JP2628839B2 - Earth under guide - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an earth under guide for holding a printed circuit board in a substantially orthogonal direction with respect to a metal base to ground the printed circuit board.

[0002]

2. Description of the Related Art Conventionally, for example, Japanese Utility Model Application Laid-Open No. 2-41368 discloses an energizing spacer that does not require the trouble of turning a screw when mounting or removing. Although the printed circuit board is arranged parallel to the metal base to ground the printed circuit board, it cannot be applied to the case where the printed circuit board is arranged in a direction substantially orthogonal to the metal base.

On the other hand, for example, Japanese Patent Application Laid-Open No. Hei 4-309292 discloses a structure in which a conductive material is arranged in a guide groove of a guide rail provided inside a housing for housing a printed circuit board to ground the printed circuit board. . According to this guide rail, it is possible to arrange the printed circuit boards in a direction substantially perpendicular to the housing that is a metal base and to ground the printed circuit boards at the same time.

[0004]

However, since the shape of the guide rail needs to be determined according to the size of the housing for accommodating the printed circuit board and the size of the printed circuit board itself, various sizes of the housing and the printed circuit board are required. When applying to a board, it is necessary to make it for each housing and each printed board, and there was a problem in cost.

Further, when a housing having a small internal space is used, there is also a problem that the internal space cannot be effectively used because the space occupied by the guide rails is large. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is an earth under guide that holds a printed circuit board in a substantially orthogonal direction with respect to a metal base to take an earth, and that can be used as a versatile guide rail substitute. The purpose is to provide an underguide.

[0006]

According to a first aspect of the present invention, there is provided an earth under guide comprising: a resin plate; and a pair of resin plates standing upright facing each other with a predetermined gap between the resin plate and the resin plate. A piece, a locking portion provided on the resin plate and fitted to a through hole provided on the metal base to cooperate with the resin plate to clamp the metal base; and a locking portion disposed on the surface of the resin plate. A conductive plate disposed in a gap between the metal base and the resin plate in a state where the locking portion is fitted into the through hole, and a predetermined gap between the pair of resin pieces coupled to the conductive plate. And a pair of conductive holding pieces that sandwich the ground pattern of the printed board and support the printed board in a direction substantially orthogonal to the metal base, and extend to each side of the pair of conductive holding pieces. Installed, and whether it is substantially parallel to the conductive plate Characterized by comprising a pair of lateral guides away from each other towards the side, the.

According to a second aspect of the present invention, there is provided the ground under guide according to the first aspect, wherein the locking portion is provided integrally with the pair of resin pieces.
The invention according to claim 3 is the earth under guide according to claim 1, wherein the locking portion is provided on a surface opposite to a surface of the resin plate on which the pair of resin pieces are erected. It is characterized by having.

According to a fourth aspect of the present invention, there is provided the ground under guide according to any one of the first to third aspects, wherein the pair of conductive sandwiching pieces extend at respective upper portions and are substantially perpendicular to the conductive plate. A pair of upper guides separated from each other upward is provided.

According to a fifth aspect of the present invention, there is provided the ground under guide according to any one of the first to fourth aspects, wherein the conductive plate includes a spring portion for urging the conductive plate away from the resin plate. Features.

According to a sixth aspect of the present invention, there is provided the ground under guide according to any one of the first to fifth aspects, wherein the locking portion and the resin plate are arranged in accordance with a thickness of the metal base. And a resin thickness permitting mechanism in which a distance between the resin plate and the resin plate changes.

[0011]

When the locking portion of the ground under guide according to claim 1 is fitted into a through hole provided in the metal base, the locking portion cooperates with the resin plate to sandwich the metal base and the conductive plate. The under guide is attached and fixed to the metal base. Then, in a state where the printed board provided with the ground pattern is substantially perpendicular to the metal base, the printed board is inserted between the pair of conductive holding pieces from the lateral direction by the guide of the side guide of the ground under guide, and the ground pattern of the printed board is formed. Is held between a pair of conductive holding pieces. At this time, the pair of resin pieces erected on both sides of the pair of holding pieces serve to reinforce the conductive holding pieces.

