JPH09308190A - Resin molding method for connection board for molded motor and resin molding forming mold apparatus - Google Patents
Resin molding method for connection board for molded motor and resin molding forming mold apparatusInfo
- Publication number
- JPH09308190A JPH09308190A JP8119861A JP11986196A JPH09308190A JP H09308190 A JPH09308190 A JP H09308190A JP 8119861 A JP8119861 A JP 8119861A JP 11986196 A JP11986196 A JP 11986196A JP H09308190 A JPH09308190 A JP H09308190A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit board
- resin molding
- molding
- metal circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 55
- 239000011347 resin Substances 0.000 title claims abstract description 55
- 238000000465 moulding Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 12
- 239000002184 metal Substances 0.000 claims abstract description 62
- 238000004080 punching Methods 0.000 claims abstract description 9
- 229920003002 synthetic resin Polymers 0.000 abstract description 13
- 239000000057 synthetic resin Substances 0.000 abstract description 13
- 238000003825 pressing Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Manufacture Of Motors, Generators (AREA)
- Motor Or Generator Frames (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、固定子巻線と外部
端子とを結線するモールドモータ用結線板の樹脂モール
ド方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method of a connecting plate for a molded motor, which connects a stator winding and an external terminal.
【０００２】[0002]
【従来の技術】近年、固定子巻線と電源、指令信号を入
力する外部端子とを接続するために結線板を備えたモー
タが多く採用されている。そして、このような結線板に
は従来プリント基板が用いられ、モータの低コスト化、
汎用化に限界があった。以下に従来のモータについて説
明する。2. Description of the Related Art In recent years, a motor having a connecting plate for connecting a stator winding to a power source and an external terminal for inputting a command signal has been widely adopted. A conventional printed circuit board is used for such a connection plate, which reduces the cost of the motor.
There was a limit to generalization. The conventional motor will be described below.
【０００３】図２（ａ）はモータ、特にモールドモータ
の断面図を示してある。図２（ｂ）は樹脂モールド前の
結線用部品を備えた固定子組立体を示した斜視図であ
る。図２（ｃ）は、図２（ｂ）における結線板のＡ−Ａ
断面図である。図において回転子１２は軸受１３により
回転自在に支持されている。回転子１２の外周面は所定
の隙間を保って固定子鉄心１１が配設されており、固定
子鉄心１１の複数のスロットには巻枠８を介してコイル
９が巻回されている。結線板１４は導電性金属１７をコ
イル９、ヒューズ等の焼損保護装置５、及び外部の電気
回路と接続をするための口出し線７との接続部を露出さ
せて合成樹脂１６で包囲して一体成形したものであり、
コイル９上に巻枠８により支持されている。回転子１
２、コイルを巻回した固定子鉄心１１、結線板１４を組
み立て、固定子組立体を組み立てた後（図２（ｂ）に示
す構造）、モータ外装モールド樹脂１０によりこの固定
子組立体の外装をモールドした後、回転子１２を軸受１
３を介してブラケット２６により、この樹脂モールドを
行った固定子組立体に装着して、図２（ａ）に示すモー
タを製造する。FIG. 2A shows a sectional view of a motor, particularly a molded motor. FIG. 2B is a perspective view showing a stator assembly provided with a wiring connecting component before resin molding. FIG. 2 (c) is A-A of the connection plate in FIG. 2 (b).
It is sectional drawing. In the figure, the rotor 12 is rotatably supported by bearings 13. A stator core 11 is disposed on the outer peripheral surface of the rotor 12 with a predetermined gap therebetween, and coils 9 are wound around a plurality of slots of the stator core 11 via a winding frame 8. The connection plate 14 is formed by exposing the conductive metal 17 to the coil 9, the burnout protection device 5 such as a fuse, and the lead wire 7 for connecting to an external electric circuit, and enclosing the connection part with a synthetic resin 16 to form an integral body. Molded,
It is supported by the winding frame 8 on the coil 9. Rotor 1
2. After assembling the stator core 11 around which the coil is wound and the connection plate 14 and assembling the stator assembly (the structure shown in FIG. 2B), the exterior of the stator assembly is covered by the motor exterior molding resin 10. After molding the
The bracket 26 is used to mount the resin-molded stator assembly on the stator 26 to manufacture the motor shown in FIG.
