JP2007115963A - Circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit module wherein a small impedance-matching structure can be obtained and the attachment of its connecting terminal is made sure. <P>SOLUTION: In the circuit module, a connecting terminal 4 for being attached to a circuit board 1 in the state of being connected with a conductive pattern 2 and for being connected with an external circuit has sandwiching portions 5, 6, 7 for being connected with the conductive pattern 2, and has a terminal portion 8 so extended from an end-side of the sandwiching portion present on the rear-surface side of the circuit board 1 as to be connected with the external circuit. Since a stub Z for the impedance matching to the external circuit is formed by the sandwiching portion, the connecting terminal 4 can be so used as the stub Z for the impedance matching too as to be able to miniaturize the circuit board and as to obtain a small impedance-matching structure. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit module suitable for use in various electronic circuit units such as ETC.

  As a conventional circuit module, the connection terminal sandwiches the circuit board as shown in FIG. 10, but the configuration of this conventional circuit module will be described with reference to FIG. Although not shown here, a conductive pattern (wiring pattern) is provided, and various electronic components are connected to the conductive pattern to form a desired electric circuit.

  Each of the plurality of connection terminals 52 has an L-shape, a forked sandwiching portion 52b provided on one end side of the upper piece portion 52a, and a terminal bent at a right angle downward from the other end of the upper piece portion 52a. The connection terminal 52 is attached by sandwiching the upper and lower surfaces of the circuit board 51 in a state where the sandwiching part 52b is in contact with the conductive pattern, and the plurality of connection terminals 52 are provided on the side surfaces of the circuit board 51. Are arranged side by side.

The box-shaped cover 53 made of a metal material has an open portion 53a at a lower portion, and the circuit board 51 to which the connection terminal 52 is attached is inserted into the cover 53 from the open portion 53a side of the cover 53, and the circuit board 51 Is attached to the cover 53, and the terminal portion 52 c of the connection terminal 52 protrudes downward from the cover 53 and is connected to a mother board (not shown), and the high frequency from the circuit board 51 side via the connection terminal 52. A signal is input to a baseband circuit on the mother board side, or a baseband signal from the mother board side is input to a high frequency circuit on the circuit board 51 side (see, for example, Patent Document 1).
Japanese Utility Model Publication No. 2-113343

  However, in the conventional circuit module, a high frequency signal from the circuit board 51 side is input to the baseband circuit on the mother board side, or a baseband signal from the mother board side is input to the high frequency circuit on the circuit board 51 side. Therefore, in order to perform impedance matching between the circuit board 51 side and the mother board side, it is necessary to separately provide an impedance matching circuit. Since the circuit board 51 is simply clamped by the bifurcated clamping part 52b, the connection terminal 52 is not positioned, and there is a problem that the circuit board 51 is misaligned and cannot be accurately attached.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a circuit module capable of obtaining a small impedance matching structure and securely attaching a connection terminal.

  In order to achieve the above object, as a first solving means of the present invention, a circuit board on which a desired electric circuit is formed by connecting an electronic component to a conductive pattern, and in a state of being connected to the conductive pattern, A connection terminal that is attached to the circuit board and is connected to an external circuit, the connection terminal being connected to the conductive pattern from one end side of the clamping part on the lower surface side of the circuit board A terminal portion that extends and is connected to the external circuit, and a stub for impedance matching of the external circuit is formed in the clamping portion.

  As a second solution, the sandwiching portion is soldered to the conductive pattern on the lower surface side of the circuit board.

  As a third solution, a matching conductive pattern connected to the clamping part is provided on the upper surface of the circuit board, and an impedance matching stub is formed by the matching conductive pattern and the clamping part. The configuration was as follows.

  As a fourth solution, the sandwiching portion and the matching conductive pattern are soldered.

  Further, as a fifth solving means, on the upper surface of the circuit board, there are a first recess provided closer to the side surface and two second recesses provided closer to the center than the first recess. The sandwiching portion includes a lower surface extending portion positioned on a lower surface side of the circuit board, an upper surface extending portion positioned on an upper surface of the circuit board, and a side surface of the circuit board. The upper surface extending portion includes a base portion, a bifurcated portion branched from the base portion, and the base portion, and is fitted to the first concave portion. A first convex portion and a second convex portion provided in each of the branch portions and fitted in the second concave portion, and the upper and lower surface extending portions of the sandwiching portion are the first convex portion, The first and second convex portions sandwich the circuit board with the first and second concave portions fitted, and the upper surface extending portion Impedance matching Te stub was formed configuration.

