JPH0974291A - Board holding structure - Google Patents

Board holding structure

Info

Publication number
JPH0974291A
JPH0974291A JP22805195A JP22805195A JPH0974291A JP H0974291 A JPH0974291 A JP H0974291A JP 22805195 A JP22805195 A JP 22805195A JP 22805195 A JP22805195 A JP 22805195A JP H0974291 A JPH0974291 A JP H0974291A
Authority
JP
Japan
Prior art keywords
substrate
board
holding structure
lid
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22805195A
Other languages
Japanese (ja)
Other versions
JP2791295B2 (en
Inventor
Yuko Wakabayashi
祐幸 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP22805195A priority Critical patent/JP2791295B2/en
Publication of JPH0974291A publication Critical patent/JPH0974291A/en
Application granted granted Critical
Publication of JP2791295B2 publication Critical patent/JP2791295B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a board holding structure which is used in a cheap board case and capable of holding boards without producing looseness, wherein the board case is not required to be high in dimensional accuracy, in the case of housing a board in a case. SOLUTION: A board holding structure is used to fix a board 1 in a case composed of a lid 3 and a main body 2, wherein the board holding structure is composed of a support which is provided on each side of the main body 2 to support the board 1 by both the sides and a pressure part which is provided inside the main body 2 and the lid 3 to distort the board 1 by pressure and to press the board 1 against the support keeping the lid 3 fitted in the main body 2, and a first output recess with a sloping side tilted at an angle to a direction in which the board 1 is inserted is provided on the lid side of the board 1. The pressure part is provided confronting the first cutout recess, and the contacting face of the pressure part which comes into contact with the board 1 is so tapered as to recede from the board 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、配線基板等をケー
スに収納保持する基板保持構造に係り、特に、基板がケ
ース内部でがたつかないように保持する基板保持構造に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board holding structure for housing and holding a wiring board and the like in a case, and more particularly to a board holding structure for holding a board so that it does not rattle inside the case.

【0002】[0002]

【従来の技術】図5は従来の基板保持構造を説明するた
めの図で、(a)は上面視断面図(基板挿入前)、
(b)は側断面図(基板挿入前)、(c)は側断面図
(基板挿入後)である。以下、図を用いて説明する。6
は電子部品等が搭載され半田付けされた基板である。7
は基板6を収納するケース本体で、内部の両側面に基板
6の両辺61を挟持する嵌合スリット71が設けられて
いる。尚、ケース本体7は、開口部付近では嵌合スリッ
ト71の間隔a’が基板6の幅bより大きく、奥部では
嵌合スリット71の間隔aが基板6の幅bより小さくな
るように形成されている。また、ケース本体7は、開口
部付近では嵌合スリット71の幅d’は基板6の厚さc
より大きく、奥部では嵌合スリット71の間隔dが基板
6の厚さcより小さくなるように形成されている。8は
蓋部で、内部に基板6の前辺62を挟持する嵌合スリッ
ト81が設けられている。尚、蓋部8は、開口部付近で
は嵌合スリット81の幅d’は基板6の厚さcより大き
く、奥部では嵌合スリット81の間隔dが基板6の厚さ
cより小さくなるように形成されている。
2. Description of the Related Art FIG. 5 is a diagram for explaining a conventional substrate holding structure, in which FIG.
(B) is a side sectional view (before inserting the substrate), and (c) is a side sectional view (after inserting the substrate). Hereinafter, description will be given with reference to the drawings. 6
Is a board on which electronic components and the like are mounted and soldered. 7
Is a case main body for accommodating the substrate 6, and fitting slits 71 for sandwiching both sides 61 of the substrate 6 are provided on both inner side surfaces thereof. The case body 7 is formed such that the interval a ′ of the fitting slits 71 is larger than the width b of the board 6 near the opening and the interval a of the fitting slits 71 is smaller than the width b of the board 6 in the inner part. Has been done. In the case body 7, the width d ′ of the fitting slit 71 is close to the thickness c of the substrate 6 near the opening.
It is formed to be larger, and the interval d between the fitting slits 71 is formed to be smaller than the thickness c of the substrate 6 in the inner portion. Reference numeral 8 is a lid portion, and a fitting slit 81 for sandwiching the front side 62 of the substrate 6 is provided inside. In the lid portion 8, the width d ′ of the fitting slit 81 is larger than the thickness c of the substrate 6 near the opening, and the distance d between the fitting slits 81 is smaller than the thickness c of the substrate 6 in the inner portion. Is formed in.

