JP2012119621A - Electronic device - Google Patents

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JP2012119621A
JP2012119621A JP2010270419A JP2010270419A JP2012119621A JP 2012119621 A JP2012119621 A JP 2012119621A JP 2010270419 A JP2010270419 A JP 2010270419A JP 2010270419 A JP2010270419 A JP 2010270419A JP 2012119621 A JP2012119621 A JP 2012119621A
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Prior art keywords
case
end portion
cover
guidance
insertion opening
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JP2010270419A
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JP5459190B2 (en
Inventor
Tsuneo Watanabe
常雄 渡邉
Hiroshi Suzuki
拓 鈴木
Masaki Saijo
将樹 西條
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Denso Corp
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Denso Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which allows for attachment enhancement of a cover to a case without providing an excessive clearance between a connection member and an insertion opening for inserting the connection member.SOLUTION: An urging part 32 for supporting the upper plate surface 40a of a circuit board 40 contained in a case 20 while urging when a guide part 33 is attached by a clamping part 22 or after completing guidance is formed on a cover 30. The guide part 33 is formed so that the proximal end portion 33a thereof is guided by the clamping part 22 when guidance is completed, and the distal end portion 33b thereof is guided by the clamping part 22 when guidance is started. The proximal end portion 33a is formed so that an insertion opening 31a is positioned to eliminate the clearance between the insertion opening 31a and a connector 42 when guidance is completed, and a protrusion 33d protruding farther than the proximal end portion 33a in the urging direction is formed at the distal end portion 33b.

Description

本発明は、ケースの開口部を閉塞するカバーに接続部材が挿通する挿通用開口部が形成される電子装置に関するものである。   The present invention relates to an electronic device in which an insertion opening through which a connection member is inserted is formed in a cover that closes an opening of a case.

従来、ケースの開口部を閉塞するカバーに接続部材が挿通する挿通用開口部が形成される電子装置として、下記特許文献1に開示される制御機器が知られている。この制御機器では、ケースに、外部装置に接続する接続部材としてコネクタ部材が実装されたプリント基板が収容されている。そして、ケースの開口部側にはカバーが嵌着され、このカバーのコネクタ用角穴部からコネクタ部材の接続端子側がケース外に臨むように構成されている。そして、ケースに収容されるプリント基板は、ケースの左右の内壁面に設けられる一対の支持レールおよびストッパ部とカバーに形成された保持部とによって支持されている。これにより、ケースに対するプリント基板のがたつきを抑制している。   Conventionally, a control device disclosed in Patent Document 1 below is known as an electronic device in which an insertion opening through which a connection member is inserted is formed in a cover that closes an opening of a case. In this control device, a printed circuit board on which a connector member is mounted as a connection member connected to an external device is accommodated in a case. A cover is fitted to the opening side of the case, and the connecting terminal side of the connector member faces the outside of the case from the connector square hole portion of the cover. The printed circuit board accommodated in the case is supported by a pair of support rails and stoppers provided on the left and right inner wall surfaces of the case and a holding part formed on the cover. Thereby, the shakiness of the printed circuit board with respect to a case is suppressed.

特開2000−261166号公報JP 2000-261166 A

ところで、上記特許文献1に開示されるように、接続部材が挿通する挿通用開口部が形成されるカバーをケースに組み付ける構成では、ケースに対するカバーの組み付け性を向上させるために、カバーにガイド部を設けてこのガイド部をケースに設けられる挟持部により挟持して案内することが考えられる。この場合、挟持部とガイド部との間には、組み付け性を確保するために所定の隙間が設けられる。   By the way, as disclosed in Patent Document 1, in the configuration in which the cover in which the insertion opening through which the connection member is inserted is assembled to the case, in order to improve the assembling property of the cover with respect to the case, the guide portion is provided on the cover. It is conceivable that the guide portion is held and guided by a holding portion provided in the case. In this case, a predetermined gap is provided between the sandwiching portion and the guide portion in order to ensure assemblability.

しかしながら、上記所定の隙間があるために、挿通前に挿通用開口部が接続部材に対して傾くことで当該挿通用開口部の縁部が接続部材に接触してしまい、ケースに対するカバーの組み付け性が悪くなるという問題がある。   However, since the predetermined gap exists, the edge of the insertion opening comes into contact with the connection member when the insertion opening is inclined with respect to the connection member before insertion, and the cover can be assembled to the case. There is a problem of getting worse.

また、ケースの反りを考慮してカバー外形寸法を設定した上で、挟持部の隙間寸法に対してガイド部の公差を設定することも考えられる。しかしながら、ガイド部の挟持部に案内される面に関する寸法を精度良く設定する事が困難であるため、結果としてカバーの挿通用開口部を大きくする必要があった。一方、組み付け性を改善するために単に挿通用開口部を大きくすると、挿通用開口部と接続部材との間に隙間ができてしまい、異物の混入やケース内の結露等が生じる可能性が高くなるという問題がある。   It is also conceivable to set the tolerance of the guide part with respect to the gap dimension of the clamping part after setting the cover outer dimension in consideration of the warp of the case. However, since it is difficult to accurately set the dimension related to the surface guided by the holding portion of the guide portion, it is necessary to enlarge the opening for insertion of the cover as a result. On the other hand, if the insertion opening is simply enlarged in order to improve the assemblability, a gap is formed between the insertion opening and the connection member, and there is a high possibility that foreign matter will be mixed in or dew condensation in the case will occur. There is a problem of becoming.

