JP2003078053A - Positioning jig for machining semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve wearing resistance of a clamp 5 to be engaged with a semiconductor package, and to prevent precision in positioning from being deteriorated by sticking solder plating on a lead L by clamping the lead L in a positioning jig 1 for machining a semiconductor package I. SOLUTION: In the positioning jig 1 for machining a semiconductor, the semiconductor package I to be placed on the machining part of the machining process of the semiconductor package I is positioned at a prescribed location in the process. The top end of a main body 2 of jig, which can appear/disappear toward the semiconductor package I placed on the machining part, is provided with the clamp part 5. The lead L protruded from a main body P of package of this semiconductor package I can be clamped, and at least the clamp part 5 of this main body 2 of the jig is made from a very high hardness sintered compact 6 composed of a sintered diamond compact or sintered CBN compact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing positioning jig for positioning a semiconductor package mounted on a processed portion in a semiconductor package marking step or the like at a predetermined position of the processed portion. It is about ingredients.

[0002]

2. Description of the Related Art For example, in the step of marking (printing) a model number or the like on a very small semiconductor package, a positioning jig having a gripping portion capable of gripping a lead protruding from the package body is aimed at this semiconductor package. By mounting the lead with the gripping part and engaging with the semiconductor package, the semiconductor package is positioned in the processing part of the printing process, and the model number etc. is printed on the package body. ing. Further, conventionally, such a positioning jig has been formed of cemented carbide having a high hardness including the above-mentioned grip portion for the purpose of extending the life thereof.

[0003]

By the way, in the positioning jig used in such a marking process,
Ink for marking the package body may adhere to the grip portion, and it is necessary to periodically wipe the ink in order to remove the ink or the like thus attached. However, no matter how high the hardness of the cemented carbide is, it is inevitable that the grip portion will be worn during repeated wiping and cleaning. Since it is not possible to perform accurate positioning, the marking position on the package body will shift, and the tip of the gripping part will be sharp and the semiconductor package will be damaged, so it is necessary to change the jig relatively frequently. Had to do. Further, in the positioning jig using the cemented carbide for the grip portion as described above, the solder plating of the leads of the semiconductor package has a high affinity with the binder phase of the cemented carbide, and thus easily adheres to the grip portion, As a result, wiping and cleaning must be performed more frequently, resulting in a shortened life and a problem that the positioning accuracy is impaired at an early stage.

The present invention has been made in view of such circumstances, and in a positioning jig for processing a semiconductor package as described above, a holding portion for holding the lead and engaging the semiconductor package. An object of the present invention is to provide a positioning jig for semiconductor processing, which has improved wear resistance and can prevent deterioration of positioning accuracy due to adhesion of lead solder plating.

[0005]

In order to solve the above problems and achieve such an object, the present invention provides a semiconductor package mounted on a processing portion of a semiconductor package processing step. A positioning jig for semiconductor processing for positioning at a predetermined position, which protrudes from the package body of this semiconductor package at the tip of the jig body that can be projected and retracted toward the semiconductor package placed on the processing section. A gripping portion capable of gripping the lead is provided, and at least the gripping portion of the jig body is formed of an ultra-high hardness sintered body. That is, such an ultra-high hardness sintered body typified by a diamond sintered body and a CBN sintered body is harder and has higher wear resistance than a cemented carbide and the like, and is used for a very long time or wiped and cleaned. In addition to causing less abrasion, the affinity of the lead for solder plating is also small. Further, the ultra-high hardness sintered body formed with the gripping portion is polished so that the surface roughness thereof is in the range of 0.05 to 0.8 μm at the maximum height Ry according to JIS B0601. However, this makes it possible to more reliably prevent the solder plating of the leads from adhering.

