JPH09331190A - Operating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an operating device which is capable of separately correcting the mounting position of electronic parts. SOLUTION: When the position data of a mounting pattern and the position data of electronic parts R1 and R2 in the mounting pattern are inputted, the positions of the electronic parts R1 and R2 are separately calculated basing on the above position data, and the electronic parts R1 and R2 are mounted basing on the calculation results. In this constitution, when corrections for mounting position are inputted, corrections and mounting positions are stored in a one-to-one correspondence between them, and the parts R1 and R2 are separately corrected on mounting position basing on the corrections.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work apparatus configured to calculate a work position for a board based on position data for the work pattern of the work position and position data for the board of the work pattern.

[0002]

In the component mounting apparatus which is an example of the above working apparatus, as shown in FIG. 5, a plurality of electronic components R1 and R2 are mounted on the same mounting pattern P1.
When mounting on the split board W with P4, as shown in FIG. 6, position data (X, Y) of each mounting pattern P1 to P4 with respect to the split board W, position data with respect to the mounting patterns P1 to P4 of the electronic components R1 and R2. There is a configuration that inputs (x, y).

In this configuration, when the position data (X, Y) and (x, y) are input, as shown in FIG. 7, the mounting positions (X, Y) of the electronic components R1 and R2 on the split board W are set. ) Are calculated individually, and these mounting positions (X,
The mounting work is performed based on Y). Therefore, there is an advantage that the mounting patterns P1 to P4 can be corrected at once only by correcting the common position data (x, y) of the electronic components R1 and R2.

By the way, when observing the split board W on which the mounting work has been performed, the mounting positions of the specific electronic components R1 and R2 may deviate due to the characteristics of the device, the mounting state, and the like.
However, in the above conventional configuration, the mounting positions of the electronic components R1 and R2 cannot be individually corrected,
Since the above-mentioned positional deviation cannot be dealt with, there is room for improvement in terms of improvement in mounting accuracy.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a working device capable of improving working accuracy.

[0006]

According to a first aspect of the present invention, there is provided a work apparatus configured to calculate a work position for a board based on position data of the work position for the work pattern and position data of the work pattern for the board. It is characterized in that it comprises storage means having a storage area for a correction amount related to the work position, and correction means for individually correcting the work position based on the correction amount stored in this storage means. According to the above means, the work position and the correction amount correspond to each other in the storage device in a one-to-one correspondence, and the work position is individually corrected based on the correction amount, so that the work accuracy is improved.

A working apparatus according to a second aspect is characterized in that it comprises an input means for inputting a correction amount, and the correction amount input by this input means is stored in a storage means. According to the above means, when the correction amount is input as the correction data, the correction amount is stored in the storage means, and the above operation is performed.

A working apparatus according to a third aspect of the present invention is characterized in that it comprises an input means for inputting a correction position, and a difference between the correction position and the work position input by the input means is stored in a storage means. Have. According to the above means, when the correction position is input as the correction data, the difference (correction amount) between the correction position and the work position is calculated. Then, this difference is stored in the storage means, and the above operation is performed.

A working apparatus according to a fourth aspect of the invention is provided with an input unit for inputting a correction amount and a correction position of a work position, and when the correction amount is input by the input unit, the correction amount is stored in the storage unit. It is characterized in that when the correction position is input, the difference between the correction position and the work position is stored in the storage means. According to the above means, when the correction amount is input as the correction data, the correction amount is stored in the storage means, and the above operation is performed. Further, when the correction position is input as the correction data, the difference between the correction position and the work position is calculated. Then, this difference is stored in the storage means, and the above operation is performed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the present invention is applied to a component mounting device. First, in FIG. 1, an XY robot 1 is mounted on a base (not shown),
A suction nozzle 3 is attached to an arm of the XY robot 1 via a drive mechanism 2. A plurality of parts feeders 4 are mounted on the base, and electronic parts R1 and R2 are set on the parts feeder 4.
The drive mechanism 2 has an elevating part for moving the suction nozzle 3 up and down, and a rotating part for rotating the suction nozzle 3.

The XY robot 1 is connected to the control device 5. The control device 5 is mainly composed of a microcomputer, and when the mounting operation is started, XY
With the drive control of the robot 1, the suction nozzle 3 is conveyed to a predetermined suction position on the parts feeder 4. Then, as the drive mechanism 2 is driven and controlled, the suction nozzle 3 is lowered and raised, and the electronic component R1 set in the parts feeder 4 is sucked and taken out.

