ₁ and 1 _{2 in} this case
There are no wrinkles or bubbles at all.

[0008] The heating and pressure rollers 2 may keep disposed separably on the substrate 1 _1, 1 _2. In this way, in FIG. 1 (a), (d) , (e), (h), (i) and as shown in (j), the substrate 1 _1, 1 ₂ heat and pressure rollers 2 against can be moved away for a certain period of time, the front end portions of the photoresist film a which begins to be heated transferred to the substrate 1 _1, 1 _2, and the substrate 1 _1,
Extra pressing the end portion of the thermal transfer photoresist film A to 1 ₂ in heat and pressure bonding roller 2, it is possible to avoid heating. That is, the front substrate ₁₁ and the rear substrate
A pair of cutting devices 5 for removing the photoresist film a between 1 and ₂
Substrate a photoresist film A such, that is heated transferred onto one substrate 1 ₁ and 1 ₂ are the case of cutting before and after the two points by
1 _1, 1 ₂ uniformly pressed over the whole can be heated, since the transfer condition of the photoresist film A in the substrate 1 _1, 1 on ₂ can be the same conditions throughout,
It is convenient.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to FIG. First, an embodiment of a method of thermally transferring a photoresist film A formed into a film onto a substrate will be described. The long photoresist film A formed in a film shape is wound in a roll shape as shown in FIG. 1 (a), and is sequentially fed out to the heating / pressing roller 2 while applying an appropriate tension. It is like this. Another roller 3 is arranged so as to face the heating / pressure bonding roller 2, and the substrates successively sent at a predetermined interval on the same conveyance path pass between the heating / pressure bonding roller 2 and the roller 3. To do. Substrate 1 _1, 1 ₂ can be sent to the sequential forward conveying roller or belt or the like conventionally known conveying means. The heating / pressing roller 2 is shown in FIG. 1 (b), (c),
The cases shown in (f) and (g), and (a), (d), (e), and
(h), you may want to place such, to be separable with respect to the substrate 1 _1, 1 ₂ of the case shown in (i) and (j).

As shown in FIG. 1 (a), when a long photoresist film A formed into a film is hung on a part of the heating / pressing roller 2, as shown in FIG. 1 (b). as shown, to move the heat-pressure roller 2 so as to abut against the substrate 1 _1. Then, when the substrate ₁₁ is advanced from the state of FIG. 1 (b) as shown in FIG. 1 (c) while sequentially feeding out the long-sized photoresist film A formed in a film shape, the substrate 11 is heated on one side thereof. The pressure-sensitive roller 2 can heat-transfer the photoresist film A. When the photoresist film A on one surface of the substrate 1 ₁ is thermal transfer, as shown in FIG. 1 (d), away heat and pressure bonding roller 2 from the substrate 1 _1. Then, the to further advance the substrate 1 _1, fed between the heated and the pressure roller 2 and the roller 3 to the next substrate 1 _2. This moment, as shown in FIG. 1 (f), moving the heating and pressure roller 2 so as again in contact with the substrate 1 _2. Then, to advance the substrate 1 _1, 1 ₂ of the two longitudinal at the same speed. Then, it can be on one side of the substrate 1 ₂ of the rear by heat and pressure bonding roller 2 successively heated transfer the photoresist film A.

[0011] As shown in FIG. 1 (g), when the photoresist film A is formed on one surface of the substrate 1 ₂ of the rear, as shown in FIG. 1 (h), the heating roller 2 from the substrate 1 ₂ together away, pin and tension the portions away the photoresist film a between the substrate 1 ₂ of the front substrate 1 ₁ and the rear from both the substrate 1 _1, 1 _2, the two front and rear positions under this condition Disconnect. Then, the photoresist film a substrate 1 of two before and after being connected in _1, 1 ₂ are brought separated from each other. In this way, a photoresist film A heating roller 2 remains elongated to be heated transferred to the substrate 1 ₂ of the front substrate 1 ₁ and the rear two substrates
1 _1, 1 ₂ pressed on, because there is no imposed after being cut as in the prior art, which the substrates 1 _1, 1 ₂ never wrinkles and bubbles occur even on top.

