JPH0961730A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device which shortens the hardening length of an image pickup unit formed by having an objective lens, solid-state image pickup element, etc. SOLUTION: The bundle end 73 of signal lines formed when plural signal lines 71... of signal cables 7, such as signal lines 71 directly connected to the external leads 36... of an image pickup section 30 and signal lines 71 connected to a peripheral circuit board 40 are integrated by cable stoppers 2 is arranged on the rear of the peripheral circuit board 40. As a result, the hardening length is shortened by constituting the image pickup unit 1 in the positional relations of an objective lens group 20, an image pickup element chip 31, the peripheral circuit board 40 and the bundle end 73 of the signal lines, successively from the front end side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device built in a distal end portion of an endoscope, and more particularly, to shortening a hard length of an image pickup unit from a tip end of an objective lens of the image pickup device to a bundle end portion of a signal cable bundle. Regarding

[0002]

2. Description of the Related Art In recent years, a slender insertion portion is inserted into a body cavity to be used for observation and inspection in a medical endoscope for observing the body cavity, in a pipe of a machine and a chemical plant, or in a machine. Industrial endoscopes are widely used.

Among these endoscopes, there is an electronic endoscope in which an image pickup device having a solid-state image pickup device such as a solid-state image pickup device is arranged at the tip of the insertion portion. In this endoscope, an elongated endoscope insertion portion having a small diameter must be inserted into a meandering tube or lumen. Therefore, in order to be able to insert the endoscope insertion part smoothly and without causing pain to the patient, the outer diameter of the tip part of the endoscope can be reduced and the length of the hard part can be reduced. Shortening was desired.

In general, an objective lens and a solid-state image pickup device, which constitute an image pickup device, are built in as an image pickup unit at the tip of an endoscope, and a subject image is captured by the solid-state image pickup device through the objective lens. An image is formed on the imaging surface. 1 in the direction opposite to the objective lens of this solid-state image sensor
Circuit boards that constitute one or two signal processing circuits are provided, and external leads extending from the solid-state image sensor are adhesively fixed to the circuit boards by soldering or the like. A signal line of a signal cable connected to a camera control unit, which is an external device, is connected to the circuit board. Further, the signal line of the signal cable is also connected to an external lead extending from the solid-state image sensor.

The solid-state image sensor drive signal, the solid-state image sensor output signal, and the solid-state image sensor drive power source, which are the input / output signals of the solid-state image sensor, are transmitted to the solid-state image sensor through the signal cable and the circuit board. It has become.

The plurality of signal lines of the signal cable connected to the external leads and the circuit board are located on the base end side opposite to the connecting part to which the external leads extending from the solid-state image pickup device are attached. By the cable stop, the signal lines that were disjointed are grouped together to form a cable bundle. For this reason, the bundle end portion of the cable bundle is provided so as to be located behind the objective lens, the solid-state imaging device, the circuit board, and the cable stopper when viewed from the distal end side of the endoscope.

Generally, the hard length of the image pickup unit that constitutes the image pickup apparatus is regarded as the length from the front end surface of the objective lens to the bundle end portion of the cable bundle, and thus the bundle end portion of the cable bundle is as described above. However, if the image pickup unit is formed by arranging on the rear side of the cable stop, there is a limit to shortening the rigid length of the image pickup unit.

[0008]

However, shortening the rigid length of the image pickup unit, that is, the length of the rigid portion of the endoscope is a factor that greatly improves the bendability of the distal end portion of the endoscope. By shortening the length of the hard part and improving the bendability, it is expected that the operator will be able to view the inner wall of the body cavity and the stomach wall from the front and improve the observation performance, and the bend operability will be ensured for the patient. Therefore, it is not necessary to inflate the body cavity excessively, and the pain is reduced. For this reason, it has been desired to reduce the length of the rigid length of the imaging unit from both the viewpoint of the operator and the viewpoint of the patient.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an image pickup apparatus for reducing the rigid length of an image pickup unit formed by including an objective lens, a solid-state image pickup device and the like. .

