JPH09294006A - Irreversible circuit element and irreversible circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the number of parts and to simplify an assembling job for improvement of reliability by forming the resistors in a single body in a high frequency magnetic substance and also on at least one of its both sides. SOLUTION: A magnetic rotor 21 contains center electrodes 12a to 12c buried in a microwave magnetic substance 22. A resistor 14 which is electrically connected a fetch electrode 15 and a coupling electrode 16 is contained in the substance 22 at the part under the electrodes 12a to 12c. A resistor paste layer is baked to the resistor 14 which is led out onto the end face 22a of the substance 22 via the electrode 15. Then a ground electrode 17 is formed under the resistor 14. Thus, the electrodes 12a to 12c serving as the transmission lines, the capacitive electrodes 13a to 13c, the resistor 14, etc., are constructed in a single body in the substance 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reciprocal circuit device represented by, for example, a circulator or an isolator, and more particularly to a high-frequency non-reciprocal circuit device in which a resistor is integrated to enable miniaturization. .

[0002]

2. Description of the Related Art In recent years, high-frequency devices such as mobile communication devices have become smaller and more versatile, and nonreciprocal circuit devices used therein are also required to be smaller and lower in cost. This type of non-reciprocal circuit device has a plurality of center electrodes that are electrically insulated from each other and that are arranged so as to intersect with each other, and microwave magnetic materials are provided above and below the plurality of center electrodes. There are known elements such as so-called lumped constant type circulators and isolators in which a body is arranged and a DC magnetic field is applied by a permanent magnet.

An example of the above-mentioned conventional non-reciprocal circuit device,
This will be described with reference to FIG. FIG. 1 is an exploded perspective view for explaining an example of a conventional non-reciprocal circuit device. In this non-reciprocal circuit device, strip-shaped center electrodes 1a to 1c are arranged so as to intersect with each other. Although not necessarily clear in FIG. 1, the center electrodes 1a to 1c are electrically insulated from each other. That is, the center electrodes 1a to
The center electrodes 1a to 1c are electrically insulated from each other by applying an insulating treatment to the surface of the strip-shaped conductor that constitutes 1c or by interposing an insulating sheet or the like between the center electrodes 1a to 1c. .

The center electrodes 1a to 1c are sandwiched by disc-shaped microwave ferrites 2 and 3. The structure in which the center electrodes 1a to 1c are sandwiched between the microwave ferrites 2 and 3 is sandwiched between the alumina substrate 4, the ground plate 5 and the magnetic yokes 6 and 7 and housed in the nonreciprocal circuit device.

The alumina substrate 4 has an opening 4a in the center for forming a portion for accommodating a structure constituted by using the microwave ferrites 2 and 3. Further, on the alumina substrate 4, capacitance electrodes 4b and 4c and a resistor 4d for forming a matching capacitance are formed. The resistor 4d is joined between the electrodes 4e and 4f by using solder or the like.

The ground plate 5 is made of a metal plate and is connected to the ground potential. The magnetic yokes 6 and 7 are formed by bending a metal plate, and the side surfaces 6 a and 6 b of the magnetic yoke 6 are formed.
The side surfaces 7a and 7b of the magnetic yoke 7 are embedded in the. A permanent magnet 8 is fixed to the lower surface of the magnetic yoke 7 as shown by an imaginary line.

[0007]

In the conventional non-reciprocal circuit device, the alumina substrate 4 on which the resistor 4d is mounted as described above is used. However, in recent years, with the downsizing of nonreciprocal circuit devices for microwaves, the central electrodes 1a to 1a ...
The length of 1c is becoming small, about several mm. As a result, there is a strong demand for downsizing not only the portions where the center electrodes 1a to 1c are provided but also other portions. Therefore,
Assembling by hand has become difficult, and there are problems that assembly defects such as displacement of the center electrodes 1a to 1c are increased, reliability is lowered, or manufacturing cost is high.

That is, in the nonreciprocal circuit device shown in FIG. 1, various works such as a structure in which the center electrodes 1a to 1c are sandwiched between the alumina substrate 4 and the microwave magnetic bodies 2 and 3 and mounting of the resistor 4d are performed. Had to be done manually.
Therefore, since the number of assembled parts is large, there is a limit to the cost reduction of the non-reciprocal circuit device, and it is difficult to further reduce the cost.