[0012] Figure 1 as shown in (h), at when the cutting photoresist film a the front and rear positions between the substrate 1 ₂ of the front substrate 1 ₁ and the rear, front and rear substrates 1 ₁ , 1 ₂ and both a cutting device such as a cutter for cutting the photoresist film a between them can be conducted while moving at the same speed, elongated being sequentially fed photoresist film a feed stops the, first to stop only the substrate 1 ₁ of the front, the photoresist film a between the substrate 1 and _second rear
To cause slack, thereafter, in a state where the substrate 1 ₂ also stops the rear, i.e., to stop the feeding of the elongated photoresist film A being successively fed, the front side of the substrate 1 ₁ and do rear of the substrate 1 ₂ in a state where any was also stopped is, for simplicity of the device is suitable. Under this condition, when the photoresist film a between the substrate 1 ₂ of the rear front substrate 1 ₁ of a side cut at the front and rear portions, the front side of the substrate 1 ₁
Since it is possible to always make constant the slack amount of the photoresist film a between the substrate 1 ₂ rear when it is possible to cut the front and rear portions of the photoresist film a at a predetermined position. Therefore, it is possible to precisely heat-transfer the photoresist film A to the substrates that are successively sent, while sequentially feeding out the long-sized photoresist film A formed in a film shape.

The photoresist film a separated by the cutting is adsorbed by the adsorption device 6 and discarded as shown in FIG. 1 (i). In this way, the unnecessary photoresist film a that has been separated can be easily removed and discarded. Thereafter, it causes further advancement of the substrate 1 _1, 1 ₂ of the two front and rear, while again feeding the elongated photoresist film A fed between the next substrate 1 ₃ heat and pressure roller 2 and the roller 3 . Then, by repeating the operations of FIG. 1 (e) to FIG. 1 (i), the long photoresist film A formed into a film shape is sequentially paid out, and the photoresist is precisely applied to the substrates sent one after another. The film A can be transferred by heating.

Next, an embodiment of the heat transfer device of the present invention will be described. Thermal transfer apparatus of the present invention, at least, on at least one side of the same transport before and after the two substrates sent at predetermined intervals on the road 1 _1, 1 _2, elongated photo formed into a film A heating / compression roller 2 for sequentially transferring and transferring the resist film A, and arranged in front of it.
And moving means 4 for tensioning the photoresist film a the substrates 1 _1, 1 ₂ from away this portion between the substrate 1 ₂ of the front substrate 1 ₁ and the rear pin and the by the moving means 4 substrate 1 ₁ ,
Photoresist film a that is stretched and pulled away from 1 ₂
It can be configured with a pair of front and rear cutting devices 5 for cutting the front and rear two places. The moving means 4, as shown in FIG. 1 (g) ~ (i) , so as to be positioned between the substrate 1 ₂ of the front substrate 1 ₁ and the rear, the photoresist film A is heated transfer The direction opposite to the surface, that is, Fig. 1 (g) and Fig. 1
It can be moved from the position shown in (i) to a position beyond the surface where the photoresist film A is transferred by heat, that is, to the position shown in FIG. 1 (h). As a very simple thing, it can be, for example, a horizontal bar. In this case, for example, both ends of the bar are connected to the tips of the piston rods of the two cylinders, respectively, and both cylinders are operated so that the bar moves between the positions shown in FIGS. 1 (i) and 1 (h). It is better to move.

[0015] opposite to the heat-pressure roller 2 should be placed in another roller 3, the substrate coming the same conveyance path is fed one after another at a predetermined distance 1 ₁ to 1 ₃ are heated and the pressure roller 2 And the roller 3 are allowed to pass. Substrate 1 ₁ to 1 ₃ may be to send the sequentially forward conveying roller or belt or the like conventionally known conveying means. In addition,
The heating / pressing roller 2 is shown in FIGS. 1 (b), (c), (f) and (g).
In the case shown in, as in the case shown in FIGS. 1 (a), (d) , (e), (h), (i) and (j), movable toward and away from the substrate 1 ₁ to 1 ₃ Should be placed in

