JPH0964504A - Hybrid ic with lead frame and method for mounting hybrid ic on mother board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method mounting a hybrid IC with a lead frame, and an IC on a mother board, in which an external force being applied to the lead frame is absorbed and has no adverse effect on the joint between the lead frame and the board. SOLUTION: An arcuate spring part (comprising a second vertical part 14 and a lower horizontal part 15) for absorbing the external force is provided integrally between a fixing part (comprising an intermediate horizontal part 13) on one end side of a frame 5 being soldered to a board 1 for a hybrid IC and a fixing part (third vertical part 16) on the other end side of a lead frame 5 being fixed to a mother board. The board 1 for the hybrid IC is fixed to the mother board through the arcuate spring part.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a hybrid IC.
The present invention relates to a hybrid IC with a lead frame, which is suitable for mounting the IC on a mother board via a lead frame, and a method for mounting the IC on the mother board.

[0002]

2. Description of the Related Art A so-called DIP type hybrid in which chip parts and DIP (Dual In-line Package) type parts such as flat package type ICs are mixedly mounted on a printed circuit board and used as a circuit book like one IC. In an IC (hereinafter, referred to as “hybrid IC substrate”), this hybrid IC substrate is referred to as a main substrate (hereinafter, “mother substrate”).
It is used by mounting multiple sheets. When mounting a hybrid IC board on a mother board, generally,
It is mounted via a lead frame attached to the hybrid IC substrate. As the hybrid IC substrate here, a double-sided substrate structure having printed wiring on both sides, a single-sided substrate structure having a multilayer structure on one side, or the like is used.

FIG. 2 shows an example of a conventional hybrid IC structure with a lead frame. In FIG.
The hybrid IC substrate 51 (hereinafter, referred to as "substrate 51") is a single-sided substrate type with printed wiring on one side. Then, a land 52 such as a copper foil is provided on one side where the printed wiring is provided, electronic circuit components such as a flat package type IC 53 and a chip component 54 are disposed, and the end of the hybrid IC substrate 51 is further provided. The lead frame 55 is attached to the portion.

Here, the lead frame 55 has a mounting portion 56 into which the end portion of the substrate 51 is inserted on one end (upper end) side, and is generally called an F-type lead frame. The mounting portion 56 includes a cantilevered upper horizontal portion 58 which is formed by bending one end of the main body portion 57 of the lead frame 55 at a substantially right angle and extending in the horizontal direction, and the upper horizontal portion 58.
On the lower side, one end side is fixed to the main body portion 57, and the other end side is constituted by a cantilevered lower horizontal portion 59 extending substantially parallel to the upper horizontal portion 58. When the lead frame 55 is attached to the substrate 51, the upper horizontal portion 5
The lead frame 55 is attached to the substrate 51 by an automatic machine so that the end portion of the substrate 51 is inserted between the lower horizontal portion 59 and the lower horizontal portion 59, and between the upper horizontal portion 58 and the lower horizontal portion 59. The existing spring force presses the upper and lower surfaces of the substrate 51 to temporarily fix them. After that, it is carried to a solder dip tank (not shown), and the lower horizontal portion 59 and the land 52 are soldered and fixed. In the figure, reference numeral 60
The part indicated by (blacked out part) is the solder part.

[0005]

As described above, when the lead frame 55 is fixed to the single-sided substrate 51 and used, only one side of the substrate 51 is fixed, that is, the lower horizontal portion 59 and the land. Only solder fixing with 52. Therefore, as shown by an arrow 61 in FIG. 2, when the lead frame 55 is inserted into a hole or the like of a mother board (not shown), or when an external force is applied to the main body 57 of the lead frame 55 due to packaging, transportation, or the like, This is directly transmitted to the fixed portion between the lower horizontal portion 59 and the land 52, and as a result, there is a possibility that land separation may occur.

The present invention has been made in view of the above problems, and its purpose is to absorb the external force or the like even if an external force is applied to the lead frame and affect the connection at the fixed portion between the lead frame and the substrate. (EN) Provided is a hybrid IC with a lead frame which does not provide the above and a method for mounting the IC on a mother board.

[0007]

In order to achieve the above-mentioned object, the present invention is provided between a fixing portion on one end side which is soldered to a substrate of a hybrid IC and a fixing portion on the other end side which is fixed to a mother substrate. In addition, a lead frame provided with a bow-shaped spring portion for absorbing external force is used.