[0010]

An image pickup apparatus according to the present invention includes a solid-state image pickup device disposed at an image forming position of an objective lens, and a solid-state image pickup device connected to the solid-state image pickup device for driving or performing signal processing. A signal comprising a peripheral circuit board for performing the above, a camera control unit for controlling the solid-state image sensor or the peripheral circuit board, and a plurality of signal lines electrically connecting the camera control unit and the solid-state image sensor or the peripheral circuit board. An image pickup device having a cable, wherein the peripheral circuit board is arranged parallel to the optical axis direction of the objective lens, and a plurality of signal lines of the signal cable are collectively arranged on the peripheral circuit board surface. The bundle ends of the signal lines formed at that time are arranged.

According to this structure, the bundle ends of the signal lines are provided on the peripheral circuit board connected to the solid-state image pickup device. As a result, the arrangement position from the objective lens to the end of the signal line bundle becomes the positional relationship of the objective lens, the solid-state imaging device, the peripheral circuit board, and the end of the signal line bundle, and the hard length is shortened.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 relate to a first embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus, and FIG. 2 is a sectional view illustrating a schematic configuration of an imaging unit.

As shown in FIG. 1, an endoscope apparatus 10 can be inserted into, for example, a body cavity and has an objective lens or a CC at the tip of the insertion section.
An endoscope 2 having an image pickup unit 1 formed by arranging a solid-state image pickup device such as D, a light source device 3 for supplying illumination light to the endoscope 2 via a light guide fiber, and the endoscope. A camera control unit (hereinafter referred to as CCU) that supplies drive power to the solid-state image sensor of the image pickup unit 1 arranged at the tip of the insertion portion of the mirror 2 and controls signal processing of a subject image formed on the image pickup surface of the solid-state image sensor. It is composed of a peripheral device 5 having a description 4 and a monitor 6 for displaying an endoscopic image on a screen by receiving a video signal obtained by converting an electric signal transmitted to the CCU 4.

The endoscope 2 includes an insertion portion 21 to be inserted into a body cavity and the like, and an operation portion 2 located on the proximal side of the insertion portion 21.
2, a universal cord 23 extending from the side portion of the operation portion 22, a universal connector 24 provided at an end portion of the universal cord 23 on the proximal side, and detachably connected to the peripheral device 5 and the like. There is.

Supply of drive power for driving the solid-state image pickup device of the image pickup unit 1 and transmission / reception of an electric signal of a subject image which is formed on the image pickup surface of the solid-state image pickup device and photoelectrically converted are carried out by the insertion section 21 and the operation section. 22 and the universal cord 23, the signal cable 7 having a plurality of signal lines.

An image pickup device 8 is constituted by the image pickup units 1, CCU 4 and the signal cable 7 connecting the image pickup unit 1 and the CCU 4.

The image pickup unit 1 will be described with reference to FIG. The image pickup unit 1 is mainly provided with a plurality of lenses and serves as an objective lens group 20, and is disposed at an image forming position of the objective lens group 20, and an optical image formed on an image pickup surface is converted into an electric signal. And an image pickup unit 30 that performs photoelectric conversion.

First, the objective lens group 20 will be described. The objective lens group 20 includes a first lens group 21a housed in a first lens frame 21, a second lens group 22a housed in a second lens frame 22, the first lens frame 21 and Insulation frame 2 fitted on the outer periphery of the second lens frame 22
4 and a third lens frame 23 fitted to the outer periphery of the insulating frame 24.

The first lens group 21a and the second lens group 22a are bonded and fixed to the first lens frame 21 and the second lens frame 22 with an adhesive, respectively. Further, the first lens frame 21 and the second lens frame 22 are adhesively fixed to the insulating frame 24 and the third lens frame 22 with an adhesive.

An image pickup portion holder 25 is fitted on the outer peripheral portion of the second lens frame 22 and is integrally fixed to the second lens frame 22 with an adhesive. The second lens frame 22 and the imaging section holder 25 are integrally bonded and fixed by an adhesive after the focus adjustment.