[0006]

1 and 2 show an embodiment of the present invention. The present invention will be described with reference to a marking process or a printing process of a very small semiconductor package I as described above. It shows a case where it is applied to a positioning jig in a machining process such as. That is, in such a very small semiconductor package I, the leads L are arranged so as to project only from the lower surface of the package body P, and the positioning jig 1 of the present embodiment holds the leads L. As a result, the semiconductor package I is engaged, and the position of the semiconductor package I in the processed portion of the above-described processing step is positioned. In addition, in the embodiment shown in FIGS. 1 and 2, three leads L ... Are projected so as to be arranged in series from the rectangular lower surface of the rectangular parallelepiped package body P, and these leads L. One positioning jig 1 is gripped to position the semiconductor package I, and therefore, three positioning jigs 1 ... Are prepared for one semiconductor package I as shown in FIG. It

Here, each positioning jig 1 has a jig body 2 formed in a substantially rectangular flat plate shape, and a mounting hole 3 for attaching the jig body 2 to a retracting device (not shown) at a base end portion thereof. Are formed. A pair of prismatic gripping claws 4, 4 are provided at the tip of the jig body 2 with a space therebetween so that the lead L can be fitted and inserted in the width direction (vertical direction in FIG. 2). The gripping claws 4, 4 are provided so as to project in parallel to each other, and are formed as a gripping portion 5 capable of gripping the lead L by sandwiching the lead L in the width direction. In the present embodiment, the hatched portion in the figure including the gripping claws 4 and 4 of the gripping portion 5 is formed by the ultra-high hardness sintered body 6 made of a diamond sintered body or a CBN sintered body. It is formed in the shape of a flat plate.
Such an ultra-high hardness sintered body 6 is joined to the recess 2A formed on the tip side of the base end of the jig body 2 formed of cemented carbide or steel by brazing with an active brazing material or the like. It is integrated.

Incidentally, instead of providing the grip portion 5 made of the ultra-high hardness sintered body 6 on the tip end of the jig body 2 by brazing as described above, for example, the base end portion of the jig body 2 is made of the same baked material. When it is formed of a cemented carbide or the like that is a united body, the raw material powder of the ultra-high hardness sintered body 6 is filled in the portion to be the gripping portion 5 during the powder compacting before sintering, and Alternatively, the rear end side may be filled with raw material powder such as cemented carbide, and these may be integrally sintered. In some cases, the entire jig body 2 may be sintered with the ultra-high hardness sintered body 6. It may be formed by. Further, in the present embodiment, at least the inner surface of the gripping claws 4, 4 for gripping the lead L among the surfaces of the gripping portion 5 formed of the ultra-high hardness sintered body 6 is polished. According to JIS
0.05μ at the maximum height Ry at B 0601
The range is from m to 0.8 μm. When it is rather complicated to polish only the inner surfaces of the gripping pawls 4 and 4 as described above, the entire gripping pawls 4 and 4 may be polished.

In the processing step having such positioning jigs 1 ...
, And the positioning jigs 1 ... project toward the leads L ... projecting from the lower surface of the package body P of the semiconductor package I by the retracting device, and grip the leads L as described above. By grasping the grasping claws 4 and 4 so as to be sandwiched in the width direction, the positioning jig 1 ...
And the semiconductor package I are engaged with each other to position the semiconductor package I on the processed portion. In the present embodiment, as described above, a plurality of (three in the present embodiment) leads L ... Are protruded from the lower surface of the package body P so as to be arranged in series in the width direction thereof, and each lead is ... Also, a plurality (three in the present embodiment) of positioning jigs 1 ... One for each L.
Are arranged so as to be sandwiched in the width direction and positioned so that the leads L, L adjacent to each other in the width direction are positioned.
In order to avoid the interference between the positioning jigs 1 and 1 for holding the lead, the positioning jigs 1 and 1 for holding the adjacent leads L, L are arranged in series as shown in FIG. Are alternately arranged on one side and the other side opposite thereto, and can be projected and retracted toward the leads L by the retracting device.