As described above, the printed circuit board is electrically connected to the metal base through the pair of conductive holding pieces and the conductive plate while the printed circuit board is substantially perpendicular to the metal base. In the ground under guide according to the second aspect, since the locking portion is formed integrally with the pair of resin pieces, the pair of resin pieces are fitted into through holes formed in the metal base. That is, the ground under guide is fitted into the through hole from the side opposite to the side on which the printed circuit board is sandwiched.

The earth under guide according to claim 3 is
The locking portion is provided on a surface opposite to the surface of the resin plate on which the pair of resin pieces are erected. For this reason, the ground under guide is fitted into the through hole from the side that sandwiches the printed circuit board. The ground under guide according to claim 4 can be inserted between the pair of conductive holding pieces from above by the guide of the upper guide in a state where the printed board provided with the ground pattern is substantially perpendicular to the metal base. .

According to a fifth aspect of the present invention,
In a state where the locking portion is fixed to the metal base by fitting the locking portion into a through hole provided in the metal base, the spring portion urges the metal base upward to press the metal base against the locking portion. For this reason, the surface pressure between the metal base and the conductive plate is increased, and the two are surely in contact with each other.

The earth under guide according to claim 6 is
The existence of the plate thickness permitting mechanism makes it possible to cope with metal bases of various plate thicknesses, and it is possible to reliably maintain contact between the conductive plate and the metal base. As the plate thickness allowable mechanism, for example, a mechanism that allows the plate thickness by a resin plate and a locking portion formed of a plurality of steps formed at a stepwise distance from the resin plate, a taper that is inclined with respect to the resin plate A mechanism to allow the plate thickness by the locking portion consisting of the resin plate, or a spring body that urges in the direction of the locking portion is formed in the resin plate, and the thickness is allowed by the spring body of the resin plate and the locking portion. And the like.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of an earth under guide according to a first embodiment. FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is AA in FIG. 1 (b). It is sectional drawing.
2A and 2B are explanatory views of the resin molded body, FIG. 2A is a plan view, FIG. 2B is a front view, FIG. 2C is a left side view, and FIG.
(D) is a bottom view. 3A and 3B are explanatory views of the conductive molded body. FIG. 3A is a plan view, FIG. 3B is a front view, and FIG.
3C is a rear view, and FIG. 3D is a right side view. FIG. 4 is a perspective view of the conductive molded body.

The ground under guide 1 is composed of a resin molded body 2 made of a synthetic resin such as a nylon resin and a conductive molded body 3 made of a conductive material such as a copper plate. Resin molding 2
Has a resin plate 4 and a pair of resin pieces 5 and 6, as shown in FIG. The resin plate 4 is formed in a shape in which the front and rear of the disk are cut out.

A pair of resin pieces 5 and 6 are erected on the resin plate 4 so as to face each other with a predetermined gap 11 therebetween. The pair of resin pieces 5 and 6 are vertically extended from the resin plate 4 in vertical directions 51 and 61, and a gap 11 is formed at the upper end of the vertical pieces 51 and 61.
Curved pieces 52, 62 bent substantially at right angles to the sides,
Folding pieces 53 and 63 that are folded toward the opposite side of the gap 11 and extend toward the resin plate 4 at the upper ends of the first and first parts 61.

At the rear ends of the vertical pieces 51 and 61, receiving portions 51a and 61a are formed which are bent at substantially right angles to the gap 11 side. Notched grooves 51b and 61b are provided at the front ends of the vertical pieces 51 and 61 and at a portion connected to the resin plate 4. In addition, chamfered portions 52a and 62a are formed at the front ends of the curved pieces 52 and 62 so as to be widened toward the front. Further, at the end of the folded pieces 53 and 63, that is, at the position facing the resin plate 4, a locking portion 53 comprising a plurality of steps formed stepwise with respect to the resin plate 4.
a, 63a are formed.

