JPH05315189A - Molded-armor type electric double layer capacitor and manufacture thereof - Google Patents
Molded-armor type electric double layer capacitor and manufacture thereofInfo
- Publication number
- JPH05315189A JPH05315189A JP4079740A JP7974092A JPH05315189A JP H05315189 A JPH05315189 A JP H05315189A JP 4079740 A JP4079740 A JP 4079740A JP 7974092 A JP7974092 A JP 7974092A JP H05315189 A JPH05315189 A JP H05315189A
- Authority
- JP
- Japan
- Prior art keywords
- double layer
- electric double
- layer capacitor
- lead frame
- laminated body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はモールド外装型電気二重
層コンデンサ及びその製造方法に関し、特にリードフレ
ームの加工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold exterior electric double layer capacitor and a method for manufacturing the same, and more particularly to a method for processing a lead frame.
【0002】[0002]
【従来の技術】従来この種のモールド外装型電気二重層
コンデンサは、図2の断面図に示すように、複数個直列
に積層された電気二重層コンデンサ素子3の上下両端部
に略L字型に曲げられた外部導出用リードフレーム1
a,1bを設置し、リードフレーム1a,1bを介して
電気二重層コンデンサ素子3の積層体を外装ケース5を
成形する金型(図5の金型と同じ金型の為、図は略す)
内の凸部にて加圧挟持され、次に金型内に樹脂が注入さ
れ、外装ケース5が形成される。外装ケース5の外部へ
導出したリードフレーム1a,1bの一部には切断、折
り曲げ加工が加えられ、外部電極となる。2. Description of the Related Art Conventionally, as shown in the cross-sectional view of FIG. 2, a conventional molded external electric double layer capacitor of this type has a substantially L-shaped structure at both upper and lower ends of an electric double layer capacitor element 3 stacked in series. Lead-out lead frame 1 bent to the outside
A mold for molding the outer case 5 by installing a and 1b and forming a laminated body of the electric double layer capacitor element 3 through the lead frames 1a and 1b (the mold is the same as the mold of FIG. 5, so the illustration is omitted).
The outer case 5 is formed by being pressed and sandwiched by the convex portions inside and then injecting resin into the mold. A part of the lead frames 1a and 1b led out of the outer case 5 is cut and bent to be an external electrode.
【0003】[0003]
【発明が解決しようとする課題】この従来のモールド外
装型電気二重層コンデンサでは図2に示したように、電
気二重層コンデンサ素子3が導電性ゴム3a、非導電性
ゴム3bの積層体から構成されている為、外装ケース5
を成形する金型内に収納され、金型内の凸部にて縦方向
から加圧挟持されると電気二重層コンデンサ素子3が横
方向に膨らみを生じるようになる。この際、略L字型に
曲げられたリードフレーム1a,1bと電気二重層コン
デンサ素子3側面に露出した導電性ゴム3aが電気的に
接触(短絡)する場合がある。In this conventional molded exterior type electric double layer capacitor, as shown in FIG. 2, the electric double layer capacitor element 3 is composed of a laminated body of conductive rubber 3a and non-conductive rubber 3b. Because it has been installed, the outer case 5
When the electric double layer capacitor element 3 is housed in a mold for molding and is pressed and sandwiched in the vertical direction by the convex portion in the mold, the electric double layer capacitor element 3 bulges in the lateral direction. At this time, the lead frames 1a and 1b bent in a substantially L shape and the conductive rubber 3a exposed on the side surface of the electric double layer capacitor element 3 may electrically contact (short circuit).
【0004】一方、電気二重層コンデンサ素子3はその
要求される耐電圧性能に応じ積層個数が決定される。従
って、リードフレーム1a,1bと導電性ゴム3aが電
気的に接触すると、耐電圧が低下する不良品ができる問
題点があった。On the other hand, the number of laminated electric double layer capacitor elements 3 is determined according to the required withstand voltage performance. Therefore, when the lead frames 1a and 1b and the conductive rubber 3a are electrically contacted with each other, there is a problem that a defective product having a reduced withstand voltage is formed.