【0003】次に、基板保持構造について述べる。ケー
ス本体7の前面開口部では、嵌合スリット71の間隔
a’及び幅d’は基板の幅b及び厚さcより大きいの
で、基板6は嵌合スリット71に沿って容易に挿入でき
る。基板6がケース本体7の奥部に挿入されるに従っ
て、嵌合スリット71の間隔a及び幅dは基板の幅b及
び厚さcより小さくなるが、押圧することにより基板6
を奥部まで挿入できる。蓋部8についても同様に、嵌合
スリット81の幅d’は基板の厚さcより大きいので、
基板6は嵌合スリット81に容易に挿入できる。基板6
が蓋部8の奥部に挿入されるに従って、嵌合スリット8
1の幅dは基板の厚さcより小さくなるが、押圧するこ
とにより基板6を奥部まで挿入できる。尚、蓋部8はケ
ース本体7に図示しない係合手段(ねじ止め、爪で係合
等)により固定される。
Next, the substrate holding structure will be described. At the front opening of the case body 7, the spacing a ′ and the width d ′ of the fitting slit 71 are larger than the width b and the thickness c of the board, so that the board 6 can be easily inserted along the fitting slit 71. As the board 6 is inserted into the inner part of the case body 7, the spacing a and the width d of the fitting slit 71 become smaller than the width b and the thickness c of the board, but the board 6 is pressed by pressing.
Can be inserted all the way to the back. Similarly for the lid portion 8, since the width d ′ of the fitting slit 81 is larger than the thickness c of the substrate,
The board 6 can be easily inserted into the fitting slit 81. Board 6
As the lid is inserted into the inner portion of the lid portion 8, the fitting slit 8
Although the width d of 1 is smaller than the thickness c of the substrate, the substrate 6 can be inserted deeply by pressing. The lid 8 is fixed to the case body 7 by engaging means (not shown) (screw fastening, engaging with claws, etc.).

【0004】このようにして、基板6はケース本体7の
嵌合スリット71及び蓋部8の嵌合スリット81に共に
圧入されており、基板6はケース本体7の内部でがたつ
くこともなく保持される。
In this way, the board 6 is pressed into the fitting slit 71 of the case body 7 and the fitting slit 81 of the lid portion 8, and the board 6 is held inside the case body 7 without rattling. It

【0005】[0005]

【発明が解決しようとする課題】上述の方法では、ケー
ス本体に基板を圧入される範囲が大きく強い力が必要な
ために、作業性が悪い。また、嵌合スリット部の寸法は
設計が容易ではなく、基板の寸法との関係もあり厳しい
精度が要求される。その結果、ケースの製作が難しく高
価なものになる。
In the above method, the workability is poor because the range in which the substrate is pressed into the case body is large and a strong force is required. In addition, the dimensions of the fitting slit portion are not easy to design, and because of the relationship with the dimensions of the board, strict precision is required. As a result, making the case is difficult and expensive.