【０００４】図３は結線板を備えた固定子鉄心の正面及
び断面図である。図において結線板１４は、固定子鉄心
１１のコイル９上に配設されている。FIG. 3 is a front view and a sectional view of a stator core provided with a connecting plate. In the figure, the connection plate 14 is arranged on the coil 9 of the stator core 11.
【０００５】このような結線板はプリント基板のような
ものも考えられるが、プリント基板は高コストであり、
専門技術がいるなどの問題があり、このようなコスト、
生産性の面から、図５に示すような導電性材料からプレ
ス加工により回路パターンを打ち抜き、導電の端子部を
残した状態で樹脂モールドするものが提案されている。Although such a connecting plate may be a printed circuit board, the printed circuit board is expensive.
There are problems such as having specialized technology, such costs,
From the viewpoint of productivity, there has been proposed a method in which a circuit pattern is punched out from a conductive material as shown in FIG. 5 and resin-molded with the conductive terminal portion left.
【０００６】図４は結線板の詳細図であり、斜線部分は
導電性材料であり、その他の部分は合成樹脂により成形
されている。FIG. 4 is a detailed view of the connection plate, in which the shaded portion is a conductive material and the other portions are molded of synthetic resin.
【０００７】図５に示すように、このような結線板は、
黄銅板等の導電性材料からプレス加工により回路配線パ
ターンとなる回路パターン２０を打抜いて（図５
（ａ））、回路パターン２０に設けた端子部２１を残し
た状態で、この回路パターン２０を成形金型内で合成樹
脂２２によりモールドして（図５（ｂ））、このモール
ドしたものの不要箇所２４を削除して結線板を完成させ
るものがある（図５（ｃ））。ここで、端子部とは、固
定子巻線、あるいは口出し線との接続部であり、不要箇
所とはプレス加工上、仮に設けた部分の事である。As shown in FIG. 5, such a connecting plate is
The circuit pattern 20 to be the circuit wiring pattern is punched out from a conductive material such as a brass plate by pressing (FIG. 5).
(A)), with the terminal portion 21 provided on the circuit pattern 20 left, the circuit pattern 20 is molded with a synthetic resin 22 in a molding die (FIG. 5B), and the molded product is unnecessary. There is one in which the place 24 is deleted to complete the connection plate (FIG. 5C). Here, the terminal portion is a connection portion with the stator winding or the lead wire, and the unnecessary portion is a portion provisionally provided in the press working.
【０００８】図５（ｂ）に示す樹脂モールド工程は、図
６に示す樹脂モールド用金型装置により行う。The resin molding step shown in FIG. 5 (b) is performed by the resin molding die apparatus shown in FIG.
【０００９】図６に示すように、樹脂モールド用金型装
置は、樹脂モールドにより所定の結線板の形状を形成す
るキャビティ２３を有するように型打ちされた上金型４
ａと下金型４ｂとからなり、このキャビティ内に導電性
材料からなる回路パターンを有する金属回路板１を配設
し、このキャビティ内にモールド樹脂２を充填して所定
の結線板を得るものである。つまり、成形金型装置の下
金型４ｂ内に金属回路板１を配置した後、上金型４ａに
より密閉し、キャビティ２３を形成し、前記キャビティ
に合成樹脂２を充填することにより結線板を製造する。As shown in FIG. 6, the resin molding die device includes an upper die 4 stamped so as to have a cavity 23 for forming a predetermined connection plate shape by resin molding.
A metal circuit board 1 having a circuit pattern made of a conductive material is provided in the cavity, which is composed of a and a lower die 4b, and a mold resin 2 is filled in the cavity to obtain a predetermined wiring board. Is. That is, after placing the metal circuit board 1 in the lower mold 4b of the molding mold device, the metal mold is sealed by the upper mold 4a to form the cavity 23, and the synthetic resin 2 is filled in the cavity to form the connection plate. To manufacture.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、図６に
示す樹脂モールド金型装置は、以下のような問題点を有
している。However, the resin mold die device shown in FIG. 6 has the following problems.