【0005】また、図2で示したような製品の小型化が
特に要求されるチップ部品では、それぞれの構成部品間
のクリアランスが非常に小さくなっている為、上述した
短絡での不良率が高く問題でもあった。Further, in the case of a chip component as shown in FIG. 2 which is particularly required to be miniaturized, the clearance between the respective components is very small, so that the defective rate due to the short circuit is high. It was also a problem.
【0006】本発明の目的は、電気二重層コンデンサ素
子を縦方向から加圧したときに生じる横方向の膨らみに
よるリードフレームとの接触・短絡を防ぎ、かつ素子の
側面とリードフレーム間のクリアランスも小さくでき、
その結果小型化も達成できるモールド外装型電気二重層
コンデンサ及びその製造方法を提供することにある。An object of the present invention is to prevent contact and short circuit with the lead frame due to lateral bulging which occurs when the electric double layer capacitor element is pressed from the vertical direction, and also the clearance between the side surface of the element and the lead frame. Can be made smaller,
As a result, it is an object of the present invention to provide a molded external type electric double layer capacitor that can achieve miniaturization and a method for manufacturing the same.
【0007】[0007]
【課題を解決するための手段】本発明の第1の発明のモ
ールド外装型電気二重層コンデンサは、複数個直列に積
層された電気二重層コンデンサ素子の積層体と、その積
層体の上下両端面に配置された、ほぼL字型に成型さ
れ、前記積層体の側面に対向する面に絶縁性樹脂が被覆
されたリードフレームと、前記積層体の両端面に接する
リードフレームに圧力を加えた状態で前記リードフレー
ムの一部を除く全体を被覆して形成された外装ケースと
を有することを特徴として構成される。According to a first aspect of the present invention, there is provided a molded exterior type electric double layer capacitor comprising a laminate of a plurality of electric double layer capacitor elements laminated in series, and upper and lower end surfaces of the laminate. And a state in which pressure is applied to the lead frame formed in a substantially L shape and having a surface facing the side surface of the laminate covered with an insulating resin and the lead frames in contact with both end surfaces of the laminate. And an outer case formed by covering the entire lead frame except a part thereof.
【0008】またリードフレームを被覆する絶縁性樹脂
として絶縁性シールを貼付することにより目的が達成で
きる。The object can be achieved by attaching an insulating seal as an insulating resin for covering the lead frame.
【0009】また本発明のモールド外装型電気二重層コ
ンデンサの製造方法は、短冊状に打ち抜かれたリードフ
レームの一面に絶縁性の樹脂をほぼ中央部を除く2箇所
に塗布,硬化させる工程と、前記絶縁性樹脂が形成され
たリードフレームの一部を片持ち梁状に分割する工程
と、前記リードフレームをほぼL字型に成形する工程
と、ほぼ円筒状の電気二重層コンデンサ素子積層体の上
下面に樹脂を塗布しない部分の面を、樹脂を塗布した面
を積層体の側面に対向させて配置する工程とを含むこと
を特徴として構成される。Further, the method of manufacturing a molded exterior type electric double layer capacitor of the present invention comprises a step of applying and curing an insulating resin on one surface of a lead frame punched in a strip shape at two locations except for the central portion. A step of dividing a part of the lead frame on which the insulating resin is formed into a cantilever shape; a step of molding the lead frame into a substantially L shape; and a step of forming a substantially cylindrical electric double layer capacitor element laminate. And a step of disposing the surface of the upper and lower surfaces where the resin is not applied so that the surface to which the resin is applied faces the side surface of the laminated body.
【0010】[0010]
【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例のモールド外装型電気二重
層コンデンサの断面図でありまた図3〜図6は図1に示
す一実施例の製造方法を説明するために工程順に示した
平面図、側面図、断面図、斜視図である。この電気二重
層コンデンサの製造に当たっては、まず図3(a)のよ
うに中央部が略円形状をなす短冊状のリードフレーム1
の一面に中央部を除いた2ケ所にシリコーンゴム等の絶
縁性樹脂2をスクリーン印刷等の手段で印刷塗布する。
次にこの絶縁性樹脂2に加熱等の処理を行い硬化させ
る。硬化後図3(b)のようにリードフレーム1の一部
を切断し、片持ち梁状1a,1bに分割する。この分割
されたリードフレーム1a,1bは図4に示したように
複数個積層された電気二重層コンデンサ素子3の上下端
に略L字形に折り曲げられ、絶縁性樹脂2塗布面を対抗
させ配置される。この状態で図5に示したように成型金
型4内に収納し、金型4内の凸部4(a),4(b),
4(c),4(d)でリードフレーム1a,1bを介し
電気二重層コンデンサ素子3を加圧する。The present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a molded exterior type electric double layer capacitor of one embodiment of the present invention, and FIGS. 3 to 6 are plan views showing in order of steps for explaining a manufacturing method of one embodiment shown in FIG. It is a side view, a cross-sectional view, and a perspective view. In manufacturing the electric double layer capacitor, first, as shown in FIG. 3A, a strip-shaped lead frame 1 having a substantially circular center portion.