本発明は、上述した課題を解決するためになされたものであり、その目的とするところは、接続部材とこの接続部材を挿通させるための挿通用開口部との間に過剰な隙間を設けることなくケースに対するカバーの組み付け性を向上させ得る電子装置を提供することにある。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an excessive gap between the connecting member and the insertion opening for inserting the connecting member. It is another object of the present invention to provide an electronic device that can improve the ease of assembling a cover to a case.

上記目的を達成するため、特許請求の範囲に記載の請求項1の電子装置では、外部装置に接続するための接続部材が実装される基板と、前記基板がケース開口部を介して収容されるケースと、前記接続部材を挿通させるための挿通用開口部と前記ケースに形成される挟持部により挟持されて案内されるガイド部とを有し、前記挿通用開口部を介して前記接続部材を挿通させた状態で前記ガイド部を前記挟持部に案内させて前記ケースに組み付けられることで前記ケース開口部を閉塞するカバーと、を備える電子装置であって、前記カバーには、前記挟持部による前記ガイド部の組付け中および案内完了時に前記ケースに収容された前記基板の板面を付勢して支持する付勢部が形成され、前記ガイド部は、その基端部位が前記案内完了時に前記挟持部により案内されるとともに、その先端部位が案内開始時に前記挟持部により案内されるように形成され、前記基端部位は、前記案内完了時に前記挿通用開口部が前記接続部材との隙間をなくす位置に位置決めされるように形成され、前記先端部位には、前記基端部位に対して突出するように突起部が形成されることを特徴とする。   In order to achieve the above object, in the electronic device according to claim 1, a substrate on which a connecting member for connecting to an external device is mounted, and the substrate is accommodated through a case opening. A case, a insertion opening for inserting the connection member, and a guide portion guided by being held by a holding portion formed in the case, and the connection member is inserted through the insertion opening. A cover that closes the case opening by guiding the guide portion to the holding portion and being assembled to the case in a state where the guide portion is inserted. A biasing portion for biasing and supporting the plate surface of the substrate accommodated in the case is formed during assembly of the guide portion and when the guide is completed, and the guide portion has a base end portion when the guide is completed. Above The distal end portion is guided by the holding portion and is guided by the clamping portion at the start of guidance, and the proximal end portion is configured such that the insertion opening portion is spaced from the connection member when the guidance is completed. It is formed so as to be positioned at a position to be eliminated, and a protruding portion is formed at the distal end portion so as to protrude with respect to the proximal end portion.

請求項2の発明は、請求項1に記載の電子装置において、前記突起部は、前記基端部位側が前記基端部位に近づくほどその突出長さが小さくなるように形成されることを特徴とする。   According to a second aspect of the present invention, in the electronic device according to the first aspect, the protruding portion is formed such that a protruding length thereof becomes smaller as the base end portion side approaches the base end portion. To do.

請求項1の発明では、カバーには、挟持部によるガイド部の組付け中および案内完了時にケースに収容された基板の板面を付勢して支持する付勢部が形成される。そして、ガイド部は、その基端部位が案内完了時に挟持部により案内されるとともに、その先端部位が案内開始時に挟持部により案内されるように形成される。そして、基端部位は、案内完了時に挿通用開口部が接続部材との隙間をなくす位置に位置決めされるように形成され、先端部位には、基端部位に対して突出するように突起部が形成される。   In the first aspect of the invention, the cover is formed with a biasing portion that biases and supports the plate surface of the substrate housed in the case during the assembly of the guide portion by the sandwiching portion and when the guidance is completed. The guide portion is formed such that the proximal end portion thereof is guided by the holding portion when the guidance is completed, and the distal end portion thereof is guided by the holding portion when the guidance is started. The proximal end portion is formed so that the insertion opening is positioned at a position where the gap with the connection member is eliminated when the guidance is completed, and the protruding portion is formed at the distal end portion so as to protrude from the proximal end portion. It is formed.

これにより、ガイド部の基端部位が挟持部に挟持されて案内される案内完了時には、挿通用開口部が接続部材との隙間をなくす位置に位置決めされた状態であって付勢部により基板が付勢されているため、ケースに対する基板のがたつきを抑制することができる。そして、ガイド部の先端部位が挟持部に挟持されて案内される案内開始時には、先端部位に形成される突起部が挟持部に接触することで、突起部が先端部位に形成されない場合と比較して、接続部材に対する挿通用開口部の傾きが抑制される。このため、案内開始時に挿通用開口部の縁部が接続部材に接触しにくくなるので、接続部材と挿通用開口部との間に過剰な隙間を設けることなくケースに対するカバーの組み付け性を向上させることができる。   Thus, when the guidance is completed with the proximal end portion of the guide portion held between the holding portions, the insertion opening is positioned at a position that eliminates the gap with the connection member, and the substrate is moved by the biasing portion. Since it is biased, it is possible to suppress the rattling of the substrate with respect to the case. Then, at the start of guidance in which the tip portion of the guide portion is held and guided by the holding portion, the protruding portion formed at the tip portion contacts the holding portion, so that the protruding portion is not formed at the tip portion. Thus, the inclination of the insertion opening with respect to the connection member is suppressed. For this reason, the edge of the insertion opening is less likely to come into contact with the connection member at the start of guidance, so that the cover can be easily assembled to the case without providing an excessive gap between the connection member and the insertion opening. be able to.