【0006】本発明は、基板をケース本体に収納するに
際して、寸法精度を必要としない安価なケースを使用し
て、作業性が良くがたつきのない基板保持構造を提供す
ることを目的とする。
An object of the present invention is to provide a substrate holding structure which is easy to work and has no rattling by using an inexpensive case which does not require dimensional accuracy when housing a substrate in a case body.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に本発明は、基板を蓋と本体部からなるケースに固定す
る基板保持構造であって、前記本体部の両側面に設けら
れ、前記基板の両側部を支持する支持部と、前記蓋に設
けられ、該蓋を前記本体部に嵌合させた状態で前記基板
を押圧して撓ませ、該基板を前記支持部に圧接する押圧
部を有する基板保持構造において、前記基板の前記蓋側
部には、該基板挿入方向に対して傾斜した傾斜辺を有す
る第1切欠凹部が設けられ、前記押圧部は前記第1切欠
凹部と対向する位置に設けられるとともに、前記基板と
の接触面は先端が前記基板とは離隔する方向に傾斜して
いることを特徴とするものである。
To achieve the above object, the present invention provides a substrate holding structure for fixing a substrate to a case consisting of a lid and a main body, which is provided on both side surfaces of the main body. A support portion that supports both side portions of the substrate, and a pressing portion that is provided on the lid and that presses the substrate to bend it with the lid fitted to the body portion and presses the substrate against the support portion. In the substrate holding structure having, a first notch concave portion having an inclined side inclined with respect to the substrate insertion direction is provided on the lid side portion of the substrate, and the pressing portion faces the first notch concave portion. The contact surface with the substrate is provided at a position, and the tip of the contact surface is inclined in a direction of separating from the substrate.

【0008】また、前記基板の前記本体部の奥側側部に
は、第2切欠凹部が設けられ、前記本体部奥側の前記第
2切欠凹部と対向する位置には該第2切欠凹部と係合す
る凸部が設けられていることを特徴とするものである。
また、前記第2切欠凹部は半円形状であり、前記凸部は
前記第2切欠凹部と同じか、もしくは小さい半円形状で
あることを特徴とするものである。
A second cutout recess is provided on the back side of the main body of the substrate, and the second cutout is provided at a position facing the second cutout on the back side of the main body. It is characterized in that a convex portion to be engaged is provided.
Further, the second cutout concave portion has a semicircular shape, and the convex portion has a semicircular shape that is the same as or smaller than the second cutout concave portion.

【0009】[0009]

【実施例】図1は本発明の一実施例の基板保持構造を説
明するための図で、(a)は上面視断面図(基板挿入
前)、(b)はA−A断面図(基板挿入前)である。図
2は本発明の一実施例の基板保持構造を説明するための
ケース本体奥部の拡大図で、(a)は上面図(押圧
前)、(b)はA−A断面図(押圧前)、(c)は上面
図(押圧後)、(d)はB−B断面図(押圧後)であ
る。図3は本発明の一実施例の基板保持構造を説明する
ための蓋部の拡大図で、(a)は上面図(押圧前)、
(b)はA−A断面図(押圧前)、(c)は上面図(押
圧後)、(d)はB−B断面図(押圧後)である。図4
は本発明の一実施例の基板保持構造を説明するための図
で、(a)は上面視断面図(基板挿入後)、(b)はA
−A断面図(基板挿入後)である。以下、図を用いて詳
細に説明する。
1A and 1B are views for explaining a substrate holding structure according to an embodiment of the present invention, in which FIG. 1A is a cross-sectional view as seen from above (before insertion of a substrate), and FIG. Before insertion). 2A and 2B are enlarged views of the inner part of the case main body for explaining the substrate holding structure of one embodiment of the present invention. FIG. 2A is a top view (before pressing), and FIG. ) And (c) are top views (after pressing), and (d) is a BB cross-sectional view (after pressing). FIG. 3 is an enlarged view of a lid portion for explaining a substrate holding structure of one embodiment of the present invention, (a) is a top view (before pressing),
(B) is an AA sectional view (before pressing), (c) is a top view (after pressing), and (d) is a BB sectional view (after pressing). FIG.
3A and 3B are views for explaining a substrate holding structure according to an embodiment of the present invention, in which FIG.
FIG. 9A is a cross-sectional view (after the substrate is inserted). This will be described below in detail with reference to the drawings.