A CCD camera 6 is mounted on the base, and when the control device 5 takes out the electronic component R1 from the parts feeder 4, the control device 5 first drives and controls the XY robot 1, and then the suction nozzle 3 is CCD camera. 6 within the field of view. Next, as the image pickup signal is output to the CCD camera 6, the electronic component R1 sucked by the suction nozzle 3 is imaged. Then, along with the image processing of the imaged data, the suction posture of the electronic component R1 is detected, and the shift amounts Xa and Ya of the suction posture in the X and Y directions and the shift amount θa in the rotation direction are calculated.

After calculating the shift amounts Xa, Ya, θa, the control device 5 adjusts the carry amount of the suction nozzle 3 by driving and controlling the XY robot 1 based on the shift amounts Xa, Ya. At the same time, as the drive mechanism 2 is driven and controlled based on the deviation amount θa, the rotation amount of the suction nozzle 3 is adjusted and the electronic component R1 is transported to the mounting position on the split substrate W. Then, as the drive mechanism 2 is driven and controlled, the suction nozzle 3 is lowered, and the electronic component R1 is pressed and mounted on the split substrate W.

When the electronic component R1 is mounted, the control unit 5 conveys the suction nozzle 3 to a predetermined suction position on the parts feeder 4 and repeats the above series of operations, so that the electronic component R2 is transferred to the split board W. Implement. And a plurality of parts R
As the series of operations described above is repeated for 1 and R2, as shown in FIG.
Are mounted on the split board W with the same mounting patterns P1 to P4.

The control device 5 has a mounting position setting section 7, as shown in FIG. The mounting position setting unit 7 is for setting the transfer position (X, Y coordinate data) of the suction nozzle 3 when the suction nozzle 3 is transferred to the split substrate W. The individual correction data storage unit 7b, the component-based mounting position calculation unit 7c, the component-based mounting data storage unit 7d, and the mounting position correction unit 7e.

Next, the operation of the above configuration will be described. As shown in FIG. 5, when mounting a plurality of electronic components R1 and R2 on the split board W with the same mounting patterns P1 to P4, as the mounting data setting unit 7a is operated,
As shown in FIG. 6, the split substrate W of the mounting patterns P1 to P4
Position data (X, Y), electronic components R1 and R
Position data (x, for the mounting patterns P1 to P4 of 2)
Enter y). At the same time, as shown in FIG. 4, the correction amounts (Δx, Δy) of the mounting positions of the plurality of electronic components R1 and R2 are individually input according to the characteristics of the device, the mounting state, and the like. The mounting data setting unit 7a is composed of a keyboard or the like and corresponds to an input means.

When the position data (X, Y) and (x, y) and the correction amount (Δx, Δy) are input to the control device 5,
The process proceeds from step S1 of FIG. 2 to S2, and the correction amount (Δx,
It is determined whether Δy) has been input. Here, since the correction amounts (Δx, Δy) have been input, it is determined to be “YES” and the process proceeds from step S2 to S3. Then, the correction amount (Δx, Δy) is written in the component-specific correction data storage unit 7b.

FIG. 4 shows the data layout of the component-specific correction data storage section 7b. Here, the component-based correction data storage unit 7b has a storage area for the correction amounts (Δx, Δy) corresponding to the electronic components R1 and R2 (that is, the mounting positions), and the correction amounts (Δx, Δy) is written in a predetermined area corresponding to the electronic components R1 and R2.
The component-specific correction data storage unit 7b is composed of a RAM or the like and corresponds to a storage unit.

When the correction amount (Δx, Δy) is written in the component-specific correction data storage section 7b, the control device 5 moves from step S3 to S4 in FIG. 2 and positions data (X, Y) and (x, Y, Based on y), the mounting positions (X, Y) of the electronic components R1 and R2 on the split board W are individually calculated. Then, the process proceeds from step S4 to S5, and the calculated mounting position (X, Y) is written in the component-based mounting data storage unit 7d.
The component mounting position calculating unit 7c is composed of a CPU and performs the mounting position calculating operation described above.

FIG. 7 shows a data layout of the component-based mounting data storage unit 7d. Here, the component-based mounting data storage unit 7d has a storage area of the mounting position (X, Y) corresponding to each electronic component R1 and R2, and the mounting position (X, Y) is the electronic component R1. And written in a predetermined area corresponding to R2. The component-based mounting data storage unit 7d is composed of a RAM or the like.

When the control unit 5 writes the mounting position (X, Y) in the component-specific mounting data storage section 7d, step S in FIG.
5 to S6, the mounting position (X, Y) written in the component-specific mounting data storage unit 7d is used as the component-specific correction data storage unit 7
With the correction based on the correction amount (Δx, Δy) written in b, as shown in FIG. 3, the correction position (X ′, Y
′) Is calculated. The mounting position calculating unit 7e is composed of a CPU and corresponds to a correcting unit that performs the mounting position correcting operation described above.

