JPH0957610A - Surface plate washing device of lapping machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically wash the surface of a surface plate without stopping a lapping machine for long hours, by providing a jet nozzle and suction ports on a straight traveling arm or a turning arm, ejecting high-pressure wash water to the surface of the surface plate from the jet nozzle, sucking washed slurry together with wash water through the suction ports to be discharged. SOLUTION: A pressure water piping 7 and vacuum pipings 6-1, 6-2 are arranged in parallel on a straight traveling arm to be moved in the radial directions of upper and lower discs 21, 22 or a turning arm 20 having the turning center O outside the rotation of a surface plate, so that a jet nozzle 23 and suction ports 24-1, 24-2 may be positioned near the tips. The pressure water piping 7 is connected to a pressure water inlet 25 provided on a fixed part, and into which external pressure water enters, and the vacuum pipings 6-1, 6-2 are connected to a vacuum port 26 connected to an external vacuum system. High-pressure wash water is ijected to the surface of the surface plate from the jet nozzle 23, and slurry is sucked together with wash water through the suction ports 24-1, 24-2 to be discharged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a platen cleaning apparatus for cleaning and removing dirt including solids accumulated in the grooves of a platen of a lapping machine for polishing parallel flat surfaces of a plate-like body such as a silicon wafer. Is.

[0002]

2. Description of the Related Art A wafer lap machine (polishing machine) is used to process a parallel plane of a silicon wafer or the like with high precision. This wafer lapping machine has a mechanism in which free silica particles (slurry) are put between upper and lower platens, and the work itself rotates while the work itself rotates by the rotational motion (upward and reverse rotation) of the platens. Narrow and deep grooves are formed on the surfaces of the upper and lower surface plates, and the shape of the grooves is optimal for discharging free slag (slurry) and abrasive powder of the work and plays an important role in processing accuracy. Therefore, the solid foreign matter deposited in the groove is regularly cleaned and removed.

[0003]

The periodic cleaning for removing the solid foreign matter accumulated in the groove of the surface plate requires a long time for the wafer lapping machine to stop and manpower, and the work involves diving into the machine. The current situation is that you cannot get out of danger. In addition, an automated washing machine is required to be one that should not damage the lapping machine body, surface plate, etc. in any case, but a washing machine that satisfies this requirement is still being developed. The current situation is that it has not been done.

[0004] In addition, a robot that stops the upper and lower surface plates and simply traces aiming at the groove streak in order to appropriately vacuum the high-pressure water jet and the sludge can be considered, but this makes the mechanism complicated, There is a problem of becoming an expensive machine.

The present invention has been made in view of the above-mentioned points, and the solid foreign matter deposited and adhering to the narrow and deep grooves of the upper and lower surface plates of the lapping machine is removed using a water jet, and the flat plate to be processed of the lapping machine is removed. It is an object of the present invention to provide a surface plate cleaning device for a lapping machine, which has a relatively simple structure and can maintain the precision of the parallel-plane machined surface in the ultraprecision machining accuracy.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 is a lapping machine of a lapping machine having a disk-shaped surface plate having a groove on its surface and rotating at a constant speed. A surface plate cleaning device for a lapping machine that cleans and removes dirt including solids accumulated in a groove, which is a straight arm that moves in the radial direction of the surface plate or a swing arm that has a swing center outside the rotation of the surface plate. The pressure water pipe connected to the jet nozzle and the vacuum pipe connected to the suction port are arranged in parallel so that the jet nozzle and the suction port are located in the vicinity of the tip, and the pressure water pipe and the vacuum pipe are provided on the fixed part. And a vacuum port connected to an external vacuum system.

According to a second aspect of the present invention, in the surface plate cleaning apparatus for a lapping machine according to the first aspect, the surface plate is composed of upper and lower surface plates having substantially the same diameter, and the upper and lower surface plates are predetermined. It is configured to rotate in the same direction with an interval of, the pressure water pipe is one, the nozzles are arranged at vertically symmetrical positions at the tip, and the cylindrical roller is rotatable around the pressure water pipe. The vacuum pipe is arranged such that the suction port at the tip thereof is located downstream of the nozzles in the rotational direction of the upper and lower surface plates.