Insulating resin 2 such as silicone rubber is printed and applied on one surface at two places except the central portion by means of screen printing or the like.
Next, the insulating resin 2 is subjected to a treatment such as heating to be cured. After curing, a part of the lead frame 1 is cut as shown in FIG. 3B and divided into cantilever beams 1a and 1b. As shown in FIG. 4, the divided lead frames 1a and 1b are bent in a substantially L shape at the upper and lower ends of the electric double layer capacitor element 3 and are arranged so as to oppose the coated surface of the insulating resin 2. It In this state, as shown in FIG. 5, it is housed in the molding die 4, and the convex portions 4 (a), 4 (b),
4 (c) and 4 (d) press the electric double layer capacitor element 3 through the lead frames 1a and 1b.
【0011】電気二重層コンデンサでは、電気二重層コ
ンデンサ素子3を加圧することにより、内部の接触抵抗
を下げ良好な特性を具現化している。電気二重層コンデ
ンサ素子3は導電性ゴム3aと非導電性ゴム3bより構
成されているため、図5に示した様に電気二重層コンデ
ンサ素子3を縦方向から加圧した場合、横方向へ膨らみ
を生じることになる。In the electric double layer capacitor, by pressing the electric double layer capacitor element 3, the internal contact resistance is lowered and good characteristics are realized. Since the electric double layer capacitor element 3 is composed of the conductive rubber 3a and the non-conductive rubber 3b, when the electric double layer capacitor element 3 is pressed in the vertical direction as shown in FIG. Will occur.
【0012】本発明では電気二重層コンデンサ素子3に
横方向の膨らみが生じても、リードフレーム1a,1b
に絶縁性樹脂2が塗布されているため、電気二重層コン
デンサ素子3の導電性ゴム3aと電気的に接触(短絡)
することがない。このような加圧状態で金型4内に成形
樹脂が注入され外装ケース5が形成される。外装ケース
5形成後、外装ケース5外部へ導出しているリードフレ
ームに切断・折り曲げ加工を加え、図6に示すモールド
外装型電気二重層コンデンサが製造される。According to the present invention, even if the electric double layer capacitor element 3 expands in the lateral direction, the lead frames 1a and 1b are formed.
Since the insulating resin 2 is applied to the surface of the electric double layer capacitor element 3, it electrically contacts (shorts) with the conductive rubber 3a of the electric double layer capacitor element 3.
There is nothing to do. Under such pressure, the molding resin is injected into the mold 4 to form the outer case 5. After the outer case 5 is formed, the lead frame led out of the outer case 5 is cut and bent to manufacture the molded outer type electric double layer capacitor shown in FIG.
【0013】尚、リードフレーム1に印刷塗布する絶縁
性樹脂2は、電気二重層コンデンサ素子3を縦方向から
加圧する面は避け、横方向に膨らむ側面の導電性ゴム3
a露出側に形成することは言うまでもない。The insulating resin 2 applied by printing on the lead frame 1 avoids the surface that presses the electric double layer capacitor element 3 in the vertical direction, and the conductive rubber 3 on the side surface that swells in the horizontal direction.
Needless to say, it is formed on the exposed side.