Next, the image pickup section 30 will be described. The image pickup unit 30 is composed of an image pickup element chip 31 having an image pickup surface and a peripheral circuit board 40 having a signal processing circuit formed therein.

A chip protection member 32, which is made of an optical material, is formed on the front surface of the image pickup device chip 31, and the image pickup unit holder 25 is externally fitted to the chip protection member 32.
A package portion 33 provided with 3a and a chip substrate 33b is arranged.

The image pickup device chip 31 is arranged so as to be orthogonal to the optical axis of the objective lens group 20, and the CFA 34 is placed on the image pickup surface side of the image pickup device chip 31 and sealed. It is sealed with a stop resin 35.

Further, from the direction of the back surface of the image pickup surface of the image pickup element chip 31, the external leads 36, 36. . . Of the external leads 36, 36. . . And the image pickup device chip 31, a chip substrate 33b and the chip substrate 33b.
It is electrically connected by an upper wiring (not shown) and a bonding wire (not shown).

A peripheral circuit board 40 whose longitudinal direction is arranged parallel to the optical axis direction of the objective lens group is electrically connected to the external lead 36 by soldering or the like.

One plane of the peripheral circuit board 40 (front side surface)
Is a mounting surface. The IC 41 is sealed by the sealing resin 43 while being electrically wired by the bonding wire 42, and the capacitor 44 is electrically wired by the solder 45 to form a signal processing circuit.

A signal cable 7 is arranged on the other end surface (back side surface) of the peripheral circuit board 40, which is a non-mounting surface on which circuits such as signal processing circuits are not formed. This signal cable 7 includes a plurality of signal lines 71, 7
1. . . And is a composite wire of a shielded wire 71a that is an inner coating and a single wire 71b that is an inner conductor.

Then, the plurality of signal lines 71, 7
1. . . The outer conductors of the shield wire 71a are bundled together so as to be electrically conducted by a cable stopper 72 which is a metal binding member. The plurality of signal lines 71, 71. . . The bundled end portions 73 of the signal lines formed by bundling together are provided behind the cable stopper 72 so as to be located on the back surface of the peripheral circuit board 40. On the other hand, the plurality of signal lines 71, 71. . . The single wires 71b are connected and fixed to the external leads 36 of the image pickup unit 30 and the peripheral circuit board 40, respectively.

A cable protection member 74 is provided on the outer periphery of the signal cable 7. This cable protection member 7
Reference numeral 4 is for reducing damage to other built-in objects arranged in the endoscope or damage to other built-in objects. It is fixed near the end 73.

The bundle end portion 73 of the signal line is an end portion of the outermost covering portion of the signal cable 7, and the bundle end portion 73 is formed from an insulating coating described later by performing a bending operation while the endoscope is being used. If the bundle end portion 73 recedes from the insulating coating, the bending strength in the vicinity of the bundle end portion sharply decreases, which may cause disconnection or defective conductor wire. Therefore, in order not to cause these problems, the second binding member 76 is integrally fixed to the peripheral circuit board 40 so that the bundle end portion 73 does not move closer to the hand side than the insulating coating.

With the above configuration, the optical image of the observation image formed on the image forming surface of the image pickup element chip 31 of the image pickup section 30 is passed through the external leads 36 and the peripheral circuit board 40.
Is output to the CCU 4 through the signal line 71 and the signal cable 7 to be processed into an image signal, which is output to the monitor 6 to display the endoscopic image on the screen.

When forming the image pickup section 30, a plurality of sealing resins are used. The first sealing resin 81 is used to reinforce the external leads 36. Also, IC4
1, the capacitor 44, the signal lines 71, 71. . . After the wiring, the second sealing resin 82 is used to cover the electrically conducting portions such as the external lead 36 and the single wire 71b. By sealing the electrically conductive portion with the second sealing resin 82, a short circuit with the shield member 91 to be assembled later is prevented. Then, when the shield member 91 is assembled to the image pickup unit 30 sealed with the second sealing resin 82,
The third sealing resin 83 is filled between the second sealing resin 82 and the shield member 91. And finally, the insulation coating 92
When the outer periphery of the shield member 91 is covered with, the fourth sealing resin 84 is filled to seal the electrical component portion.