【0010】1は電子部品等が搭載され半田付けされた
基板で、基板1の一辺に半円形状の凹部11と対向する
辺に台形状の凹部12が設けられている。2は基板1を
収納するケース本体で、内部の両側面に基板1の両辺1
3、14を挟持する嵌合スリット21が設けられてい
る。尚、嵌合スリット21の間隔L2、L3及び幅t
2、t3はケース本体2の開口部付近及び奥部において
も、基板1をケース本体2に挿入し易いように基板の厚
さt1、幅L1より大きくなっている。また、ケース本
体2の奥の内面には基板1の半円形状の凹部11と係合
する半円柱状の突起22と、半円柱状の突起22の上部
に挿入された基板1の上面1aに接触する傾斜した下面
23aを有する突起23が設けられている。尚、本例で
は半円柱状の突起22と下面23aに傾斜を有する突起
23は一体となっているが、別体でも構わない。3は蓋
部で、内面に挿入された基板1の上面1aに接触する傾
斜した下面31aを有する突起31が設けられている。
尚、基板1の挿入時には、この突起31の下側面部31
bに基板1の台形状の凹部12の傾斜部12aが接触す
るようになっている。また、基板の半円形状の凹部1
1、台形状の凹部12、ケース本体2の半円柱状の突起
22、突起23、突起31はいくつでも構わない。
Reference numeral 1 denotes a substrate on which electronic components and the like are mounted and soldered, and a trapezoidal recess 12 is provided on one side of the substrate 1 and a semicircular recess 11 on the opposite side. Reference numeral 2 denotes a case main body for accommodating the board 1, and both sides 1 of the board 1 are provided on both inner sides thereof.
A fitting slit 21 for sandwiching the members 3 and 14 is provided. In addition, the intervals L2 and L3 of the fitting slit 21 and the width t
2 and t3 are larger than the thickness t1 and the width L1 of the board so that the board 1 can be easily inserted into the case body 2 even in the vicinity of the opening and the back of the case body 2. In addition, a semi-cylindrical protrusion 22 that engages with the semi-circular recess 11 of the substrate 1 is formed on the inner surface of the back of the case body 2, and an upper surface 1 a of the substrate 1 that is inserted above the semi-cylindrical protrusion 22 is provided. A protrusion 23 is provided having a contacting inclined lower surface 23a. In this example, the semi-cylindrical projection 22 and the projection 23 having an inclined lower surface 23a are integrated, but they may be separate bodies. Reference numeral 3 denotes a lid portion, which is provided with a protrusion 31 having an inclined lower surface 31a that comes into contact with the upper surface 1a of the substrate 1 inserted into the inner surface.
When the substrate 1 is inserted, the lower side surface portion 31 of the protrusion 31
The inclined portion 12a of the trapezoidal concave portion 12 of the substrate 1 comes into contact with b. In addition, the semicircular concave portion 1 of the substrate
1, the trapezoidal recess 12, the semi-cylindrical projection 22, the projection 23, and the projection 31 of the case body 2 may be any number.

【0011】先ず、基板のケース本体への収納について
図2の拡大図に従って述べる。基板1は半円形の凹部1
1の方からケース本体2の嵌合スリット(図示せず)に
沿って奥の方に挿入される。この時、基板の幅及び厚さ
に対して嵌合スリットの間隔の方が大きい。従って、基
板1はケース本体2に容易に挿入できる。基板1がケー
ス本体2の奥部に挿入されると、基板1の先端部が突起
23の傾斜した下面23aに接触して止まる。この状態
では、基板1の半円形の凹部11がケース本体2の奥部
の面に設けられた半円柱状の突起22に近づいている
が、まだ両者は接触していない(図2(a)、(b)参
照)。
First, the storage of the substrate in the case body will be described with reference to the enlarged view of FIG. Substrate 1 is a semicircular recess 1
1 is inserted in the inner side along a fitting slit (not shown) of the case body 2. At this time, the gap between the fitting slits is larger than the width and thickness of the substrate. Therefore, the substrate 1 can be easily inserted into the case body 2. When the board 1 is inserted into the inner part of the case body 2, the tip of the board 1 comes into contact with the inclined lower surface 23 a of the projection 23 and stops. In this state, the semicircular concave portion 11 of the substrate 1 is close to the semicylindrical projection 22 provided on the inner surface of the case body 2, but they are not in contact with each other yet (FIG. 2 (a)). , (B)).