On the other hand, the conductive molded body 3 is formed by processing a single copper plate, and comprises a conductive plate portion 7, a pair of conductive holding pieces 8, 9 and a spring portion 12, as shown in FIGS. .
The conductive plate portion 7 is formed in a substantially convex shape (see FIG. 3A). The conductive plate portion 7 has fitting portions 71 and 72 that can be fitted into the notched grooves 51b and 61b provided in the pair of resin pieces 5 and 6, respectively. The conductive plate portion 7 includes a pair of conductive holding pieces 8 and 9.
Is erected.

The front end of the conductive plate portion 7 has two cuts 7
3, 74 are inserted, and four portions are bent upward in a triangular shape along the zigzag fold line L, thereby forming a spring portion 12. The pair of conductive holding pieces 8 and 9
Standing portions 81 and 91, front guide portions 82 and 92, respectively.
It comprises clamping portions 83 and 93, rear guide portions 84 and 94, and upper guide portions 85 and 95.

The standing portions 81 and 91 extend vertically upward at positions facing each other on the conductive plate portion 7. The front guide portions 82 and 92 are provided continuously behind the standing portions 81 and 91, and are formed so that the shape as viewed from above is substantially arc-shaped. The interval between the pair of front guide portions 82 and 92 gradually decreases from the front side to the rear side. The front guides 82 and 92 correspond to side guides of the present invention.

The holding portions 83 and 93 are provided with front guide portions 82 and 9
3 and a pair of holding portions 83 and 93
Are formed to be the narrowest in the conductive holding pieces 8 and 9. The rear guide portions 84 and 94 are provided continuously to the rear of the holding portions 83 and 93, and are formed so that the shape when viewed from above is substantially circular. This pair of rear guide portions 8
The interval between 4, 94 gradually increases toward the rear side.

The upper guide portions 85 and 95 are provided with holding portions 83 and 9.
3 is a plate-shaped body provided continuously on the upper part of The interval between the pair of upper guide portions 85 and 95 gradually increases toward the upper side. When the fitting portions 71 and 72 of the conductive molded body 3 are fitted into the cutout grooves 51 b and 61 b of the resin molded body 2, the rear ends of the rear guide portions 84 and 94 of the conductive molded body 3 become a pair of resin pieces 5 and 6. It comes into contact with the receiving portions 51a and 61a provided.
Thus, the resin molded body 2 and the conductive molded body 3 are integrated, and the earth under guide 1 of FIG. 1 is completed.

Next, an example of use of the ground under guide 1 of the first embodiment will be described. 5A and 5B are explanatory views of use of the present embodiment. FIG. 5A is a plan view and FIG. 5B is a front view. A substantially rectangular through hole 22a is formed in a chassis (metal base) 22 of a housing capable of accommodating a plurality of printed circuit boards 21, and a pair of ground under guides 1 is formed in the through hole 22a from outside to inside. The resin pieces 5 and 6 are fitted. The pair of resin pieces 5, 6 slightly bend toward the gap 11 when passing through the through hole 22a, and after passing, urge the opposite side of the gap 11 by the reaction. And the folded piece 53,
The chassis 22 is sandwiched between the resin plate 4 and the predetermined step of the locking portions 53a, 63a provided on the 63. However, since the conductive plate 7 is disposed between the resin plate 4 and the chassis 22. The chassis 22 is sandwiched together with the conductive plate 7. At this time, the front end of the conductive plate 7 is
The spring portion 12 urges the chassis 22 upward. Therefore, the chassis 22 is firmly fixed and is strongly pressed against the conductive plate 7. The locking portion 53
Which one of the plurality of steps provided in a and 63a sandwiches the chassis changes according to the thickness of the chassis 22. That is, the step and the resin plate 4 constitute a plate thickness allowable mechanism.

Thus, the earth under guide 1
Is fixed to the chassis 22. Subsequently, the printed circuit board 21 is inserted into the ground under guide 1 so as to be substantially orthogonal to the chassis 22. In addition, the printed circuit board 2
A ground pattern 21a (see FIG. 6) is provided at one edge.