請求項2の発明では、突起部は、基端部位側が基端部位に近づくほどその突出長さが小さくなるように形成される。先端部位の突起部が基端部位に対して段差を構成するように突出して形成されていると、付勢部を介する抗力のために、挟持部によるガイド部の案内時に、突起部の案内が終わると基端部位が挟持部に衝突するように押し付けられることとなる。   In the invention of claim 2, the protruding portion is formed such that the protruding length becomes smaller as the proximal end portion side approaches the proximal end portion. If the protruding portion at the distal end portion is formed so as to form a step with respect to the proximal end portion, the guide of the protruding portion is not guided at the time of guiding the guide portion by the sandwiching portion due to the drag through the biasing portion. When finished, the proximal end portion is pressed so as to collide with the holding portion.

そこで、基端部位側が基端部位に近づくほどその突出長さが小さくなるように突起部を形成することで、突起部の案内が終わる場合でも挟持部に対する基端部位の衝突が抑制される。これにより、カバーの組み付け性を向上させるとともに、付勢部からの抗力の急な変化を抑制することができる。   Therefore, by forming the protruding portion so that the protruding length becomes smaller as the proximal end portion side approaches the proximal end portion, collision of the proximal end portion with the sandwiching portion is suppressed even when guidance of the protruding portion is finished. Thereby, the assembling property of the cover can be improved and a sudden change in the drag from the urging portion can be suppressed.

第1実施形態に係る電子装置を示す斜視図である。1 is a perspective view showing an electronic device according to a first embodiment. 図2(A)は、図1の電子装置を側面から見た断面図であり、図2(B)は、上面から見た断面図である。2A is a cross-sectional view of the electronic device in FIG. 1 as viewed from the side, and FIG. 2B is a cross-sectional view as viewed from the top. 第1実施形態におけるカバーの詳細形状を説明するための説明図であり、図3(A)は正面図であり、図3(B)は側面図である。It is explanatory drawing for demonstrating the detailed shape of the cover in 1st Embodiment, FIG. 3 (A) is a front view, FIG.3 (B) is a side view. 図4(A)は、第1実施形態において回路基板をケースに収容する前の組付状態を示す側面図であり、図4(B)は、案内開始時の組付状態を示す側面図である。FIG. 4A is a side view showing an assembled state before the circuit board is housed in the case in the first embodiment, and FIG. 4B is a side view showing the assembled state at the start of guidance. is there. 図5(C)は、第1実施形態においてガイド部の突起部による案内中の組付状態を示す側面図であり、図5(D)は、案内完了時の組付状態を示す側面図である。FIG. 5C is a side view showing the assembled state during guidance by the protrusions of the guide portion in the first embodiment, and FIG. 5D is a side view showing the assembled state when guidance is completed. is there. 第2実施形態におけるカバーの詳細形状を説明するための説明図であり、図6(A)は正面図であり、図6(B)は側面図である。It is explanatory drawing for demonstrating the detailed shape of the cover in 2nd Embodiment, FIG. 6 (A) is a front view, FIG.6 (B) is a side view. 図7(A)は、第2実施形態において回路基板をケースに収容する前の組付状態を示す側面図であり、図7(B)は、案内開始時の組付状態を示す側面図である。FIG. 7A is a side view showing the assembled state before the circuit board is housed in the case in the second embodiment, and FIG. 7B is a side view showing the assembled state at the start of guidance. is there. 図8(C)は、第2実施形態においてガイド部の突起部による案内中の組付状態を示す側面図であり、図8(D)は、案内完了時の組付状態を示す側面図である。FIG. 8C is a side view showing the assembled state during guidance by the protrusions of the guide portion in the second embodiment, and FIG. 8D is a side view showing the assembled state when guidance is completed. is there. 図9(A)は、上記実施形態の第1変形例に係るガイド部の形状を示す側面図であり、図9(B)は、上記実施形態の第2変形例に係るガイド部の形状を示す側面図である。FIG. 9A is a side view showing the shape of the guide part according to the first modification of the embodiment, and FIG. 9B shows the shape of the guide part according to the second modification of the embodiment. FIG.

[第1実施形態]
以下、本発明の第1実施形態に係る電子装置について、図面を参照して説明する。図1は、第1実施形態に係る電子装置10を示す斜視図である。図2(A)は、図1の電子装置10を側面から見た断面図であり、図2(B)は、上面から見た断面図である。図3は、第1実施形態におけるカバー30の詳細形状を説明するための説明図であり、図3(A)は正面図であり、図3(B)は側面図である。
[First Embodiment]
Hereinafter, an electronic device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an electronic device 10 according to the first embodiment. 2A is a cross-sectional view of the electronic device 10 of FIG. 1 viewed from the side, and FIG. 2B is a cross-sectional view of the electronic device 10 viewed from the top. FIGS. 3A and 3B are explanatory views for explaining the detailed shape of the cover 30 in the first embodiment, FIG. 3A is a front view, and FIG. 3B is a side view.

電子装置10は、たとえば自動車のように振動の影響を受ける機器に搭載され、コネクタ42を介して接続される外部装置(図示略)と通信する通信機能を有するものである。この電子装置10は、図1および図2に示すように、略直方体形状に形成される樹脂製のケース20と、このケース20のケース開口部21を閉塞する樹脂製のカバー30とにより外郭が構成されている。   The electronic device 10 is mounted on a device affected by vibration, such as an automobile, and has a communication function for communicating with an external device (not shown) connected via a connector 42. As shown in FIGS. 1 and 2, the electronic device 10 has a resin case 20 formed in a substantially rectangular parallelepiped shape and a resin cover 30 that closes the case opening 21 of the case 20. It is configured.