The object of the present invention is to achieve the simplification of the structure of the non-reciprocal circuit device in which the resistors are combined, to manufacture it with a small number of parts, to have a small size and to have excellent reliability. It is to provide an inexpensive non-reciprocal circuit device for high frequencies.

[0010]

A nonreciprocal circuit device according to the present invention is integrated with a high frequency magnetic body, a transmission line formed in the high frequency magnetic body, and at least one of the high frequency magnetic body and the surface. A non-reciprocal circuit device, comprising: a resistor formed on the substrate, and thereby achieving the above object.

In the nonreciprocal circuit device according to the present invention, since the resistor is integrally formed on at least one of the inside and the surface of the high frequency magnetic body in which the transmission line is formed, the nonreciprocal circuit including the resistor is formed. Since the element can be handled as a single part, the structure of the non-reciprocal circuit device combined with the magnetic yoke, the permanent magnet, etc. can be simplified and the number of parts can be reduced, and the assembling work also becomes easy.

That is, the present invention is characterized in that the above resistor is also integrally formed on the high frequency magnetic body used in the non-reciprocal circuit device or on the surface of the magnetic body. In the present invention, the high-frequency magnetic material can be made of an appropriate magnetic material suitable for high-frequency applications, and can be made of, for example, microwave ferrite. For this microwave ferrite,
Examples thereof include calcium vanadium iron garnet and yttrium iron garnet.

In a particular aspect of the present invention, the microwave ferrite is composed of calcium vanadium iron garnet, and the resistor fires a resistance paste containing calcium vanadium iron garnet powder and at least one of parazimuu and platinum powder. The microwave ferrite and the resistor are integrally fired as a result. When the resistor contains calcium vanadium iron garnet which is the main component of the ferrite for microwaves, the resistor can be firmly bonded and integrated with the ferrite for microwaves by firing.

Further, in the nonreciprocal circuit device of the present invention, in the structure including the magnetic rotor having the high frequency magnetic material and the transmission line, and the resistor, the resistor is at least one of the surface and the inside of the high frequency magnetic material. And is formed integrally with the high frequency magnetic material. That is,
The non-reciprocal circuit device according to the present invention is a device including the non-reciprocal circuit element according to the present invention, and is not particularly limited, but, for example, a permanent magnet for applying a magnetic field to the microwave magnetic portion, It is configured by combining a magnetic yoke and the like.

A method of manufacturing a nonreciprocal circuit device according to the present invention is a method for obtaining the nonreciprocal circuit device according to the present invention, in which a magnetic green sheet having a resistance paste layer formed on one surface and a transmission line are provided. The method includes a step of laminating a plurality of magnetic green sheets including a magnetic green sheet formed on one surface to obtain a laminated body, and a step of firing the laminated body and integrally firing the resistance paste layer and the magnetic body. It is characterized by

That is, the method for manufacturing a non-reciprocal circuit device according to the present invention uses the ceramics lamination / integral firing technique which is commonly used in the multilayer capacitors as described above. Therefore, by increasing the printing accuracy of the resistance paste and the forming accuracy of the transmission line, it is possible to easily obtain a non-reciprocal circuit device having high accuracy and excellent reliability even when miniaturized.

Preferably, a green sheet containing calcium vanadium iron garnet as a main component is used as the magnetic green sheet, and the resistance paste contains calcium vanadium iron garnet powder and at least one of palladium powder and platinum powder. In this case, since the resistor contains the same material as the magnetic layer, the resistor layer and the magnetic body are firmly integrated.

When yttrium iron garnet is used as the microwave ferrite, the resistor layer is also formed by using yttrium iron garnet powder and palladium and / or platinum powder. The contact structure between the magnetic layer and the magnetic layer can be effectively enhanced.

Further, in the method for producing a nonreciprocal circuit device of the present invention, after a high frequency magnetic material is obtained in advance by firing or the like, a resistance paste made of a resistive composition is applied onto the high frequency magnetic material, It may be solidified to form a resistor.
In this case, the resistance paste may be applied and solidified by drying a solvent or the like to form a resistor, or the resistance paste may be applied on the magnetic body and then solidified by baking the resistance paste. To form a resistor.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a method for manufacturing a non-reciprocal circuit device according to the present invention and an example of a non-reciprocal circuit device according to the present invention will be described with reference to FIGS.