According to a third aspect of the present invention, in the surface plate cleaning apparatus for the lapping machine according to the first aspect, the surface plate is composed of upper and lower surface plates having substantially the same diameter, and the upper and lower surface plates are predetermined. It is configured to rotate in the opposite direction at intervals of, with one pressure water pipe, the nozzles are arranged vertically symmetrically at the tip, and a cylindrical roller is rotatably mounted around the pressure water pipe. The vacuum pipe is arranged such that the suction port at its tip is located downstream of the nozzle in the rotational direction of the upper and lower platens.

According to a fourth aspect of the present invention, in the surface plate cleaning apparatus for a lapping machine according to the third aspect, the surface plate is composed of upper and lower surface plates having substantially the same diameter, and the upper and lower surface plates are 10 -10
The nozzles are configured to rotate in the opposite direction at intervals of 0 mm or less so that the absolute values of their rotational speeds differ by up to about 10 times, have only one pressure water pipe, and the nozzles that are arranged at vertically symmetrical positions at their tips are A flat spray nozzle or a cone spray nozzle is used, and its spray angle is characterized in that the spray angle for a surface plate having a high absolute value of rotation speed is smaller than the spray angle for a low surface plate.

According to a fifth aspect of the present invention, in the surface plate cleaning apparatus for a lapping machine according to any one of the first to fourth aspects, the straight-moving speed of the straight-moving arm or the turning speed of the turning arm is adjustable. A control means is provided for fast-forwarding from the standby position of the arm to the cleaning start point and to the standby position when resetting after an emergency stop.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are views showing the structure of a surface plate cleaning apparatus for a lapping machine according to the present invention. FIG. 1 is a plan view and FIG.
Is a side view. In the figure, reference numeral 20 denotes a swivel arm which can be located between an upper surface plate 21 and a lower surface plate 22 of the lapping machine, and has a swivel center O outside the rotation of the upper and lower surface plates 21 and 22. Although not shown, a narrow and deep groove is formed on the lower surface of the upper surface plate 21 and the upper surface of the lower surface plate 22, which is optimum for discharging the polishing powder of the work and plays an important role in the processing accuracy.

The swing arm 20 includes a mounting plate 4 and an arm 5.
The front end of the mounting plate 4 and the rear end of the arm 5 are joined together, and the rear end of the mounting plate 4 is rotatably attached to the boss 3. A pressure water pipe 7 connected to a jet nozzle 23 for injecting pressure water at the tip is arranged in the central longitudinal direction of the arm 5, and the upper suction port 24-1 and the bottom are provided at both ends on both sides of the pressure water pipe 7. The vacuum pipes 6-1 and 6-2 connected to the suction ports 24-2 are arranged. Reference numeral 8 is a pipe clamp for fixing the pressure water pipe 7 and the vacuum pipes 6-1 and 6-2 to the upper surface of the arm 5. In addition, in FIG. 3, the jet nozzle 23 is shown, and the upper and lower suction ports 24-
1, 24-2 are omitted. Further, in FIG. 4, the upper and lower suction ports 24-1 and 24-2 are shown, and the jet nozzle 23 is omitted.

Near the swivel center O of the swivel arm 20, one end of a flexible pressure hose 13 is connected to the rear end of the pressure water pipe 7, and the rear ends of the vacuum pipes 6-1 and 6-2 are connected to each other. It is connected by a pipe 27, and one end of a flexible suction hose 12 is connected to the connection pipe 27. The other ends of the pressure hose 13 and the suction hose 12 are connected to a pressure water inlet 25 and a vacuum port 26 attached to the fixed portion. Further, the pressure water inlet 25 is connected to an external high pressure water pipe so as to allow high pressure water to enter as described later, and the vacuum port 26 is connected to an external vacuum suction pipe.