【００１１】先述したように、このようなモータ用の結
線板はモータの小型化、定コスト化のためにプレス加工
により打ち抜いた黄銅板のような、薄い金属板を用いて
いるが、金属回路板１を電気絶縁性の合成樹脂２で樹脂
モールドする際に、結線板における回路パターンの精度
維持が重要となる。As described above, such a connection plate for a motor uses a thin metal plate such as a brass plate punched out by press work in order to downsize the motor and reduce the cost. When resin-molding the board 1 with the electrically insulating synthetic resin 2, it is important to maintain the accuracy of the circuit pattern on the connection board.
【００１２】しかし、従来の樹脂モールド金属装置では
図６に示すように成形金型装置のキャビティ内に金属回
路板１を設置し、上金型４ａと下金型４ｂとにより金属
回路板１を密閉した後、合成樹脂２を充填し、樹脂モー
ルドする工程において、図に示すように下金型４ｂの内
周面に金属回路板１を固定し、樹脂モールドしていたた
めに金属回路板１の位置固定が不十分であり、樹脂が成
形金形に充填された時に充填圧力、温度等により金属回
路板が変形し、結線板を構成する金属回路板自体が浮き
上がったり、金属回路板自体に反りが発生した。However, in the conventional resin-molded metal device, the metal circuit board 1 is installed in the cavity of the molding die device as shown in FIG. 6, and the metal circuit board 1 is mounted by the upper die 4a and the lower die 4b. After the sealing, the synthetic resin 2 is filled, and in the resin molding step, the metal circuit board 1 is fixed to the inner peripheral surface of the lower mold 4b as shown in the figure, and the metal circuit board 1 is formed by resin molding. Insufficient position fixing, when the resin is filled in the molding die, the metal circuit board is deformed due to the filling pressure, temperature, etc., and the metal circuit board that constitutes the connection board rises or warps to the metal circuit board itself. There has occurred.
【００１３】このために、結線板の回路パターンの精度
が低下したり、金属回路板が樹脂よりはみ出る不良が生
じた。As a result, the accuracy of the circuit pattern of the wiring board is lowered, and the metal circuit board has a defect protruding from the resin.
【００１４】本発明は上記課題を解決するもので結線板
の回路パターンの精度を高精度に維持し、かつ結線板の
不良をも防止するものである。The present invention is intended to solve the above problems and to maintain the accuracy of the circuit pattern of the connection plate with high accuracy and prevent the connection plate from being defective.
【００１５】[0015]
【課題を解決するための手段】上記目的を達成するため
に本発明は、導電性金属板をプレスにより打ち抜いて回
路パターンを形成した金属回路板を樹脂モールド用の成
形金型内に配設し、前記金属回路板を電気絶縁性の樹脂
で一体にモールドするモールドモータ用結線板の樹脂モ
ールド方法であって、前記金属回路板の上下両端面を前
記樹脂モールド用金型に有する複数のピンで位置固定し
た状態で樹脂モールドするモールドモータ用結線板の樹
脂モールド方法を用い、また、導電性金属板をプレスに
より打ち抜いて回路パターンを形成した金属回路板を配
設し、樹脂モールドにより所定の結線板の形状を形成す
るキャビティを構成する上金型及び下金型とからなる成
形金型装置において、前記上金型と下金型のキャビティ
面に、前記金属回路板の上下両端面を保持する複数のピ
ンを備えた樹脂モールド成形金型装置を用いることによ
り、前記ピンにより金属回路板を均等に固定することが
できるので、樹脂充填時に金属回路板が浮くことがな
く、また、反りが発生することもない。In order to achieve the above object, the present invention provides a metal circuit board having a circuit pattern formed by punching out a conductive metal plate with a press in a molding die for resin molding. A resin molding method for a connection plate for a molded motor, wherein the metal circuit board is integrally molded with an electrically insulating resin, wherein a plurality of pins having upper and lower end surfaces of the metal circuit board in the resin molding die are provided. Use the resin molding method of the connection plate for the motor that molds the resin in the position-fixed state.Also, dispose the metal circuit board on which the circuit pattern is formed by punching out the conductive metal plate with a press, and perform the predetermined connection In a molding die device comprising an upper die and a lower die forming a cavity forming a plate shape, the metal die is attached to the cavity surfaces of the upper die and the lower die. By using a resin mold forming die device provided with a plurality of pins for holding both upper and lower end surfaces of the plate, the metal circuit plate can be evenly fixed by the pins, so that the metal circuit plate floats when the resin is filled. And there is no warpage.