First, as shown in the exploded perspective view of FIG. 2, a plurality of magnetic green sheets 11a to 11i are prepared. The magnetic green sheets 11a, 11e, 11
As shown in FIG. 2, a plurality of i are used. Magnetic green sheets 11a-11i
Can be obtained by sheet-forming a slurry obtained by kneading a microwave ferrite, for example, calcium vanadium iron garnet powder with an organic binder and a solvent. The magnetic green sheets 11a and 11i are
It is provided to form the magnetic layers above and below the fired body described later.

Center electrodes 12a, 12b and 12c are formed on the upper surfaces of the magnetic green sheets 11b to 11d, respectively. The center electrodes 12a to 12c have a strip shape and are crossed so as to form an angle of 120 degrees when viewed from above in a stacked state.
The center electrodes 12a to 12c are formed by applying a conductive paste containing a conductive powder such as palladium or platinum powder onto the magnetic green sheets 11b to 11d by screen printing or the like.

Capacitor electrodes 13a to 13 for forming matching capacitors are provided on the magnetic green sheet 11f, respectively.
c is formed. The capacitance electrodes 13a to 13c are shown in FIG.
As shown in FIG.
Are drawn to different edges. The capacitance electrode 13a is
It is drawn out to a position that vertically overlaps with one end of the upper center electrode 12a. In addition, the capacitance electrode 13b is drawn out to a position overlapping with one end of the center electrode 12b in the vertical direction. The capacitance electrode 13c is drawn out to a position overlapping with one end of the center electrode 12c in the vertical direction.

The capacitance electrodes 13a to 13c can also be formed by printing the conductive paste. The capacitance electrodes 13a to 13c are ground electrodes 17 to be described later.
It is formed in order to take out a capacitance between and. The matching capacitance can be adjusted by the electrostatic capacitance taken out by the capacitance electrodes 13a to 13c and the ground electrode 17.
That is, by adjusting the areas of the capacitance electrodes 13a to 13c, or by further inserting one or more appropriate number of magnetic green sheets between the magnetic green sheets 11f and 11g. The size of the matching capacitance can be adjusted. Therefore, it is understood that the matching capacitance can be easily adjusted.

Capacitance electrode 13a for forming a matching capacitance
13c and the center electrode 1 described above.
A plurality of magnetic green sheets 11e are inserted in order to separate the portions 2a to 12c from each other.

On the other hand, the magnetic green sheet 11g is arranged below the magnetic green sheet 11f. A resistor paste layer 14 is formed on the magnetic green sheet 11g.
The lead electrode 15 and the connection electrode 16 are formed, and the resistance paste layer 14 is formed between the electrodes 15 and 16. The connection electrode 16 is connected to the ground electrode 17 below by a through-hole conductor 16a. The resistance paste layer 14 is printed to form a resistor, and is formed using, for example, a resistance paste containing calcium vanadium iron garnet powder and at least one of palladium and platinum powder.
Preferably, the calcium vanadium iron garnet powder is 5 to 90% by weight, and the palladium and / or platinum powder is 9% by weight.
By containing 5 to 5% by weight, the adhesion strength between the resistor formed by baking the resistance paste layer 14 and the magnetic body layer formed by baking the magnetic green sheet can be increased.

If the content of the calcium vanadium iron garnet powder in the resistance paste layer 14 is less than 5% by weight, the effect of enhancing the adhesion strength with the magnetic layer may not be sufficiently obtained. On the other hand, if it exceeds 90% by weight, the resistance value becomes too high, and the desired resistor may not be formed in some cases.

The specific resistance value of the resistor formed by the resistor paste layer 14 can be easily adjusted by changing the content ratio of the calcium vanadium iron garnet powder and the platinum and / or palladium powder. You can Also, the resistance value obtained from the resistor can be easily adjusted by changing the area or thickness of the resistor paste layer 14 formed.

Below the magnetic green sheet 11g,
A magnetic material green sheet 11h is arranged, and a ground electrode 17 is formed on the upper surface of the magnetic material green sheet 11h. The ground electrode 17 is the capacitance electrode 13 described above.
It is formed so as to oppose to a to 13c in the thickness direction, and is drawn out to a position where it does not vertically overlap with the part where the capacitor electrodes 13a to 13c are drawn out.
Further, the ground electrode 17 is the center electrode 12a, 12b, 1
2c is drawn to a position where one end of 2c vertically overlaps with the drawn part.