In order to enhance the shield effect of the image pickup section 30, the cable stopper 72 and the external lead 36 are electrically connected by a jumper wire 77, and the cable stopper 72 and the shield member 91 are made of a conductive material. 93
The electrical connection is established by the
The shield member 92 and the shield member 92 are electrically connected by the conductive member 93.

As described above, a signal line formed when a plurality of signal lines of the signal cable such as the signal line directly connected to the external lead of the image pickup section and the signal line connected to the peripheral circuit board are grouped by the cable stopper. By arranging the bundle end portion of the above on the back surface of the peripheral circuit board, the imaging unit is configured from the front end side in the positional relationship of the objective lens, the solid-state image sensor, the peripheral circuit board, and the bundle end portion of the signal line to achieve a hard length. It can be shortened. As a result, the length of the hard portion of the endoscope is shortened, the bendability of the distal end portion of the endoscope is improved, the observation performance is improved, and the pain to the patient is reduced.

By partially assembling the cable protection member and the cable stopper in advance on the signal cable, the assembling workability can be improved.

FIG. 3 is a diagram for explaining the wiring state to the peripheral circuit board according to the second embodiment of the present invention. FIG. 3 is a view of the peripheral circuit board 40 of FIG. 2 viewed from the direction A,
On the surface of the peripheral circuit board 40, lands 46, 46. For connecting the external lead 36, the jumper wire 77, the shield wire 71a of the signal wire 71, the single wire 71b, or the like. . .
Are formed.

These lands 46, 46. . . I previously bonded to the peripheral circuit board 40 by die bonding.
After being connected to C41 via a bonding wire 42, it is sealed with a sealing resin 43. A capacitor 44 is mounted on the peripheral circuit board 40 with solder 45. That is, the peripheral circuit board 40 is a single-sided board in which the IC 41, the capacitor 44, etc. are mounted on the front surface side of the board, and the lands 46, 46. . . Is located on the front surface side, and the bundle end portion 73 of the signal line is arranged on the non-mounting surface on the back surface side of the substrate.

Therefore, the plurality of signal lines 71, 7 of the signal cable 7 arranged on the back surface side of the peripheral circuit board 40.
1. . . Of the lands 46, 46. . . When connecting to the image pickup unit 1, the signal line 71 protrudes from the outer peripheral surface of the peripheral circuit board 40.
The peripheral circuit board 40 is provided with at least one notch 47 for guiding the signal line 71 from the back surface side to the front surface side of the peripheral circuit board 40 so as not to have a large diameter. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof will be omitted.

By forming the notch 47 in the peripheral circuit board 40 as described above, the signal line 71 of the signal cable 7 arranged on the back side of the peripheral circuit board 40,
71. . . The peripheral circuit board 4 through the cutout portion 47.
Guide to the front side of 0. Then, the signal line guided to the front surface side is connected and fixed to a predetermined position on the mounting surface by soldering or the like. For example, the jumper wire 77 is guided from the non-mounting surface on the back surface of the peripheral circuit board 40 to the mounting surface on the front surface through the notch 47, is soldered to the external lead 36b described later, and is connected to the shield member 79a of the shield wire 79. The single wire 79b and the single wire 79c are soldered to the land 46.
Are directly soldered to the electrodes of the capacitor 44.

In this way, when connecting the signal line of the signal cable arranged on the back surface which is the non-mounting surface of the peripheral circuit board to the mounting surface formed on the surface of the peripheral circuit board,
By guiding the signal line of the signal cable to the surface that is the mounting surface through the notch formed in the peripheral circuit board,
The signal line can be guided and connected from the non-mounting surface side to the mounting surface side without protruding from the outer peripheral surface of the peripheral circuit board. As a result, the size of the imaging unit is not increased by guiding the signal line on the non-mounting surface side to the mounting surface side.