Reference numeral 14 is an actuator, and the actuator 14 is mounted on an actuator mounting plate 2 fixed to the base 1. The actuator 14 is equipped with a motor, a speed reduction mechanism, etc., so that the revolving arm 20 can be revolved around the revolving center O (center boss 3). In addition, 9 is a guide, 10 is a stopper, and 11 is a standby deck.

FIG. 3 is a view showing the structure of the pressure water pipe 7 and the jet nozzle 23 connected to the tip thereof. The jet nozzle 23 includes an upper nozzle 23a and a lower nozzle 2 that form a fan-shaped jet water W at a predetermined angle vertically as shown in the figure.
3b is provided. Further, a cylindrical roller 28 is attached near the jet nozzle 23 so as to be rotatable around the pressure water pipe 7. Upper nozzle 23a and lower nozzle 2
The jet water W jetted from 3b has a fan shape, and the fan angle of the upper nozzle 23a is substantially in the radial direction of the upper platen 22, and the fan angle of the lower nozzle 23b is the circumferential direction of the lower platen 21. I am trying to become. The upper nozzle 23a
A flat play type or cone spray type nozzle is used for the lower nozzle 23b.

FIG. 4 is a view showing the structure of the vacuum pipe 6 and the suction port connected to the tip thereof, and FIG. 4 (a) shows the upper surface plate 2
1 shows the structure of the upper suction port 24-1 for 1 and the structure of the lower suction port 24-2 for the lower surface plate 22 is shown in FIG. As shown in FIG. 3A, the upper suction port 24-1 has an opening 24-1a facing the lower surface of the upper surface plate 21,
The lower suction port 24-2 has an opening 24-2a facing the upper surface of the lower surface plate 22.

In the lapping machine cleaning apparatus of the above structure, the revolving arm 20 is on the standby deck 11, and when cleaning the upper and lower lapping machines of the wafer lapping machine, the upper surface plate 21 and the lower surface plate 22 are properly spaced. Open the appropriate distance (for example, about 50 mm), and rotate the upper surface plate 21 and the lower surface plate 22 in the same direction or in opposite directions, and insert the revolving arm 20 in this interval. As a result, as shown in FIGS.
The suction port 24-1 for the upper surface plate 21 approaches the lower surface of the upper surface plate 21, and the suction port 24-2 for the lower surface plate 22 approaches the lower surface plate 21 for the upper surface. Further, when the turning arm 20 is inserted, the roller 28 moves the lower surface plate 22.
Rolls on the upper surface of while rotating around the pressure water pipe 7.

When the upper surface plate 21 and the lower surface plate 22 rotate in opposite directions, the upper suction port 24-1 and the lower suction port 24-2 are respectively aligned with the rotation directions of the upper surface plate 21 and the lower surface plate 22. It is arranged on the downstream side of the jet nozzle 23 so that the sludge flowing out by the jet water W can be immediately sucked.

The upper nozzle 23a and the lower nozzle 23b of the jet nozzle 23 spray a fan-shaped jet water W onto the upper surface plate 21 and the lower surface plate 22 to form upper and lower suction ports 24-1, 24-2.
Water and sludge are vacuumed from the respective openings 24-1a and 24-2a. At this time, the revolving arm 20 is automatically swung in the radial direction with respect to the upper and lower surface plates 21 and 22, so that the jet nozzle 23 and the upper and lower suction ports 24-
1,24-2 are automatically fed in the radial direction to the upper and lower surface plates 21 and 22.
The surfaces 1 and 22 are automatically cleaned.

In the above example, the upper and lower surface plate 2 of the lapping machine
Although the distance between the first and second members 22 and 22 is made to be movable within 50 mm, it is also possible to make them movable within, for example, 10 to 100 mm. Further, the number of rotations of the surface plate is such that the upper surface plate 21 rotates left and N ₁ rpm, the lower surface plate 22 rotates right and N ₂ rpm, and the ratio N ₂ / N ₁ ≈3.5. It is also possible that 21 and 22 rotate in the same direction or in the reverse direction, and the absolute values of the rotation speeds differ by up to about 10 times.