【００１６】[0016]
【発明の実施の形態】本発明の請求項１に記載の発明
は、導電性金属板をプレスにより打ち抜いて回路パター
ンを形成した金属回路板を樹脂モールド用の成形金型内
に配設し、前記金属回路板を電気絶縁性の樹脂で一体に
モールドするモールドモータ用結線板の樹脂モールド方
法であって、前記金属回路板の上下両端面を前記樹脂モ
ールド用金型に有する複数のピンで位置固定した状態で
樹脂モールドするモールドモータ用結線板の樹脂モール
ド方法により、金属回路板を複数のピンで挟合して固定
することができ、樹脂モールドの樹脂充填時の圧力等に
より、金属回路板が浮くことがなく、また、金属回路板
に反りが発生することがない。BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a metal circuit board having a circuit pattern formed by punching out a conductive metal plate by a press is placed in a molding die for resin molding, A method of resin-molding a connection plate for a molded motor, wherein the metal circuit board is integrally molded with an electrically insulating resin, wherein the upper and lower end surfaces of the metal circuit board are positioned by a plurality of pins provided in the resin mold. Molded with a resin in a fixed state By the resin molding method of the connection plate for the motor, the metal circuit board can be fixed by sandwiching it with a plurality of pins. Does not float, and the metal circuit board does not warp.
【００１７】本発明の請求項２に記載の発明は、導電性
金属板をプレスにより打ち抜いて回路パターンを形成し
た金属回路板を配設し、樹脂モールドにより所定の結線
板の形状を形成するキャビティを構成する上金型及び下
金型とからなる成形金型装置において、前記上金型と下
金型のキャビティ面に、前記金属回路板の上下両端面を
保持する複数のピンを備えた樹脂モールド成形金型装置
において、前記上金型と下金型に前記金属回路板を上下
から押さえつける複数のピンを備えた樹脂モールド成形
金型装置を用いることにより、上金型と下金型に配され
た複数のピンで金属回路板を挟合固定することができ、
樹脂モールドの樹脂充填時の圧力等により、金属回路板
が浮くことがなく、また、金属回路板に反りが発生する
ことがない。The invention according to claim 2 of the present invention is a cavity for arranging a metal circuit board having a circuit pattern formed by punching out a conductive metal plate with a press and forming a predetermined connection board shape by resin molding. In a molding die device comprising an upper die and a lower die, the resin having a plurality of pins for holding the upper and lower end surfaces of the metal circuit board on the cavity surfaces of the upper die and the lower die. In the mold forming die device, by using a resin mold forming die device having a plurality of pins for pressing the metal circuit board from above and below on the upper die and the lower die, the upper die and the lower die are distributed. The metal circuit board can be sandwiched and fixed with the multiple pins
The metal circuit board does not float and the metal circuit board does not warp due to pressure when the resin mold is filled with resin.
【００１８】以下、本発明の実施の形態について、図を
用いて説明する。 （実施の形態１）図１は本発明の第一の実施の形態にお
ける樹脂モールド成形金型装置を示してある。図におい
て４は所定の結線板の形状を形成するように型打ちされ
た成形金型装置であり、導電性材料からなる回路パター
ンを有する金属回路板１は、下金型４ａと下金型４ｂと
により構成される空間（キャビティ）に配され、この上
金型４ａと下金型４ｂとを合成樹脂２の充填口（図示せ
ず）を除いて密閉する。複数のピンである押え用のピン
３は、上金型４ａと下金型４ｂとのキャビティ面に形成
され、金属回路板１を各々の金型に設けた押え用のピン
３により挟んで固定する。そして、前記充填口から合成
樹脂を充填する充填装置（図示せず）があり、この充填
装置から前記金型の樹脂充填口を通して前記空間内に合
成樹脂２を充填することにより金属回路板１を所定の形
状に樹脂モールドし、結線板を製造する。Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 shows a resin molding die apparatus according to a first embodiment of the present invention. In the figure, reference numeral 4 denotes a molding die device stamped so as to form a predetermined connection plate shape. A metal circuit board 1 having a circuit pattern made of a conductive material is a lower die 4a and a lower die 4b. The upper mold 4a and the lower mold 4b are sealed in a space (cavity) constituted by and except the filling port (not shown) of the synthetic resin 2. The pressing pins 3, which are a plurality of pins, are formed on the cavity surfaces of the upper mold 4a and the lower mold 4b, and the metal circuit board 1 is sandwiched and fixed by the pressing pins 3 provided in each mold. To do. There is a filling device (not shown) for filling the synthetic resin from the filling port, and the metal circuit board 1 is filled with the synthetic resin 2 from the filling device through the resin filling port of the mold. A wiring board is manufactured by resin molding into a predetermined shape.