The extraction electrode 15 has an end face 22.
On a, it is drawn out to a position that vertically overlaps with the center electrode 12a and the capacitor electrode 13a. Connection electrode 16
Are connected to the ground electrode 17 by through-hole conductors 16a. The ground electrode 17 can be formed by applying the above-mentioned conductive paste to the entire surface by printing or the like.

The magnetic green sheet 11a shown in FIG.
2 to 11i are laminated in the orientation shown in FIG. 2 and pressure-bonded in the thickness direction to obtain a laminate. The laminated body thus obtained is cut to have a desired planar shape, and is further fired at a temperature of, for example, about 1250 to 1500 ° C. to obtain the center electrodes 12a to 12c as the transmission line and the matching capacitance. It is possible to obtain a magnetic rotor in which the capacitive electrodes 13a to 13c and the resistor paste layer 14 for constituting are integrated.

FIG. 3 is a perspective view schematically showing the internal structure of the magnetic rotor obtained as described above. The magnetic rotor 21 includes a center electrode 12a in a microwave magnetic body 22.
12 to 12c are embedded. Further, in the microwave magnetic body 22, the above-mentioned capacitance electrodes 13a to 13c are arranged below the portion where the center electrodes 12a to 12c are provided.

The resistor 14 is formed below the portion where the capacitance electrodes 13a to 13c are formed in a state of being electrically connected to the lead-out electrode 15 and the connection electrode 16. The resistor 14 is configured by baking the resistor paste layer 14 described above, and is drawn out to the end surface 22 a of the magnetic body 22 by the extraction electrode 15.

Further, a ground electrode 17 is formed below the portion where the resistor 14 is formed. In the actual manufacturing, after burning the above-mentioned laminated body, the side surfaces and the end surfaces of the magnetic body 22 are polished so that the center electrodes 12a to 12c and the capacitance electrodes 13a to 13c.
Also, the end of the extraction electrode 15 is surely exposed.

As described above, in the nonreciprocal circuit device including the magnetic rotor 21 according to the present invention, the center electrodes 12a to 12c as transmission lines and the capacitance electrode 13 for obtaining the matching capacitance are provided.
a to 13c, the resistor 14 and the like are integrally formed in the microwave magnetic body 22.

Therefore, if the magnetic rotor 21 shown in FIG. 3 is prepared, for example, as shown in FIG. 4, a rectangular permanent magnet 23 is arranged above the magnetic rotor 21, and the magnetic yoke is arranged from above and below. By combining 24 and 25,
It is possible to easily assemble a nonreciprocal circuit device including a magnetic rotor having a high frequency magnetic material and a transmission line, and a resistor. That is, it can be seen that the number of parts of the non-reciprocal circuit device can be reduced and the assembling work can be simplified.

In FIG. 4, 26a to 26f are
External electrodes are shown respectively. The external electrode 26a is electrically connected to one end of the center electrode 12a, the capacitance electrode 13a, and the extraction electrode 15. The external electrode 26b is electrically connected to one end of the center electrode 12c and the ground electrode 17. The external electrode 26c is electrically connected to one end of the center electrode 12b and the capacitive electrode 13b. External electrode 2
6d is electrically connected to the other end of the center electrode 12a and the ground electrode 17.

The external electrode 26e electrically connects one end of the center electrode 12c and the capacitance electrode 13c. The external electrode 26f includes one end of the center electrode 12b and the ground electrode 17
Are electrically connected.

In addition, the step of manufacturing the magnetic rotor 21 uses the integral firing technique which is commonly used in manufacturing a monolithic ceramic capacitor or the like as described above. Therefore, even when miniaturization is attempted. , Center electrode 1
It is possible to surely improve the accuracy of the dimensions and the forming positions of 2a to 12c, and the forming positions and the dimensional accuracy of the capacitor electrodes 13a to 13c and the resistor 14. That is, it is possible to provide a smaller and more reliable non-reciprocal circuit device.

In the example described with reference to FIGS. 2 to 4, the resistor 14 is formed in the microwave magnetic body 22, but as shown in FIG. It may be formed on the surface such as the upper surface of the wave magnetic body 22. In addition, FIG. 5 shows the upper surface 22 of the microwave magnetic body 22.
FIG. 3 is a schematic perspective view shown for explaining the structure in which the resistor 14 is formed in b. Although the internal structure of the microwave magnetic body 22 is simplified (the ground electrode 17 is not shown), 14, take-out electrode 15 and connection electrode 16
The magnetic rotor 21 has the same configuration as that of the magnetic rotor 21 shown in FIG.