【0014】また、本発明の第2の実施例の絶縁シール
6の貼られたリードフレーム1の平面図を図7に示し
た。この第2の実施例でも、電気二重層コンデンサ素子
3を縦方向から加圧した際に生ずる横方向の膨らみに対
し、絶縁性樹脂2と同様にリードフレーム1と絶縁が保
たれる利点を有している。ここで使用される絶縁性シー
ル6の材料としては製品の使用最高温度でも変質しない
ポリアミド材等が望ましい。FIG. 7 is a plan view of the lead frame 1 to which the insulating seal 6 according to the second embodiment of the present invention is attached. The second embodiment also has an advantage that the insulation from the lead frame 1 is maintained like the insulating resin 2 against the lateral bulging that occurs when the electric double layer capacitor element 3 is pressed from the vertical direction. is doing. As the material of the insulating seal 6 used here, a polyamide material or the like that does not deteriorate even at the maximum operating temperature of the product is desirable.
【0015】[0015]
【発明の効果】以上説明したように本発明は、電気二重
層コンデンサ素子の側面の導電性ゴム露出側に向き合っ
た絶縁性樹脂又は絶縁性シールを有するリードフレーム
を配置しているので、電気二重層コンデンサ素子を縦方
向から加圧した際に生じる横方向の膨らみがあっても、
リードフレームと電気的に接触(短絡)する不良品が発
生しない利点を有している。As described above, according to the present invention, the lead frame having the insulating resin or the insulating seal facing the exposed side of the conductive rubber on the side surface of the electric double layer capacitor element is arranged. Even if there is a lateral bulge that occurs when the multilayer capacitor element is pressed from the vertical direction,
This has the advantage that no defective product that electrically contacts (shorts) with the lead frame is generated.
【0016】また、電気二重層コンデンサ素子の側面と
リードフレーム間のクリアランスも絶縁性樹脂又は絶縁
性シールにより離間されているので小さくできる。つま
り製品の小型化が実現できる利点も有している。Further, the clearance between the side surface of the electric double layer capacitor element and the lead frame can be reduced because it is separated by the insulating resin or the insulating seal. In other words, it also has the advantage that the product can be made smaller.
【図1】本発明の一実施例のモールド外装型電気二重層
コンデンサの断面図である。FIG. 1 is a cross-sectional view of a mold exterior type electric double layer capacitor of one embodiment of the present invention.
【図2】従来のモールド外装型電気二重層コンデンサ一
例の断面図である。FIG. 2 is a cross-sectional view of an example of a conventional mold exterior type electric double layer capacitor.
【図3】本発明の一実施例に使用する絶縁性樹脂の塗布
された短冊状のリードフレームの平面図及びその一部を
切断した平面図である。3A and 3B are a plan view and a partially cut plan view of a strip-shaped lead frame coated with an insulating resin used in an embodiment of the present invention.
【図4】図3に続く工程と、絶縁性樹脂の形成されたリ
ードフレームに電気二重層コンデンサ素子を配設した状
態を示す側面図である。FIG. 4 is a side view showing a step following FIG. 3 and a state in which an electric double layer capacitor element is arranged on a lead frame on which an insulating resin is formed.
【図5】図4に続く工程で外装ケース成形金型内に収納
された状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state of being housed in an outer case molding die in a step following that of FIG.
【図6】本発明の一実施例のモールド外装型電気二重層
コンデンサの斜視図である。FIG. 6 is a perspective view of a mold exterior type electric double layer capacitor of one embodiment of the present invention.
【図7】本発明の第2の実施例に使用する絶縁性シール
の貼られたリードフレームの平面図である。FIG. 7 is a plan view of a lead frame to which an insulating seal is attached, which is used in the second embodiment of the present invention.
1,1a,1b リードフレーム 2 絶縁性樹脂 3 電気二重層コンデンサ素子 3a 導電性ゴム 3b 非導電性ゴム 4 金型 4a,4b,4c,4d 金型の凸部 5 外装ケース 6 絶縁性シール 1, 1a, 1b Lead frame 2 Insulating resin 3 Electric double layer capacitor element 3a Conductive rubber 3b Non-conductive rubber 4 Mold 4a, 4b, 4c, 4d Convex part of mold 5 Exterior case 6 Insulating seal
Claims (3)
デンサ素子の積層体と、該積層体の上下両端面に配置さ
れた、ほぼL字型に成型され前記積層体の側面に対向す
る面に絶縁性樹脂が被覆されたリードフレームと、前記
積層体の両端面に接するリードフレームに圧力を加えた
状態で前記リードフレームの一部を除く全体を被覆して
形成された外装ケースとを有することを特徴とするモー
ルド外装型電気二重層コンデンサ。1. A laminated body of a plurality of electric double layer capacitor elements laminated in series, and a surface which is arranged in upper and lower end surfaces of the laminated body and which is formed into a substantially L shape and faces a side surface of the laminated body. A lead frame coated with an insulating resin, and an outer case formed by covering the entire lead frame except a part of the lead frame in a state where pressure is applied to the lead frames in contact with both end faces of the laminated body. A molded exterior type electric double layer capacitor characterized by the following.
