JPH0949070A - Jig for vapor deposition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the dislodgment of Au sticking to a substrate holder made of Cu onto a plastic substrate at the time of vapor deposition and to improve the yield of products by providing the surface of the holder with a Pt plating layer, then further, forming a metallic plating layer having good adhesion to Au at the time of depositing Au by evaporation on the substrate by using the holder. SOLUTION: This jig (substrate holder) for vapor deposition is formed of Cu or Cu alloy having good heat radiatability and the surface thereof is provided with the Pt plating layer. The surface of the Pt plating layer is further plated with any of Au, Ag, Cu or Ni. The thickness of the plating layer of Au, Ag, etc., formed on the Pt plating surface is specified to 0.1 to 1.0μm. Not only the yield of the products is improved but also the recovery of the Au sticking to the surface of the jig for vapor deposition by a treatment with chemical materials and move the regeneration of the jig are facilitated by the double layer plating treatment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor deposition jig used for sputtering, ion plating, etc., and is particularly suitable for forming a vacuum thin film on a plastic substrate such as CD or CDR. It is about.

[0002]

2. Description of the Related Art Vacuum thin film forming techniques represented by sputtering, ion plating, vacuum deposition and the like are widely used in the semiconductor industry. When forming a vacuum thin film on a base material, it is common to mount the base material on a deposition jig called a holder and form a thin film on the base material. Generally, stainless steel or titanium is used as the material of the deposition jig. However, when a thin film is formed on a plastic substrate such as an optical disk, a vapor deposition jig made of Cu or a Cu alloy is used in order to improve heat radiation and prevent deformation and deterioration of the substrate. Peeling off the deposited material deposited on the Cu or Cu alloy deposition jig is performed by a sandblast method. Noble metal such as Au or Ag is Cu
Alternatively, when the Cu alloy is attached to a jig for vapor deposition, if it is similarly peeled by the sandblast method, about 90% of the precious metal can be recovered as largely peeled precious metal. However, the remaining 10% is mixed in the emery. If the noble metal mixed into the emery is recovered, the recovery rate can be increased, but it takes much time and effort. To recover all the precious metals, the precious metals can be easily recovered by treating with a chemical solution such as aqua regia, nitric acid, or cyanide. But,
Since the evaporation jig made of Cu or Cu alloy does not have corrosion resistance, the base material is also melted, and the evaporation jig cannot be reused. Noble metals are also expensive materials, but vapor deposition jigs are also expensive, so the former method, which allows the vapor deposition jigs to be regenerated, is usually adopted.

From the above, the applicant of the present invention satisfactorily dissipates heat by providing a Pt plating layer on the surface of a jig for vapor deposition made of Cu or Cu alloy, particularly in vapor deposition on a plastic substrate. It is possible to prevent the deformation of the plastic base material, and vapor-deposited on the surface of the vapor deposition jig during vapor deposition.
We have developed a vapor deposition jig that can recover and recycle u, Ag, and Pd, and a method for regenerating it. (Japanese Patent Application No. 6-28890
However, when Au vapor deposition is performed on a plastic substrate using the vapor deposition jig provided with this Pt plating layer, the adhesion between Pt and Au on the vapor deposition jig surface is low. The problem of Au exfoliation occurred. The exfoliated Au drops onto the material to be vapor-deposited, which is a plastic substrate, and then CDs.
There is a possibility that quality of CDR and CDR will be affected. In particular, many problems occur when the surface of the evaporation jig before Pt plating is performed by the etching method. It is considered that the reason for this is that the one using the etching method has a smoother surface and further reduces the adhesion strength between Pt and Au.

[0004]

SUMMARY OF THE INVENTION Therefore, the present invention increases the adhesion strength of Au to the vapor deposition jig during vapor deposition of Au on the plastic substrate mounted on the vapor deposition jig and eliminates the exfoliation of Au. CD, C without falling to
An object of the present invention is to provide a deposition jig capable of preventing the occurrence of defects in products such as DR.

[0005]

A vapor deposition jig of the present invention for solving the above-mentioned problems is provided with a Pt plating layer on the surface of a vapor deposition jig made of Cu or a Cu alloy.
It is characterized in that a plating layer of any one of Au, Ag, Cu and Ni is provided on the surface of the plating layer. This vapor deposition jig is particularly preferable for forming a vacuum thin film on a plastic substrate such as CD or CDR. The thickness of the plating layer in the above evaporation jig is preferably 0.1 to 1.0 μm.

[0006]

As described above, in the evaporation jig of the present invention, any one of Au, Ag, Cu and Ni is formed on the surface of the Pt plating layer.
Since the metal plating layer having good adhesion to Au is provided, when Au is vapor-deposited on the plastic substrate mounted on the evaporation jig, the adhesion strength of Au also mounted on the evaporation jig is increased. Therefore, there is no exfoliation of Au during the evaporation work,
Since it does not fall onto the plastic substrate, the incidence of defective products such as CDs and CDRs is greatly reduced.

[0007]

EXAMPLES Examples and conventional examples of the evaporation jig of the present invention will be described. Prior to a concrete example, a material test will be described. Cu having a length of 40 mm, a width of 20 mm and a thickness of 0.5 mm is used.
Prepared test pieces were prepared. As Example 1, this was directly subjected to degreasing and activation treatment, then subjected to Pt plating (Platinate 100: used by Nippon Electroplating Engineering Co., Ltd.) 5 μm, washed with water, and further subjected to Au plating (Aurobond TN: Japan). Electroplating Engineering (manufactured by The Company)) 0.1 μm. Next, as in Example 2, the prepared Cu test piece was sandblasted for 3 minutes to roughen the surface, and then Pt-plated and then Au-plated as in Example 1. In addition, as Conventional Example 1, the prepared Cu test piece was subjected to degreasing and activation treatment, and then subjected to only Pt plating of 5 μm. In Conventional Example 2, a prepared Cu test piece was sandblasted for 3 minutes to roughen the surface, and then, similarly to Conventional Example 1, only Pt plating of 5 μm was applied.