Next, description will be made on the working condition of heat-transferring the film-shaped photoresist film A onto the substrate by using this heat-transfer device. As shown in FIG. 1 (a), when a long photoresist film A formed in a film shape is hung on a part of the heating / pressing roller 2, as shown in FIG. 1 (b). , Heating and pressure roller 2 as substrate
1 Move it so that it touches ₁ . Then, as shown in FIG. 1 (c), the long-sized photoresist film A formed into a film is sequentially drawn out from the substrate 1 _{1 as} shown in FIG. 1 (c).
When the is moved forward, the photoresist film A can be transferred by heating to one surface thereof by the heating / pressing roller 2.
When the photoresist film A on one surface of the substrate 1 ₁ is thermal transfer, as shown in FIG. 1 (d), the heat-pressure roller 2 substrate
Move away from 1 ₁ . Then, the to further advance the substrate 1 _1, fed between the next substrate 1 ₂ a heat-pressure roller 2 at a predetermined distance and the roller 3. At this moment, Figure 1
(f), the moving heat and pressure bonding roller 2 so again in contact with the substrate 1 _2. And the two substrates before and after
Advance 1 ₁ and 1 ₂ at the same speed. Then, it can be on one side of the substrate 1 ₂ of the rear by heat and pressure bonding roller 2 successively heated transfer the photoresist film A.

[0017] Figure 1 (g), the case where the photoresist film A is formed on one surface of the substrate 1 ₂ of the rear, as shown in FIG. 1 (h), the heat-pressure roller 2 substrate 1 ₂ while moving the moving means 4 from the direction opposite to the surface on which the photoresist film A is heat-transferred, that is, from the position shown in FIGS. 1 (g) and 1 (i). It is moved to a position beyond the surface on which the thermal transfer is made, that is, a position shown in FIG. 1 (h). Then, the photoresist film a is the substrates 1 _1, 1 ₂ moved away from the portion between the substrate 1 ₂ of the front substrate 1 ₁ and the rear is taut. When operating the pair of the cutting device 5 back and forth under this condition, it is possible to cut the front and rear portions of the photoresist film a between the substrate 1 ₂ of the front substrate 1 ₁ and the rear. When the photoresist film a between the substrate 1 ₂ of the front substrate 1 ₁ and the rear side is cut at the front and rear two points, the photoresist film a substrate of two before and after being connected in 1 _1, 1 ₂ are allowed separated from one another, as shown in FIG. 2, it is possible to obtain a substrate 1 _1, a photoresist film a is formed. When using this heating transfer device,
Photoresist film A is elongated while heating and pressure bonding roller 2 at the both substrates 1 ₁ to be heated transferred to the substrate 1 ₂ of the front substrate 1 ₁ and the rear, 1 ₂ pressed on, as in the prior art Since it will not be pressed after it is cut, both boards 1 ₁ and 1 ₂
Wrinkles and bubbles do not occur even if they are stacked on top of each other. Then, the substrate having the photoresist film A in which no wrinkles or bubbles are generated can be automatically and efficiently manufactured.

[0018] As described above, when the heat and pressure bonding roller 2 is arranged so as to be separable with respect to the substrate 1 _1, 1 _2, in FIG. 1
As shown in (a), (d), (e), (h), (i) and (j),
Substrate 1 _1, 1 ₂ a heat-pressure roller 2 can be moved away for a given length of time, the substrate 1 _1, 1 ₂ forward end portion of the photoresist film A which begins to be heated transferred to, and, on the substrate 1 _1, 1 ₂ It is possible to avoid excessively pressing and heating the end portion of the photoresist film A that has been transferred by heating with the heating / compression roller 2. That is, a case of cutting before and after the two positions by a photoresist film pair of cutting devices and forth a 5 between the substrate 1 and _second front substrate 1 ₁ and the rear, on one substrate 1 ₁ and 1 ₂ evenly press the photoresist film a being heated transfer across the substrate 1 _1, 1 _2, can be heated, the substrate 1 _1,
This is convenient because the transfer conditions of the photoresist film A on 1 ₂ can be the same throughout.

[0019] As will be understood from FIG. 2, the photoresist A is not heated transfer across one side of the substrate 1 _1, 1 _2. That is, at least the left and right end portions in FIG. 2 are not thermally transferred with the photoresist film A. This is the case of using a substrate 1 _1, 1 ₂ as a liquid crystal substrate of the semiconductor device, since the photoresist film A does not need to be heated transferred to left and right end portions in FIG. Then, as described above, tension pin photoresist film a the substrates 1 _1, 1 this part away from ₂ between the substrate 1 ₂ of the front substrate 1 ₁ and the rear, that under this condition When the front and rear portions are cut, the end portions of the photoresist film A near the left and right ends in FIG. 2 are slightly curled up as shown in FIG. It is convenient because you can pinch and peel off this part when you need to peel off.