In this embodiment, there are two insertion directions. That is, there are a case where it is inserted into the chassis 22 from a parallel direction and a case where it is inserted from a vertical direction. When Inserting into the Chassis 22 from a Parallel Direction (See FIG. 5A) First, the printed circuit board 21 is set up so as to be substantially orthogonal to the chassis 22. Then, the printed circuit board 21 is inserted into the gap 11 of the ground under guide 1 from the front side (FIG. 5).
(See the arrow in (a)).

Since the pair of resin pieces 5 and 6 of the ground under guide 1 are provided with chamfered portions 52a and 62a which are chamfered so as to spread forward, the printed circuit board 21 is mounted on the chamfered portions 52a and 62a. It is guided and slid between the pair of conductive holding pieces 8 and 9.

The printed circuit board 21 has a pair of conductive holding pieces 8,
After passing through the upright portions 81 and 91 of 9, the guides are guided by front guide portions 82 and 92, the distance of which gradually narrows from the front, and proceeds between the holding portions 83 and 93. At this time, the printed circuit board 21 is inserted so as to push the holding portions 83 and 93 apart. Then, the insertion operation is completed when the insertion operation reaches the desired position. When inserting the printed circuit board 21 into the chassis 22 from a vertical direction (see FIG. 5B), first, the printed circuit board 21 is set up so as to be substantially orthogonal to the chassis 22. Then, the printed circuit board 21 is inserted into the gap 11 of the ground under guide 1 from above.

When the printed circuit board 21 passes through the curved pieces 52, 62 of the pair of resin pieces 5, 6, the printed circuit board 21 is guided from above by upper guides 85, 95, whose intervals gradually become narrower, to the holding parts 83, 93. And proceed. At this time, the printed circuit board 21 is inserted so as to push the holding portions 83 and 93 apart.
Then, the insertion operation is completed when the insertion operation reaches the desired position.

When the printed circuit board 21 is inserted into the ground under guide 1 as described above, the holding portions 83 and 93 of the pair of conductive holding pieces 8 and 9 are provided with the upright portions 81 and 9.
Since the elastic action of urging the printed circuit board 21 with the connecting portion of the front guide portions 82 and 92 as a fulcrum acts, the ground pattern 21a (see FIG. 6) of the printed circuit board 21 is pressed and held by the holding portions 83 and 93. You.

As described above, with the printed circuit board 21 substantially perpendicular to the chassis 22, the ground pattern 21a
(See FIG. 6) is a pair of conductive holding pieces 8, 9 and conductive plate portion 7.
Is electrically connected to the chassis 22 via the Next, a specific example of use of the ground under guide 1 will be described with reference to FIGS. FIG. 6 is an explanatory view of use of the first embodiment, and FIG. 7 is an enlarged perspective view of FIG.

The ground under guide 1 of this embodiment can be used as a substitute for a guide rail provided in the inside 23a of the housing 23 as shown in FIGS. That is, two through holes 22a are formed in the chassis 22 forming the left and right side surfaces of the housing 23, and the ground under guide 1 is fitted into the through holes 22a from the outside 23b. still,
The number of the ground under guides 1 is appropriately adjusted according to the size of the printed board 21 to be used.

The ground under guide 1 is shown in FIG.
As shown in (b), the guide rail 29 is already mounted on the housing 23.
Is installed, and the guide rail 29
Does not have a structure for grounding, a through hole is formed in the chassis 22 forming the inner surface of the housing 23, and the ground under guide 1 of the present embodiment is fitted to the grounding structure. Can be. That is, since the ground under guide 1 of the present embodiment includes the upper guide portions 85 and 95 (see FIG. 1), even if the ground under guide 1 is attached to the chassis 22 forming the inner surface of the housing 23, The printed circuit board 21 can be inserted from the vertical direction. For this reason, there is no need to replace the guide rail with a grounding structure, and the structure can be easily grounded.