[0041]

EXAMPLES Next, the present invention will be clarified based on specific experimental examples. Example 1 After calcination, a calcined powder was prepared which became calcium vanadium iron garnet containing calcium oxide, yttrium oxide, iron oxide and vanadium oxide as main components. The calcium vanadium iron garnet calcined powder was pulverized and mixed with polyvinyl butyral as a binder, an organic solvent, a dispersant and a plasticizer to obtain a magnetic slurry.

Using the obtained magnetic slurry, a magnetic green sheet made of calcium vanadium iron garnet was prepared by a doctor blade method and punched into a rectangular shape.

The magnetic green sheets prepared as described above are the magnetic green sheets 11a to 11a shown in FIG.
It has the same shape as 11i. Of the magnetic green sheets prepared in this way, three green sheets were each printed with the paradigm paste to form the center electrodes 12a to 12c.

Furthermore, a resistor paste layer 14 was printed on the magnetic green sheet 11g using a resistor paste containing the above calcium vanadium iron garnet powder and palladium powder. Also, magnetic green sheet 11g
Has a through hole for forming a through-hole conductor 16a formed therein. By printing the extraction electrode 15 and the connection electrode 16 using the above-mentioned palladium paste on the magnetic green sheet 11g by screen printing,
The through hole conductor 16a was formed in the through hole.

Further, a palladium paste is used on the magnetic green sheet 11f, and each of the capacitive electrodes 1 is
3a-13c were printed. A magnetic green sheet on which various electrodes or resistor paste layers are formed as described above is laminated together with a plain magnetic green sheet as shown in FIG. 2, pressure-bonded in the thickness direction, and then punched to a desired size. A laminated body was obtained. The obtained laminated body is heated to about 400 ° C.
After degreasing at the temperature of 10 hours and firing at a temperature of 1250 to 1500 ° C., the microwave magnetic body 22 shown in FIG. 3 was obtained.

Next, the side surfaces of the microwave magnetic material 22 are polished to form the center electrodes 12a to 12c and the extraction electrode 15.
And the like are exposed on the side surface, and a glass frit-containing conductive paste is applied to the side surface of the microwave magnetic material and baked to form the external electrodes 26a to 26f shown in FIG.

Further, as shown in FIG. 4, the permanent magnet 2
3 was arranged on the upper part, and the magnetic yokes 24 and 25 further constituted a magnetic closed circuit to assemble a nonreciprocal circuit device.

The nonreciprocal circuit device thus obtained was subjected to a magnetic field of 6000.
By magnetizing at ˜11000 (Oe), it was confirmed that this nonreciprocal circuit device can operate as an isolator.

Example 2 In the same manner as in Example 1, a plurality of magnetic green sheets with a center electrode printed were prepared. Of course, other magnetic green sheets 11a to 11f, 11h, and 11i except the magnetic green sheet 11g shown in FIG. 2 were prepared and laminated as shown in FIG. The laminated body thus obtained was pressure-bonded in the thickness direction and then punched into a predetermined size to obtain a laminated body. The obtained laminated body was fired in the same manner as in Example 1 to obtain a microwave magnetic body.

Thereafter, the end face of the obtained magnetic body for microwaves was polished in the same manner as in Example 1 to expose the center electrode and the capacitor electrodes 13a to 13c, and the side surface of the magnetic body for microwaves was used for the embodiment. External electrodes 26a-2
6f was formed.

Next, a resistance paste layer was printed on the upper surface of the microwave magnetic material obtained as described above using a resistance paste prepared by mixing ruthenium dioxide, glass powder and an organic solvent. An extraction electrode made of a conductive paste was printed. Next, the resistance paste layer and the conductive paste layer were baked by heat treatment at 500 to 1000 ° C., and the magnetic rotor 31 shown in FIG. 5 was obtained.

Also in the magnetic rotor 31 obtained in Example 2, the permanent magnets were arranged one above the other and the magnetic yoke was used to form a magnetic closed magnetic circuit to manufacture a nonreciprocal circuit device. It was confirmed that it can be operated as an isolator by magnetizing at 11000 (Oe).