ケース20の内壁面には、回路基板40を案内して支持する支持レール(図示略)が形成されており、回路基板40は、ケース開口部21を介して上記支持レールに案内されてケース20内に収容されている。この回路基板40には、所定の配線パターンが形成されており、上記通信機能等を実現するための電子部品41等が実装されている。また、この回路基板40の上側板面40aの外縁近傍には、上記外部装置に接続するための接続部材として、コネクタ42が上記所定の配線パターンに対応して実装されている。   A support rail (not shown) for guiding and supporting the circuit board 40 is formed on the inner wall surface of the case 20, and the circuit board 40 is guided to the support rail through the case opening 21 and is supported by the case 20. Is housed inside. A predetermined wiring pattern is formed on the circuit board 40, and an electronic component 41 and the like for realizing the communication function and the like are mounted thereon. Further, a connector 42 is mounted in the vicinity of the outer edge of the upper plate surface 40a of the circuit board 40 as a connection member for connecting to the external device, corresponding to the predetermined wiring pattern.

ケース20の外壁面上であってケース開口部21の近傍には、後述するガイド部33を案内するための一対の挟持部22がそれぞれ設けられている。これら両挟持部22は、互いに平行な上側端面22aおよび下側端面22bが所定の距離を介して対向するようにそれぞれ形成されている。また、上側端面22aと下側端面22bとの間には、係合部23が後述する係合用開口部33cに係合可能に突出して形成されている。   On the outer wall surface of the case 20 and in the vicinity of the case opening 21, a pair of holding portions 22 for guiding a guide portion 33 described later is provided. These both clamping parts 22 are each formed so that the upper end face 22a and the lower end face 22b parallel to each other face each other with a predetermined distance. Further, an engagement portion 23 is formed between the upper end surface 22a and the lower end surface 22b so as to protrude into an engagement opening 33c, which will be described later.

カバー30は、ケース20内に収容された回路基板40のコネクタ42を露出させた状態で、ケース開口部21を閉塞するもので、この閉塞により、ケース開口部21を介したケース20内への異物の混入や結露等が防止される。このカバー30は、図3(A),(B)に示すように、略平板状のカバー本体31と、このカバー本体31に対して下端近傍から略直交して突出する2つの付勢部32と、カバー本体31に対して長手方向両端から略直交して突出する一対のガイド部33と、を有するように形成されている。   The cover 30 closes the case opening 21 in a state where the connector 42 of the circuit board 40 accommodated in the case 20 is exposed. By this closing, the cover 30 enters the case 20 through the case opening 21. Foreign matter and condensation are prevented. As shown in FIGS. 3A and 3B, the cover 30 includes a substantially flat cover body 31 and two urging portions 32 that protrude from the vicinity of the lower end of the cover body 31 substantially orthogonally. And a pair of guide portions 33 projecting substantially orthogonally from both ends in the longitudinal direction with respect to the cover main body 31.

カバー本体31には、その中央部にコネクタ42の外形に応じて矩形状の挿通用開口部31aが形成されるとともに、四隅にケース20の内壁に係合するための4つの係合爪31bが形成されている。挿通用開口部31aは、各係合爪31bが上記内壁に係合してカバー本体31によりケース開口部21が閉塞される際に、コネクタ42を露出するように挿通させ、この閉塞時に当該挿通用開口部31aの縁部とコネクタ42との間の隙間を極力なくすように形成されている。   The cover body 31 is formed with a rectangular insertion opening 31a at the center thereof according to the outer shape of the connector 42, and four engagement claws 31b for engaging with the inner wall of the case 20 at the four corners. Is formed. The insertion opening 31a is inserted so as to expose the connector 42 when each of the engaging claws 31b engages with the inner wall and the case opening 21 is closed by the cover main body 31. The gap between the edge of the common opening 31a and the connector 42 is formed as much as possible.

両付勢部32は、カバー本体31によるケース開口部21の閉塞時に、ケース20に収容された回路基板40の上側板面40aのコネクタ側端部を上方から下方に向けて付勢して支持するためのものである。これら両付勢部32は、閉塞時に上側板面40aに対する付勢力を徐々に増加させるため、その下面が先端側(突出側)ほど上方に位置するようにテーパ状に形成されている。   The two urging portions 32 support the end portion on the connector side of the upper plate surface 40a of the circuit board 40 accommodated in the case 20 from above to below when the case opening 21 is closed by the cover body 31. Is to do. These urging portions 32 are formed in a tapered shape so that the lower surface of the urging portion 32 is located higher on the tip side (projecting side) in order to gradually increase the urging force on the upper plate surface 40a when closed.

両ガイド部33は、カバー本体31によるケース開口部21の閉塞時に挟持部22によりそれぞれ案内されるもので、その基端部位33aが案内完了時に挟持部22により案内されるとともに、その先端部位33bが案内開始時に挟持部22により案内されるように形成されている。また、ガイド部33の側面中央には、上記閉塞時に係合部23に係合することでカバー30とケース20とを係脱自在に連結するための係合用開口部33cが形成されている。   Both guide portions 33 are respectively guided by the clamping portion 22 when the case opening 21 is closed by the cover body 31, and the base end portion 33a is guided by the clamping portion 22 when the guide is completed, and the distal end portion 33b. Is configured to be guided by the clamping unit 22 at the start of guidance. In addition, an engagement opening 33c is formed at the center of the side surface of the guide portion 33 to engage and disengage the cover 30 and the case 20 by engaging with the engagement portion 23 at the time of closing.

