JPS63269550A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS63269550A JPS63269550A JP10498587A JP10498587A JPS63269550A JP S63269550 A JPS63269550 A JP S63269550A JP 10498587 A JP10498587 A JP 10498587A JP 10498587 A JP10498587 A JP 10498587A JP S63269550 A JPS63269550 A JP S63269550A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- external extraction
- extraction terminal
- connector
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 12
- 238000010292 electrical insulation Methods 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract 6
- 238000000034 method Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体装置、特にＩＣカード等の絶縁基板と
外部引き出し端子とを半田付けした構造の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor device, and particularly to an improvement in a structure in which an insulating substrate such as an IC card and an external lead-out terminal are soldered together.
従来のこの種の半導体装置としてのＩＣカードの構造に
ついて説明する。第２図１ａｌ、 （ｂ）は絶縁基板で
あるプリント基板と外部引出し端子とを半田付けしてい
るＩＣカードを示し、図において、１はプリント基板、
ｌａはプリント基板ｌ上に形成された金属膜、１ｂはプ
リント基板１上に装着されたＩＣ等の電気部品である。The structure of an IC card as a conventional semiconductor device of this type will be explained. Fig. 2 1al, (b) shows an IC card in which a printed board, which is an insulating board, and an external lead-out terminal are soldered; in the figure, 1 is a printed board;
la is a metal film formed on the printed circuit board l, and 1b is an electric component such as an IC mounted on the printed circuit board 1.
２はプリント基板１に固着されたコネクタで、２ａはコ
ネクタ２に装着された外部引き出し端子である。2 is a connector fixed to the printed circuit board 1, and 2a is an external lead terminal attached to the connector 2.
またこの外部引出し端子２ａの取付けは電気部品１ｂを
有する基板１上の金属１１１ａに半田３を印刷し又は半
田板を設置した上でこの上にコネクタ２の外部引き出し
端子２ａを置き、ホントプレートあるいは加熱炉中で加
熱して上記端子２ａをプリント基板１の金属膜１ａに半
田付は固着することにより行われる。Also, to attach the external lead terminal 2a, print the solder 3 on the metal 111a on the board 1 that has the electrical component 1b, or install a solder plate, and then place the external lead terminal 2a of the connector 2 on top of the metal 111a on the board 1 having the electrical component 1b. Soldering is performed by heating the terminals 2a in a heating furnace to fix the terminals 2a to the metal film 1a of the printed circuit board 1.
このような従来の装置では、外部引出し端子２ａはその
半田付は面が平坦であるため、プリント基板ｌとコネク
タ２との半田付は時に加える圧力およびコネクタ２の自
重により半田粒３ａの突出が発生し必要な電気絶縁距離
を確保できないとか、短絡する等の欠点があった。また
近年、高集積化に伴いコネクタ２の外部引出し端子２ａ
の間隔は短縮していく傾向にあり、このような欠点の解
決゛は不可欠となってきている。In such a conventional device, the external lead terminal 2a has a flat surface for soldering, so when soldering the printed circuit board l and the connector 2, the solder grains 3a sometimes protrude due to the applied pressure and the weight of the connector 2. There were disadvantages such as not being able to secure the necessary electrical insulation distance and short circuits. In addition, in recent years, with the increase in integration, the external lead terminal 2a of the connector 2
As the distance between these two points tends to become shorter, it has become essential to solve these drawbacks.
この発明はこのような欠点を解消するためになされたも
ので、外部引出し端子の半田付けの信頼性を向上でき、
かつ電気絶縁距離が不足したり、短絡したりするのを防
止できる半導体装置を得ることを目的とする。This invention was made to eliminate such drawbacks, and it is possible to improve the reliability of soldering of external lead terminals,
Another object of the present invention is to obtain a semiconductor device that can prevent insufficient electrical insulation distance and short circuits.
この発明にかかる半導体装置はコネクタの外部引出し端
子の半田付は面に突起部を設けたものである。In the semiconductor device according to the present invention, a protrusion is provided on the soldering surface of the external lead terminal of the connector.
この発明においては、コネクタの外部引出し端子の半田
付は面に突起部を設けたから、該外部引出し端子を絶縁
基板の金属膜に半田付けする際半田の表面張力により半
田層の厚さを均一にできるとともに半田の突出を防止で
き、これにより半田付けの信頼性を向上でき、さらに電
気絶縁距離不足あるいは短絡を解消できる。In this invention, since the external lead terminal of the connector is soldered with a protrusion on the surface, when the external lead terminal is soldered to the metal film of the insulating substrate, the thickness of the solder layer is made uniform by the surface tension of the solder. At the same time, it is possible to prevent the solder from protruding, thereby improving the reliability of soldering, and further eliminating the problem of insufficient electrical insulation distance or short circuits.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例による半導体装置を示し、図
において、第２図の従来例と同一符号は同一または相当
部分を示している。FIG. 1 shows a semiconductor device according to an embodiment of the present invention, and in the figure, the same reference numerals as in the conventional example of FIG. 2 indicate the same or corresponding parts.
