JPH01253906A - Manufacture of chip-type inductance element - Google Patents

Abstract

PURPOSE:To enable an element which is simple in construction and is superb in mass production by embedding a metal coil within resin molded object and by engaging a metal cap for electrode at both end of the resin molded object while it is connected to the ends part of the metal coil. CONSTITUTION:A metal coil 22 formed by using a metal conductor is put into a mold force, a resin obtained by mixing a magnetic body powder into the molding die, and a chiplike resin molded body 23 where the metal coil 22 is embedded inside is formed. The solid resin molded body 23 is taken out of the molding die, a metal cap 24 for electrode is mounted at both edges and each metal cap 24 is electrically connected to the edge of the metal coil 22. It allows the inductor element to meet the requirement for high integration and high frequency and an element which is simple in construction and superb in mass production is obtained.

Description

[Detailed Description of the Invention] <Industrial Application Field> This invention is a chip-type inductance element manufactured by Tozo 3S.
This relates to method a.

<Prior Art> In recent years, with the miniaturization, higher integration, and higher frequency of circuits, the demand for small, surface-mountable chip-type inductance elements has increased.

Conventionally, this type of inductance element has been manufactured by forming an electrode on a substrate holding a magnetic core, winding a conductor around the magnetic core, and connecting the terminal of the conductor to the electrode on the substrate. linear inductance element, or
A laminated inductance element, which is formed by alternately stacking ferrite green sheets and conductors and connecting the conductors in each layer, is commonly used.

As a conventional multilayer inductance element, the Japanese Patent Publication No. 57
-39521 etc. are known, and the manufacturing process of 3aI will be explained based on FIGS. 3 to 14.

A support is stretched on a flat surface of aluminum or the like, and a magnetic material 1 made of ferrite powder is imprinted on it.

(Fig. 3) Next, a conductive batahen 2 whose terminal 5 reaches the edge of the magnetic material 1 is printed on the surface of the magnetic material 1 having an insulating layer, (Fig. 4)
An insulating layer is printed to cover the lower half of the conductive pattern 2,
Furthermore, the magnetic material 1 is printed on the same part, and an insulating layer is printed on it. (Fig. 5) A conductive pattern 4 is formed in an L shape from the top of the magnetic material 1 having an insulating layer to the end of the conductive pattern 2.
is printed, and the conductive patterns 2 and 4 are electrically connected at the overlapping portion 5. (FIG. 6) Next, an insulating layer is printed so as to cover the upper half of the conductive pattern 4, a magnetic material 6 is further printed at the same location, and an insulating layer is printed on the surface thereof. (Fig. 7) Next, conductive pattern 7
is printed in an L-shape on the magnetic body 6 having an insulating layer and the end of the conductive pattern 4, and the conductive patterns 4 and 7 are electrically connected at the overlapping part 8. (Fig. 8) As described in connection with Fig. 5, the insulating layer and the magnetic material 9
and an insulating layer are printed in this order (Fig. 9), then a conductive pattern 10 is printed to make an electrical connection at the Φ main part 11, and (Fig. 10) an insulating layer, a magnetic material 12, and an insulating layer are printed. Print in this order. (Fig. 11) After R, a conductive pattern 13 having a lead terminal F is printed,
(Fig. 12) Print an insulating layer and magnetic material 14 if necessary.
Ru. (Fig. 13) Terminal conductors S and F are exposed from the edge of the obtained W4 layered body, (Fig. 13) This 1i! The one-layer body is placed in a firing furnace and processed at the required firing temperature and time for the magnetic material, and a conductive paste similar to the conductive pattern is applied to the ends where terminals S and F of the obtained laminated inductance are exposed, and then heated at an appropriate temperature. The external terminals 16 are made by baking them. (Figure 14) <Problem to be solved by the invention> As mentioned above, conventional inductances and their manufacturing methods have complex structures and manufacturing processes, making it difficult to mass-produce both wire-wound inductance elements and multilayer inductance elements. There is a problem that the manufacturing cost is high.

This invention was made to solve the above-mentioned problems, and aims to provide a chip-type inductance that is easy to construct in 4N, easy to mass-produce, and has a low manufacturing cost, and a method for manufacturing the same. .