基端部位33aは、挟持部22による上記案内完了時に、挿通用開口部31aがコネクタ42との隙間をなくす位置に位置決めされるように形成されている。また、先端部位33bには、基端部位33aに対して下方向に突出するように突起部33dが形成されている。すなわち、先端部位33bは、突起部33dにより、基端部位33aよりも付勢部32による付勢方向(上下方向)の長さが長くなるように突出して形成されている。   The proximal end portion 33 a is formed so that the insertion opening 31 a is positioned at a position where the gap with the connector 42 is eliminated when the guidance by the holding portion 22 is completed. Further, a protrusion 33d is formed on the distal end portion 33b so as to protrude downward with respect to the proximal end portion 33a. That is, the distal end portion 33b is formed to protrude by the protruding portion 33d so that the length in the urging direction (vertical direction) by the urging portion 32 is longer than the proximal end portion 33a.

次に、回路基板40を収容したケース20に対するカバー30の取り付けについて、図4および図5を用いて説明する。なお、図4(A)は、第1実施形態において回路基板40をケース20に収容する前の組付状態を示す側面図であり、図4(B)は、案内開始時の組付状態を示す側面図である。図5(C)は、第1実施形態においてガイド部33の突起部33dによる案内中の組付状態を示す側面図であり、図5(D)は、案内完了時の組付状態を示す側面図である。   Next, attachment of the cover 30 to the case 20 that houses the circuit board 40 will be described with reference to FIGS. 4 and 5. 4A is a side view showing the assembled state before the circuit board 40 is accommodated in the case 20 in the first embodiment, and FIG. 4B shows the assembled state at the start of guidance. FIG. FIG. 5C is a side view showing an assembled state during guidance by the protrusion 33d of the guide portion 33 in the first embodiment, and FIG. 5D is a side view showing the assembled state when the guidance is completed. FIG.

まず、図4(A)に示すように、回路基板40を、ケース20のケース開口部21を介して上記支持レールに案内されるように差し込む。次に、回路基板40をケース20内に収容した後に、カバー30の両ガイド部33の先端部位33b(突起部33d)をケース20の両挟持部22にそれぞれ案内させる。この案内開始直後では、コネクタ42が挿通用開口部31aに挿通していない。   First, as shown in FIG. 4A, the circuit board 40 is inserted through the case opening 21 of the case 20 so as to be guided by the support rail. Next, after the circuit board 40 is accommodated in the case 20, the distal end portions 33 b (projection portions 33 d) of the both guide portions 33 of the cover 30 are guided to the both sandwiching portions 22 of the case 20. Immediately after the start of guidance, the connector 42 is not inserted through the insertion opening 31a.

そして、先端部位33bが挟持部22に案内された状態でカバー30がケース20に近づけられると、図4(B)に示すように、コネクタ42が挿通用開口部31aに挿通する。このとき、先端部位33bに形成される突起部33dが挟持部22の下側端面22bに接触しているので、突起部33dが先端部位33bに形成されない場合と比較して、上側板面40aに対する両付勢部32の接触にかかわらず、コネクタ42に対する挿通用開口部31aの傾きが抑制されることとなる。   When the cover 30 is brought close to the case 20 with the distal end portion 33b guided to the holding portion 22, as shown in FIG. 4B, the connector 42 is inserted into the insertion opening 31a. At this time, since the protrusion 33d formed on the distal end portion 33b is in contact with the lower end surface 22b of the sandwiching portion 22, the protrusion 33d is formed on the upper plate surface 40a as compared with the case where the protrusion 33d is not formed on the distal end portion 33b. Regardless of the contact between the two urging portions 32, the inclination of the insertion opening 31a with respect to the connector 42 is suppressed.

さらにカバー30がケース20に近づけられると、図5(C)に示すように、両付勢部32が上側板面40aに接触して回路基板40のコネクタ側端部が上方から下方に向けて付勢される。これにより、ケース20に対する回路基板40のがたつきが抑制される。このとき、コネクタ42は既に挿通用開口部31aに挿通した状態であるため、挿通用開口部31aの縁部がコネクタ42に接触しても、ケース20に対するカバー30の組み付け性が悪くなることもない。   When the cover 30 is further brought closer to the case 20, as shown in FIG. 5C, the two urging portions 32 come into contact with the upper plate surface 40a so that the connector side end portion of the circuit board 40 faces from the upper side to the lower side. Be energized. Thereby, rattling of the circuit board 40 with respect to the case 20 is suppressed. At this time, since the connector 42 is already inserted into the insertion opening 31a, even if the edge of the insertion opening 31a contacts the connector 42, the assembly of the cover 30 to the case 20 may be deteriorated. Absent.

この状態からカバー本体31がケース開口部21を閉塞するまで近づけられると、図5(D)に示すように、先端部位33b(突起部33d)による案内が終わり、基端部位33aが挟持部22により案内されて、係合用開口部33cが係合部23に係合すると案内完了状態となる。この案内完了状態では、カバー本体31の各係合爪31bがケース20の内壁にそれぞれ係合することで、ケース開口部21に対するカバー本体31の位置決めがなされる。   When the cover main body 31 is approached from this state until the case opening 21 is closed, as shown in FIG. 5 (D), the guide by the distal end portion 33b (projection portion 33d) is finished, and the proximal end portion 33a is held by the clamping portion 22. When the engagement opening 33c engages with the engagement portion 23, the guidance is completed. In this guidance completion state, the engagement claw 31b of the cover main body 31 is engaged with the inner wall of the case 20, whereby the cover main body 31 is positioned with respect to the case opening 21.