この実施例では、第１図に示すようにコネクタ４に装着
された外部引出し端子４ａの半田付は面には突起部４ｂ
が設けられている。In this embodiment, as shown in FIG.
is provided.
またこの外部引出し端子４ａの取付けは前記従来例の場
合と同様に、電気部品１ｂを有するプリント基板１上の
金属膜１ａに半田３を印刷し又は半田板を設置した上で
この上にコネクタ４の外部引出し端子４ａを置いてホッ
トプレートあるいは加熱炉中で加熱して行なう。In addition, the external lead terminal 4a is attached in the same manner as in the conventional example, by printing the solder 3 on the metal film 1a on the printed circuit board 1 having the electrical component 1b or installing a solder plate, and then attaching the connector 4 on the metal film 1a. This is done by placing the external lead terminal 4a and heating it in a hot plate or heating furnace.
このような本実施例装置では外部引出し端子４ａの半田
付は面に突起部４ｂを設けたので、半田付けに際して、
外部引出し端子４ａと金属膜１ａとの間に圧力があるい
はコネクタの自重が加わってもこれらは突起部４ｂによ
り支えられて半田３の層厚は一定に保たれ、このため半
田の表面張力の作用により半田の突出の発生を防止する
ことができ、これにより外部引出し端子の半田付けの信
頼性を向上でき、かつ電気絶縁距離が不足したり、短絡
したりするのを防止できる。In the device of this embodiment, the protrusion 4b is provided on the surface of the external lead terminal 4a for soldering.
Even if pressure is applied between the external lead terminal 4a and the metal film 1a or the weight of the connector is applied, these are supported by the protrusion 4b and the layer thickness of the solder 3 is kept constant, so that the surface tension of the solder This makes it possible to prevent the solder from protruding, thereby improving the reliability of soldering the external lead terminals, and preventing insufficient electrical insulation distance and short circuits.
また突起部４ｂの高さは外部引出し端子４ａの大きさに
より多少異なってくるが、０．０５〜０．３５＋ｕ程度
とすることで有効な結果が得られる。Further, although the height of the protrusion 4b varies somewhat depending on the size of the external lead terminal 4a, effective results can be obtained by setting the height to about 0.05 to 0.35+u.
なお上記実施例ではＩＣカードについて述べたが、本発
明はその他の半導体装置であるところの、例えはトラン
ジスタ、サイリスタ、ダイオードモジュール、あるいは
ハイブリッドＩＣ等にも広く適用できることは勿論であ
る。Although the above embodiments have been described with reference to IC cards, it goes without saying that the present invention can be widely applied to other semiconductor devices such as transistors, thyristors, diode modules, and hybrid ICs.
以上のように、この発明にかかる半導体装置によれば、
コネクタの外部引出し端子の半田付は面に突起部を設け
たので、半田層の厚さを一定にできると共に半田突出を
防止することができ、これにより半田付けの信頼性を向
上し、かつ電気絶縁距離不足および短絡を解消できる効
果がある。As described above, according to the semiconductor device according to the present invention,
Protrusions are provided on the soldering surface of the external terminals of the connector, so the thickness of the solder layer can be kept constant and solder protrusion can be prevented.This improves soldering reliability and improves electrical performance. This has the effect of eliminating insufficient insulation distance and short circuits.
第１図（ａ）は本発明の一実施例による半導体装置を示
す斜視図、第１図（ｂｌはそのＩｂ−Ｉｂ線断面図、第
２図（ａ）は従来の半導体装置を示す斜視図、第２図（
ｂ）はそのｎｂ−ｎｂ線断面図である。
図中、１はプリント基板、１ａは金属膜、１ｂは電気部
品、３は半田、４はコネクタ、４ａは外部引出し端子、
４ｂは突起部である。
なお図中同一符号は同−又は相当部分を示す。FIG. 1(a) is a perspective view showing a semiconductor device according to an embodiment of the present invention, FIG. , Figure 2 (
b) is a sectional view taken along the nb-nb line. In the figure, 1 is a printed circuit board, 1a is a metal film, 1b is an electrical component, 3 is solder, 4 is a connector, 4a is an external lead terminal,
4b is a protrusion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
引出し端子を半田で固着している半導体装置において、 上記外部引出し端子は上記金属膜との固着面に突起を有
するものであることを特徴とする半導体装置。(1) In a semiconductor device in which an external lead terminal is fixed by solder to a metal film on an insulating substrate on which an electric circuit is formed, the external lead terminal has a protrusion on the surface to which it is fixed to the metal film. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10498587A JPS63269550A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10498587A JPS63269550A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63269550A true JPS63269550A (en) | 1988-11-07 |
Family
ID=14395386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10498587A Pending JPS63269550A (en) | 1987-04-27 | 1987-04-27 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63269550A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5288667A (en) * | 1990-08-23 | 1994-02-22 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler |
-
1987
- 1987-04-27 JP JP10498587A patent/JPS63269550A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5288667A (en) * | 1990-08-23 | 1994-02-22 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler |
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