Means for Solving the Problems> In order to solve the above problems, the first invention is to embed a metal coil inside a resin molded body mixed with magnetic powder, and to attach electrodes to both ends of the resin molded body. The metal 4-Yappu is attached to C, and both metal caps are electrically connected to the corresponding ends of the metal coil.

A second invention that solves the problem is to place a metal coil in a mold, inject a resin mixed with magnetic powder into the mold to form a resin molded body, and after the resin hardens, a resin molded body is formed.
Afterwards, metal caps connected to the ends of the metal coil are attached to both ends of the molded body.

Effect〉 A metal coil formed using gold T14 wire is placed in a mold, and 8J fat mixed with magnetic powder is injected into the mold to produce a chip-shaped resin molded body with the metal coil embedded inside. The hardened resin molded body is taken out from the mold, metal caps for electrodes are fitted on both ends,
A chip-type inductance element is completed by electrically connecting each metal cap to the end of the corresponding metal coil.

<Example> Hereinafter, an example of the present invention will be described based on FIGS. 1 and 2 of the accompanying drawings.

As shown in the figure, the chip-type inductance element 21 is composed of a metal coil 22, a 4IJII molded body 23 in which the metal coil 22 is embedded, and metal caps 24, 24, etc. fitted to both ends of the resin molded body 23. Both metal caps 24,24 are electrically connected to corresponding ends of the metal coil 22.

The metal coil 22 is formed into an air-core coil using a metal conducting wire, and the resin molded body 23 is formed into a rectangular chip shape by injection into a mold using a synthetic resin mixed with magnetic powder. There is.

The chip-type inductance element of the present invention has the above-mentioned structure, and the manufacturing method will be explained next.

Metal coil 22 formed into an air-core coil using metal conductor wire
The metal 1 tile 22 is placed in a mold that determines the shape of the resin molded product.

A resin mixed with magnetic powder is injected into a mold in a molten state, and the resin molded body 23 is molded and covered.

After the injected resin hardens, the resin molded body 23 is removed from the mold, metal caps 24.24 are fixed to both ends of this resin molded body 23 by IR bonding, and both metal caps 24.24 are fixed.
24 and the metal] If the corresponding ends of the tile 22 are electrically connected using a conductive material, as shown in the figure, the metal ↑l
A chip-type inductance water droplet in which the protrusions 24 and 24 serve as electrodes has been completed, and can be made compact and compatible with higher integration and higher frequencies.

Note that the resin scale used for the resin molded body 23 of the present invention may be either thermoplastic or thermosetting.

As mentioned above, this defense means that metal inside the resin molded body:
] The metal caps for the electrodes are fitted to both ends of the resin molded body while being connected to the ends of the metal coil, so the structure is simple and mass-producible, making the Bup-type inductance inexpensive. can be provided.

Furthermore, since the resin molded body is molded using a mold, it has high dimensional accuracy, is compact, and can respond to high integration and high frequencies.

Furthermore, the chip-type inductance water droplet of this defense can demonstrate its characteristics even in the case of high-frequency circuits where air-core coils have been mainly used.While achieving low loss equivalent to air-core coils, It is possible to construct a chip-type inductance element with a robust structure and superior 721 air shielding properties and surface mountability compared to an air-core coil.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a chip-type inductance element according to the present invention, FIG. 2 is a partially cutaway front view of the same, and each of FIGS. 3 to 14 shows a multilayer inductance element exemplified as a conventional inductance element. It is a culm diagram showing the structural order. 21...Chip-type inductance water droplet 22...Metal] 23...Resin molded body 24...Metal cap Applicant's agent Patent attorney Kazuo Iguchi Showa Figure 9 Figure 13 Figure 10
Figure 14 10 So j

Claims (2)

[Claims] (1) A metal coil is buried inside a resin molded body mixed with magnetic powder, metal caps for electrodes are attached to both ends of the resin molded body, and both metal caps are electrically connected to the corresponding ends of the metal coil. Chip type inductance element connected. (2) Place the metal coil in a mold, inject resin mixed with magnetic powder into the mold to form a resin molded body, and after the resin hardens, attach the ends of the metal coil to both ends of the resin molded body. A method for manufacturing a chip-type inductance element, characterized by attaching a metal cap so as to connect it.