  As a sixth solution, a circuit board in which a desired electrical circuit is formed by connecting an electronic component to the conductive pattern, and a circuit board that is connected to the conductive pattern and attached to the circuit board and connected to an external circuit And a connection terminal connected to the conductive pattern, and a terminal extending from one end of the clamping part on the lower surface side of the circuit board and connected to the external circuit The circuit board is provided with a matching conductive pattern connected to the clamping portion, and an impedance matching stub for the external circuit is formed by the matching conductive pattern.

  In the circuit module of the present invention, the connection terminal that is attached to the circuit board in a state of being connected to the conductive pattern and is connected to the external circuit includes the holding part connected to the conductive pattern and the holding part on the lower surface side of the circuit board. And the terminal portion connected to the external circuit, the impedance matching stub of the external circuit is formed by the sandwiching portion, so that the connection terminal can also be used as the impedance matching stub, and the circuit board A small impedance matching structure can be obtained.

  Further, since the sandwiching portion is soldered to the conductive pattern on the lower surface side of the circuit board, the connection terminal can be reliably connected to the conductive pattern, and the connection terminal can be securely attached to the circuit board.

  In addition, a matching conductive pattern connected to the sandwiching portion is provided on the upper surface of the circuit board, and an impedance matching stub is formed by the matching conductive pattern and the sandwiching portion. In addition to being used as an impedance matching stub, the length of the matching conductive pattern can be shortened by the presence of a part of the clamping part, and the circuit board can be reduced in size, and the matching conductive pattern can be easily adjusted by cutting, etc. Thus, an impedance matching can be easily adjusted.

  In addition, since the sandwiching portion and the matching conductive pattern are soldered, the connection terminal can be securely connected to the matching electric pattern, and the connection terminal can be securely attached to the circuit board.

  In addition, since the connection terminal sandwiches the circuit board with the first and second protrusions fitted in the first and second recesses of the circuit board, the connection terminal can be reliably positioned on the circuit board. As a result, a connection terminal having no positional deviation is obtained, and the impedance matching stub is formed by the upper surface extending portion having the branch portion, so that a long impedance matching stub is obtained.

  The connection terminal has a sandwiching portion connected to the conductive pattern, and a terminal portion extending from one end side of the sandwiching portion on the lower surface side of the circuit board and connected to an external circuit. The matching conductive pattern connected to the external circuit is provided, and the impedance matching stub for the external circuit is formed by the matching conductive pattern, so that the length of the matching conductive pattern can be shortened by the presence of a part of the clamping portion, and the circuit In addition to reducing the size of the substrate, the matching conductive pattern can be easily adjusted by cutting or the like, so that impedance matching can be easily adjusted.

  1 is a partially cutaway plan view of a circuit module of the present invention, FIG. 2 is a front view of the circuit module of the present invention, and FIG. FIG. 4 is an enlarged plan view of the main part of the circuit module according to the present invention, FIG. 5 is an enlarged front view of the main part of the circuit module according to the present invention, and FIG. 6 is taken along the line 6-6 in FIG. FIG. 7 is a sectional view taken along line 7-7 of FIG. 5, FIG. 8 is an explanatory diagram schematically showing impedance matching according to the circuit module of the present invention, and FIG. 9 is a manufacturing method according to the circuit module of the present invention. It is a perspective view shown.

Next, the configuration according to the circuit module of the present invention will be described with reference to FIGS.
A rectangular circuit board 1 made of a ceramic substrate or the like has a flat upper surface, lower surfaces 1a and 1b, a plurality of first concave portions 1d provided on the upper surface 1a in the vicinity of the side surface 1c, and a circuit more than the first concave portion 1d. Near the center of the substrate 1, two pairs of second recesses 2 e provided on the upper surface 1 a at a distance from each other, and adjacent to both sides of the first recess 1 d on the upper surface 1 a It has the 3rd recessed part 1f provided.

  On the upper and lower surfaces 1 a and 1 b of the circuit board 1, a conductive pattern (wiring pattern) 2 composed of a signal pattern 2 a and a ground pattern 2 b and a band for impedance matching provided on the upper surface 1 a of the circuit board 1 are formed. A matching conductive pattern 2c is provided, and various electronic components 3 are mounted on the upper and lower surfaces 1a and 1b of the circuit board 1 while being connected to the conductive pattern 2 to form a desired electric circuit. ing.