この閉塞時では、基端部位33aは、案内完了時に挿通用開口部31aがコネクタ42との隙間をなくす位置に位置決めされるように形成されているため、ケース20内に異物の混入や結露等が生じることもない。   At the time of closing, the base end portion 33a is formed so that the insertion opening 31a is positioned at a position where the gap with the connector 42 is eliminated when guidance is completed. Does not occur.

以上説明したように、本実施形態に係る電子装置10では、カバー30には、挟持部22によるガイド部33の組付け中および案内完了時にケース20に収容された回路基板40の上側板面40aを付勢して支持する付勢部32が形成される。そして、ガイド部33は、その基端部位33aが案内完了時に挟持部22により案内されるとともに、その先端部位33bが案内開始時に挟持部22により案内されるように形成される。そして、基端部位33aは、案内完了時に挿通用開口部31aがコネクタ42との隙間をなくす位置に位置決めされるように形成され、先端部位33bには、基端部位33aよりも付勢方向に突出する突起部33dが形成される。   As described above, in the electronic apparatus 10 according to the present embodiment, the cover 30 has the upper plate surface 40a of the circuit board 40 accommodated in the case 20 during assembly of the guide portion 33 by the holding portion 22 and when the guide is completed. A biasing portion 32 that biases and supports is formed. The guide portion 33 is formed such that its proximal end portion 33a is guided by the sandwiching portion 22 when the guidance is completed, and its distal end portion 33b is guided by the sandwiching portion 22 when the guidance is started. The proximal end portion 33a is formed so that the insertion opening 31a is positioned at a position where the gap with the connector 42 is eliminated when the guidance is completed, and the distal end portion 33b is more biased than the proximal end portion 33a. A protruding protrusion 33d is formed.

これにより、ガイド部33の基端部位33aが挟持部22に挟持されて案内される案内完了時には、挿通用開口部31aがコネクタ42との隙間をなくす位置に位置決めされた状態であって付勢部32により回路基板40が付勢されているため、ケース20に対する回路基板40のがたつきを抑制することができる。そして、ガイド部33の先端部位33bが挟持部22に挟持されて案内される案内開始時には、先端部位33bに形成される突起部33dが挟持部22に接触することで、コネクタ42に対する挿通用開口部31aの傾きが抑制される。このため、案内開始時に挿通用開口部31aの縁部がコネクタ42に接触しにくくなるので、コネクタ42と挿通用開口部31aとの間に過剰な隙間を設けることなくケース20に対するカバー30の組み付け性を向上させることができる。   As a result, when the guide end 33a of the guide portion 33 is held and guided by the holding portion 22, the insertion opening 31a is positioned at a position where the gap with the connector 42 is eliminated, and is biased. Since the circuit board 40 is urged by the portion 32, rattling of the circuit board 40 with respect to the case 20 can be suppressed. At the start of guidance in which the distal end portion 33b of the guide portion 33 is sandwiched and guided by the sandwiching portion 22, the projection 33d formed on the distal end portion 33b comes into contact with the sandwiching portion 22 so that the insertion opening for the connector 42 is provided. The inclination of the part 31a is suppressed. For this reason, since the edge of the insertion opening 31a is less likely to contact the connector 42 at the start of guidance, the cover 30 is assembled to the case 20 without providing an excessive gap between the connector 42 and the insertion opening 31a. Can be improved.

[第2実施形態]
次に、本発明の第2実施形態に係る電子装置について図6〜図8を参照して説明する。図6は、第2実施形態におけるカバー30aの詳細形状を説明するための説明図であり、図6(A)は正面図であり、図6(B)は側面図である。図7(A)は、第2実施形態において回路基板40をケース20に収容する前の組付状態を示す側面図であり、図7(B)は、案内開始時の組付状態を示す側面図である。図8(C)は、第2実施形態においてガイド部33の突起部33dによる案内中の組付状態を示す側面図であり、図8(D)は、案内完了時の組付状態を示す側面図である。
[Second Embodiment]
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS. FIGS. 6A and 6B are explanatory views for explaining the detailed shape of the cover 30a in the second embodiment, FIG. 6A is a front view, and FIG. 6B is a side view. FIG. 7A is a side view showing an assembled state before the circuit board 40 is accommodated in the case 20 in the second embodiment, and FIG. 7B is a side view showing the assembled state at the start of guidance. FIG. FIG. 8C is a side view showing an assembled state during guidance by the projection 33d of the guide portion 33 in the second embodiment, and FIG. 8D is a side view showing the assembled state when the guidance is completed. FIG.

本第2実施形態に係る電子装置10では、カバー30に代えてカバー30aを採用する点が、上記第1実施形態に係る電子装置と異なる。したがって、第1実施形態の電子装置と実質的に同一の構成部分には、同一符号を付し、その説明を省略する。   The electronic device 10 according to the second embodiment differs from the electronic device according to the first embodiment in that a cover 30a is employed instead of the cover 30. Therefore, substantially the same components as those of the electronic device of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図6(A),(B)に示すように、カバー30aは、カバー30に対して、両付勢部32に代えて両付勢部32aを有するように形成されている。両付勢部32aは、カバー本体31によるケース開口部21の閉塞時に、ケース20に収容された回路基板40の下側板面40bのコネクタ側端部を下方から上方に向けて付勢して支持するためのものである。これら両付勢部32aは、閉塞時に下側板面40bに対する付勢力を徐々に増加させるため、その上面が先端側(突出側)ほど下方に位置するようにテーパ状に形成されている。   As shown in FIGS. 6A and 6B, the cover 30 a is formed to have both urging portions 32 a instead of the urging portions 32 with respect to the cover 30. Both urging portions 32a urge and support the connector side end of the lower plate surface 40b of the circuit board 40 accommodated in the case 20 from below to above when the case opening 21 is closed by the cover body 31. Is to do. These urging portions 32a are formed in a taper shape so that the upper surface of the urging portion 32a is positioned lower toward the tip side (projecting side) in order to gradually increase the urging force against the lower plate surface 40b when closed.