FIG. 5 is a view showing the arrangement of the lapping machine and the platen cleaning device and the structure of its drive system. A plurality of (nine in the figure) lapping machines RM are arranged, and the surface plate cleaning device 100 of the present invention is arranged in each of the lapping machines RM. Each platen cleaning device 100 is connected to a high pressure water pipe 102 via a high pressure water electromagnetic valve 101, and is connected to a vacuum suction pipe 104 via a vacuum electromagnetic valve 103. The high pressure water solenoid valve 101 is connected to the pressure water inlet 25 of FIG. 1, and the vacuum solenoid valve 103 is connected to the vacuum port 26.

The high-pressure water pipe 102 is connected to the high-pressure pump 105, and by activating the high-pressure pump 105, the water in the water storage tank 106 is pressure-fed to the high-pressure water pipe 102.
Further, the vacuum suction pipe 104 is connected to a vacuum tank 107, the vacuum tank 107 is connected to a vacuum pump 108, the vacuum tank 107 is connected to a separator tank 109, and the vacuum pump 108 is started to activate the vacuum tank 107. The inside is evacuated, and the vacuum suction is transmitted to each surface plate cleaning device 100 via the vacuum suction pipe 104. Also, a mud discharge pipe 110 is connected to the vacuum tank 107 so that mud such as slurry accumulated in the vacuum tank 107 can be discharged to the outside.

In the wafer lapping machine factory, the lapping machines RM of large and small types are arranged, and the high pressure water pump 105,
Water storage tank 106, vacuum tank 107, vacuum pump 10
8. The separator tank 109 is arranged in one place, and the platen cleaning devices 100 arranged in each lapping machine RM are connected by a high pressure water pipe 102 and a vacuum suction pipe 104. The high-pressure water solenoid valve 101 and the vacuum solenoid valve 103 of each platen cleaning device 100 are opened and closed by a command from a control panel (not shown),
Injection of high-pressure water from the jet nozzle 23 and suction by the upper and lower suction ports 24-1, 24-2 are automatically performed.

The operation control of the platen cleaning apparatus 100 (mainly the activation control of the actuator 14) is performed by electricity (air
Hydraulic pressure may be used). Further, in this control, the revolving speed of the revolving arm 20 is adjustable, and there is also control means for fast-forwarding from the standby position of the revolving arm 20 (the upper surface of the standby deck 11) to the cleaning start point and to the standby position when resetting after an emergency stop. Have

In the above example, the jet nozzle 23 and the vertical suction port 24 provided on the swivel arm 20 which swivels around the swivel center O outside the rotation of the upper and lower surface plates 21 and 22.
Although the example in which the 1, 24-2 swivel in the radial direction of the upper and lower surface plates 21, 22 has been shown, the jet nozzle and the upper and lower suction ports may be provided in a rectilinear arm configured to rectilinearly move in the radial direction.

[0026]

As described above, according to the present invention, the jet nozzle and the suction port are provided in the rectilinear arm that moves in the radial direction of the surface plate or the swivel arm that has a swivel center outside the rotation of the surface plate. High-pressure washing water is jetted from the jet nozzle onto the surface of the surface plate, the washed slurry is sucked and discharged together with the cleaning water at the suction port, and the surface plate surface is automatically cleaned, so that the following excellent effects are obtained.

(1) There is no need to perform a manual washing operation, which is dangerous, without suspending the lapping machine for a long time. (2) Lapping machine main body and lapping machine with a simple structure capable of holding ultra-precision machining of the lapping machine without causing damage such as scratching the lapping machine requiring accuracy of plane parallelism Can be provided relatively inexpensively.