Au for compact discs was added to the test pieces prepared in Example 1, Example 2, Conventional Example 1 and Conventional Example 2.
Au was sputtered every 1000 times under the condition of vapor deposition. Every 1000 times, it was confirmed whether Au was likely to be exfoliated, and the process was repeated until it was about to be exfoliated. First
It is confirmed that the test piece coated with 1000 times Au sputtering does not exfoliate Au. If it does not occur, it is immersed in a cyan-based Au solution (containing potassium cyanide and a reaction accelerator) at 50 ° C and air is blown into it. , The Au coating was dissolved. After that, for the test pieces of Examples 1 and 2, Au plating 0.1 μm was again used using Aurobond TN.
The test pieces of Conventional Examples 1 and 2 were subjected to Au sputtering as they were. Table 1 shows the results of examining the number of times the sputtering was repeated until the sputtering was repeated until the Au was not exfoliated during the sputtering.

[0009]

[Table 1]

As is clear from Table 1, the number of times that sputtering is possible is significantly improved in the test piece plated with Au as compared with the test piece not plated with Au.

Next, specific examples and conventional examples will be described. As shown in Fig. 1, a plurality of mounting screw pins 2 are fixedly mounted on the lower surface of a circular Cu lower piece 1 having a diameter of 140 mm and a thickness of 12 mm. An annular Cu upper piece 3 having an inner diameter of 120 mm, an outer diameter of 140 mm, and a height of 8 mm is fixed from the lower side with a set screw 4 to form a Cu vapor deposition jig 5. The Cu vapor deposition jig 5 is formed. As a conventional example, a Pt plating layer 6 of 5 μm is applied to the surface of, and as an example, an Au plating layer 7 is further formed on the Pt plating layer 6.
0.5 μm is applied. A donut-shaped plastic substrate 9 having a circular hole 8 with an inner diameter of 15 mm in the central portion as shown in FIG. 2 was attached to both of these evaporation jigs as shown in FIG.
Au was vapor-deposited on the plastic substrate 9 by sputtering. As a result, as shown in FIG. 4, Au10 adhered to the outer peripheral surface of the evaporation jig that was exposed after the plastic substrate was mounted, the upper and inner peripheral surfaces of the upper piece 3, and the central portion of the upper surface of the lower piece 1. During the work of vapor deposition of Au on the plastic substrate 9 by the above-mentioned sputtering, in the conventional vapor deposition jig, P
Since the adhesion strength between the t-plated layer 6 and the evaporated Au is not high,
Very rarely, Au peels off and this is the plastic substrate 9
However, in the case of the vapor deposition jig of the example, since the adhesion strength between the Au plating layer 7 and the vapor deposition Au was high, Au was completely eliminated. Without exfoliation,
Therefore, the product did not fall onto the plastic substrate 9 and the product quality was good.

The above-described embodiment of the vapor deposition jig of the present invention is
Although the Au plating layer 7 is applied to the Pt plating layer 6 by 0.5 μm, the same results as above can be obtained with an Ag plating layer, a Cu plating layer, a Ni plating layer, or the like. The reason for setting the thickness of these plating layers to 0.1 to 1.0 μm is that the adhesion strength with the vapor deposition Au is insufficient when the thickness is less than 0.1 μm, and the adhesion strength does not increase further when the thickness is 1.0 μm or more, resulting in high cost. Is.

[0013]

As can be seen from the above description, the vapor deposition jig of the present invention has the plating layer of any one of Au, Ag, Cu, and Ni provided on the outermost surface thereof. Au for the jig for vapor deposition during Au vapor deposition on the substrate
It is possible to prevent the occurrence of defective products such as CDs and CDRs by eliminating the peeling of Au and eliminating the drop on the plastic substrate.

[Brief description of drawings]

FIG. 1 is a view showing an embodiment of a vapor deposition jig of the present invention.

FIG. 2 is a diagram showing a donut-shaped plastic substrate on which Au is deposited.

FIG. 3 is a diagram showing a state in which the plastic substrate of FIG. 2 is mounted on the vapor deposition jig of FIG.

FIG. 4 is a diagram showing a state in which Au is attached to a vapor deposition jig when Au is vapor deposited on a plastic substrate mounted on the vapor deposition jig shown in FIG.

[Explanation of symbols]

 5 Cu deposition jig 6 Pt plating layer 7 Au plating layer

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Akemi Yamagami 2-14 Mayor Toru, Hiratsuka, Kanagawa Tanaka Kikinzoku Kogyo Co., Ltd.

Claims (3)

[Claims] 1. A Pt plating layer is provided on the surface of a vapor deposition jig made of Cu or a Cu alloy, and a plating layer of any one of Au, Ag, Cu, and Ni is provided on the surface of the Pt plating layer. A vapor deposition jig characterized in that 2. A vapor deposition jig according to claim 1, which is for forming a vacuum thin film on a plastic substrate. 3. The evaporation jig according to claim 1, wherein the plating layer has a thickness of 0.1 to 1.0 μm.