このように構成される電子装置10において、回路基板40を収容したケース20に対するカバー30aの取り付けについて、図7および図8を用いて説明する。
まず、上記第1実施形態と同様に、ケース20のケース開口部21を介して回路基板40を差し込む(図7(A)参照)。次に、回路基板40をケース20内に収容した後に、カバー30aの両ガイド部33の先端部位33b(突起部33d)をケース20の両挟持部22にそれぞれ案内させる。
In the electronic device 10 configured as described above, attachment of the cover 30a to the case 20 in which the circuit board 40 is accommodated will be described with reference to FIGS.
First, similarly to the first embodiment, the circuit board 40 is inserted through the case opening 21 of the case 20 (see FIG. 7A). Next, after the circuit board 40 is accommodated in the case 20, the distal end portions 33 b (projection portions 33 d) of the both guide portions 33 of the cover 30 a are guided to the both sandwiching portions 22 of the case 20.

そして、先端部位33bが挟持部22に案内された状態でカバー30aがケース20に近づけられると、図7(B)に示すように、コネクタ42が挿通用開口部31aに挿通する。このとき、先端部位33bに形成される突起部33dが挟持部22の下側端面22bに接触しているので、突起部33dが先端部位33bに形成されない場合と比較して、下側板面40bに対する両付勢部32aの接触にかかわらず、コネクタ42に対する挿通用開口部31aの傾きが抑制されることとなる。   Then, when the cover 30a is brought close to the case 20 with the distal end portion 33b guided to the holding portion 22, as shown in FIG. 7B, the connector 42 is inserted into the insertion opening 31a. At this time, since the protrusion 33d formed on the distal end portion 33b is in contact with the lower end surface 22b of the sandwiching portion 22, the protrusion 33d is formed on the lower plate surface 40b as compared with the case where the protrusion 33d is not formed on the distal end portion 33b. Regardless of the contact between the two urging portions 32a, the inclination of the insertion opening 31a with respect to the connector 42 is suppressed.

さらにカバー30aがケース20に近づけられると、図8(C)に示すように、両付勢部32aが下側板面40bに接触して回路基板40のコネクタ側端部が下方から上方に向けて付勢される。これにより、ケース20に対する回路基板40のがたつきが抑制される。このとき、コネクタ42は既に挿通用開口部31aに挿通した状態であるため、挿通用開口部31aの縁部がコネクタ42に接触しても、ケース20に対するカバー30aの組み付け性が悪くなることもない。   When the cover 30a is further brought closer to the case 20, as shown in FIG. 8C, the two urging portions 32a come into contact with the lower plate surface 40b so that the connector side end of the circuit board 40 faces from the lower side to the upper side. Be energized. Thereby, rattling of the circuit board 40 with respect to the case 20 is suppressed. At this time, since the connector 42 is already inserted into the insertion opening 31a, even if the edge of the insertion opening 31a contacts the connector 42, the assembly of the cover 30a to the case 20 may be deteriorated. Absent.

この状態からカバー本体31がケース開口部21を閉塞するまで近づけられると、図8(D)に示すように、先端部位33b(突起部33d)による案内が終わり、基端部位33aが挟持部22により案内されて、係合用開口部33cが係合部23に係合すると案内完了状態となる。   When the cover body 31 is brought close to the case opening 21 from this state, as shown in FIG. 8D, the guide by the distal end portion 33b (projection portion 33d) is finished, and the proximal end portion 33a is held by the clamping portion 22 as shown in FIG. When the engagement opening 33c engages with the engagement portion 23, the guidance is completed.

このように、両付勢部32aにより、回路基板40の下側板面40bのコネクタ側端部を下方から上方に向けて付勢して支持する構成であっても、コネクタ42と挿通用開口部31aとの間に過剰な隙間を設けることなくケース20に対するカバー30aの組み付け性を向上させることができる。   Thus, even if it is the structure which urges | biases and supports the connector side edge part of the lower board surface 40b of the circuit board 40 toward the upper direction from the downward direction by both the urging | biasing parts 32a, the connector 42 and the insertion opening part The assembling property of the cover 30a with respect to the case 20 can be improved without providing an excessive gap with 31a.