After correcting the mounting position (X, Y), the control unit 5 proceeds from step S6 to step S7 in FIG. Then, based on the corrected mounting position (X ′, Y ′), XY
With the drive control of the robot 1, as described above, the transfer amount of the suction nozzle 3 is adjusted, and the plurality of electronic components R are
1 and R2 are mounted on the split board W.

After that, when the position data (x, y) of the electronic components R1 and R2 are corrected by operating the mounting data setting section 7a, the control device 5 shifts from step S1 to S2 in FIG. , It is determined whether the correction amount (Δx, Δy) is input. Here, the correction amount (Δx, Δy)
Is not input, the determination is "NO" and the process proceeds from step S2 to S4. Then, position data (X,
Y) and (x, y) based on the new mounting position (X,
After calculating Y) individually, the process proceeds from step S4 to S5, and the new mounting position (X, Y) is written in the component-based mounting data storage unit 7d.

When the mounting position (X, Y) is written in the component-specific mounting data storage section 7d, the control unit 5 proceeds from step S5 to S6 and newly writes the component-specific mounting data storage section 7d. The position (X, Y) is stored in the correction data storage unit 7
The mounting position is corrected in accordance with the correction based on the previous correction amount (Δx, Δy) written in b. Then, the process proceeds from step S6 to S7, and the corrected mounting position (X ',
Based on Y '), a plurality of electronic components R1 and R2 are mounted on the split board W.

When the position data (X, Y) of the mounting patterns P1 to P4 are corrected, the control device 5 determines "NO" in step S2 and proceeds to step S4. Then, after calculating the new mounting position (X, Y), the process proceeds from step S4 to S5 and S6, and the new mounting position (X, Y).
Y) is corrected based on the previous correction amount (Δx, Δy).
Further, a non-volatile storage device 8 is connected to the control device 5, and the storage data of the component-specific correction data storage unit 7b and the component-specific mounting data storage unit 7d and the correction position (X ′, Y ′).
Etc. are written in the non-volatile storage device 8.

According to the above embodiment, the mounting position (X, Y)
A component-specific correction data storage unit 7b having a storage area for the correction amount (Δx, Δy) is provided, and the mounting position (based on the correction amount (Δx, Δy) stored in the component-specific correction data storage unit 7b ( (X, Y) were individually corrected. Therefore, the electronic components R1 and R2 are
Since the mounting position (X, Y) can be corrected every time, the mounting accuracy is improved.

Moreover, when the position data (x, y) of the electronic components R1 and R2 is corrected, a new mounting position (X, y) is obtained.
Y) and the correction amounts (Δx, Δy) have a one-to-one correspondence, and the new mounting position (X, Y) is the correction amount (Δx, Δy).
Will be corrected based on. Therefore, there is no need to re-input the correction amount (Δx, Δy) when correcting the position data (x, y). Along with this, position data (x,
The advantage of being able to modify the mounting patterns P1 to P4 at once by only modifying y) will not be impaired.

Further, as the mounting data setting section 7a is operated, the correction amounts (Δx, Δy) are directly input and written in the component-specific correction data storage section 7b. Therefore, the software configuration is simplified as compared with the case of inputting the correction position (X ′, Y ′) (described later).

In the above embodiment, the electronic component R1
The position data (x, y) was input to correct the mounting positions of R2 and R2, but the present invention is not limited to this, and for example, the correction amount (Δx, Δy) may be input.
In this case, it is not necessary to calculate a new mounting position (X, Y) based on the position data (X, Y) and (x, y). In this case, if a code (for example, R1) that specifies the electronic components R1 and R2 is input in addition to the correction amounts (Δx, Δy), the correction amounts (Δ
If the x, Δy) are collectively corrected, the data input operation can be simplified.

In the above embodiment, the correction amount (Δ
Although x, Δy) is input, the present invention is not limited to this, and any one of the following (1) to (3) may be used.

(1) The correction position (X ', Y') is input individually, and the difference (Δx, Δy) between the correction position (X ', Y') and the mounting position (X, Y) is calculated. Write in a predetermined area of the component-specific correction data storage unit 7b. Then, position data (X,
At the time of correcting Y) and (x, y), the new mounting position (X, Y) and the correction amount (Δx, Δy) are corrected as in the above embodiment.
And 1 in a one-to-one correspondence, and a new mounting position (X,
Y) is corrected based on the correction amount (Δx, Δy).