【0012】さらに、基板1が押圧されてケース本体2
の奥に挿入されると、同時に基板1がケース本体2の奥
部の突起23の傾斜した下面23aにより下方(矢印方
向)に押される。基板1は両辺が嵌合スリットに挟持さ
れているので、基板1は両側の嵌合スリットを支点とし
て下方に湾曲する。基板1の半円状の凹部11とケース
本体2の円柱状の突起22が接触して止まる。この時、
基板1の半円形の凹部11の半径R1がケース本体2の
半円柱状の突起22の半径R2と同じか、もしくは大き
く設定されているので、嵌合し易く基板1の半円形の凹
部11の中心線とケース本体2の半円柱状の突起22の
中心線が一致することにより一点のみで接触する。この
ようにして、基板1のケース本体2に対する位置は決定
される(図2(c)、(d)参照)。
Furthermore, the substrate 1 is pressed and the case body 2 is pressed.
At the same time, the substrate 1 is pushed downward (in the direction of the arrow) by the inclined lower surface 23a of the protrusion 23 in the inner portion of the case body 2. Since both sides of the board 1 are sandwiched by the fitting slits, the board 1 bends downward with the fitting slits on both sides as fulcrums. The semi-circular recess 11 of the substrate 1 and the cylindrical protrusion 22 of the case body 2 come into contact with each other and stop. This time,
The radius R1 of the semicircular recess 11 of the substrate 1 is set to be equal to or larger than the radius R2 of the semicylindrical protrusion 22 of the case body 2, so that the semicircular recess 11 of the substrate 1 can be easily fitted. Since the center line and the center line of the semi-cylindrical projection 22 of the case body 2 coincide with each other, they are in contact at only one point. In this way, the position of the substrate 1 with respect to the case body 2 is determined (see FIGS. 2C and 2D).

【0013】次に、蓋部の取付けについて図3の拡大図
に従って述べる。基板1がケース本体に挿入された後、
蓋部3をケース本体2に取り付ける。この時、基板1の
後端部(台形状の凹部12のある辺)において、蓋部3
の突起31の傾斜した下面31aが基板1の台形状の凹
部12の上面1aに接触し、また、基板1の台形状の凹
部12の傾斜部12aに突起31の下側面部31bが接
触して止まる(図3(a)、(b)参照)。
Next, attachment of the lid will be described with reference to an enlarged view of FIG. After the board 1 is inserted into the case body,
The lid 3 is attached to the case body 2. At this time, at the rear end portion of the substrate 1 (the side having the trapezoidal recess 12), the lid portion 3
The inclined lower surface 31a of the projection 31 contacts the upper surface 1a of the trapezoidal concave portion 12 of the substrate 1, and the lower side surface portion 31b of the projection 31 contacts the inclined portion 12a of the trapezoidal concave portion 12 of the substrate 1. It stops (see FIGS. 3 (a) and 3 (b)).

【0014】さらに、基板1が蓋部3により押圧される
と、蓋部3とケース本体2が完全に嵌合され、基板1が
蓋部3の突起31の傾斜した下面31aにより下方に押
される。その結果、基板1はケース本体の両側の嵌合ス
リットを支点として下方に湾曲する。同時に、突起31
の両下側面部31bが基板1の台形状の凹部12の傾斜
部12aを押圧する。(図3(c)、(d)参照)。
Further, when the substrate 1 is pressed by the lid portion 3, the lid portion 3 and the case body 2 are completely fitted, and the substrate 1 is pushed downward by the inclined lower surface 31a of the protrusion 31 of the lid portion 3. . As a result, the substrate 1 bends downward with the fitting slits on both sides of the case body as fulcrums. At the same time, the protrusion 31
Both lower side surface portions 31b press the inclined portion 12a of the trapezoidal recess 12 of the substrate 1. (See FIGS. 3C and 3D).