In this structure, when an external force is applied from the other end side of the lead frame, the external force is absorbed by the arcuate spring portion, and the force directly acting on the connecting portion with the substrate of the hybrid IC is attenuated. Therefore, peeling or the like at the connection portion can be prevented. Further, when mounting the lead frame on the mother board, the arc spring portion can be used as a stopper.

[0009]

FIG. 1 shows an embodiment of a hybrid IC structure with a lead frame according to the present invention.
In FIG. 1, this hybrid IC substrate 1 (hereinafter,
"Substrate 1") is a single-sided substrate type with printed wiring on one side. A land 2 made of copper foil or the like is provided on one side where the printed wiring is provided, and electronic circuit parts such as a flat package IC 3 and a chip part 4 are arranged, and the hybrid IC board 1 is further provided.
The lead frame 5 is attached to the end of the.

The lead frame 5 is formed by sequentially bending a conductive plate-like material having a spring property, and has an upper horizontal portion 11 extending in a substantially horizontal direction, and an upper horizontal portion 11 from one end side thereof. A first vertical portion 12 extending in the vertical direction, an intermediate horizontal portion 13 extending in a substantially horizontal direction along an upper horizontal portion 11 from a lower end of the first vertical portion 12, and the intermediate horizontal portion. A second vertical portion 14 extending in a substantially vertical direction from one end side of 13, and a lower horizontal portion extending in a substantially horizontal direction from a lower end of the second vertical portion 14 along an intermediate horizontal portion 13. 15
And a third vertical portion 16 extending in a substantially vertical direction from one end side of the lower horizontal portion 15 are integrally formed. Further, the upper horizontal portion 11 is, as shown in FIG.
The intermediate portion 11a is formed in a curved shape that is gently hung toward the intermediate horizontal portion 13 side, and the minimum distance between the upper horizontal portion 11 and the intermediate portion 11a is formed slightly smaller than the thickness of the substrate 1. ing. Therefore, the upper horizontal portion 11
When the end portion of the substrate 1 is inserted between the intermediate horizontal portion 13 and the intermediate horizontal portion 13, the lead frame 5 is press-fitted.
It is ready for temporary fixing.

When the lead frame 5 is attached to the substrate 1, first, an end of the substrate 1 is press-fitted between the upper horizontal part 11 and the intermediate horizontal part 13 by an automatic machine, and the lead frame 5 is press-fitted. Temporarily fixed to the substrate 1. After that, it is carried to a solder dip tank (not shown) and soldered between the intermediate horizontal portion 13 and the land 2 to permanently fix it.
Complete. In addition, in FIG. 1, a portion indicated by reference numeral 9 (a portion painted in black) is the solder portion.

When the substrate 1 having the lead frame 5 attached thereto is attached to the mother substrate (not shown), the third vertical portion 16 of the lead frame 5 is inserted into the hole (not shown) of the mother substrate. It can be attached with. In this case, the fixed portion (consisting of the upper horizontal portion 11, the first vertical portion 12, and the intermediate horizontal portion 13) on one end side of the lead frame 5 soldered to the substrate 1 and the lead frame fixed to the mother substrate are formed. A bow spring portion for absorbing an external force, which is formed by the second vertical portion 14 and the lower horizontal portion 15 integrally with each fixing portion between the fixing portion on the other end side (corresponding to the third vertical portion 16). Since the lead frame 5 has been formed,
When an external force is applied from the other end side (third vertical portion 16) of the above, the external force is absorbed by the spring portion, and the force directly acting on the connecting portion between the substrate 1 and the intermediate horizontal portion 13 is attenuated. . As a result, peeling or the like at the connecting portion can be prevented. Further, when the lead frame 5 is mounted on the mother board, the lower horizontal portion 15 forming the arcuate spring portion can be used as a stopper, and a predetermined gap is provided between the mother board and the board 1. Can be secured. A line 17 indicated by an alternate long and short dash line in FIG. 1 indicates a portion where the upper surface of the mother substrate is located with respect to the substrate 1 when the lower horizontal portion 15 is attached to the mother substrate as a stopper.