  The first connection terminal 4 made of a metal plate having a spring property and having a substantially Z shape is connected to the upper surface extension portion 5 located on the upper surface 1a side of the circuit board 1 and the upper surface extension portion 5. A connecting portion 6 that extends along the side surface 1c of the insulating substrate 1, a lower surface extending portion 7 that is connected to the connecting portion 6 and is located on the lower surface 1b side of the circuit board 1, and a lower side from the end of the lower surface extending portion 7 And has a terminal portion 8 that is bent to be connected to the mother board M. The upper surface extending portion 5 has a Y-shape, a base portion 5a positioned on the side surface 1c, and a bifurcated branch from the end portion of the base portion 5a, and is positioned near the center portion of the circuit board 1. The character-shaped branch portion 5b, the first convex portion 5c provided at the position of the base portion 5a so as to fit into the first concave portion 1d, and the branch portion 5b so as to fit into the second concave portion 1e. It has the 2nd convex part 5d provided, and the 3rd convex part 5e provided so that the conductive pattern 2c for matching may be contacted, and the lower surface extension part 7 contacts the pattern 2a for signals. The terminal portion 8 is arranged in parallel with the lower surface extending portion 7 and can be mounted on the mother substrate M by being provided at the end portion. The mounting portion 8a is connected to the lower surface extending portion 7 by connecting the mounting portion 8a and the lower surface extending portion 7 to the right angle piece portion and the lower surface extending portion 7 extending perpendicularly from the lower surface extending portion 7. An inclined piece extending obliquely to the connecting portion 6 side Te having a connecting portion 8b.

  In addition, as shown in FIG. 5, the first terminal portion 4 is formed across the connecting portion 6, the lower surface extending portion 7, and the terminal portion 8, and has a wide portion 9 that extends in both width directions, As shown in FIG. 6, the 4th convex part 7a is arrange | positioned in the position between the 1st, 2nd convex parts 5c and 5d including the position which opposes the 1st convex part 5c, and the 1st, 1st 2, the circuit board 1 can be clamped by the fourth projecting portions 5c, 5d, 7a, that is, the upper surface extending portion 5 and the lower surface extending portion 7, and the upper surface extending portion 5, the connecting portion 6, and the lower surface extension A clamping part for clamping the circuit board 1 is formed by the installation part 7.

  The first connecting terminal 4 is inserted into the circuit board 1 from the upper side opposite the connecting portion 6 and between the lower surface extending portions 5 and 7, and the first and second convex portions 5 c and 5 d are respectively connected to the first connecting terminal 4. The upper and lower surfaces 1a and 1b are sandwiched and attached in a state where the first and second concave portions 1d and 1e are fitted and the fourth convex portion 7a is in contact with the lower surface of the circuit board 1. . When the first connection terminal 4 is attached, the third convex portion 5e comes into contact with the matching conductive pattern 2c, and a gap is formed between the matching conductive pattern 2c and the upper surface extending portion 5. The matching conductive pattern 2c is connected to the upper surface extending portion 5 which is the sandwiching portion by the soldering portion 10 provided in the gap portion, and the fourth convex portion 7a is connected to the signal pattern. 2a, a gap is formed between the signal pattern 2a and the lower surface extending portion 7, and the signal pattern 2a and the lower surface extending portion are formed by the soldering portion 10 provided in the gap. 7 is connected.

  The second connection terminal 11 made of a metal plate having a spring property and having a substantially Z shape has an upper surface arrangement portion 12 disposed on the upper surface 1 a side of the circuit board 1, and the upper surface is connected to a part 12. A connecting portion 13 extending along the side surface 1c, a lower surface disposing portion 14 connected to the connecting portion 13 and located on the lower surface 1b side of the circuit board 1, and a lower side from the end portion of the lower surface disposing portion 14 are bent downward. It has a terminal piece 15 connected to M. And the upper surface arrangement | positioning part 12 has the 5th convex part 12a provided so that it might fit in the 3rd recessed part 1f, and the lower surface arrangement | positioning part 14 was provided so that the pattern 2b for grounding might be contacted In addition, the terminal piece 15 is arranged in a state parallel to the lower surface arrangement portion 14 and is provided on the end portion and can be placed on the mother substrate M. And the mounting portion 15a and the lower surface arranging portion 14, and a connecting portion formed of a right angle piece extending perpendicularly from the lower surface arranging portion 14 and an inclined piece portion extending obliquely toward the coupling portion 13 with respect to the lower surface arranging portion 14. 15b.

  Further, as shown in FIG. 5, the second terminal portion 11 is formed across the coupling portion 13, the lower surface arranging portion 14, and the terminal piece 15, and has a wide portion 16 that extends in both width directions. 7, the circuit board 1 can be held between the fifth and sixth convex portions 12 a and 14 a, that is, the upper surface arranging portion 12 and the lower surface arranging portion 14, and the upper surface arranging portion 12 and the coupling portion 13, and A clamping part for clamping the circuit board 1 is formed by the lower surface arrangement part 14.