Further, since the single-sided board can be used as the peripheral circuit board, the image pickup unit can be constructed at a low cost. Other functions and effects are the same as those of the first embodiment.

Reference numerals 36a and 36b are external leads of the same electrode, and are grounds in this embodiment. In the present embodiment, the conduction of the two electrodes is performed in the image pickup device chip 31, but even if it is performed on the substrate 33a, a structure is adopted in which the conduction is achieved by connecting to the land 46 of the peripheral circuit board 40. Is also good.

Reference numeral 46a indicates the external lead 36.
a is a land to which the a and the external lead 36b are connected, and a slit 46b is formed in the land 46a.
This slit 46b is provided with external leads 36, 36. . . To land 46, 46. . . This is to make the amount of cream solder applied constant in automatic soldering in which cream solder is applied when soldering is performed, and laser light is irradiated to automatically perform soldering.

Further, the lands 46, 46. . . Is
Gold is plated after the conductor is patterned on the peripheral circuit board 40. At this time, the IC 41 and the land 46 are electrically connected to each other in order to perform the electrolytic treatment. After gold plating, a land trimming portion 80 is provided in the vicinity of the cutout portion 47 of the substrate in order to make this portion non-conductive.

By the way, in the prior art, a separate cable stop member is provided on the side closer to the peripheral circuit board, and this cable is divided into the front side and the back side of the board on the side closer to the cable stop member. , The bundle end of the cable is located closer to the hand side than the cable stop member, and the cable is divided into the front side and the back side of the board, so by filling this part with an adhesive, the hard length is increased. Not only does it become longer, but the flow of adhesive becomes unstable,
Eventually, the hard length became unstable. However, by configuring the image pickup unit as described above, the bundle end 7
3 is located on the back side of the peripheral circuit board 40, and the hard length is shortened, and it is not necessary to divide the cable into the front side and the back side and it is not necessary to pour the adhesive into the cable bundle, and the hard length is stabilized.

By the way, when soldering the external leads protruding from the image pickup unit and the lands of the peripheral circuit board, first, the external leads and the lands are aligned using a jig (not shown), and the cream is dispensed by a dispenser. Solder was applied, and then heat was applied to the cream solder for soldering. At this time, the cream solder was applied to the land automatically by a dispenser.

However, when the cream solder is applied by this dispenser, the solder amount on the end side of the soldering amount, which is the coating start portion and the coating end portion, is larger than the solder amounts of other soldering portions. It was For this reason, when soldering, there is a problem that the soldering condition is significantly different depending on whether the soldering condition is set to the both end sides or the central part other than the both end parts, and the fixing state is not stable. . Therefore, it has been desired that the soldering conditions are unified.

Therefore, as shown in FIG. 4, in the present embodiment, the external leads 36, 36. . . The lands 46, 46. of the peripheral circuit board 40 to be soldered with. . . The land width m of the lands 46b on both ends of the lands 46, 46. . . Is formed wider than the land width n. The land 46a is the land 46, 4 on the central side.
6. . . Is formed wider than the land width n.

Therefore, for example, a jig is used to form the external lead 3
6,36. . . And land 46,46. . . When the cream solder 85 is automatically applied by the dispenser after aligning with, the application amount of the cream solder 85 applied by the dispenser is as shown in the figure on both end sides of the application start part and the application end part. Land 4 on both ends
Lands 6a and 46b have lands 46 and 4 on the central side.
6. . . Since it is wider than the land width, the soldering conditions are unified when soldering by applying heat.

In this way, when the soldering work is performed in an automatic process by appropriately setting the land width of the land formed on the peripheral circuit board so that the soldering conditions are substantially unified, the peripheral circuit The soldering conditions are unified on the end side and the center side of the board, and the soldering can be performed under appropriate soldering conditions. As a result, the soldering strength between the external lead and the land is increased and stabilized, and the reliability of connection and fixing by soldering is greatly improved.

When soldering a solid-state image pickup device that is weak to heat, it is desirable to use laser soldering capable of locally irradiating laser light to heat the solder instead of using a thermal probe.

