JPH09505638A - ディスク状のワークを処理するための装置 - Google Patents
ディスク状のワークを処理するための装置Info
- Publication number
- JPH09505638A JPH09505638A JP7529333A JP52933395A JPH09505638A JP H09505638 A JPH09505638 A JP H09505638A JP 7529333 A JP7529333 A JP 7529333A JP 52933395 A JP52933395 A JP 52933395A JP H09505638 A JPH09505638 A JP H09505638A
- Authority
- JP
- Japan
- Prior art keywords
- seal
- processing
- compartment
- processing compartment
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatment Of Fiber Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.処理浴(BB)を備えた少なくとも1つの処理区画室(BZ)内を水平な 搬送路に沿って垂直な状態で案内されるディスク状のワーク(W)、特にプリン ト配線板を処理するための装置であって、処理区画室(BZ)の端壁に、ワーク (W)を通過させるための垂直なスリット(S)が設けられており、かつ、この 垂直なスリットにシール(D)が対応して配置されている形式のものにおいて、 このシール(D)が、垂直な向きで処理浴(BB)内にルーズに対をなして配置 されたロッド又は管により形成されており、これらのロッド又は管が、液圧によ り互いに、又はそのつど通過するワーク(W)と処理区画室(BZ)の対応する 端壁とに圧着されることを特徴とするディスク状のワークを処理するための装置 。 2.ロッド又は管が円筒状横断面を有していることを特徴とする請求項1記載 の装置。 3.シール(D)が処理区画室(BZ)の端面側に設けられたスルース室(S K)内に配置されていることを特徴とする請求項1又は2記載の装置。 4.シール(D)がプラスチックから成ることを特徴とする請求項1から3ま でのいずれか1項記載の装置。 5.シール(D)が垂直方向で複数のセグメント( SG)からルーズに組み合わされていることを特徴とする請求項1から4までの いずれか1項記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4416708 | 1994-05-11 | ||
DE4416708.3 | 1994-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09505638A true JPH09505638A (ja) | 1997-06-03 |
JP2749452B2 JP2749452B2 (ja) | 1998-05-13 |
Family
ID=6517920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7529333A Expired - Fee Related JP2749452B2 (ja) | 1994-05-11 | 1995-05-09 | ディスク状のワークを処理するための装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5772765A (ja) |
EP (1) | EP0760023B1 (ja) |
JP (1) | JP2749452B2 (ja) |
CN (1) | CN1098375C (ja) |
DE (1) | DE59500956D1 (ja) |
DK (1) | DK0760023T3 (ja) |
ES (1) | ES2109104T3 (ja) |
WO (1) | WO1995031589A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002275681A (ja) * | 2001-03-15 | 2002-09-25 | Chuo Seisakusho Ltd | めっき装置の液漏れ防止機構 |
KR100867301B1 (ko) * | 2007-03-15 | 2008-11-10 | (주)포인텍 | 표면처리조 |
JP2010174265A (ja) * | 2009-01-27 | 2010-08-12 | Sumitomo Metal Mining Co Ltd | フープ材のめっき装置、及びそれを用いたフープ材の連続めっき方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19813528A1 (de) | 1998-03-26 | 1999-10-07 | Siemens Sa | Vorrichtung zur Behandlung von plattenförmigen Werkstücken, insbesondere Leiterplatten |
TW438906B (en) * | 1998-06-11 | 2001-06-07 | Kazuo Ohba | Continuous plating apparatus |
US7204918B2 (en) * | 2003-03-10 | 2007-04-17 | Modular Components National, Inc. | High efficiency plating apparatus and method |
DE102005033784A1 (de) * | 2005-07-20 | 2007-01-25 | Viktoria Händlmeier | System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US312451A (en) * | 1885-02-17 | Manufacture of tarred paper | ||
US3120795A (en) * | 1957-03-21 | 1964-02-11 | Polaroid Corp | Photographic products |
US4401522A (en) * | 1980-09-29 | 1983-08-30 | Micro-Plate, Inc. | Plating method and apparatus |
US4724856A (en) * | 1986-03-17 | 1988-02-16 | Pender Don P | Dynamic flood conveyor |
US4812101A (en) * | 1987-04-27 | 1989-03-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method and apparatus for continuous throughput in a vacuum environment |
DE3733996A1 (de) * | 1987-10-08 | 1989-04-20 | Kuesters Eduard Maschf | Vorrichtung zur zufuhr einer fluessigkeit in einen laenglichen fluessigkeitsvorrat |
DE3929728A1 (de) * | 1989-09-07 | 1991-03-14 | Werner M Kraemer | Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage |
CN1057803A (zh) * | 1990-06-28 | 1992-01-15 | 林森义 | 不锈钢金属表带的制法 |
US5186279A (en) * | 1991-03-08 | 1993-02-16 | Ball Corporation | Method and apparatus for lubricating tab stock |
US5592958A (en) * | 1995-02-01 | 1997-01-14 | Coates, Asi, Inc. | Flood conveyer |
-
1995
- 1995-05-09 WO PCT/EP1995/001754 patent/WO1995031589A1/de active IP Right Grant
- 1995-05-09 CN CN95193021A patent/CN1098375C/zh not_active Expired - Fee Related
- 1995-05-09 ES ES95921737T patent/ES2109104T3/es not_active Expired - Lifetime
- 1995-05-09 EP EP95921737A patent/EP0760023B1/de not_active Expired - Lifetime
- 1995-05-09 US US08/737,257 patent/US5772765A/en not_active Expired - Fee Related
- 1995-05-09 JP JP7529333A patent/JP2749452B2/ja not_active Expired - Fee Related
- 1995-05-09 DE DE59500956T patent/DE59500956D1/de not_active Expired - Fee Related
- 1995-05-09 DK DK95921737.3T patent/DK0760023T3/da active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002275681A (ja) * | 2001-03-15 | 2002-09-25 | Chuo Seisakusho Ltd | めっき装置の液漏れ防止機構 |
JP4591984B2 (ja) * | 2001-03-15 | 2010-12-01 | 株式会社中央製作所 | めっき装置の液漏れ防止機構 |
KR100867301B1 (ko) * | 2007-03-15 | 2008-11-10 | (주)포인텍 | 표면처리조 |
JP2010174265A (ja) * | 2009-01-27 | 2010-08-12 | Sumitomo Metal Mining Co Ltd | フープ材のめっき装置、及びそれを用いたフープ材の連続めっき方法 |
Also Published As
Publication number | Publication date |
---|---|
DK0760023T3 (da) | 1998-04-27 |
WO1995031589A1 (de) | 1995-11-23 |
US5772765A (en) | 1998-06-30 |
EP0760023B1 (de) | 1997-11-05 |
JP2749452B2 (ja) | 1998-05-13 |
DE59500956D1 (de) | 1997-12-11 |
CN1147839A (zh) | 1997-04-16 |
ES2109104T3 (es) | 1998-01-01 |
CN1098375C (zh) | 2003-01-08 |
EP0760023A1 (de) | 1997-03-05 |
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