Further, the earth under guide 1 is shown in FIG.
As shown in (c), a through hole is formed in the chassis 22 forming the bottom surface of the housing 23, the ground under guide 1 of this embodiment is fitted therein, and the relatively small printed circuit board 21 is attached to the two ground under guides. 1 and can be securely fixed.

The effect of the above ground under guide 1 will be described below. Regardless of the size of the printed circuit board 21 or the size of the housing 23, a common part can be used as a substitute for the guide rail. For this reason, the printed circuit board 2
This is advantageous in terms of cost as compared with a case where a guide rail is designed and manufactured for each size of the housing 1 and the size of the housing 23. Since the ground under guide 1 has a small occupation ratio of the internal space, the internal space can be sufficiently effectively used even if the inside 23a of the housing 23 is narrow. The ground under guide 1 is attached to the outside 23 of the housing 23.
The mounting operation can be performed extremely easily, since it is only necessary to insert from the position b. At this time, the outside 23 of the housing 23
Only the resin plate 4 is exposed at b, and even if a force is applied to the resin plate 4 in the direction of the inner side 23a, the ground under guide 1 does not come off. Since the spring portion 12 is provided, the chassis 22 and the conductive plate portion 7
As a result, the surface pressure of the ground under guide 1 increases and the ground under guide 1 is securely fixed to the chassis 22. Since the locking portions 53a and 63a have a step-like step,
It is possible to cope with the case where the thickness of the chassis 22 is different. In addition to the front guides 82 and 92, an upper guide 85,
Since the printed circuit board 95 is provided, the printed circuit board 21 can be inserted in either a horizontal direction (a direction parallel to the chassis 22) or an upper direction (a direction perpendicular to the chassis 22). For example, as shown in FIG. Since it can be used, its versatility is high.

Next, a second embodiment will be described. FIG.
FIG. 9 is an assembled perspective view of the second embodiment, and FIG. 9 is a perspective view of the second embodiment. The ground under guide 201 of the second embodiment is
As in the first embodiment, the resin molded body 202 and the conductive molded body 20
And 3.

As shown in FIG. 8, the resin molded body 202 includes a resin plate 204, a pair of resin pieces 205 and 206, and a locking piece 21.
5 is provided. The resin plate 204 is formed in a substantially rectangular shape,
Guide part 220 for inserting a printed circuit board at the front end
Is provided. The pair of resin pieces 205 and 206 are erected on the resin plate 204 so as to face each other with a predetermined gap 211 therebetween. The pair of resin pieces 205, 206 are vertical pieces 251, 261 extending vertically upward from the resin plate 4, and bent pieces 252, 262 of a shape bent at a right angle to the gap 211 side at upper ends of the vertical pieces 251, 261. Consists of Piece 2
At the front ends of 52 and 262, chamfered portions 252a and 262a which are chamfered so as to spread forward are formed.

The locking piece 215 is a pair of resin pieces 205 and 2
06 stands on the surface on the opposite side to the surface of the resin plate 204 on which it stands. The locking piece 215 includes a support piece 216 extending from the resin plate 204 and a folded piece 21 that is folded back at the tip of the support piece 216 and extends toward the resin plate 204.
7,218. At the ends of the folded pieces 217 and 218, that is, at positions facing the resin plate 204, similarly to the locking portions 53a and 63a of the first embodiment, a plurality of steps formed at a stepwise distance from the resin plate 204 are formed. (See FIG. 2).

On the other hand, the conductive molded body 203 is formed by processing a single copper plate, and as shown in FIG.
7, a pair of conductive holding pieces 208 and 209 and a spring portion 212
Consists of The conductive plate portion 207 is formed in a substantially concave shape (see FIG. 8), and a plurality of triangular spring portions 212 are provided on both sides. The spring part 212 is bent slightly downward with respect to the surface of the conductive plate part 207.

At the front end of the conductive plate portion 207, a connecting portion 230 is provided.
Is provided. The connecting portion 230 is formed in a shape substantially coinciding with the guide portion 220 provided on the resin plate 204. The pair of conductive holding pieces 208 and 209 are
Is erected on the upper surface 230a of the main body. Each standing part 28
1, 291; front guide portions 282, 292;
3, 293, rear guides 284, 294 and upper guides 285, 295. Since these components have the same configuration as the conductive holding pieces 8 and 9 of the first embodiment, the description thereof is omitted.