【0015】このようにして、基板1の上面1aがケー
ス本体2の突起23の傾斜した下面23a及び蓋部3の
突起31の傾斜した下面31aにより下方に押されて基
板1が下方に湾曲し、その弾力で基板1はケース本体2
内でがたつくこともなく固定される。同時に、基板1は
半円形状の凹部11とケース本体2の半円柱状突起22
に係合して、また基板1は台形状の凹部12と蓋部3の
台形状突起31に係合して、基板1の挿入方向及び幅方
向の位置が固定されて、基板1はケース本体2の内部で
がたつくこともなく保持される。尚、蓋部3はケース本
体2に図示しない係合手段(ねじ止め、爪で係合等)に
より固定される。
In this way, the upper surface 1a of the substrate 1 is pushed downward by the inclined lower surface 23a of the protrusion 23 of the case body 2 and the inclined lower surface 31a of the protrusion 31 of the lid portion 3 to bend the substrate 1 downward. , Its elasticity makes the substrate 1 the case body 2
It is fixed without rattling inside. At the same time, the substrate 1 has a semi-circular recess 11 and a semi-cylindrical projection 22 of the case body 2.
, And the board 1 is engaged with the trapezoidal recess 12 and the trapezoidal projection 31 of the lid 3 so that the position of the board 1 in the insertion direction and the width direction is fixed. It is held inside the 2 without rattling. The lid 3 is fixed to the case body 2 by an engaging means (not shown) (screw fastening, engaging with claws, etc.).

【0016】以上のように本実施例では、基板を収納す
るケース本体の嵌合スリットの精度を必要としないの
で、基板を挿入し易く、またケースを安価に製作でき
る。しかも、基板はケース本体にがたつきなく収納でき
る。
As described above, in this embodiment, since the precision of the fitting slit of the case body for accommodating the substrate is not required, the substrate can be easily inserted and the case can be manufactured at low cost. Moreover, the substrate can be stored in the case body without rattling.

【0017】[0017]

【発明の効果】以上説明したように、本発明では基板を
ケース本体に収納するに際して、寸法精度を必要としな
い安価なケースによる基板保持構造が提供できる。
As described above, according to the present invention, it is possible to provide a substrate holding structure with an inexpensive case which does not require dimensional accuracy when the substrate is housed in the case body.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の基板保持構造を説明するた
めの図で、(a)は上面視断面図(基板挿入前)、
(b)はA−A断面図(基板挿入前)である。
FIG. 1 is a diagram for explaining a substrate holding structure according to an embodiment of the present invention, in which (a) is a cross-sectional top view (before substrate insertion),
(B) is a sectional view taken on line AA (before insertion of the substrate).

【図2】本発明の一実施例の基板保持構造を説明するた
めのケース本体奥部の拡大図で、(a)は上面図(押圧
前)、(b)はA−A断面図(押圧前)、(c)は上面
図(押圧後)、(d)はB−B断面図(押圧後)であ
る。
2A and 2B are enlarged views of the inner part of the case main body for explaining the substrate holding structure of one embodiment of the present invention, in which FIG. 2A is a top view (before pressing), and FIG. Before), (c) is a top view (after pressing), and (d) is a BB sectional view (after pressing).

【図3】本発明の一実施例の基板保持構造を説明するた
めの蓋部の拡大図で、(a)は上面図(押圧前)、
(b)はA−A断面図(押圧前)、(c)は上面図(押
圧後)、(d)はB−B断面図(押圧後)である。
FIG. 3 is an enlarged view of a lid portion for explaining a substrate holding structure of one embodiment of the present invention, (a) is a top view (before pressing),
(B) is an AA sectional view (before pressing), (c) is a top view (after pressing), and (d) is a BB sectional view (after pressing).

【図4】本発明の一実施例の基板保持構造を説明するた
めの図で、(a)は上面視断面図(基板挿入後)、
(b)はA−A断面図(基板挿入後)である。
FIG. 4 is a diagram for explaining a substrate holding structure according to an embodiment of the present invention, in which (a) is a cross-sectional top view (after insertion of the substrate),
(B) is a sectional view taken on line AA (after the substrate is inserted).