In the above embodiment, the second vertical portion 14
Although the structure in which the bow spring portion for absorbing the external force is formed between the lower horizontal portion 15 and the lower horizontal portion 15 is disclosed, the load applied from the third vertical portion 16 side is absorbed and attenuated before reaching the intermediate horizontal portion 13. Other structures may be used as long as they can be formed.

[0014]

As described above, according to the present invention,
When external force is applied from the other end of the lead frame,
External force is absorbed by the bow-shaped spring part and the hybrid IC
Since the force directly acting on the connection portion with the substrate is attenuated, peeling or the like at the connection portion can be prevented.
In addition, when the lead frame is mounted on the mother board, it is possible to expect an effect that the bow-shaped spring portion can be used as a stopper.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part showing one embodiment of the present invention.

FIG. 2 is a cross-sectional view of an essential part showing an example of a conventional structure.

[Explanation of symbols]

 1 substrate 2 land 5 lead frame 11 upper horizontal part 12 first vertical part 13 intermediate horizontal part 14 second vertical part 15 lower horizontal part 16 third vertical part

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display area H01L 23/12 H

Claims (6)

[Claims] 1. A hybrid IC with a lead frame provided with a lead frame for mounting on a mother board, wherein a bow-shaped spring portion for absorbing an external force is fixed to the lead frame at one end side by soldering to the board of the IC. And a lead frame hybrid IC provided on the other end side of the mounting lead frame fixed to the mother board. 2. A hybrid IC with a lead frame having a lead frame for mounting on a mother substrate, wherein an upper horizontal portion extending in a substantially horizontal direction and an upper horizontal portion extending in a substantially vertical direction from one end side of the upper horizontal portion. The first vertical portion,
An intermediate horizontal portion extending substantially horizontally from the lower end of the first vertical portion along the upper horizontal portion, and a second vertical portion extending substantially vertically from one end side of the intermediate horizontal portion. A lower horizontal portion extending substantially horizontally from the lower end of the second vertical portion along the intermediate horizontal portion, and a first horizontal portion extending substantially vertically from one end side of the lower horizontal portion. An elastic lead frame integrally having a vertical portion 3 and an end portion of the substrate in the hybrid IC is inserted between the upper horizontal portion and the intermediate horizontal portion of the lead frame, and the inserted portion A hybrid IC with a lead frame, characterized in that the lead frame and the substrate of the hybrid IC are integrated by soldering. 3. The hybrid IC substrate is a DIP.
The hybrid IC with a lead frame according to claim 2, which is shaped and uses a single-sided substrate. 4. The intermediate horizontal portion is brought into contact with the mother substrate and functions as a stopper when the third vertical portion is inserted into the mother substrate by a predetermined amount. Hybrid IC with lead frame. 5. A mounting method for mounting a hybrid IC on a mother board via a lead frame, the method comprising: fixing to the mother board and a fixing portion on one end side of the lead frame which is soldered to the board of the hybrid IC. Between the fixed portion on the other end side of the lead frame,
A method for mounting a mother board of a hybrid IC, wherein an arc-shaped spring portion for absorbing an external force is provided integrally with each of the fixing portions, and the substrate of the hybrid IC is attached to the mother substrate via the bow-shaped spring portion. 6. A mounting method for mounting a substrate of a hybrid IC on a mother substrate via a lead frame, wherein the lead frame has an upper horizontal portion extending in a substantially horizontal direction and one end side of the upper horizontal portion. A first vertical portion extending in a substantially vertical direction, an intermediate horizontal portion extending in a substantially horizontal direction along the upper horizontal portion from a lower end of the first vertical portion, and the intermediate horizontal portion of the intermediate horizontal portion. A second vertical portion extending in a substantially vertical direction from one end side; a lower horizontal portion extending in a substantially horizontal direction from the lower end of the second vertical portion along the intermediate horizontal portion; A third vertical portion extending substantially vertically from one end of the side horizontal portion is integrally formed, and a board of the hybrid IC is provided between the upper horizontal portion and the intermediate horizontal portion of the lead frame. The end is inserted and clamped, and this clamped The lead frame and the substrate of the hybrid IC are integrated by soldering a portion, and when the third vertical portion is inserted into a hole on the mother substrate side, a predetermined amount is inserted. A mother board of a hybrid IC, wherein an intermediate horizontal portion is positioned in contact with the mother board, and the second vertical portion mounts the hybrid IC board and the mother board apart from each other. How to implement.