The conductive molded body 203 is slid from the front end side of the resin plate 204 of the resin molded body 202 and fitted therein, and the guide portion 220 of the resin plate 204 and the connecting portion 230 of the conductive molded body 203 are fitted to each other. Nine earth under guides 201 are completed. Next, a method of attaching the ground under guide 201 of the second embodiment will be described. The earth under guide 201 extends from the inside of the housing to the outside of the through hole 22a.
The chassis 22 is firmly fixed and firmly attached to the conductive plate portion 207 by fitting the locking piece 215 into the mounting portion 215 and by the presence of the spring portions 212 provided on both sides of the conductive plate portion 207 in the fitted state. It is the same as the first embodiment except that it is pressed. Therefore, a detailed description is omitted.

The method of using the ground under guide 201 of the second embodiment and a specific example of use thereof are the same as those of the first embodiment, and a detailed description thereof will be omitted. That is, also in the second embodiment, there are two insertion directions of the printed circuit board, that is, the horizontal direction and the upward direction, and as shown in FIGS. 6A to 6C, the printed circuit board can be applied as a substitute for a guide rail. .

FIG. 10 shows another specific example of the use of the ground under guide 201. That is, when the guide rail 29 is already attached to the housing 23 and the guide rail 29 does not have a structure for grounding, the guide rail 29 passes through the rear side of the chassis 22 forming the side surface of the housing 23. A hole is formed, and the earth under guide 201 of this embodiment is formed.
Can be fitted to ground. For this reason, there is no need to replace the guide rail with a grounding structure, and the structure can be easily grounded.

At this time, since the ground under guide 201 is fitted from the inside 23 a of the housing 23, the resin plate 204
Is located on the inside 23 a side of the housing 23. For this reason, the gap 211 of the ground under guide 201 is raised from the side by the thickness of the resin plate 204. On the other hand, since the surface of the guide rail 29 that contacts the side surface of the housing 23 has a thickness, the guide groove is raised from the side surface by the thickness. Therefore, the gap 211 and the guide groove are lifted by substantially the same amount from the side surface, and the printed board 21 can be smoothly inserted.

The use example of FIG. 10 can be applied to the ground under guide 1 of the first embodiment in the same manner, but the second embodiment is applied in that the insertion is made smooth by utilizing the thickness of the resin plate as described above. The example is better. The effects of the second embodiment described above are substantially the same as those of the first embodiment except for the effects of the first embodiment, and a detailed description thereof will be omitted. However, also in the second embodiment, the locking pieces 2
Since it is only necessary to fit 15 into the through hole 22a from the inside, the effect that the mounting operation can be easily performed is obtained.

It is needless to say that the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the technical scope of the present invention. For example, a conductive molded body 101 shown in FIG. 11 may be used instead of the conductive molded body 3 of the above embodiment. This conductive molded body 10
One conductive plate portion 107 is formed in a substantially T-shape, and has a spring portion 102 at the front and a spring portion 103 at the rear. In addition, the pair of conductive holding pieces 108 and 109 are connected to the front guide 1.
82, 192, clamping parts 183, 193, rear guide part 1
84, 194, but no upper guide portion.

Therefore, although the ground under guide using the conductive molded body 101 can be inserted from the lateral direction, it cannot be inserted from above. Except for this point, the ground under guide using the conductive molded body 101 has the same effect as the effect of the above embodiment.

Further, in the above embodiment, the plate thickness allowable mechanism is constituted by the locking portion composed of a plurality of steps and the resin plate. As another example, as shown in FIG. A mechanism that allows the plate thickness by a locking portion formed of a tapered slope and a resin plate, or a spring body that urges in the locking portion direction as shown in FIG. 12B or 12C is formed on the resin plate. A mechanism or the like that allows the thickness of the resin plate by the spring body and the locking portion can be adopted.