[Brief description of drawings]

FIG. 1 is a plan view showing the structure of a surface plate cleaning apparatus for a lapping machine according to the present invention.

FIG. 2 is a side view showing the structure of a platen cleaning device for a lapping machine according to the present invention.

FIG. 3 is a side sectional view showing the structures of a pressure water pipe and a jet nozzle.

FIG. 4 is a view showing the structure of a vacuum pipe and a suction port, FIG. 4A is a side sectional view showing a structure of an upper suction port, and FIG. 4B is a side sectional view showing a structure of a lower suction port.

FIG. 5 is a diagram showing an arrangement of a lapping machine and a platen cleaning device and a configuration of a drive system thereof.

[Explanation of symbols]

 1 Base 2 Actuator Mounting Plate 3 Boss 4 Mounting Plate 5 Arm 6-1 Vacuum Piping 6-2 Vacuum Piping 7 Pressure Water Piping 8 Piping Clamp 9 Guide 10 Stopper 11 Standby Deck 12 Suction Hose 13 Pressure Hose 14 Actuator 20 Swing Arm 21 Top Surface plate 22 Lower surface plate 23 Jet nozzle 24-1 Upper suction port 24-2 Lower suction port 25 Pressure water inlet 26 Vacuum port 27 Connection pipe 28 Roller

Claims (5)

[Claims] 1. A lapping machine surface plate for cleaning and removing dirt including solids accumulated in the groove of the lapping machine surface of a lapping machine equipped with a disk-shaped surface plate having a groove on its surface and rotating at a constant speed. In the cleaning device, a straight arm that moves in a radial direction of the surface plate or a rotation arm having a rotation center outside the rotation of the surface plate includes a pressure water pipe connected to a jet nozzle and a vacuum pipe connected to a suction port. The jet nozzle and the suction port are arranged in parallel so that they are located near the tip, and the pressure water pipe and the vacuum pipe are provided in the fixed part. A lapping machine surface plate cleaning device characterized by being connected to. 2. The surface plate is composed of upper and lower surface plates having substantially the same diameter, and the upper and lower surface plates are configured to rotate in the same direction at a predetermined interval, and one pressure water pipe is provided. , The nozzles are arranged at vertically symmetrical positions at its tip, a cylindrical roller is attached rotatably around the pressure water pipe, and the vacuum pipe has a suction port at the tip of the upper and lower sides with respect to the nozzle. The platen cleaning device for a lapping machine according to claim 1, wherein the platen cleaning device is arranged so as to be located on the downstream side in the rotation direction of the platen. 3. The platen is composed of upper and lower platens having substantially the same diameter, and the upper and lower platens are configured to rotate in opposite directions at a predetermined interval, and one pressure water pipe is provided. The nozzles are arranged at vertically symmetrical positions at the tip of the nozzle, a cylindrical roller is rotatably mounted around the pressure water pipe, and the vacuum pipe has a suction port at the tip of the platen above and below the nozzle. The platen cleaning device for a lapping machine according to claim 1, wherein the platen cleaning device is arranged so as to be located on the downstream side in the rotation direction of the. 4. The surface plate is composed of upper and lower surface plates having substantially the same diameter, and the upper and lower surface plates rotate in opposite directions at a predetermined interval, and the absolute value of the rotation speed is up to about 10 times. The pressure water pipes are different from each other, and the nozzles arranged at vertically symmetrical positions at the tip are flat spray nozzles or cone spray nozzles, and the spray angle is for a surface plate having a high absolute value of rotation speed. The surface plate cleaning apparatus for a lapping machine according to claim 3, wherein the spray angle is smaller than the spray angle for a low surface plate. 5. A control means for adjusting the straight-ahead speed of the straight-ahead arm or the swivel speed of the swivel arm for fast-forwarding from a standby position of the arm to a cleaning start point and to a standby position when resetting after an emergency stop is provided. The surface plate cleaning device for a lapping machine according to any one of claims 1 to 4, wherein