【００１９】次に、この樹脂モールド成形金型装置を用
いた結線板の樹脂モールド方法を説明する。まず、導電
性の金属板からプレスにより打ち抜いて回路パターンを
形成した金属回路板１を樹脂モールド用の下金型４ｂの
押え用のピン３上に配設し、上金型４ａを下金型４ｂ上
に配し、上金型４ａと下金型４ｂとによりモールド用の
空間（キャビティ）を形成する。この際、キャビティ内
に設けた押え用のピン３により、上下から金属回路板１
を挟んで固定する。Next, a method for resin-molding a connection plate using this resin mold molding die device will be described. First, the metal circuit board 1 on which a circuit pattern is formed by punching out from a conductive metal plate by a press is arranged on the pressing pins 3 of the lower mold 4b for resin molding, and the upper mold 4a is set as the lower mold. 4b, and a mold space (cavity) is formed by the upper mold 4a and the lower mold 4b. At this time, the metal circuit board 1 is placed from above and below by the holding pin 3 provided in the cavity.
Fix by sandwiching.
【００２０】次に充填装置から前記金型に設けた充填口
を通して、モールド用の空間に合成樹脂２を充填し、所
定の形状の結線板を製造する。Then, the space for molding is filled with the synthetic resin 2 from the filling device through the filling port provided in the mold to manufacture a wire connection plate having a predetermined shape.
【００２１】このように、金型内に設けた複数のピンに
より金属回路板を挟合して固定することができるので、
合成樹脂の充填時の圧力により金属回路板が浮くことが
なく、また充填時の温度により金属回路板が変形するこ
ともないので、結線板の回路パターンの精度を高精度に
維持し、かつ結線板の不良をも防止するものである。As described above, since the metal circuit board can be sandwiched and fixed by the plurality of pins provided in the mold,
Since the metal circuit board does not float due to the pressure when the synthetic resin is filled, and the metal circuit board does not deform due to the temperature when filling, the accuracy of the circuit pattern of the wiring board is maintained with high accuracy and It also prevents board defects.
【００２２】[0022]
【発明の効果】以上のように本発明によれば、導電性金
属板をプレスにより打ち抜いて回路パターンを形成した
金属回路板を樹脂モールド用の成形金型内に配設し、前
記金属回路板を電気絶縁性の樹脂で一体にモールドする
モールドモータ用結線板の樹脂モールド方法であって、
前記金属回路板の上下両端面を前記樹脂モールド用金型
に有する複数のピンで位置固定した状態で樹脂モールド
するモールドモータ用結線板の樹脂モールド方法を用い
ることにより、金属回路板を複数のピンで挟合して固定
することができ、樹脂モールドの樹脂充填時の圧力等に
より、金属回路板が浮くことがなく、また、金属回路板
に反りが発生することがないので、結線板の回路パター
ンの精度を高精度に維持し、かつ結線板の不良をも防止
するものである。As described above, according to the present invention, a metal circuit board having a circuit pattern formed by punching out a conductive metal plate with a press is arranged in a molding die for resin molding, and the metal circuit board is formed. Is a resin molding method of a connecting plate for a molded motor, which is integrally molded with an electrically insulating resin,
By using the resin molding method of the connection plate for the molded motor, the resin is molded while the upper and lower end surfaces of the metal circuit board are fixed in position by the plurality of pins provided in the resin molding die. The metal circuit board will not float due to the pressure when the resin is filled in the resin mold, and the metal circuit board will not warp. The accuracy of the pattern is maintained with high accuracy, and the connection plate is prevented from being defective.
【図１】本発明の第一の実施の形態における樹脂モール
ド成形金型装置を示す図FIG. 1 is a diagram showing a resin mold molding die device according to a first embodiment of the present invention.