[0050]

As described in detail above, according to the first to sixth aspects of the present invention, there is provided an earth under guide for holding a printed circuit board in a substantially orthogonal direction with respect to a metal base to obtain an earth. It is possible to provide a ground under guide which can be used as a reliable guide rail replacement and is easy and reliable to mount.

In addition, according to the fourth aspect of the present invention, since the printed circuit board can be inserted from both the horizontal direction and the upward direction, the versatility is improved. The ground under guide is securely fixed to the metal base at the same time as the two are surely brought into contact with each other because the surface pressure with the plate is increased. According to the invention of claim 6, it is possible to cope with metal bases having various thicknesses. it can.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a first embodiment, FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is a cross-sectional view taken along line AA of FIG. 1 (b). is there.

2 (a) is a plan view, FIG. 2 (b) is a front view, FIG. 2 (c) is a left side view, and FIG. 2 (d) is a bottom view. is there.

3 (a) is a plan view, FIG. 3 (b) is a front view, FIG. 3 (c) is a rear view, and FIG.
(D) is a right side view.

FIG. 4 is a perspective view of a conductive molded body.

FIG. 5 is an explanatory view of use of the first embodiment, and FIG.
Is a plan view and FIG. 5B is a front view.

FIG. 6 is an explanatory diagram of use of the first embodiment.

FIG. 7 is an enlarged perspective view of FIG.

FIG. 8 is an assembled perspective view of the second embodiment.

FIG. 9 is a perspective view of a second embodiment.

FIG. 10 is an explanatory diagram of use of the second embodiment.

FIG. 11 is a perspective view of another conductive molded body.

FIG. 12 is an illustration of another plate thickness permitting mechanism conduction.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Earth under guide, 2 ... Resin molding, 3 ... Conducting molding,
4 ... resin plate, 5, 6 ... resin piece,
7, a conductive plate portion, 8, 9, a conductive holding piece,
11: gap, 12: spring part,
21 ... Printed circuit board, 21a
... Earth pattern, 22 ... Chassis, 22a ... Through hole, 51
..Drops, 52, bent pieces,
53 ... folded piece, 53a ... locking part,
81, 91 ... standing part, 82, 92 ...
Front guide part, 83, 93 ... clamping part, 8
4, 94 · · · rear guide part, 85, 95 ·
..Upward guides,

Claims (6)

(57) [Claims] 1. A resin plate, a pair of resin pieces standing upright facing each other with a predetermined gap in the resin plate, and being fitted into a through hole provided in the metal base and provided in the metal base. A locking portion for holding the metal base in cooperation with the resin plate, and the metal base and the resin being arranged on a surface of the resin plate, wherein the locking portion is fitted in the through hole. A conductive plate disposed in a gap between the metal base and the conductive plate, the conductive plate being connected to the conductive plate and being disposed within a predetermined gap between the pair of resin pieces, and sandwiching a ground pattern of the printed board with the metal base; A pair of conductive holding pieces that are supported in a substantially orthogonal direction with respect to the pair of conductive holding pieces that extend on respective side portions of the pair of conductive holding pieces and are substantially parallel to the conductive plate and are separated from each other toward the side. Characterized by comprising a side guide and Earth under guide. 2. The ground under guide according to claim 1, wherein the locking portion is formed integrally with the pair of resin pieces. 3. The ground under guide according to claim 1, wherein the locking portion is provided on a surface opposite to a surface of the resin plate on which the pair of resin pieces are erected. 4. The pair of conductive sandwiching pieces includes a pair of upper guides extending at respective upper portions thereof and being substantially perpendicular to the conductive plate and separated from each other upward. The ground under guide according to any one of (1) to (3). 5. The ground under guide according to claim 1, wherein said conductive plate includes a spring portion for urging in a direction away from said resin plate. 6. The locking portion and the resin plate constitute a plate thickness permitting mechanism in which a distance between the locking portion and the resin plate changes according to a plate thickness of the metal base. The ground under guide according to claim 1.