なお、本発明は上記各実施形態およびその変形例に限定されるものではなく、以下のように具体化してもよい。
(1)図9(A)は、上記実施形態の第1変形例に係るガイド部33の形状を示す側面図であり、図9(B)は、上記実施形態の第2変形例に係るガイド部33の形状を示す側面図である。
図9(A)に示すように、上記各実施形態の第1変形例として、ガイド部33の突起部33dは、基端部位側が基端部位33aに近づくほどその突出長さが小さくなるように形成されてもよい。先端部位33bの突起部33dが基端部位33aに対して段差を構成するように突出して形成されていると、付勢部32(32a)を介する抗力のために、挟持部22によるガイド部33の案内時に、突起部33dの案内が終わると基端部位33aが挟持部22に衝突するように押し付けられることとなる。
In addition, this invention is not limited to said each embodiment and its modification, You may actualize as follows.
(1) FIG. 9A is a side view showing the shape of the guide portion 33 according to the first modification of the embodiment, and FIG. 9B is a guide according to the second modification of the embodiment. 4 is a side view showing the shape of a portion 33. FIG.
As shown in FIG. 9A, as a first modification of the above-described embodiments, the protrusion 33d of the guide portion 33 has a protruding length that decreases as the proximal end portion side approaches the proximal end portion 33a. It may be formed. When the protrusion 33d of the distal end portion 33b is formed so as to form a step with respect to the proximal end portion 33a, the guide portion 33 by the clamping portion 22 is used for drag through the biasing portion 32 (32a). When the guide of the protrusion 33d is finished, the proximal end portion 33a is pressed so as to collide with the holding portion 22.

そこで、基端部位側が基端部位33aに近づくほどその突出長さが小さくなるように突起部33dを形成することで、突起部33dの案内が終わる場合でも挟持部22に対する基端部位の衝突が抑制される。これにより、カバー30(30a)の組み付け性を向上させるとともに、付勢部32(32a)からの抗力の急な変化を抑制することができる。   Therefore, by forming the protruding portion 33d so that the protruding length becomes smaller as the proximal end portion side approaches the proximal end portion 33a, even if the guiding of the protruding portion 33d ends, the collision of the proximal end portion with the clamping portion 22 is prevented. It is suppressed. Thereby, while improving the assembly | attachment property of the cover 30 (30a), the sudden change of the drag from the urging | biasing part 32 (32a) can be suppressed.

また、図9(B)に示すように、上記各実施形態の第2変形例として、ガイド部33の突起部33dは、その上端および下端において基端部位33aよりも突出するように形成されてもよい。   As shown in FIG. 9B, as a second modification of the above-described embodiments, the protrusion 33d of the guide portion 33 is formed so as to protrude from the proximal end portion 33a at the upper end and the lower end. Also good.

(2)挿通用開口部31aに対して隙間無く挿通させる接続部材としては、コネクタ42に限定されることなく、例えば、ワイヤ等を採用しても同等の作用効果を奏する。 (2) The connecting member that is inserted into the insertion opening 31a without a gap is not limited to the connector 42. For example, even if a wire or the like is employed, the same effect can be obtained.

10…電子装置
20…ケース
21…ケース開口部
22…挟時部
30,30a…カバー
31…カバー本体
31a…挿通用開口部
32,32a…付勢部
33…ガイド部
33a…基端部位
33b…先端部位
33d…突起部
40…基板
42…コネクタ(接続部材)
DESCRIPTION OF SYMBOLS 10 ... Electronic device 20 ... Case 21 ... Case opening part 22 ... Clamping part 30, 30a ... Cover 31 ... Cover main body 31a ... Opening part 32, 32a ... Energizing part 33 ... Guide part 33a ... Base end part 33b ... Tip part 33d ... Projection 40 ... Substrate 42 ... Connector (connection member)

Claims (2)

外部装置に接続するための接続部材が実装される基板と、
前記基板がケース開口部を介して収容されるケースと、
前記接続部材を挿通させるための挿通用開口部と前記ケースに形成される挟持部により挟持されて案内されるガイド部とを有し、前記挿通用開口部を介して前記接続部材を挿通させた状態で前記ガイド部を前記挟持部に案内させて前記ケースに組み付けられることで前記ケース開口部を閉塞するカバーと、
を備える電子装置であって、
前記カバーには、前記挟持部による前記ガイド部の組付け中および案内完了時に前記ケースに収容された前記基板の板面を付勢して支持する付勢部が形成され、
前記ガイド部は、その基端部位が前記案内完了時に前記挟持部により案内されるとともに、その先端部位が案内開始時に前記挟持部により案内されるように形成され、
前記基端部位は、前記案内完了時に前記挿通用開口部が前記接続部材との隙間をなくす位置に位置決めされるように形成され、
前記先端部位には、前記基端部位に対して突出するように突起部が形成されることを特徴とする電子装置。
A substrate on which a connection member for connecting to an external device is mounted;
A case in which the substrate is accommodated through a case opening;
An insertion opening for inserting the connection member and a guide portion guided by being held by a holding portion formed in the case, the connection member being inserted through the insertion opening. A cover that closes the case opening by being assembled to the case by guiding the guide portion to the clamping portion in a state;
An electronic device comprising:
The cover is formed with an urging portion that urges and supports the plate surface of the substrate accommodated in the case when the guide portion is assembled by the clamping portion and when the guide is completed.
The guide portion is formed such that a base end portion thereof is guided by the clamping portion when the guidance is completed, and a distal end portion thereof is guided by the clamping portion at the start of guidance,
The base end portion is formed so that the insertion opening is positioned at a position where the gap with the connection member is eliminated when the guidance is completed,
The electronic device according to claim 1, wherein a protrusion is formed at the distal end portion so as to protrude from the proximal end portion.
前記突起部は、前記基端部位側が前記基端部位に近づくほどその突出長さが小さくなるように形成されることを特徴とする請求項1に記載の電子装置。   The electronic device according to claim 1, wherein the protruding portion is formed such that a protruding length thereof becomes smaller as the proximal end portion side approaches the proximal end portion.
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