[0020]

According to the invention of claim 1, wherein, according to the present invention, a photoresist film A is heated and the pressure roller 2 remains elongated to be heated transferred to the substrate 1 ₂ of the front substrate 1 ₁ and the rear both Board 1 ₁ , 1 ₂
Is pressed against the upper, there is no necessity imposed after being cut in a conventional manner, the effect that can be made is not this the substrates 1 _1, 1 ₂ also wrinkles and bubbles on top results is there.

According to the invention of claim 2, the front substrate
Since the slack amount of the photoresist film a between 1 ₁ and the substrate 1 ₂ of the rear side can be always constant, it is possible to cut the front and rear portions of the photoresist film a at a predetermined position.
Therefore, there is an effect that the photoresist film A can be precisely heated and transferred to the substrates successively sent while the long photoresist film A formed in a film shape is sequentially fed out.

According to the third aspect of the invention, there is an effect that the unnecessary photoresist film a which has been separated can be easily removed and discarded.

When the heat transfer device according to the fourth aspect is used, there is an effect that a substrate having the photoresist film A in which no wrinkles or bubbles are generated can be manufactured automatically and efficiently. is there.

When the heat transfer apparatus according to the fifth aspect is used, the photoresist film A transferred by heat on a single substrate can be uniformly pressed and heated over the entire substrate, so that the substrate can be heated. There is an effect that the transfer conditions of the photoresist film A can be the same over the entire substrate.

[Brief description of drawings]

FIG. 1 is a side view showing an example of a process sequence in which a photoresist film formed in a film shape is transferred onto a substrate by heating.

FIG. 2 is an enlarged cross-sectional view of a substrate on which a photoresist film has been transferred by heating.

FIG. 3 is a side view showing a conventional method of heat-transferring a photoresist film formed in a film shape onto a substrate.

FIG. 4 is an enlarged side view showing a defect of the conventional heat transfer method.

[Explanation of symbols]

₁ 1 ~1 _3, 1'─ substrate, 2,3'─ heat and pressure bonding roller, 4─ moving means, 5─ cutting device, 6─ adsorber, A, a, A ', a'
─ Photoresist film.

Claims (5)

[Claims] 1. A front and rear two substrates 1 which are sent on a same conveying path at a predetermined interval by a heating / pressing roller 2 while sequentially feeding out a long photoresist film A formed in a film shape. _1, 1 ₂ continue to sequentially heat transferred at least on one side, when the photoresist film a on one surface of the substrate 1 ₂ of the rear is formed, the rear front substrate 1 ₁ of the side between the substrate 1 ₂ the photoresist film a away from the substrates 1 _1, 1 ₂ tension this part pin and, characterized by cutting the front and rear two positions under this state, the photoresist film substrate formed into a film How to heat transfer on top. Feeding stops the of 2. A elongated being sequentially fed photoresist film A, in a state in which both the substrate 1 ₂ of the front substrate 1 ₁ and the rear is stopped, the photoresist film A method of heat-transferring a film-shaped photoresist film onto a substrate according to claim 1, which comprises cutting a. 3. The film-formed photoresist film as claimed in claim 1, wherein the photoresist film a separated by the cutting is adsorbed by an adsorption device 6 and discarded. How to heat transfer on top. 4. A at least one side of the same transport before and after path the transmitted at predetermined intervals two substrates 1 _1, 1 _2, the elongated photoresist film A formed into a film sequentially and heating and pressure bonding roller 2 to heat transfer, is arranged it from the front, the photoresist film a the substrates 1 _1, 1 this part away from ₂ between the substrate 1 ₂ of the front substrate 1 ₁ and the rear and moving means 4 for tensioning the pin and a pair of cutting devices before and after cutting the front and rear portions of the substrate 1 _1, 1 ₂ moved away from the pin and stretched photoresist film a by the moving means 4 5
An apparatus for heating and transferring a film-shaped photoresist film onto a substrate, which comprises: Wherein said heating and pressure rollers 2 is characterized in that it is arranged to be separable with respect to the substrate 1 _1, 1 _2, the claim 4 the photoresist film formed into a film according A device that heats and transfers onto a substrate.