(2) Correction amount (Δx, Δy), or
The correction position (X ', Y') is input individually, and the correction amount (Δ
When (x, Δy) is input, the correction amount (Δx, Δy) is directly written in a predetermined area of the component-specific correction data storage unit 7b. When the correction position (X ′, Y ′) is input, the difference (Δx, Δy) between the correction position (X ′, Y ′) and the mounting position (X, Y) is calculated, and the component-specific correction data is calculated. Write in a predetermined area of the storage unit 7b. Then, position data (X,
At the time of correcting Y) and (x, y), the new mounting position (X, Y) and the correction amount (Δx, Δy) are corrected as in the above embodiment.
And 1 in a one-to-one correspondence, and a new mounting position (X,
Y) is corrected based on the correction amount (Δx, Δy).

(3) A correction amount mode and a correction position mode are selected by operating the mounting data setting section 7a. Then, when the correction amount mode is selected, the input correction amount (Δx, Δy) is directly written in the component-specific correction data storage unit 7b. When the correction position mode is selected, the difference (Δx, Δy) between the input correction position (X ′, Y ′) and the mounting position (X, Y) is calculated and written in the component-specific correction data storage unit 7b. Put in.

In the case of the configuration (1), the correction position (Δx, Δ
Even if the correction position (X ′, Y ′) is used instead of y), the mounting accuracy can be improved and the data input operation can be simplified. In the case of the configurations (2) and (3), the correction amount (Δx,
Since either Δy) or the corrected position (X ′, Y ′) may be input, usability is improved.

In the above embodiment, the correction amounts (Δx, Δy) and the correction positions (X ', Y') in the X and Y directions are input, but the present invention is not limited to this. Alternatively, for example, the correction amount Δθ in the rotation direction may be input. In the above embodiment, the electronic component R
The suction condition such as the suction order of 1 and R2 may be input by the mounting data setting unit 7a. Further, in the above embodiment, the present invention is applied to the component mounting apparatus,
The invention is not limited to this, and may be applied to, for example, an adhesive application device that applies an adhesive to the mounting position of the split substrate W, a solder application device that applies cream solder, or the like.

[0036]

As is apparent from the above description, the working apparatus of the present invention has the following effects. According to the means described in claim 1, the storage means having the storage area for the correction amount in relation to the work position is provided. Therefore, the work position is individually corrected based on the correction amount, so that the work accuracy is improved. According to the means described in claim 2, the correction amount is directly input and written in the storage means. Therefore, the software configuration is simplified as compared with the case of inputting the correction position.

According to the third aspect, the difference between the correction position and the mounting position is calculated and written in the storage means. Therefore, the correction position can be used as the correction data. According to the means described in claim 4, when the correction amount is input, the correction amount is directly written in the storage means, and when the correction position is input, the difference between the correction position and the mounting position is calculated and written in the storage means. Complicated. Therefore, since the correction amount and the correction position can be used as the correction data, the usability is improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention (a diagram schematically showing the entire configuration).

FIG. 2 is a flowchart showing the control contents of the control device.

FIG. 3 is a diagram showing a result of correcting a mounting position.

FIG. 4 is a diagram showing a data layout of a correction data storage unit for each component.

FIG. 5 is a diagram showing a mounting pattern of electronic components.

FIG. 6 is a diagram showing mounting data.

FIG. 7 is a diagram showing a data layout of a mounting data storage unit for each component.

[Explanation of symbols]

P1 to P4 are mounting patterns (working patterns), W is a split board (board), 7a is a mounting data setting unit (input means), 7
Reference numeral b indicates a component-specific correction data storage unit (storage unit), and reference numeral 7e indicates a mounting position calculation unit (correction unit).

Claims (4)

[Claims] 1. A structure in which a work position with respect to a board is calculated based on position data of a work pattern with respect to a board and position data of the work position with respect to a work pattern has a storage area for a correction amount in relation to the work position. A working apparatus comprising: a storage unit and a correction unit that individually corrects a work position based on a correction amount stored in the storage unit. 2. The working apparatus according to claim 1, further comprising an input unit for inputting a correction amount, wherein the correction amount input by the input unit is stored in the storage unit. 3. An input means for inputting a correction position is provided, and a difference between the correction position input by this input means and a work position is stored in a storage means.
Working device as described. 4. A correction amount of a work position, and an input means for inputting the correction position are provided, and when the correction amount is input by this input means, the correction amount is stored in the storage means, and when the correction position is input. The working apparatus according to claim 1, wherein a difference between the corrected position and the working position is stored in the storage means.