JPH0938031A - Solid state imaging component package structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to easily deal with manufacture of different types of packages by assembling a package by directly connecting each terminals on a package body and a lower package body. SOLUTION: Since an upper package body 21 is dealt with by overturning an image on a front sight type package member, the package member is mounted by directing a side (d) side to a signal line connection terminal 28 side and an objective lens system 36 is mounted on a cover glass 24 via a prism 35. On the other hand on a side sight type, an upper package body 21 as it is set and connected on lower bodies 27 and 32, then an objective optical system 37 is directly mounted on the cover glass 24. Thus, by forming the upper package body 21 as a single member and only the lower package bodies 27 and 32 in a structure corresponding to a respective type and installing a common electrode between the members, a different type, such as front sight, side sight etc., can be easily manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device package structure, and more particularly to a package structure that can be used for both a direct-view type and a side-view type of an electronic endoscope.

[0002]

2. Description of the Related Art FIG. 5 shows the structure of a tip portion of an electronic endoscope which is a direct-view type and uses a prism for an image pickup optical system. In FIG. 5, a solid-state image sensor C is provided on the tip surface of the tip portion 1 via an objective lens system 3 including an observation window 2 and a prism 4.
A CCD package 5 accommodating a CD (Charge Coupled Device) is attached, and an irradiation window (not shown) connected to a light guide 6 is arranged near the observation window 2. A circuit member 7 such as a capacitor and a transistor is arranged in the CCD package 5, and a signal cable 8 for transmitting a video signal and a CCD driving signal is connected to the rear end portion. A forceps port 9 for introducing a treatment instrument and the like and a treatment instrument insertion channel 10 are provided on the lower side of the drawing.

FIG. 6 shows the structure of a front end portion of an electronic endoscope which is a side-view type and does not use a prism in an image pickup optical system. In FIG. 6, a CCD package 15 is attached to the side surface of the tip portion 12 via an objective lens system 14 including an observation window 13. The CCD package 15 is provided with a circuit member 16 and a signal on the bottom surface side. The cable 17 is arranged. A light guide 19 is connected to the irradiation window 18 arranged near the observation window 13.

According to the direct-view type shown in FIG. 5, the inside of the body to be observed can be observed in the insertion direction of the endoscope (the axial direction of the endoscope). According to this, it becomes possible to observe the inside of the observed body in a direction perpendicular to the insertion direction of the endoscope, and these types of electronic endoscopes are used depending on the purpose of observation or treatment.

[0005]

By the way, in the above-described direct-view type or side-view type electronic endoscope, the CCD packages 5 and 15 are different in arrangement state and structure, so that the CCD in the package is the same. Even so, they are manufactured separately for each type. That is, as shown in FIG. 5, in the direct-view type, the circuit member 7 is mainly arranged on the lower surface side of the CCD package 5, whereas in the side-view type, the circuit member 16 is arranged.
Is arranged on the upper surface side of the CCD package 15, and in the direct-view type, the signal cable 8 is connected to the rear end portion.
In the side view type, the signal cable 17 is connected to the rear surface side. The difference in these structures arises from the fact that the endoscope is required to have a smaller diameter and the positional relationship with other constituent members.

Further, in the electronic endoscope shown in FIG. 5, the prism 4 is arranged in the image pickup optical system in order to convert the optical axis to the right angle direction. That is, FIG. 7 shows the image formation state of the CCD 5 of FIG. 5, and FIG. 8 shows the image formation state of the CCD 15 of FIG. 6. As is clear from this figure, the CC of FIG.
Since the prism 4 exists after the objective lens system 4, the image (F) captured by D5 is compared with the image captured by the CCD 15 in FIG. 6 (image through the objective lens system 14). It will be rotated 180 degrees. Therefore, FIG.
The CCD 5 of FIG. 6 is connected with the CCD 15 of FIG. 6 rotated 180 degrees. This difference is also the reason why the CCD packages 5 and 15 are manufactured separately for each type.

However, it is useless to separately manufacture the CCD packages 5 and 15 according to the individual types, and even with these different types of CCD packages 5 and 15, there is room for improvement in simplification of manufacturing. However, if the simplification of the manufacturing can be achieved, the manufacturing cost can be reduced.

The present invention has been made in view of the above problems, and an object of the invention is to form a part as a common part, which can easily cope with manufacturing of different types of packages and can reduce the cost. An object is to provide a device package structure.