[Additional Notes] 1. A solid-state image pickup device disposed at an image forming position of an objective lens; a peripheral circuit board connected to the solid-state image pickup device for driving the solid-state image pickup device or performing signal processing; and the solid-state image pickup device or the peripheral circuit board. In an imaging device having a camera control unit for controlling, and a signal cable including a plurality of signal lines electrically connecting the camera control unit and the solid-state imaging device or the peripheral circuit board, in an optical axis direction of the objective lens. The peripheral circuit boards are arranged in parallel to each other, and a bundle end portion of signal lines formed when a plurality of signal lines of the signal cable are grouped together is arranged on the peripheral circuit board surface. Image pickup device.

2. A solid-state image sensor disposed at an image forming position of the objective lens and orthogonal to the optical axis of the objective lens, and a peripheral circuit board connected to the solid-state image sensor for driving the solid-state image sensor or performing signal processing. And a camera control unit for controlling the solid-state image sensor or the peripheral circuit board, and a signal cable including a plurality of signal lines electrically connecting the camera control unit and the solid-state image sensor or the peripheral circuit board. In the device, the peripheral circuit board is arranged parallel to the optical axis direction of the objective lens, and a signal line formed when a plurality of signal lines of the signal cable are grouped on the peripheral circuit board surface. Image pickup device for arranging the bundle ends of the.

3. A solid-state image pickup device disposed at an image forming position of an objective lens; a peripheral circuit board connected to the solid-state image pickup device for driving the solid-state image pickup device or performing signal processing; and the solid-state image pickup device or the peripheral circuit board. In an imaging device having a camera control unit for controlling and a signal cable composed of a plurality of signal lines for electrically connecting the camera control unit and the solid-state imaging device or the peripheral circuit board, a cutout portion is provided in the peripheral circuit board. And a plurality of signal lines of the signal cable arranged on one plane of the peripheral circuit board arranged parallel to the optical axis direction of the objective lens, the notch portion formed on the peripheral circuit board. An image pickup apparatus having an image pickup unit which is wired to the other plane of the substrate through the.

4. In a solid-state image sensor having a solid-state image sensor arranged at an image forming position of an objective lens, and a peripheral circuit board connected to the solid-state image sensor to drive the solid-state image sensor or perform signal processing, the solid-state image sensor Of the lands provided on the peripheral circuit board to which the external leads extending from are soldered, the land width of the lands located on both end sides is smaller than the land width of the land located on the central side of the peripheral circuit board. A wide imaging device.

[0056]

As described above, according to the present invention, it is possible to provide an image pickup apparatus for reducing the hard length of an image pickup unit formed by including an objective lens, a solid-state image pickup device and the like.

[Brief description of drawings]

1 and 2 relate to a first embodiment of the present invention,
FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope apparatus.

FIG. 2 is a sectional view illustrating a schematic configuration of an image pickup unit.

FIG. 3 is a diagram illustrating a wiring state to a peripheral circuit board according to a second embodiment of the invention.

FIG. 4 is an explanatory diagram showing a land configuration and a solder application state on the land.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Imaging unit 7 ... Signal line 20 ... Objective lens group (objective lens) 30 ... Imaging part (solid-state image sensor) 40 ... Peripheral circuit board 71 ... Signal line 73 ... Bundle end part

Claims (1)

[Claims] 1. A solid-state image sensor arranged at an image-forming position of an objective lens, a peripheral circuit board connected to the solid-state image sensor to drive the solid-state image sensor or perform signal processing, and the solid-state image sensor. Alternatively, in the imaging device having a camera control unit for controlling the peripheral circuit board and a signal cable including a plurality of signal lines electrically connecting the camera control unit and the solid-state imaging device or the peripheral circuit board, the objective lens While arranging the peripheral circuit board parallel to the optical axis direction of the signal cable, a bundle end portion of signal lines formed when a plurality of signal lines of the signal cable are grouped is arranged on the peripheral circuit board surface. An imaging device characterized by: