JPH09300266A - Suction bit for electronic part mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the life for use of a suction bit to the utmost by forming a diamond layer of fixed thickness on the sucking face of a suction part provided on the extreme end part of a nozzle main body fitted to a mounting head. SOLUTION: A suction bit A for an electronic part mounting machine sucks an electronic part (b) and mounts it to the printed circuit board of a mounting part, and it is constituted of a nozzle main body 2 fitted to the mounting head 1 of a mounting machine and provided with a suction hole 4 in the center, and a suction body 3 provided on the extreme end part of the nozzle main body 2. A film-like diamond layer 3a of fixed thickness, for example, 10-100μm thickness is formed on the sucking face of the suction body 3. This diamond layer 3a is formed by a electrodeposition process, a plasma decomposition composition method, an ionization vapor deposition method, or the like, and diamond powder is deposited on a base material 3b such as sintered hard alloy. Hereby, the sucking face of the suction bit is not deformed, and sucking accuracy of the sucking face can be semipermanently maintained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction bit for an electronic component mounting machine for mounting an electronic component at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art In mounting a chip-shaped electronic component on a printed circuit board, the electronic component is sucked by a suction nozzle and mounted on the printed circuit board. Since it is often formed from a hard material such as, due to the repeated mounting operation, the suction surface of this suction nozzle wears in a relatively short period of time, or a chipping phenomenon occurs due to its brittleness. Will cause adsorption error or unusability.

For this reason, a cemented carbide is brazed to the tip of this nozzle, or Japanese Patent Laid-Open No. 90700/1990.
As described in Japanese Patent Publication No. 7-67030.
It is known that the above-mentioned drawbacks can be eliminated by using a ceramic material having excellent wear resistance.

However, since electronic parts are frequently delivered and received due to a large amount of processing and a high speed, even an adsorption bit made of cemented carbide or ceramic is worn out in a short time and its adsorption surface. Is damaged.

Further, when ceramic is used, the bondability with the mother body tends to be insufficient, and it may fall off during use. There were various problems such as.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an adsorbent is provided at the tip of a nozzle body attached to a mounting head used for mounting electronic components on a printed circuit board. By providing a diamond layer or a diamond sintered body on the suction surface of this suction body, it is possible to provide a suction bit for an electronic component mounting machine that can improve the service life of the suction bit as much as possible. Has an aim.

[0007]

The means of the present invention for achieving the above-mentioned object is an electronic component mounting machine for adsorbing an electronic component from a supply portion and mounting the electronic component on a printed circuit board of the mounting portion. In the suction bit for use in an electronic device, the nozzle body is attached to the mounting head, and the suction body is provided at the tip of the nozzle body. The suction surface of the suction body has a diamond layer of a predetermined thickness. It is in the structure of the suction bit for the component mounting machine.

Further, the suction bit for the electronic component mounting machine is provided with a nozzle body mounted on the mounting head and a suction body formed of a diamond sintered body provided at the tip of the nozzle body.

Further, the adsorbent is made of a diamond sintered body having an inner surface bonded to one side of the cemented carbide and an adsorption surface provided on the outermost side. It is joined to the outer end of the nozzle body.

[0010]

The present invention configured as described above has the following effects.

On the suction surface provided at the tip of the nozzle body,
An adsorbent having a diamond layer or a diamond sintered body is provided.

As a result, the durability life and the suction accuracy are improved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the suction bit for an electronic component mounting machine according to the present invention will be described below with reference to the drawings.

In FIG. 1 and FIG. 2, A is a suction bit for an electronic component mounting machine, which sucks an electronic component b from a supply section of an electronic component mounting machine (not shown) and prints a printed circuit board (not shown) of a mounting section. This electronic component b is mounted on a nozzle body 2 having a suction hole 4 inside the center, which is mounted on the mounting head 1 of the mounting machine, and an adsorbent provided at the tip of the nozzle body 2. 3 and 3.

In the suction bit A of the first embodiment of the present invention, as shown in FIG. 1, a film-shaped diamond layer 3a having a predetermined thickness, for example, 10 to 100 μm, is formed on the suction surface of the suction member 3. To be done.