【図5】従来の基板保持構造を説明するための図で、
(a)は上面視断面図(基板挿入前)、(b)は側断面
図(基板挿入前)、(c)は側断面図(基板挿入後)で
ある。
FIG. 5 is a diagram for explaining a conventional substrate holding structure,
(A) is a top view sectional view (before board insertion), (b) is a side sectional view (before board insertion), and (c) is a side sectional view (after board insertion).

【符号の説明】[Explanation of symbols]

1・・・基板 21・・・嵌合
スリット 2・・・ケース本体 22・・・半円
柱状の突起 3・・・蓋部 23・・・台形
状の突起 11・・・半円形の凹部 31・・・台形
状の突起 12・・・台形状の凹部
DESCRIPTION OF SYMBOLS 1 ... Substrate 21 ... Fitting slit 2 ... Case main body 22 ... Semi-cylindrical projection 3 ... Lid 23 ... Trapezoidal projection 11 ... Semi-circular recess 31 ... Trapezoidal projection 12 ... Trapezoidal recess

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板を蓋と本体部からなるケースに固定
する基板保持構造であって、 前記本体部の両側面に設けられ、前記基板の両側部を支
持する支持部と、 前記本体部奥側及び前記蓋に設けられ、該蓋を前記本体
部に嵌合させた状態で前記基板を押圧して撓ませ、該基
板を前記支持部に圧接する押圧部を有する基板保持構造
において、 前記基板の前記蓋側部には、該基板挿入方向に対して傾
斜した傾斜辺を有する第1切欠凹部が設けられ、 前記押圧部は前記第1切欠凹部と対向する位置に設けら
れるとともに、前記基板との接触面は先端が前記基板と
は離隔する方向に傾斜していることを特徴とする基板保
持構造。
1. A substrate holding structure for fixing a substrate to a case composed of a lid and a main body, wherein support portions provided on both side surfaces of the main body portion and supporting both side portions of the substrate, the back portion of the main body portion. A substrate holding structure having a pressing portion that is provided on a side and the lid, presses and bends the substrate with the lid fitted to the main body, and presses the substrate against the supporting portion. A first notch recess having an inclined side inclined with respect to the substrate insertion direction is provided on the lid side part of the substrate, and the pressing part is provided at a position facing the first notch recess and The substrate holding structure is characterized in that the contact surface has a tip inclined in a direction in which it is separated from the substrate.
【請求項2】 前記基板の前記本体部の奥側側部には、
第2切欠凹部が設けられ、 前記本体部奥側の前記第2切欠凹部と対向する位置には
該第2切欠凹部と係合する凸部が設けられていることを
特徴とする請求項1記載の基板保持構造。
2. The back side of the main body of the substrate,
The 2nd notch crevice is provided, and the convex part which engages with the 2nd notch crevice is provided in a position which counters the 2nd notch crevice on the back side of the body part. Substrate holding structure.
【請求項3】 前記第2切欠凹部は半円形状であり、 前記凸部は前記第2切欠凹部と同じか、もしくは小さい
半円形状であることを特徴とする請求項1記載の基板保
持構造。
3. The substrate holding structure according to claim 1, wherein the second cutout recess has a semicircular shape, and the protrusion has a semicircular shape that is the same as or smaller than the second cutout recess. .
JP22805195A 1995-09-05 1995-09-05 Substrate holding structure Expired - Lifetime JP2791295B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22805195A JP2791295B2 (en) 1995-09-05 1995-09-05 Substrate holding structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22805195A JP2791295B2 (en) 1995-09-05 1995-09-05 Substrate holding structure

Publications (2)

Publication Number Publication Date
JPH0974291A true JPH0974291A (en) 1997-03-18
JP2791295B2 JP2791295B2 (en) 1998-08-27

Family

ID=16870438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22805195A Expired - Lifetime JP2791295B2 (en) 1995-09-05 1995-09-05 Substrate holding structure

Country Status (1)

Country Link
JP (1) JP2791295B2 (en)

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