Therefore, the positioning jig 1 having such a structure
In the above, the gripping portion 5 for gripping the lead L of the semiconductor package I is formed by the ultra-high hardness sintered body 6 made of a diamond sintered body or a CBN sintered body. Even if wiping is performed to remove the dust, the wear is less than that of cemented carbide and the like, which enables accurate and stable positioning over a long period of time, and the tips of the gripping claws 4, 4 become sharp. As a result, the semiconductor package I is not damaged, and the number of times the positioning jig 1 is replaced can be greatly reduced. Further, such an ultra-high hardness sintered body 6
Has a low affinity with the solder plating on the surface of the lead L of the semiconductor package I, so that the solder plating does not adhere to the gripping claws 4 and 4 of the gripping portion 5 during repeated positioning, and such solder plating To prevent such a situation that the adhesion deteriorates the positioning accuracy and that the adhered solder plating is peeled off to become powder and contaminate the process of the semiconductor package I that requires a clean environment. You can

Further, in the present embodiment, in the grip portion 5 formed of the ultra-high hardness sintered body 6, at least the inner side surfaces of the grip claws 4 and 4 which come into contact with the lead L are polished so that The surface roughness is in the range of 0.05 μm to 0.8 μm at the maximum height Ry. Therefore, according to the present embodiment, the surface roughness of the gripping claws 4, 4 is made smooth in this way, so that the solder plating adheres to the gripping claws 4, 4 even if the lead L is gripped. Since it is possible to prevent it more reliably, accurate and stable positioning can be achieved over a long period of time. In order to reduce the labor required for polishing while preventing the adhesion of the solder plating in this way, the surface roughness is 0.1 to 0.8 μm at the same maximum height Ry.
It is more desirable that the range is about m.

Further, in the present embodiment, since the grip portion 5 is formed of the ultra-high hardness sintered body 6, even if the grip claws 4 and 4 are polished and the surface roughness thereof is smoothed,
For example, unlike the case where the conventional grip portion is coated with a hard coating, the coating is not lost or the film thickness is not damaged, and the above-described effect can be maintained as it is. This is the same, for example, even when the grip portion 5 is used again after being re-polished when it is worn. Also,
In the present embodiment, the jig main body 2 may be made of a material such as steel as long as it can be attached to the ultra-high hardness sintered body 6, but the extremely small semiconductor package I is positioned as described above. In order to do so, the jig body 2 must be downsized, and it is desirable to use cemented carbide in order to secure the rigidity of the jig body 2 and the wear resistance of the jig body 2 itself.

[0013]

As described above, according to the present invention,
Since the ultra-high hardness sintered body made of diamond sintered body or CBN sintered body is used for the holding part of the positioning jig that holds and positions the leads of the semiconductor package, the wear resistance of this holding part is greatly improved. It is possible to extend the life of the positioning jig and to reduce the time and labor required for the replacement and adjustment work of the worn positioning jig, and to achieve high accuracy over a long period of time. It is possible to perform stable positioning. Further, it is possible to suppress the adhesion of plating due to the affinity between the grip portion and the solder plating on the lead surface, and it is possible to prevent the positioning accuracy from being impaired by such adhesion.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

2 is a view of a state in which a semiconductor package I is positioned by a positioning jig 1 ... In the embodiment shown in FIG. 1 as viewed from a lower surface side of a package body P. FIG.

[Explanation of symbols]

1 Positioning jig 2 Jig body 4 gripping claws 5 grip 6 Ultra-hard hardness sintered body I Semiconductor package P package body L lead

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) (72) Inventor Ken Takahashi 1528, Nakashinda, Yokoi, Kobe-cho, Anha-gun, Gifu Prefecture in the factory

Claims (3)

[Claims] 1. A semiconductor processing positioning jig for positioning a semiconductor package mounted on a processing portion of a semiconductor package at a predetermined position in the semiconductor package processing step, the semiconductor being mounted on the processing portion. At the tip of the jig body that can be projected and retracted toward the package, a gripping portion capable of gripping a lead protruding from the package body of the semiconductor package is provided, and at least the gripping portion of the jig body has an ultra-high hardness. A positioning jig for semiconductor processing, which is formed of a sintered body. 2. The positioning jig for semiconductor processing according to claim 1, wherein the ultra-high hardness sintered body comprises a diamond sintered body or a CBN sintered body. 3. The ultra-high hardness sintered body formed with the grip portion has a surface roughness in a range of Ry of 0.05 to 0.8 μm.
A positioning jig for semiconductor processing as described in.