  Then, the second connection terminal 11 is inserted into the circuit board 1 from the upper side opposite the coupling portion 13 and between the lower surface arrangement portions 12 and 14, and the fifth convex portion 12a is fitted into the third concave portion 1f. When the sixth convex portion 14a is in contact with the lower surface of the circuit board 1, the upper and lower surfaces 1a and 1b are sandwiched between the circuit board 1 and the second connection terminal 11 is attached. The sixth protrusion 14a is in contact with the grounding pattern 2b, and a gap is formed between the grounding pattern 2b and the lower surface arrangement part 14, and the soldering part 10 provided in the gap is formed. As a result, the ground pattern 2b and the lower surface arrangement portion 14 are connected.

  The two second connection terminals 11 attached in this way are arranged in a state adjacent to both sides of one first connection terminal 4, so that one first connection terminal 4 and two first connection terminals 4 are arranged. A pair is formed with the second connection terminal 11, and at least one side surface 1c of the circuit board 1 is provided with a plurality of sets, and the other side surface 1c side of the circuit board 1 is 1 side. A set is arranged, and when the second connection terminal 11 is attached, the first and second connection terminals 4 and 11 are narrowed to each other due to the presence of the wide portions 9 and 16. In the above embodiment, the first connecting terminal 4 is provided with the wide portion 9 and the second connecting terminal 11 is provided with the wide portion 16. However, the first and second connecting terminals 4, 11 are described. One of the first and second connection terminals 4 and 11 can be narrowed by narrowing the space between the first and second connection terminals 4 and 11, and the wide part can be provided on one or both of the first and second connection terminals 4 and 11. With a simple configuration provided with 9, 16, a coplanar line can be easily formed, and a stable impedance can be obtained.

  A box-shaped frame 17 made of a metal plate has a bottom wall 17a, four side walls 17b bent upward from the bottom wall 17a, and a notch 17c provided on the opposite side wall 17b. In the frame 17, the circuit board 1 is attached by appropriate means in a state where the first and second connection terminals 4 and 11 are located in the notch 17 c, and the upper opening of the frame 17 A lid 18 made of a metal plate is covered to form the circuit module of the present invention.

  The circuit module of the present invention having such a configuration is incorporated in an electronic device, and inputs a high frequency signal from the circuit board 1 side to a baseband circuit on the mother board M side or receives a baseband signal from the mother board M side. The high-frequency circuit on the circuit board 1 side is input via the first connection terminal 4 serving as an input / output terminal. Such a circuit module of the present invention has a circuit as shown in FIG. An impedance matching stub Z is provided for impedance matching between the impedance in the line L1 on the substrate 1 side and the impedance in the line L2 on the mother substrate M side.

  The line L1 on the circuit board 1 side includes the length of the first connection terminal 4 and the length of the signal pattern 2a between the connection part P1 with the wiring pattern H of the mother board M and the connection part P2 with the signal pattern 2a. The line L2 on the mother substrate M side is formed with the length of the wiring pattern H, and the impedance matching stub Z is extended from the connecting portion P2 to the lower surface extending portion 7, the connecting portion 6, and the upper surface extending. Depending on the length from the connecting portion P2 to the tip of the branch portion 5b of the installation portion 5, the base portion 5a of the lower surface extending portion 7, the connecting portion 6, the upper surface extending portion 5 and the tip portion of the matching conductive pattern 2c. The impedance matching between the impedance on the circuit board 1 side and the impedance on the mother board M side is performed by the clamping portion of the first connection terminal 4 and the matching conductive pattern 2c. By line It has become way.

  In this embodiment, impedance matching is performed by the holding portion of the first connection terminal 4 and the matching conductive pattern 2c. However, the holding portion of the first connection terminal 4 and the matching conductive pattern 2c Impedance matching may be performed by either one, that is, the matching conductive pattern 2c is eliminated and the holding portion where the branch portion 5b is provided, or the matching conductive pattern 2c is eliminated without the branch portion 5b. It may be provided.

  Next, a method for manufacturing a circuit module according to the present invention will be described with reference to FIG. 9. The metal flat plate 20 made of a hoop material or the like is positioned by a pilot hole 22 provided in the frame portion 21, and the frame portion 21. A forming process for forming the first and second connection terminals 4 and 11 connected to the first and second connection terminals is performed. In this forming step, the terminal portion 8 of the first connection terminal 4 and the end portion of the terminal piece 15 of the second connection terminal 11 are connected to the frame portion 21, and one first connection terminal 4 and the first connection terminal 4 are connected. One set or a plurality of sets of two second connection terminals 11 arranged adjacent to both sides of the connection terminal 4 are continuously formed.