[0009]

In order to achieve the above object, a solid-state image pickup device package structure according to a first aspect of the present invention houses a solid-state image pickup device and has a plurality of terminals on a bottom surface in a predetermined arrangement. A formed upper package body, and a lower package body on which circuit members arranged according to types such as a direct-view type or a side-view type are attached, and terminals having an arrangement that matches the arrangement of the terminals of the upper package body are formed on the upper surface. , And each terminal of the upper package is directly connected to each terminal of the lower package to assemble the package. According to a second aspect of the present invention, in the lower package body, in the case of an image reversal type using a prism in the image pickup optical system, the terminals are arranged by rotating the terminal arrangement in the case of not using the prism by 180 degrees, The image reversal type lower package body is characterized in that the upper package body is attached by being rotated by 180 degrees.

[0010]

According to the structure described in the first claim, the lower package body is a direct-view type or a side-view type, but the upper package is a single package containing the solid-state image sensor. To be done. In addition, since the upper package and the various lower packages are formed with terminals in an array that allows the two to be connected to each other, the same upper package can be connected to different types of lower packages. That is, in addition to the difference between the direct-viewing type and the side-viewing type, there are some types of electronic endoscopes that use a prism that converts the imaging light ray axis in a right-angle direction, and some do not. It becomes possible to correspond to the thing.

According to the structure described in the second aspect, there are cases in which the image reversal type using the prism and a case in which the prism is not used are dealt with. In this case, the lower package is rotated by 180 degrees. By providing the terminals in different arrangements, it is possible to cope well.

[0012]

1 to 4 show a structure of a solid-state image pickup device package which is an optimum embodiment of the present invention. 1 is an upper package body, FIG. 2 is a lower package body used in a direct-viewing endoscope, and FIG. 3 is a lower package body used in a side-viewing endoscope. FIG.
The figure (B) is a side view and the figure (C) is a bottom view. In FIG. 1, the upper package body 21 is composed of a main body 23 having a storage portion 22 and a cover glass 24 on the upper surface, and the CCD 25 is arranged in the storage portion 22. The cover glass 24 is adhered to the outer peripheral portion (dot display portion) F of the main body 23, and a terminal surface is formed on the intermediate surface having a step from the surface of the outer peripheral portion F, and the CCD 25 is attached to the terminal surface. The terminals are connected by wire bonding. The main body 23 is formed by laminating a plurality of ceramic thin plates, for example.

Then, as shown in FIG. 1C, terminals (electrodes) P1 to Pn (n is, for example, about 14 to 18) are arranged in two rows on the bottom surface of the main body 23 in order. ,
The terminals P1 to Pn are connected to the terminals on the connection terminal surface to the CCD 25. Further, as shown in the drawing, the terminal arrangement is an arrangement in which one terminal is missing in the upper portion of the terminal P1. This will prevent a mistake in the connection direction of the upper package body 21, although the details will be described later. it can.

In FIG. 2, the direct-viewing type lower package body 27 is made of one plate member such as ceramics, and projecting terminals p1 to pn projecting a small amount are formed on the upper surface thereof.
The protruding terminals p1 to pn are connected to the upper package body 21 by one.
The arrangement is such that the terminals P1 to Pn can be connected to the terminals p1 to pn corresponding to the respective numbers in a state of being rotated by 80 degrees. That is, in the case of the direct-view type in which a prism is used as shown in FIG. 5, since the image is vertically and horizontally reversed, the CCD 25 is mounted upside down (the d side in the drawing is the lower side). Is required. Therefore, the protruding terminals p1 to pn of the lower package 27 are
The terminal arrangement in contact with one terminal P1 to Pn is rotated by 180 degrees.

In the lower package 27, the lower side of the terminal p1 corresponds to the terminal arrangement of the upper package 21 and one terminal is omitted. According to such a terminal arrangement, it is possible to determine whether the upper package 21 is up or down (in this case, the defective position is the end d) depending on the defective position of the terminal, and it can be used as a marker at the time of arrangement and connection. .

The protruding terminals p1 to pn are
It is wired to the signal line connection terminal 28 arranged at one end of the lower package 27 by a wiring pattern (not shown). Further, in this direct-view type, a capacitor 29 is provided on the lower surface thereof.
Circuit members such as a transistor and a transistor 30 are attached.

In FIG. 3, the side-view type lower package body 32 is also made of a single plate member such as ceramics, and the protruding terminals p1 to pn are formed on the upper surface thereof in an arrangement different from the arrangement shown in FIG. . That is, in this side view type, since no prism is used as shown in FIG. 6, the upper package 2
The protruding terminals p1 to pn are formed in such an arrangement that the first terminals P1 to Pn can be placed and connected as they are. Then, these protruding terminals p1 to pn are wired to the signal line connecting terminals 33 formed on the lower surface of the lower package 32 by a wiring pattern and through holes (not shown). Further, in this side-view type, a capacitor 29 is attached to the upper surface and a transistor 30 and the like are attached to the lower surface.

