JPH04279016A - Manufacture of chip type electrical double-layer capacitor - Google Patents

Abstract

PURPOSE:To reduce the cost of the title capacitor by simplifying the structure and eliminating the need of a large number of enclosing members. CONSTITUTION:This method for manufacturing a chip type electrical double- layer capacitor contains a process for installing lead terminal blocks 2a and 2b for leading out to both end sections of an electrical double-layer capacitor element 1 composed of a laminated body of a plurality of layers piled up in series and fixing the terminal blocks while parts of the terminal blocks are held by molding dies, process for forming an enclosing case by injecting a resin in the molding dies, and process for shaping the lead terminals drawn out from the side faces of the enclosing case after bending the terminals in the same direction.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip type electric double layer capacitor, and more particularly to a case forming process.

0002

2. Description of the Related Art As shown in FIG. 4, a conventional electric double layer capacitor has a lead terminal plate 2c in contact with a lower surface portion 1a of a plurality of electric double layer capacitor elements 1 stacked in series, and an upper surface portion 1b. The lead terminal plates 2d electrically connected via the metal case 5 were each bent into a substantially U-shaped cross section to serve as external electrodes. In the case of this conventional chip type electric double layer capacitor, the bent lead terminal plates 2c, 2d and the metal case 5 are separated by an insulating sleeve 7 so that they do not come into electrical contact.

[0003]Also, even within the metal case 5, the electrodes (not shown) exposed on the side surfaces of the electric double layer element 1 are separated by an insulating case 6 so that they do not come into electrical contact with the metal case 5. There is. Furthermore, the lead terminal plates 2c, 2 on the bottom of the product
In order to ensure the sealability of d, a sealing resin 8 was applied and assembled.

0004

[Problems to be Solved by the Invention] A conventional electric double layer capacitor has, in addition to an electric double layer capacitor element 1 which originally has the function of a capacitor, a metal case 5 for electrical connection and insulation, and a metal case 5 for electrical connection and insulation. Since members such as the resin 8 are required, there is a problem in that the cost is high.

An object of the present invention is to provide a method for manufacturing a chip-type electric double layer capacitor that has a simple structure, does not require many exterior members as in the past, and can reduce costs. .

[0006]

[Means for Solving the Problems] The method for manufacturing a chip-type electric double layer capacitor of the present invention includes installing lead terminal plates for leading to the outside at both ends of a plurality of electric double layer capacitor elements stacked in series. A process of clamping and fixing a part of the lead terminal board with each mold, and pouring resin into the mold.
The method includes a step of forming an outer case, and a step of bending and shaping each lead terminal led out from the side surface of the outer case in the same direction.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view of a chip type electric double layer capacitor according to an embodiment of the present invention. Further, FIG. 2 is a side view showing a case molding process showing the features of the present invention, and FIG. 3 is an external view of an embodiment of the present invention.

In FIG. 2, lead terminal plates 2a are provided at both ends of the electric double layer capacitor elements 1 stacked in series.
, 2b are in contact. These lead terminal plates 2a and 2b are spaced apart from electrodes (not shown) exposed layer by layer on the side surfaces of the electric double layer capacitor element 1, and are arranged from approximately the center to the outer periphery of the electric double layer capacitor element 1 stacked in series. A bending process has been added in the direction. In this state, in order to mold the exterior case 3, it is housed in molding molds 4a and 4b. PPS (polyphenylene sulfide) is used as the molding resin to satisfy the heat resistance required for chip parts.
So-called engineering plastics such as resin are used. In the case of the present invention, the electric double layer capacitor element is placed in the molding molds 4a, 4b via the lead terminal plates 2a, 2b so that it does not move due to the injection pressure of the resin used to mold the exterior case 3. 4a
, 4b are provided with convex portions 4c, 4d and clamped and fixed. The convex portions 4c and 4d simultaneously have the effect of pressurizing the electric double layer capacitor element 1 and lowering the conduction resistance between the electric double layer capacitor elements 1. Since the resin is cast after being clamped and fixed by the convex parts 4c and 4d, concave parts 3a and 3b are formed in a part of the exterior case 3, as shown in FIG. After the case 3 is molded, it is pulled out from the case 3. The lead terminal plates 2a and 2b are bent into a predetermined electrode shape to complete a chip type electric double layer capacitor as shown in FIG.

[0009]

[Effects of the Invention] As explained above, in the present invention, after the electric double layer capacitor element and the lead terminal are clamped and fixed,
Since the outer case is formed by casting, the outer case is integrated and becomes a chip component, so it does not require as many members as in the conventional case, so it has the advantage of low cost.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a chip type electric double layer capacitor formed according to an embodiment of the present invention.

FIG. 2 is a side view of a molding process for explaining one embodiment of the present invention.

FIG. 3 is a top view, a side view, and a bottom view of a chip type electric double layer capacitor formed according to an embodiment of the present invention.

FIG. 4 is a sectional view of a conventional electric double layer capacitor for explaining a conventional example.

[Explanation of symbols]

1 Electric double layer capacitor element 1a (of the electric double layer capacitor element) Upper surface part 1
b Lower surface part 2a (of the electric double layer capacitor element)
, 2b, 2c, 2d Lead terminal plate 3 Exterior case 3a, 3b Recessed portions 4a, 4b of exterior case Molding mold 4c, 4d Convex portion of molding mold 5 Metal case 6 Insulating case 7 Insulating sleeve 8 Sealing resin

Claims (1)

[Claims] 1. A step of installing lead terminal plates for external extraction at both ends of a plurality of electric double layer capacitor elements stacked in series, and clamping and fixing a part of the lead terminal plates with respective molds, A chip mold characterized by comprising the steps of: pouring resin into the mold to form an exterior case; and shaping each lead terminal led out from the side surface of the exterior case by bending in the same direction. Method for manufacturing electric double layer capacitors.