【図２】（ａ）結線板を備えたモールドモータの断面図 （ｂ）同モールドモータの固定子組立体を示す図 （ｃ）図２（ｂ）に示す結線板のＡ−Ａ断面図2A is a cross-sectional view of a molded motor provided with a connection plate. FIG. 2B is a diagram showing a stator assembly of the same molded motor. FIG. 2C is a cross-sectional view taken along the line AA of the connection plate shown in FIG.
【図３】図２に示すモールドモータを構成する結線板と
固定子鉄心を示す正面及び断面図3 is a front view and a cross-sectional view showing a connection plate and a stator core that form the molded motor shown in FIG.
【図４】図３に示す結線板の詳細図FIG. 4 is a detailed view of the connection plate shown in FIG.
【図５】図４に示す結線板の製造工程図FIG. 5 is a manufacturing process diagram of the connection plate shown in FIG.
【図６】従来の樹脂モールド成形金型装置を示す図FIG. 6 is a diagram showing a conventional resin mold molding die device.
１ 金属回路板 ２ 合成樹脂 ３ 押え用のピン ４ａ 上金型 ４ｂ 下金型 1 Metal Circuit Board 2 Synthetic Resin 3 Pin for Holding 4a Upper Mold 4b Lower Mold
フロントページの続き (72)発明者 近藤 元輝 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Front page continuation (72) Inventor Motoki Kondo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (2)
回路パターンを形成した金属回路板を樹脂モールド用の
成形金型内に配設し、前記金属回路板を電気絶縁性の樹
脂で一体にモールドするモールドモータ用結線板の樹脂
モールド方法であって、前記金属回路板の上下両端面を
前記樹脂モールド用金型に有する複数のピンで位置固定
した状態で樹脂モールドするモールドモータ用結線板の
樹脂モールド方法。1. A metal circuit board having a circuit pattern formed by punching out a conductive metal plate by a press is placed in a molding die for resin molding, and the metal circuit board is integrally molded with an electrically insulating resin. A method for resin-molding a connection plate for a mold motor, comprising: resin for a connection plate for a mold motor, wherein the upper and lower end surfaces of the metal circuit board are position-fixed by a plurality of pins provided in the mold for resin molding. Molding method.
回路パターンを形成した金属回路板を配設し、樹脂モー
ルドにより所定の結線板の形状を形成するキャビティを
構成する上金型及び下金型とからなる成形金型装置にお
いて、前記上金型と下金型のキャビティ面に、前記金属
回路板の上下両端面を保持する複数のピンを備えた樹脂
モールド成形金形装置。2. An upper die and a lower die which form a cavity for forming a predetermined connection board shape by resin molding, in which a metal circuit board having a circuit pattern formed by punching out a conductive metal plate is arranged. A molding die apparatus comprising: a resin molding die apparatus having a plurality of pins for holding the upper and lower end surfaces of the metal circuit board on the cavity surfaces of the upper die and the lower die.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8119861A JPH09308190A (en) | 1996-05-15 | 1996-05-15 | Resin molding method for connection board for molded motor and resin molding forming mold apparatus |
| CN96108868A CN1063701C (en) | 1996-05-15 | 1996-07-22 | Terminal plate resin die casting method and resin die casting forming metal modeld evice for die casting motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8119861A JPH09308190A (en) | 1996-05-15 | 1996-05-15 | Resin molding method for connection board for molded motor and resin molding forming mold apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09308190A true JPH09308190A (en) | 1997-11-28 |
Family
ID=14772092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8119861A Pending JPH09308190A (en) | 1996-05-15 | 1996-05-15 | Resin molding method for connection board for molded motor and resin molding forming mold apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH09308190A (en) |
| CN (1) | CN1063701C (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1050157A (en) * | 1990-07-25 | 1991-03-27 | 中国船舶工业总公司第六三五四所 | Casting technique for servo slip ring |
| NL9301585A (en) * | 1993-03-23 | 1994-10-17 | Tchai Lights Bv | Method and device for manufacturing light panels, as well as such a light panel. |
| CN1155465A (en) * | 1995-12-06 | 1997-07-30 | 员引院 | Technological parameters and prescription of mixed materials of epoxy terminals of electric locomotive transformer |
-
1996
- 1996-05-15 JP JP8119861A patent/JPH09308190A/en active Pending
- 1996-07-22 CN CN96108868A patent/CN1063701C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1063701C (en) | 2001-03-28 |
| CN1165076A (en) | 1997-11-19 |
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