FIG. 4 shows an assembled state of the above-mentioned package member, and the left side views (B) to (D) are of a direct view type. In this direct-view type, the upper package body 21 in FIG.
The d side is attached to the signal line connection terminal 28 side.
This attachment is performed by means such as bumps. Then, as shown in FIG. 3D, the objective lens system 36 is mounted on the cover glass 24 via the prism 35.
The left-right inversion caused by using the prism can be eliminated by electrically converting the signal reading direction of the horizontal scanning line.

On the other hand, the drawings (E) to (G) on the right side of FIG. 4 are of the side-view type, and in this side-view type, the view (A) is shown.
The same upper package body 21 is placed and connected on the lower package body 32 as it is. Then, as shown in FIG. 3G, the objective optical system 37 is placed on the cover glass 24.
Are mounted directly, no prism is provided. In addition,
The above-mentioned connection has an advantage that the direction of connection can be specified from the defect position of one terminal near the terminals P1 and p1 as described above.

As described above, according to the package structure of the present invention, the upper package body 21 is formed as a single member, and only the lower package bodies 27 and 32 are structured according to their respective types. By providing a common electrode between the members, different types of packages such as a direct-view type and a side-view type can be easily manufactured.

In the above example, the CCD package is arranged horizontally with respect to the axis of the endoscope. However, the CCD package may be arranged vertically with respect to the axis of the endoscope. In this case, the prism is a side-view type prism. Will be placed. In the case of the direct-view type or the side-view type in such a case, the above configuration can be similarly applied.

[0022]

As described above, according to the first aspect of the invention, the solid-state image pickup device is housed, and the upper package body in which terminals of a predetermined array are formed on the bottom surface thereof and the direct-view type or side-view type Since the upper package body and the lower package body are formed by attaching the circuit members arranged according to the type, and the terminals of the arrangement that matches the arrangement of the terminals of the upper package body are formed on the upper surface, As a common component, it is possible to easily deal with the manufacture of different types of solid-state imaging device packages, and it is possible to reduce the manufacturing cost.

According to the second aspect of the invention, in the lower package body in which the prism is used, the terminals are arranged by rotating the terminal arrangement in the case of not using the prism by 180 degrees. By attaching the upper package to the lower package by rotating it by 180 degrees, there is an advantage that it is possible to easily cope with the production of an image reversal type CCD package.

[Brief description of drawings]

1A and 1B show a structure of an upper package body in a solid-state imaging device package which is optimum as an embodiment of the present invention. FIG. 1A is a top view, FIG. 1B is a side view, and FIG. 1C is a bottom view. .

2A and 2B show a structure of a direct-view type lower package body in the solid-state imaging device package of the embodiment, FIG. 2A is a top view, FIG. 2B is a side view, and FIG.

3A and 3B show a structure of a side-view type lower package body in the solid-state imaging device package of the embodiment, FIG. 3A is a top view, FIG. 3B is a side view, and FIG. 3C is a bottom view.

FIG. 4 is a perspective view sequentially showing the assembly of the direct-view type and side-view type solid-state imaging device packages of FIGS. 3 and 4;

FIG. 5 is a diagram showing a configuration of a distal end portion of a conventional direct-viewing type electronic endoscope.

FIG. 6 is a diagram showing a configuration of a distal end portion of a conventional side-view electronic endoscope.

FIG. 7 is an explanatory view showing an image formation state captured by the CCD of FIG.

8 is an explanatory diagram showing an image formation state captured by the CCD of FIG.

[Explanation of symbols]

 5, 15 ... CCD package, 21 ... upper package body, 23 ... body, 24 ... cover glass, 25 ... CCD, 27 ... lower package body (direct view type), 28, 33 ... signal line connection terminal, 32 ... lower package body (Side view type), P1 to Pn ... Upper package terminal, p1 to pn ... Lower package protruding terminal.

Claims (2)

[Claims] 1. A solid-state image sensor is housed, an upper package body having a plurality of terminals formed on a bottom surface in a predetermined arrangement, and a circuit member arranged according to the type such as a direct-view type or a side-view type are attached. A lower package body on the top surface of which terminals having an arrangement that matches the arrangement of the terminals of the upper package body are formed,
A solid-state image pickup device package structure comprising: a package for assembling a package by directly connecting each terminal of the upper package and each terminal of the lower package. 2. In the lower package, in the case of an image reversal type in which a prism is used for an image pickup optical system, the terminals are arranged by rotating the terminal arrangement in the case of not using the prism by 180 degrees, and the image reversal type is formed. The solid-state image pickup device package structure according to claim 1, wherein the upper package body is attached to the lower package body by rotating the upper package body by 180 degrees.