脂が貼付された絶縁性シールであることを特徴とする請
求項1記載のモールド外装型電気二重層コンデンサ。2. The molded external type electric double layer capacitor according to claim 1, wherein the molded outer type electric double layer capacitor is an insulating seal to which an insulating resin covering the lead frame is attached.
一面に絶縁性の樹脂をほぼ中央部を除く2箇所に塗布,
硬化させる工程と、前記絶縁性樹脂が形成されたリード
フレームの一部を片持ち梁状に分割する工程と、前記リ
ードフレームをほぼL字型に成形する工程と、ほぼ円筒
状の電気二重層コンデンサ素子積層体の上下面に樹脂を
塗布しない部分の面を、樹脂を塗布した面を積層体の側
面に対向させて配置する工程とを含むことを特徴とする
モールド外装型電気二重層コンデンサの製造方法。3. An insulative resin is applied to one surface of a lead frame punched in a strip shape at two locations except for the central portion,
A step of curing, a step of dividing a part of the lead frame on which the insulating resin is formed into a cantilever shape, a step of forming the lead frame into a substantially L shape, and a substantially cylindrical electric double layer And a step of disposing the surface of the capacitor element laminated body where the resin is not applied on the upper and lower surfaces of the capacitor element laminated body facing the side surface of the laminated body. Production method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4079740A JPH05315189A (en) | 1992-04-01 | 1992-04-01 | Molded-armor type electric double layer capacitor and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4079740A JPH05315189A (en) | 1992-04-01 | 1992-04-01 | Molded-armor type electric double layer capacitor and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05315189A true JPH05315189A (en) | 1993-11-26 |
Family
ID=13698620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4079740A Pending JPH05315189A (en) | 1992-04-01 | 1992-04-01 | Molded-armor type electric double layer capacitor and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05315189A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039256A (en) * | 2003-06-30 | 2005-02-10 | Seiko Instruments Inc | Electrochemical cell and method for manufacturing the same |
WO2006064837A1 (en) * | 2004-12-14 | 2006-06-22 | Kitagawa Seiki Kabushiki Kaisha | Electric double layer capacitor |
JP2012023220A (en) * | 2010-07-15 | 2012-02-02 | Seiko Instruments Inc | Electronic component, electronic apparatus, and method of manufacturing electronic component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350119B2 (en) * | 1980-10-08 | 1988-10-06 | Hitachi Ltd | |
JPH03268315A (en) * | 1990-03-16 | 1991-11-29 | Hyogo Nippon Denki Kk | Electric double layer capacitor and manufacture thereof |
-
1992
- 1992-04-01 JP JP4079740A patent/JPH05315189A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350119B2 (en) * | 1980-10-08 | 1988-10-06 | Hitachi Ltd | |
JPH03268315A (en) * | 1990-03-16 | 1991-11-29 | Hyogo Nippon Denki Kk | Electric double layer capacitor and manufacture thereof |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039256A (en) * | 2003-06-30 | 2005-02-10 | Seiko Instruments Inc | Electrochemical cell and method for manufacturing the same |
JP4520778B2 (en) * | 2003-06-30 | 2010-08-11 | セイコーインスツル株式会社 | Surface-mount type electrochemical cell and manufacturing method thereof |
WO2006064837A1 (en) * | 2004-12-14 | 2006-06-22 | Kitagawa Seiki Kabushiki Kaisha | Electric double layer capacitor |
JP2012023220A (en) * | 2010-07-15 | 2012-02-02 | Seiko Instruments Inc | Electronic component, electronic apparatus, and method of manufacturing electronic component |
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