[0053]

According to the invention of claim 1, since the resistor is integrally formed on at least one of the high frequency magnetic body and the surface, the high frequency magnetic body, the transmission line and the resistor are integrated. A non-reciprocal circuit device can be provided. In this non-reciprocal circuit element, the resistor is integrated with the high-frequency magnetic substance, so the mounting work of the resistor, which requires soldering and other work, can be omitted, and the electrical connection of the resistor is possible. Can also increase the reliability of. In addition, since the resistor is integrated with the transmission line and high frequency magnetic material,
The non-reciprocal circuit device can be used, and further, the assembling work can be simplified when the non-reciprocal circuit device is configured by combining it with a permanent magnet or a magnetic yoke.

Therefore, according to the invention of claim 1,
It is possible to reduce the number of parts required for high-frequency non-reciprocal circuit devices and non-reciprocal circuit devices and simplify the assembly work.
And the reliability of these can also be effectively improved.

In the nonreciprocal circuit device according to the third aspect of the invention, the microwave ferrite is calcium vanadium iron garnet, and the resistor is composed of palladium and / or platinum powder and calcium vanadium iron garnet powder. Therefore, the resistor is firmly bonded to the magnetic body.

In the method of manufacturing a nonreciprocal circuit device according to the fifth aspect of the invention, a plurality of magnetic bodies including a magnetic green sheet having a resistive paste layer and a magnetic green sheet having a transmission line formed therein. Using a green sheet,
The nonreciprocal circuit device according to the first aspect of the invention can be easily obtained by the stacking / integral firing technique.

Particularly, as described in claim 6, as the magnetic green sheet, a green sheet mainly containing calcium vanadium iron garnet is used, and as the resistance paste, at least calcium vanadium iron garnet powder, and palladium powder and platinum powder are used. If one including one is used, it is possible to effectively improve the adhesion between the magnetic layer formed by baking the magnetic green sheet and the resistor formed by baking the resistance paste.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a conventional non-reciprocal circuit device.

FIG. 2 is an exploded perspective view for explaining a method for manufacturing a nonreciprocal circuit device of the present invention.

FIG. 3 is a perspective view showing a magnetic rotor of the present invention.

4 is an exploded perspective view for explaining a non-reciprocal circuit device in which a permanent magnet and a magnetic yoke are combined with the magnetic rotor shown in FIG.

FIG. 5 is a schematic perspective view showing another example of the nonreciprocal circuit device of the present invention, showing an example in which a resistor is provided on the upper surface of the microwave magnetic body.

[Explanation of symbols]

 11a to 11i ... Magnetic green sheets 12a to 12c ... Center electrodes 13a to 13c ... Capacitance electrodes 14 ... Resistor paste layer (resistor) 15 ... Extraction electrode 21 ... Magnetic rotor 22 ... Microwave magnetic body 23 ... Permanent magnet 24, 25 ... Magnetic yoke 31 ... Magnetic rotor

Claims (7)

[Claims] 1. A high-frequency magnetic body, a transmission line formed in the high-frequency magnetic body, and a resistor integrally formed on at least one of the high-frequency magnetic body and the surface. A non-reciprocal circuit device. 2. The nonreciprocal circuit device according to claim 1, wherein the high-frequency magnetic material is composed of microwave ferrite. 3. The microwave ferrite is calcium vanadium iron garnet, and the resistor is formed by firing a resistance paste containing calcium vanadium iron garnet powder and at least one of palladium and platinum powder. The nonreciprocal circuit device according to claim 2, wherein the ferrite for microwaves and the resistor are integrally fired. 4. A nonreciprocal circuit device comprising a magnetic rotor having a high frequency magnetic material and a transmission line, and a resistor, wherein the resistor is formed on at least one of a surface and an inside of the high frequency magnetic material. And a non-reciprocal circuit device characterized by being integrally formed with the high-frequency magnetic material. 5. A step of stacking a plurality of magnetic green sheets including a magnetic green sheet having a resistive paste layer formed on one surface and a magnetic green sheet having a transmission line formed on one surface to obtain a laminated body. The method for manufacturing a nonreciprocal circuit device according to claim 1, further comprising: firing the laminated body to integrally fire the resistance paste layer and the magnetic body. 6. A green sheet containing calcium vanadium iron garnet as a main component is used as the magnetic green sheet, and one containing calcium vanadium iron garnet powder and at least one of palladium powder and platinum powder is used as the resistance paste. The method for manufacturing a nonreciprocal circuit device according to claim 5, which is used. 7. The method for producing a nonreciprocal circuit device according to claim 1, wherein a resistive paste made of a resistive composition is applied onto the high frequency magnetic material and solidified.