  Next, after the circuit board 1 is sandwiched and the first and second connection terminals 4 and 11 are attached to the circuit board 1, an attachment process is performed, and then the lower surface extending portion 7 and the signal pattern 2a are reflowed or the like. Then, the first and second connection terminals 4 and 11 are connected to the conductive pattern by performing a soldering process of soldering between the upper surface extension portion 5 and the matching conductive pattern 2c and between the lower surface arrangement portion 14 and the ground pattern 2b. After fixing to 2, the circuit module of the present invention is manufactured by performing a cutting step of cutting the first and second connection terminals 4 and 11 from the frame portion 21 by cutting at the position of the line S.

It is a partially broken top view which concerns on the circuit module of this invention. It is a front view concerning the circuit module of the present invention. It is sectional drawing in the 3-3 line of FIG. It is a principal part enlarged plan view concerning the circuit module of the present invention. It is a principal part enlarged front view which concerns on the circuit module of this invention. FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. It is sectional drawing in the 7-7 line | wire of FIG. It is explanatory drawing which shows typically the impedance matching which concerns on the circuit module of this invention. It is a perspective view which shows the manufacturing method which concerns on the circuit module of this invention. It is a partially broken perspective view which concerns on the conventional circuit module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 1a Upper surface 1b Lower surface 1c Side surface 1d 1st recessed part 1e 2nd recessed part 1f 3rd recessed part 2 Conductive pattern 2a Signal pattern 2b Grounding pattern 2c Matching conductive pattern 3 Electronic component 4 1st connection terminal 5 Upper surface extending portion 5a Base portion 5b Branching portion 5c First convex portion 5d Second convex portion 5e Third convex portion 6 Connecting portion 7 Lower surface extending portion 7a Fourth convex portion 8 Terminal portion 8a Mounting portion 8b Connecting portion Part 9 Wide part 10 Solder part 11 Second connection terminal 12 Upper surface arrangement part 12a Fifth convex part 13 Coupling part 14 Lower surface arrangement part 14a Sixth convex part 15 Terminal piece 15a Mounting part 15b Connecting part 16 Wide part 17 Frame 17a Bottom wall 17b Side wall 17c Notch 18 Lid 20 Metal flat plate 21 Frame 22 Pilot hole M Mother board Z Impedance matching stub H Wiring pad Over down L1, L2 line P1, P2 connecting portion S line

Claims (6)

A circuit board having a desired electrical circuit formed by connecting electronic components to the conductive pattern, and a connection terminal attached to the circuit board in a state of being connected to the conductive pattern and connected to an external circuit The connection terminal includes a clamping part connected to the conductive pattern, and a terminal part extending from one end side of the clamping part on the lower surface side of the circuit board and connected to the external circuit, and the clamping part A circuit module, wherein a stub for impedance matching of the external circuit is formed. The circuit module according to claim 1, wherein the clamping portion is soldered to the conductive pattern on a lower surface side of the circuit board. 2. A matching conductive pattern connected to the clamping portion is provided on an upper surface of the circuit board, and an impedance matching stub is formed by the matching conductive pattern and the clamping portion. Or the circuit module according to 2. 4. The circuit module according to claim 3, wherein the sandwiching portion and the matching conductive pattern are soldered. The upper surface of the circuit board has a first recess provided closer to the side surface and two second recesses provided closer to the center than the first recess. A lower surface extending portion located on the lower surface side of the circuit board; an upper surface extending portion located on the upper surface of the circuit board; and a connecting portion located on a side surface of the circuit board and connecting the upper and lower surface extending portions. And the upper surface extending portion includes a base, a branch portion bifurcated from the base, a first convex portion provided on the base and fitted into the first concave portion, respectively. Provided at the branch portion, and has a second convex portion that fits into the second concave portion, and the upper and lower surface extending portions of the sandwiching portion have the first and second convex portions as described above. The circuit board is sandwiched in a state of being fitted in the first and second recesses, and an impedance matching star is formed by the upper surface extending portion. The circuit module according to claim 1, any one of 4, characterized in that but formed. A circuit board having a desired electrical circuit formed by connecting electronic components to the conductive pattern, and a connection terminal attached to the circuit board in a state of being connected to the conductive pattern and connected to an external circuit The connection terminal has a clamping part connected to the conductive pattern, and a terminal part extending from one end side of the clamping part on the lower surface side of the circuit board and connected to the external circuit, Includes a matching conductive pattern connected to the clamping portion, and an impedance matching stub for the external circuit is formed by the matching conductive pattern.

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