The diamond layer 3a is formed by an electrodeposition method or the like (a plasma decomposition synthesis method, an ionization vapor deposition method or the like can also be adopted), and a diamond powder is formed on the base material 3b such as cemented carbide. Deposit.

Further, in the second embodiment, as shown in FIG. 2, the nozzle body 2 mounted on the mounting head 1 is mounted.
And an adsorbent 3 formed by a diamond sintered body 3c provided at the tip of the nozzle body 2.

The inside of the adsorbent 3 is made of cemented carbide 5.
Of the diamond sintered body 3c with the suction surface provided on the outermost side, and the other side of the cemented carbide 5 is joined to the outer end of the nozzle body 2 by brazing 3d or the like. is there.

The diamond sintered body 3c is, for example,
Cemented carbide 5 serving as a base material is placed in a metal capsule of titanium or zirconium, and fine powder of diamond is filled in contact therewith, and then a high pressure device (not shown) is used to
It is obtained by sintering at high pressure.

Further, by using the cemented carbide 5 as the base material, the brazing 3d to the nozzle body 2 is easy and the fixation is sure, and the reinforcing effect of the thin diamond layer formed is exerted. .

The adsorbent 3 made of the diamond sintered body 3c in the second embodiment is, for example, a product name DA100 or DA150 manufactured by Sumitomo Electric Industries, and has a Vickers hardness of about 14,000 Kg / mm ² . It is suitable for its use.

Therefore, in the suction bit A of the embodiment of the present invention configured as described above, the diamond layer 3a is formed on the suction surface of the suction member 3 provided at the tip of the nozzle body 2. Since the diamond sintered body 3c is provided, when the conventional cemented carbide or ceramic is used, the adsorption bit A as a whole must be replaced after a certain use, whereas the present invention The suction surface can withstand semi-permanent use, does not need to be replaced, and improves the suction accuracy of the electronic component b.

[0023]

As described above, according to the present invention, the suction surface of the suction bit is not deformed, the suction accuracy of the suction surface can be maintained semipermanently, and the suction bit is not replaced.

Since the diamond sintered body used as the adsorbent is bonded to the bit body by using cemented carbide as an intermediate material,
Adhesion to the bit body is secured, and detachment of the adsorbent during use is eliminated. And so on.

[Brief description of drawings]

FIG. 1 is a schematic front view showing a first example of implementation of a suction bit for an electronic component mounting machine according to the present invention and an enlarged view of a part thereof.

FIG. 2 is a schematic front view showing a second example of implementation of a suction bit for an electronic component mounting machine according to the present invention and an enlarged view of a part thereof.

[Explanation of symbols]

 A Adsorption bit for electronic component mounting machine b Electronic component 1 Adsorption bit 2 Bit body 3 Adsorption body 3a Diamond layer 3c Diamond sintered body 4 Cemented carbide

Claims (3)

[Claims] 1. An adsorption bit for an electronic component mounting machine, which adsorbs an electronic component from a supply unit to mount the electronic component on a printed circuit board of a mounting unit, comprising a nozzle body mounted to a mounting head and the nozzle. An adsorption bit for an electronic component mounting machine, comprising an adsorption body provided at a tip portion of a main body, and a diamond layer having a predetermined thickness is formed on an adsorption surface of the adsorption body. 2. An adsorption bit for an electronic component mounting machine for adsorbing an electronic component from a supply unit to mount the electronic component on a printed circuit board of a mounting unit, the nozzle body being mounted on a mounting head, and the nozzle. An adsorption bit for an electronic component mounting machine, comprising: an adsorption body formed of a diamond sintered body provided at a tip portion of a main body. 3. An adsorption bit for an electronic component mounting machine, which adsorbs an electronic component from a supply unit and mounts the electronic component on a printed circuit board of a mounting unit, in which a nozzle body is mounted on a mounting head, and the nozzle. It is provided with an adsorbent provided at the tip portion of the main body, and the adsorbent is composed of a diamond sintered body having an adsorbing surface provided on the outermost side, the inner portion of which is joined to one side of the cemented carbide. An adsorption bit for an electronic component mounting machine, characterized in that the other side of the cemented carbide is joined to the outer end of the nozzle body.